Controlling Temperature Patents (Class 451/7)
  • Patent number: 10259098
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: April 16, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
  • Patent number: 10045878
    Abstract: A collecting bag for human body wastes having a barrier film (20a, 20b) covered by a comfort layer (15) attached to the barrier film in an attachment zone wherein the comfort layer is a textile material that is attached to said barrier film in one or more zones of attachment such that not all of the fiber filaments of the textile material in the attachment zone(s) are embedded in the barrier film material.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: August 14, 2018
    Assignee: Coloplast A/S
    Inventor: Markus Freiding
  • Patent number: 9620166
    Abstract: The invention relates to devices, systems and methods for restoring optical discs, including CD's, DVD's and Blu-ray discs. The invention provides an easy to use device for user's to repair optical discs without having to clean or remove rotating pads in the device between uses for the life of the pads of about 84 cycles.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: April 11, 2017
    Assignee: Venmill Industries
    Inventor: Mariusz Surowaniec
  • Patent number: 9168626
    Abstract: A tool sharpening assembly suitable for sharpening cutting tools. In accordance with some embodiments, the apparatus has a rotatable abrasive surface, and a tool support structure which contactingly supports a body portion of a tool while a cutting surface of the tool is presented against the abrasive surface during a sharpening operation. A cooling mechanism operates to reduce a temperature of the tool.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: October 27, 2015
    Assignee: Professional Tool Manufacturing LLC
    Inventors: Daniel T. Dovel, Christopher T. DeLorenzo, Steven J. Miner
  • Patent number: 9017139
    Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 28, 2015
    Assignee: Seagate Technology LLC
    Inventors: Marc Perry Ronshaugen, Joel W. Hoehn
  • Publication number: 20150093968
    Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Makoto FUKUSHIMA, Katsuhide WATANABE, Hozumi YASUDA, Satoru YAMAKI
  • Patent number: 8968054
    Abstract: A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: March 3, 2015
    Assignee: Siltronic AG
    Inventors: Peter Wiesner, Anton Huber
  • Publication number: 20150017881
    Abstract: A method of grinding spring ends of helical compression springs is carried out using a numerically controlled spring end grinding machine having a grinding unit, a loading unit and a control unit that controls the loading unit and the grinding unit. The grinding unit has a pair of grinding wheels including two rotatable grinding wheels between which is formed a grinding space. The loading unit has at least one loading plate substantially rotatable axially parallel to the grinding wheels and has a plurality of out-of-axis spring receptacles, each to receive a helical compression spring.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 15, 2015
    Inventors: Uwe-Peter Weigmann, Egon Reich, Thomas Kuttler
  • Patent number: 8932106
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: January 13, 2015
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Katsuhide Watanabe, Hozumi Yasuda, Satoru Yamaki
  • Publication number: 20140364040
    Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
    Type: Application
    Filed: August 26, 2014
    Publication date: December 11, 2014
    Inventors: Tadakazu SONE, Yasuyuki MOTOSHIMA, Toru MARUYAMA, Katsutoshi ONO, Yoichi SHIOKAWA
  • Patent number: 8893519
    Abstract: A cooling system and method for a machining process. The system includes a coolant supply and a coolant activation assembly, where the coolant supply is configured to provide coolant to the coolant activation assembly. The coolant activation assembly includes a plurality of piezoelectric actuators. Each of the plurality of piezoelectric actuators is configured to emit a coolant stream and to impart an ultrasonic or megasonic vibration component to each coolant stream. The coolant activation assembly is configured to provide cooling to a focal point in a work zone by directing multiple coolant streams emitted by the plurality of piezoelectric actuators to the focal point such that multiple coolant streams converge at the focal point.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: November 25, 2014
    Assignee: The Hong Kong University of Science and Technology
    Inventors: Yongsheng Gao, Shengyin Zhou
  • Patent number: 8881352
    Abstract: A machining device for machining crankshafts has a rotationally driven disk-shaped base body with blade inserts arranged peripherally thereon. A first supply line for a cryogenic cooling medium is arranged concentrically with the axis of rotation and is thermally insulated in at least some sections. The tool has a plurality of second supply lines for the cryogenic cooling medium running across the axis of rotation and leading to the blade inserts, the second supply lines each being thermally insulated in at least some sections. A distributor unit connects the first supply line to at least one of the second supply lines for supplying the cryogenic cooling medium to at least one of the blade inserts. The cryogenic cooling medium can be conducted directly to the blade inserts which are engaged with the crankshaft that is to be machined.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: November 11, 2014
    Inventors: Moshe Israel Meidar, Wolfgang Horn, Heiner Lang, Holger H. Kolb, Paul Dieter Scharpf
  • Patent number: 8882562
    Abstract: A scratch removal tool that includes a motor, a housing, a rotatable shaft operably coupled to the motor and movable in an axial direction along a length of the shaft, and a head assembly. The head assembly includes a shroud member having an open end, a pad member, a slurry input, a slurry output, and a seal member. The pad member is positioned within the shroud and mounted to the shaft. Rotation of the shaft rotates the pad member. Axial movement of the shaft moves the pad member relative to the open end of the shroud. The slurry input and slurry are in fluid communication with the pad member. The seal member is positioned at the open end of the shroud.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: November 11, 2014
    Assignee: TCG International Inc.
