Abstract: A patterned polishing pad adapted for use in a wafer polishing machine. The patterned polishing pad has a polishing surface adapted to contact frictionally a semiconductor wafer being polished in a chemical mechanical polishing machine. The polishing surface has a first region and a second region. The first region is adapted to contact frictionally the wafer and achieve a first process effect. The second region is adapted to contact frictionally the wafer and achieve a second process effect. The surface of the second region extends a predetermined protrusion amount above the polishing surface with respect to the surface of the first region.

Abstract: A processing system for increasing the quality of a gear having a shot peening apparatus for subjecting, to shot peening, a gear after tooth-forming and surface hardening; a barreling apparatus positioned adjacently to the shot peening apparatus, for subjecting, to barreling, the gear which has been subject to shot peening by the shot peening apparatus; and a gear feeding apparatus positioned adjacently to the shot peening apparatus and the barreling apparatus, for feeding, to the barreling apparatus, the gear which has been subjected to the shot peening by the shot peening apparatus. Thus, a gear of high quality can be efficiently produced, and the working environment can be cleaned at low cost by a dust collecting apparatus.

Abstract: A polishing apparatus comprises a carrier having a pressing surface to be engaged with a platy workpiece to press it against a polishing surface, whereby the workpiece is polished by being subjected to a relative sliding motion relative to the polishing surface while being pressed thereagainst. The pressing surface includes a suction opening provided along an outer peripheral portion of the pressing surface for applying a vacuum to hold the workpiece on the pressing surface during polishing of the workpiece. The carrier further comprises a pressure applying opening provided inside of the suction opening for applying a pressure to press the workpiece against the polishing surface during polishing of the workpiece.

Abstract: Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.

Abstract: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays or other microelectronic substrate assemblies. One planarizing machine of the invention is a web-format machine having a planarizing table to support a portion of the polishing pad in a planarizing zone, at least one roller to hold another portion of the polishing pad, and a carrier assembly for handling a microelectronic substrate assembly. A web-format polishing pad used with this machine can include a body having a planarizing medium, an elongated first side edge, and an elongated second side edge opposite the first side edge. The body has a length sufficient to extend across the planarizing zone and wrap around the roller.

Abstract: A polishing apparatus comprises a plurality of (three, for example) polishing portions and a cleaning portion. First, roughing is performed in a first polishing portion by a platen made of a hard grinder. The polishing surface of the platen is hard so that the wafer on the polishing surface exhibits no pattern dependence. Next, scratches and polishing distortion slightly generated on the wafer in the platen are removed (medium polishing) by a hard abrasive pad with a single-layered structure in a second polishing portion. Further, finishing is performed in a third polishing portion by an abrasive pad with a two-layered structure. At last, the contamination left by the micro scratches or slurry generated in the prior process is completely cleaned by a cleaning pad in the cleaning portion.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: A grinding machine has a swivel head (1) with at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the workpiece.

Abstract: The invention relates to a method and apparatus for polishing the end faces of optical components so that the end faces of an optical wave guide protrude a desired amount of protrusion from the connection end faces (of the ferrule) of the optical component. The polishing apparatus is composed of a connector holding section (16), a ferrule disposing section (15), and an ultrasonic wave generator (14). With an optical connector (1) held at the connector holding section (16), the end faces (6) are opposed to the connection end faces (of the ferrule) (5) side via a polishing member (20) and a ferrule (3) is disposed on the ferrule disposing section (15). A stepped guide pin (11) is inserted into the respective pin fitting holes (9) and (10) of the optical connector (1) and the ferrule (3), thereby correctly positioning the optical connector (1) and ferrule (3), wherein the ultrasonic wave generator (14) is driven in a state where the ferrule (3) is pressed to the optical connector (1) side.

Abstract: The surface of a workpiece is treated by discharging a stream of pliant shot in a carrier fluid at a shallow angle of incidence thereagainst. The shot is then scrubbed laterally along the surface for selectively removing target material therefrom.

Abstract: A polishing apparatus comprises a rotating table intermittently rotating through 120°0 increments; three polishing drums and three work-holding means 12 provided on the rotating table; a handling means for unloading a processed work from the work-holding means at a handling position and supplying an unprocessed work to the work-holding means at the same position; and a work-inverting means for inverting a work, the front-plane-side edge of which has been polished, at a front-plane edge polishing position.

Abstract: An apparatus for planarizing a semiconductor wafer having a polishing endpoint layer that includes a catalyst material is disclosed. The apparatus is operable to detect the endpoint based upon the chemical slurry whether a catalytic reaction has occurred due to the polishing platen removing a portion of the catalyst material from the wafer.

Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.