    Inventors: Jonathan P. Thomas, Keith A. Beveridge, Chad J. Olson
  • Patent number: 8845391
    Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: September 30, 2014
    Assignee: Ebara Corporation
    Inventors: Tadakazu Sone, Yasuyuki Motoshima, Toru Maruyama, Katsutoshi Ono, Yoichi Shiokawa
  • Patent number: 8834234
    Abstract: A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Junichi Ueno, Kazuya Sato, Syuichi Kobayashi
  • Patent number: 8821212
    Abstract: A method for operating a machining tool, comprising: setting a flow rate and a pressure of a flow of coolant to a target flow rate and a pressure target, respectively, the coolant flow being provided to the machining tool; machining a work-piece using the machining tool; measuring the flow rate and the pressure of the flow of coolant; and detecting an anomaly with respect to the coolant flow; and taking a corrective action depending on the type of the detected anomaly.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: September 2, 2014
    Assignee: Pratt & Whitney Canada Corp.
    Inventors: James Leishman, Amr Elfizy
  • Patent number: 8764515
    Abstract: An example component machining method includes immersing a surface of a component within a fluid during a machining process. The method heats the surface during the machining to vary the machining process at the surface relative to other surfaces of the component.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: July 1, 2014
    Assignee: United Technologies Corporation
    Inventor: John P. Rizzo, Jr.
  • Patent number: 8758087
    Abstract: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 24, 2014
    Assignee: DENSO CORPORATION
    Inventors: Kyohei Koutake, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Sumitomo Inomata, Masatake Nagaya
  • Patent number: 8753176
    Abstract: A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: June 17, 2014
    Assignee: Infineon Technologies AG
    Inventors: Werner Kroeninger, Manfred Schneegans
  • Patent number: 8746227
    Abstract: A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: June 10, 2014
    Assignee: Siltronic AG
    Inventors: Anton Huber, Wolfgang Gmach, Robert Kreuzeder, Peter Wiesner
  • Patent number: 8740667
    Abstract: According to one embodiment, a polishing method comprises pressing a substrate being rotated against a polishing pad being rotated and supplying slurry on the polishing pad, measuring a surface temperature of the polishing pad, and when the surface temperature is not less than a predetermined temperature, jetting jet stream containing supercooled droplets from a nozzle having a narrow portion toward the polishing pad.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: June 3, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masako Kodera, Yukiteru Matsui
  • Patent number: 8690636
    Abstract: A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 ?m.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: April 8, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventor: Yuichi Oshima
  • Publication number: 20140015107
    Abstract: Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired extent of variation of within wafer uniformity of a semiconductor wafer.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Ching-Kun Chen, Chun-Fu Chen, Chin-Ta Su
  • Patent number: 8616935
    Abstract: A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing endpoint time of the first and second substrates, respectively. The polishing method further includes calculating an overpolishing stop time where the overpolishing stop time is between the first polishing endpoint time plus the default overpolishing time and the second polishing endpoint time plus the default overpolishing time. Polishing of the first substrate is continued past the first polishing endpoint time and polishing of the second substrate is continued past the second polishing endpoint time. Polishing of both the first substrate and the second substrate is halted simultaneously at the overpolishing stop time.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: December 31, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Jimin Zhang, Ingemar Carlsson, Stephen Jew, Boguslaw A Swedek
  • Patent number: 8602845