Abstract: A process for post processing a part that has a Nitinol coating applied by plasma spraying or PVD coating gives the Nitinol desirable properties of toughness and malleability. It also produces a layer of surface material that is extremely hard, chemically non-reactive, electrically and thermally insulating. The process includes selecting a part that has a surface coating of Nitinol applied by plasma spraying or PVD coating and polishing the surface coating to give it a smooth and shiny surface. The polished surface is then cleaned to remove all polishing residue. The surface of the Nitinol coating is heated a temperature in a range of about 400° C. to 900° C.; and is rapidly cooled by forced air flow over the surface coating or by low temperature air or liquid immersion. Thereafter, the outer surfaces of the layer of surface material may be repolished and reheated as before to enhance the layer of thermally produced surface material.

Abstract: To provide a small polishing means featuring high machining efficiency that is capable of efficiently and quickly mirror-polishing an outer periphery of a chamfered workpiece (5) by bringing the outer periphery into even contact with a plurality of polishing drums (2, 2) at the same time. In an apparatus for polishing an outer periphery by bringing an outer periphery of the workpiece (5) retained by workpiece retaining means (3a, 3b) into contact with two polishing drums (2, 2) simultaneously to perform mirror polishing, the workpiece retaining means (3a, 3b) are supported by a sliding mechanism (16) such that they may move in a direction in which the two polishing drums (2, 2) are arranged, thereby to form an aligning means. In addition, the workpiece retaining means (3a, 3b) are provided with loading means (30) for absorbing a force applied to the workpiece retaining means in an X direction, the force being generated due to contact between the rotating workpiece (5) and the polishing drums (2, 2).

Abstract: An apparatus having a processing chamber for processing a semiconductor wafer under evacuated conditions that is capable of transfer of the wafer from the processing chamber under conditions that are substantially equal to the pressure of an adjacent environment. In a preferred embodiment, the processing chamber is pressurized and vented with a source of high purity dry gas that is diffused into the chamber through a diffuser to pressurize the processing chamber after processing of the wafer is completed. A chamber equalization port between the processing chamber and the adjacent environment is opened to maintain the pressure within the chamber at or slightly above the pressure of the adjacent environment, and the chamber valve is then opened. The wafer can then be removed from the processing chamber, and a new wafer can be inserted. The chamber is then sealed by closing the chamber valve and the equalization port, and the atmosphere within the processing chamber is evacuated to a desired level.

Abstract: A polishing machine provided with a plurality of bases operative independently of each other; a plurality of abrasive pads respectively fixed to the plurality of bases and each having an abrasive surface for polishing a workpiece; and a base driving mechanism for individually operating the plurality of bases. The operations of the respective bases are individually controlled by controlling the base driving mechanism by means of a control circuit. The control circuit controls the base driving mechanism so that the workpiece is generally uniformly polished by the abrasive surfaces of the respective abrasive pads.

Abstract: The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station includes a workpiece processing surface; such as a polishing pad or buffing pad, defining a plurality of apertures for applying fluids, including water, chemicals, slurry, or vacuum, to the surface of a workpiece. In operation, a workpiece carrier moves a polished wafer from a primary polishing surface to the handoff station, and polishes, buffs, or cleans the wafer in the handoff station by rotating the wafer and oscillating the wafer across the handoff station polishing surface while pressing the wafer thereon.

Abstract: The present invention provides a dual purpose workpiece handoff station for intermediately staging a semiconductor wafer, or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station includes a workpiece processing surface; such as a polishing pad or buffing pad, defining a plurality of apertures for applying fluids, including water, chemicals, slurry, or vacuum, to the surface of a workpiece. In operation, a workpiece carrier moves a polished wafer from a primary polishing surface to the handoff station, and polishes, buffs, or cleans the wafer in the handoff station by rotating the wafer and oscillating the wafer across the handoff station polishing surface while pressing the wafer thereon.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: The present invention is directed to polishing the surface of an airplane part to an improved specularity by adding the additional step of sanding prior to the polishing step.

Abstract: In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

Abstract: An apparatus for grinding and polishing without visible flaws a variety of different size and shape full-lead crystal workpieces. A conveyor supports the workpieces and runs through the apparatus housing. A workpiece calibrator is located proximate the entrance end of the housing. A plurality of grinders having an abrasive grinding surface within a range of coarseness are located downline of the calibrator. A plurality of polishers are located downline of the grinders. Control means raises and lowers the calibrator, grinders and polishers relative to the belt conveyor and the unfinished surface of the workpiece supported thereon.A method of automatically making a finished full-lead crystal ornament using an automated machine having a housing, conveyor, a plurality of motor-driven grinding heads, and a plurality of motor-driven polishing heads.

Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.