    Abstract: A machining method comprises selecting a finished surface dimension and a material property for a working surface, defining a working temperature range based on the selected material property, and defining a machining power based on the working temperature range. The machining power depends on a removal rate and a specific heat of the working surface. The working surface is machined at the removal rate to achieve the finished surface dimension, and the machine power is controlled to maintain the working surface within the working temperature range. The working surface is heated or cooled from the working temperature range to a transition temperature range, such that the selected material property is preserved in the working surface.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 10, 2013
    Assignee: United Technologies Corporation
    Inventor: Changsheng Guo
  • Patent number: 8591286
    Abstract: Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 26, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Denis M. Koosau
  • Patent number: 8568200
    Abstract: An ultra-low temperature magnetic polishing machine includes a housing defining therein a grinding chamber, a door hinged to the housing and controllable to open/close the grinding chamber, a motor mounted inside the housing below the grinding chamber, a magnetic disc set in between the grinding chamber and the motor and rotatable by the motor to cause an alternative magnetic field in the grinding chamber, a freezer having an output pipeline inserted into the grinding chamber and freezing medium deliverable through the output pipeline into the grinding chamber, a container set in the grinding chamber, and magnetically conductive grinding media put in the container.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: October 29, 2013
    Assignee: Holding Electric Co., Ltd.
    Inventor: Lu-Jung Liao
  • Patent number: 8567384
    Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: October 29, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hiroshi Oishi, Koji Kitagawa, Hideo Kudo
  • Patent number: 8568198
    Abstract: A system for machining a work-piece is described which includes a machine tool and coolant delivery unit, pressure and flow rate sensors, and a control unit. The control unit controls coolant delivery and is adapted to detect a first anomaly when either a measured flow rate or pressure deviates from target flow rates and pressures by a first predetermined amount, and to detect a second anomaly when the measured flow rate or pressure deviates from the target flow rates and pressures by a second predetermined amount greater than the first. An alarm signal is outputted when the first anomaly is detected, and the machine tool is stopped when the second anomaly is detected.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: October 29, 2013
    Assignee: Pratt & Whitney Canada Corp.
    Inventors: James Leishman, Amr Elfizy
  • Patent number: 8563012
    Abstract: Certain embodiments disclosed herein relate to compositions, methods, devices, systems, and products regarding frozen particles. In certain embodiments, the frozen particles include materials at low temperatures. In certain embodiments, the frozen particles provide vehicles for delivery of particular agents. In certain embodiments, the frozen particles are administered to at least one biological tissue.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: October 22, 2013
    Assignee: The Invention Science Fund I, LLC
    Inventors: Edward S. Boyden, Daniel B. Cook, Roderick A. Hyde, Eric C. Leuthardt, Nathan P. Myhrvold, Elizabeth A. Sweeney, Lowell L. Wood, Jr.
  • Patent number: 8551505
    Abstract: Certain embodiments disclosed herein relate to compositions, methods, devices, systems, and products regarding frozen particles. In certain embodiments, the frozen particles include materials at low temperatures. In certain embodiments, the frozen particles provide vehicles for delivery of particular agents. In certain embodiments, the frozen particles are administered to at least one biological tissue.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: October 8, 2013
    Assignee: The Invention Science Fund I, LLC
    Inventors: Edward S. Boyden, Roderick A. Hyde, Eric C. Leuthardt, Nathan P. Myhrvold, Elizabeth A. Sweeney, Lowell L. Wood, Jr.