Abstract: A polishing method and apparatus for a semiconductor wafer includes a loading section having a loading platform for mounting a loading cassette, and a loading robot arm for transferring a wafer from the loading cassette. The apparatus includes a standby stage having a pre-polishing stand on which the wafer is placed, and a post-polishing stand for holding the wafer after polishing, and a polishing table on which a polishing process is performed. A wafer moving device transfers the wafer from the pre-polishing stand to the polishing table and back to the post-polishing stand. An unloading section includes an unloading platform for mounting an unloading cassette, and an unloading robot arm for transferring the wafer to the unloading cassette. A measurement device, proximal to the unloading stage, analyzes a polishing state of the wafer and then a cleaning device cleans the wafer after the wafers are analyzed.

Abstract: A technique for integrating a film thickness monitoring sensor within a load and unload unit of a cluster tool for performing chemical-mechanical polishing (CMP). In order to determine CMP performance, a sensor (or sensors) for determining film thickness is/are integrated within the load and unload unit of the cluster tool. Accordingly, film thickness measurements can then be taken at discrete times during the processing cycle without removing the wafer from the cluster tool.

Abstract: A pressure sensing structure for measuring a local pressure on a surface of a wafer and a wafer carrier for communicating with the wafer is disclosed. The pressure sensing structure includes a conductive via extending through the wafer, a pressure transducer electrically connected to a first side of the conductive via, and a connector arranged in electrical contact with a second side of the conductive via. Further, a wafer incorporating multiple such pressure sensing structures is disclosed. In addition, a pressure sensing structure further including integrated circuitry in electrical contact with the pressure transducer and a conductive via is disclosed. The pressure sensing structure is well suited for use in sensing pressure variations throughout the surface of the wafer when a selected wafer layer is undergoing a chemical mechanical polishing operation.

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing.

Abstract: A polishing system comprises: a rotating mounting table 14 which is rotatable while holding an object W to be polished; a rotating polishing plate 28 which has a smaller diameter than that of the rotating mounting table and which is provided with an abrasive layer 30 on the surface thereof; a scanning mechanism 26 for moving the rotating polishing plate in radial directions of the rotating mounting table while pressing the abrasive layer on the object; and abrasive solution supply means 46 for supplying an abrasive solution to the surface of the object. Thus, the system can be decreased in size, and the polished quantity can be partially controlled.

Abstract: An apparatus for polishing a first side of a semiconductor wafer down to a desired level includes a polishing platen having a polishing surface. The polishing platen has a light egress opening defined therein. The apparatus also includes a wafer carrier which is configured to engage the wafer by a second side of the wafer and apply pressure to the wafer in order to press the wafer against the polishing surface of the polishing platen, wherein the wafer carrier has a light-ingress opening defined therein. The apparatus further includes an infrared light source unit positioned such that light signals generated by the infrared light source unit are directed out the light egress opening and into the wafer. The apparatus yet further includes a light receiving unit positioned such that the light signals generated by the infrared light source unit emanate out of the wafer and are received with the light receiving unit.

Abstract: Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.

Abstract: A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.

Abstract: The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.

Abstract: Method of making pistons and piston rods as well as cylinders for hydraulic and pneumatic apparatus, whereby a precision-finished cylindrical semi-finished article made of an aluminum alloy is hard-anodized at its sliding surface and whereby the hard-anodized article is rotated about its axis and the formed ceramic sliding surface layer thereof is treated by a plurality of successive grinding operations with two-dimensional grinding media of differing reducing grain size.

Abstract: Planarization of a patterned semiconductor wafer is effected by chemical-mechanical polishing using a carrier assembly comprising a carrier film adhesively bonded to a base plate, preferably by a pressure sensitive adhesive. Chemical-mechanical polishing is preferably conducted employing three phases of different pressures to prevent wafer slippage.

Abstract: A solid buffing compound made up of polishing powder and a bonding agent, wherein the bonding agent to be used is a good amount of water-soluble surface active agent and/or polyalkylene glycol which is an intermediate thereof; the melting point of said bonding agent is 30.degree. C. or more, and said bonding agent is water soluble so that a buff residue adhering on the surface of product, etc. after buffing may be washed out easily by use of water.

Abstract: The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.

Abstract: A sharpening and cleaning apparatus for sharpening scalloped-edged blades in a carton slitting machine includes at least two rotating cylindrical hones mounted on a pneumatically controlled actuator, and a pair of blade cleaning brushes mounted on a separate actuator. A sharpening operation is initiated by a machine operator as needed to maintain blade sharpness, and is performed automatically by the apparatus controls. The hone actuator positions the rotating hones in contact with opposing sides of a cutting edge of the slitting blade as the blade moves past the hones at reduced speed. A first hone is rotated in a direction opposite to the direction of the blade and a second hone is rotated in the same direction of the blade. During sharpening, the hones execute several reciprocating axial movements to stroke the blade. Prior to the operation of the hones the actuator positions the brushes in contact with the blade and causes the brushes to rotate to remove debris from the blade.

Abstract: A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization means is locked, so that the slide table is kept locked to the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is chamfered. A grinding wheel for polishing is used. The pressurization means is not locked, so that the slide table can be slide on the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is polished.

Abstract: A surface finishing apparatus for in-line outer surface finishing of elongate cylindrical stock. The stock, such as tubing, is fed through the finishing apparatus from an infeed to an outfeed position and rotated about its longitudinal axis. The outer surface of the stock is finish treated as the stock is fed through the apparatus. The finishing apparatus includes a rotatable finishing wheel having a finish-treating peripheral surface for being applied in an in-line orientation against the outer surface of the stock as the stock is simultaneously fed and rotated through the finishing apparatus. The wheel is mounted on an axis of rotation which is variable within a predetermined range of motion from one side to the other of the longitudinal axis of the stock. The finishing wheel is oscillated back and forth within the predetermined range of motion while in continuous contact with the stock.

Abstract: Provided is a polishing apparatus which comprises a polishing mechanism for polishing a wafer taken out from a cassette, an attaching-detaching device for attaching to and detaching the wafer from the polishing mechanism, a device for cleaning the polished wafer, and a transportation device for transporting the wafer between the cassette, polishing mechanism, attaching-detaching device, and cleaning device. These devices are arranged individually in compartments. A working chamber is divided into a plurality of compartments by means of partitioning devices. A device for polishing a workpiece is set in one of the compartments. The apparatus is also provided with communication devices for internally connecting the adjacent compartments which are divided by the partitioning devices. The apparatus may further comprise devices for individually controlling the respective internal pressures of the compartments or a device for generating an air flow in the form of a laminar flow in each of the compartments.

Abstract: Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first and second polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject, and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, and not intermittently.

Abstract: There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.

Abstract: A polishing tool includes a tool body and a polishing member which is mounted rotatably on the tool body and which has a central hole unit formed through the polishing member. The working surface of the polishing member has a plurality radially extending slots which are spaced apart from each other in an angularly equidistant relation and which extend from the inner periphery of the working surface to the outer periphery of the working surface. A plurality of flat working surface sections are defined on the working surface of the polishing member by the slots. When a slurry consisting of a lubricating liquid and abrasive grains flows onto the working surface of the polishing member via the central hole unit and when the polishing member is rotated on the tool body, each of the abrasive grains moves across all of the slots and from the inner periphery of the working surface to the outer periphery of the working surface, by hydrodynamic effect, so as to polish positively and effectively the workpiece.

Abstract: A machine is disclosed for forming facets on the surfaces of a plurality of workpieces. The machine is characterized by the presence of a plurality of pin members for holding the workpieces to be faceted against an abrading surface of a lap or an abrading wheel. The pin members are positioned and held together in a contiguous relationship. The machine also includes a mechanism for setting the angular relationship of the pin members relative to the lap or abrading wheel and for causing movement of the pin members away from the lap. An automated lap cooling, moisturizing and working compound supply system is also provided in another embodiment of this invention, for allowing continuous operation of the machine.

Abstract: A device for cleaning and/or polishing an end surface of an optical fiber is comprised of an insert and a cleaning rod. The insert has a hole formed throughout its length whose axis is eccentric to the optical fiber axis. The rod, when rotated, effectuates cleaning and/or polishing of the end surface of the optical fiber. The optical fiber is mounted in a fiber optic connector, which may be disposed within a corresponding coupling. Various industry-standard models exist for the connectors and the couplings. One or more inserts are designed and utilize various female-type adaptors or sleeves that properly hold the insert within the various types of couplings. Also, a male-type adaptor is provided that adapts the insert to several of the various types of connectors when the connectors are disconnected from their associated couplings.

Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: An apparatus for polishing medals for a game machine, and for separating an abrasive from the medals. An intake port (2) for the medals and the abrasive is provided on the lower end side of a polishing pipe (1) set upright, while a medal delivery port (3) is provided on the upper end side. A rotatable screw element (4) is mounted inside the polishing pipe (1) so as to lift up the medals and the abrasive while stirring them. A separation unit (A) which separates the abrasive from the medals and which feeds the separated abrasive to the intake port (2), is joined to the upper part of the polishing pipe (1).

Abstract: A plurality of parallel adjacent grooves are formed in at least one surface of a sheet of glass. Each of the multiple grooves has a maximum width dimension of 7 millimeters and a minimum angle between the grooved wall and the plane of the glass surface of 12.degree.. The grooves are formed by affixing the sheet of glass to the conveyor of a grinding machine and subjecting the glass sheet to one or more grinding wheels in which the surface thereof has a plurality of parallel adjacent grooves formed therein of the mirror image of the grooves to be formed in the glass, wherein the grooves are simultaneously cut in a single path.