  • Patent number: 8529312
    Abstract: A nozzle for cooling lubricant is described having a connecting chamber with a chamber inlet and with a deflector plate in the interior of the connecting chamber that is held on at least two mounting means, a main chamber that is removably mounted by the rear face on the front face of the connecting chamber and has a diffusion plate with drilled holes, and a nozzle plate that is removably mounted by the rear face on the front face of the main chamber and has a hole pattern adapted to a grinding wheel profile.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: September 10, 2013
    Assignee: Saint-Gobain Diamantwerkzeuge GmbH & Co. KG
    Inventors: Marc Kritzky, Dieter Muchow, Alexander Foethke, Dietmar Paehler
  • Publication number: 20130217305
    Abstract: The present invention provides a method of working a high hardness material including the steps of heating the high hardness material, working the high hardness material by using a polishing tool, cooling the polishing tool at a position which is different from a worked part, and washing the polishing tool at a position which is different from the worked part.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 22, 2013
    Applicant: DENSO CORPORATION
    Inventor: DENSO CORPORATION
  • Patent number: 8485861
    Abstract: Certain embodiments disclosed herein relate to compositions, methods, devices, systems, and products regarding frozen particles. In certain embodiments, the frozen particles include materials at low temperatures. In certain embodiments, the frozen particles provide vehicles for delivery of particular agents. In certain embodiments, the frozen particles are administered to at least one substrate.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: July 16, 2013
    Assignee: The Invention Science Fund I, LLC
    Inventors: Edward S. Boyden, Daniel B. Cook, Roderick A. Hyde, Eric C. Leuthardt, Nathan P. Myhrvold, Elizabeth A. Sweeney, Lowell L. Wood, Jr.
  • Patent number: 8439723
    Abstract: A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: May 14, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Robert A. Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum
  • Publication number: 20130115855
    Abstract: According to one embodiment, a polishing method comprises pressing a substrate being rotated against a polishing pad being rotated and supplying slurry on the polishing pad, measuring a surface temperature of the polishing pad, and when the surface temperature is not less than a predetermined temperature, jetting jet stream containing supercooled droplets from a nozzle having a narrow portion toward the polishing pad.
    Type: Application
    Filed: March 8, 2012
    Publication date: May 9, 2013
    Inventors: Masako KODERA, Yukiteru MATSUI
  • Patent number: 8435096
    Abstract: A dust proof structure for a machine tool includes a flow guiding element located therein. The machine tool includes a housing chamber to hold a spindle and the flow guiding element. The housing chamber has an air intake section and an air discharge section communicating with the air intake section. The machine tool further has an air inlet communicating with the air intake section and an air outlet communicating with the air discharge section. The spindle is coupled with an action member outside the air outlet. When the spindle drives the action member to operate, the flow guiding element introduces external air through the air inlet to the air intake section, and directs the air to the air discharge section to be discharged towards the action member. Hence dust generated by the action member during operation of the machine tool does not enter the machine tool through the air outlet.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: May 7, 2013
    Assignee: X'Pole Precision Tools Inc.
    Inventor: Bach Pangho Chen
  • Patent number: 8409364
    Abstract: The invention relates to a method for removing at least part of at least one layer of a composite coating that is formed of fibers and at least one resin that is present on the surface of the body of a gas cartridge. In said method, at least one liquid nitrogen stream is dispensed at a temperature less than ?100 DEG C at a pressure of at least 00 bars upon contact with said coating so as to remove at least part of said coating layer present on the body of the gas cartridge.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: April 2, 2013
    Assignee: L'Air Liquide Societe Anonyme pour l'Etude el l'Exploitation des Procedes Georges Claude
    Inventors: Jacques Quintard, Frederic Richard, Charles Truchot
  • Publication number: 20130045596
    Abstract: According to one embodiment, a semiconductor device manufacturing method is provided. In the semiconductor device manufacturing method, a process target film is formed on a semiconductor substrate, and the surface of the process target film is polished by a CMP method. The CMP method comprises heating a rotating polishing pad from a first temperature to a second temperature higher than the first temperature, and bringing the surface of the process target film into contact with the polishing pad heated to the second temperature.
    Type: Application
    Filed: March 23, 2012
    Publication date: February 21, 2013
    Inventors: Hajime EDA, Yukiteru MATSUI
  • Publication number: 20130023186
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 24, 2013
    Inventors: Yasuyuki MOTOSHIMA, Toru Maruyama, Hisanori Matsuo
  • Patent number: 8353739
    Abstract: The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: January 15, 2013
    Assignee: Allison Transmission, Inc.
    Inventors: Elizabeth Frazee, Paul Horvath
  • Patent number: 8348719
    Abstract: Embodiments of a polisher for chemical mechanical planarization. The polisher includes a polishing pad structure containing a first reactant therein, and a second reactant in a polishing environment over the polishing pad structure. The first reactant and the second reactant react endothermically upon contact when polishing a wafer surface between the polishing pad structure and the polishing environment.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: January 8, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Hsien Lu, Liang-Guang Chen, Tien-I Bao, Shau-Lin Shue
  • Patent number: 8342908
    Abstract: An apparatus for thermal mechanical machining of composite materials includes a head, a drive, and a shaft. The head has an abrasive face. The drive is coupled to the apparatus to move the head to produce abrasion of the composite material by the abrasive face. The shaft includes a passageway that communicates a heated gas to an interface between the abrasive face and the composite material. The gas removes particles that result from the abrasion of the composite material by the abrasive face. The gas can be heated sufficiently to carbonize or vaporize organic constituents of the composite material.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: January 1, 2013
    Assignee: United Technologies Corporation
    Inventor: John H. Vontell
  • Patent number: 8342905
    Abstract: An optical disk restoration apparatus and optical disk restoration method are provided, which are capable of achieving a high level of capability of restoring a scratched optical disk, without consuming the time and labor of an operator, while reducing the production cost of the apparatus. During a polishing process, an appropriate amount of a polishing agent is dropped onto the readout surface of the optical disk by a polishing agent supply pump to continuously supply the polishing agent to the interface between the optical disk and polishing pads, while a polishing water supply pump is operated to replenish the polishing agent with moisture evaporated by the polishing heat. By this mechanism, the amount and physical properties of the polishing agent at the interface between the optical disk and the polishing pads are appropriately maintained for a long period of time, so that the restoration capability is maintained at high levels.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: January 1, 2013
    Assignee: Elm Inc.
    Inventors: Takakazu Miyahara, Terumasa Miyahara, Kazutoshi Chijiiwa
  • Publication number: 20120276816
    Abstract: A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
    Type: Application
    Filed: April 24, 2012
    Publication date: November 1, 2012
    Inventors: Katsutoshi Ono, Yu Ishii, Hisanori Matsuo, Kuniaki Yamaguchi
  • Patent number: 8292694
    Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: October 23, 2012
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Tetsuji Togawa, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama
  • Patent number: 8292691
    Abstract: A method and apparatus for temperature control for a chemical mechanical polishing process is provided. In one embodiment, the method comprises polishing the substrate with a surface of a polishing pad assembly, measuring a real-time temperature of the surface of the polishing pad assembly, determining whether the real-time temperature of the surface of the polishing pad assembly is within a predetermined processing temperature range, and contacting the surface of the polishing pad assembly with a pad conditioner to adjust the temperature of the surface of the polishing pad assembly to fall within the predetermined temperature range.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: October 23, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Thomas H. Osterheld, Jimin Zhang, Stephen Jew
  • Patent number: 8267742
    Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: September 18, 2012
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Koji Kitagawa
  • Publication number: 20120220196
    Abstract: A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 30, 2012
    Applicant: EBARA CORPORATION
    Inventors: Toru MARUYAMA, Tadakazu Sone, Yasuyuki Motoshima
  • Publication number: 20120220195
    Abstract: According to one embodiment, a CMP apparatus includes a supplying portion supplying a slurry to a surface portion of a polishing pad including water-soluble particles, a holding portion contacting an object to be polished with the surface portion of the polishing pad in a condition of holding the object, a temperature setting portion on the surface portion of the polishing pad, the temperature setting portion setting a temperature of the surface of the polishing pad. A control portion executes a first polishing step and a second polishing step after the first polishing step, the object is polished in a condition of setting the temperature of the surface of the polishing pad within a first temperature range in the first polishing step, and the object is polished in a condition of setting the temperature of the surface of the polishing pad within a second temperature range in the second polishing step.
    Type: Application
    Filed: September 15, 2011
    Publication date: August 30, 2012
    Inventors: Akifumi GAWASE, Yukiteru Matsui