Abstract: A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

Abstract: Thick film paste composition for applying conductive patterns to automotive window glass comprising finely divided particles of metallic silver, glass frit having transition metal oxide, contained in the glass, all of the particulate solids being dispersed in an organic medium.

Abstract: Thick film paste composition for applying conductive patterns to automotive window glass comprising finely divided particles of metallic silver, glass frit, and selected transition metal oxides, all of the particulate solids being dispersed in an organic medium.

Abstract: Lead-free, tin phosphate glasses contain 25-50 mole percent P.sub.2 O.sub.5, 30-70% SnO, 0-15% ZnO, the mole ratio of SnO:ZnO being greater than 5:1, and an effective amount up to 25% total of at least one oxide in the indicated proportion selected from the group consisting of up to 25% R.sub.2 O, wherein R.sub.2 O consists of 0-25% Li.sub.2 O, 0-25% Na.sub.2 O, and 0-25% K.sub.2 O, up to 20% B.sub.2 O.sub.3, up to 5% Al.sub.2 O.sub.3, up to 5% SiO.sub.2, and up to 5% WO.sub.3. The glasses are particularly useful as sealing glass frits in sealing material to join component parts in electrical and electronic devices. The sealing glass material may contain mill additions to reduce the effective coefficient of thermal expansion in a seal, as well as a strength reinforcing additive having a coefficient of thermal expansion preferably below 120.times.10.sup.-7 /.degree.C.

Abstract: There is disclosed a noble metal-containing overglaze colour composition in a liquid or paste form for application to ceramics. The composition comprises (1) a solution or paste of a resinate of a noble metal, (2) an amount sufficient to serve as a sintering inhibitor and alkali resistance improving agent of a solution or paste of a thorium resinate, (3) an adhesive, in particular bismuth, (4) an appropriate amount of a rosin and (5) an appropriate amount of a solvent and, further, wherein required, (6) chromium and (7) a small amount of rhodium. Preferably, the noble metal is gold, platinum or palladium.

Abstract: Purple pigments based on glass frits having an average particle diameter (D.sub.50 value) of 0.5 to 50 .mu.m, of which the surface has a coating of essentially 0.05 to 5% by weight, based on the pigment, of colloidal gold and, if desired, color-modifying metals from the group consisting of Ag, Cu, Co, Ni, Sn, Ru, Rh, Pd, Os, Ir and Pt in a total quantity below that of the gold. The purple pigments do not require the hitherto necessary calcination step and can be used for pigmenting glazes, enamels, glass colors, decorative colors, plastics, printing inks and lacquers.

Abstract: Resistor composition to produce thick film resistors, preferably the resistor films in sensors for temperature measurement, includes glass frit and an oxide which is at least one of CaCu.sub.3 Ru.sub.4 O.sub.12 and LaCu.sub.3 Ru.sub.4 O.sub.12.

Abstract: A silver-glass paste comprising silver flake, lead vanadium telluride glass, resin, surfactant and a mixture of solvents, said mixture comprising at least two solvents selected from the group consisting of glycol ether, isoparaffin, and terpineol, each of said solvents having a boiling point of from about 170.degree. C. to about 230.degree. C. and a surface tension of from about 20 to about 30 dynes/cm.sup.2.

Abstract: Disclosed is a thick film sense resistor composition containing palladium and silver in a weight ratio of about 56/44 to about 60/40 and a specific glass frit composition so that the sense resistor achieves low resistivity and controlled TCR.

Abstract: Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.

Abstract: A fusion sealing material containing a mill addition, a sealing tape cast from the material, and a method of producing the tape. The material is composed of a low temperature glass, a mill addition that lowers the effective coefficient of thermal expansion of the glass in a seal and an organic medium. The sealing tape is prepared by hot mixing the solids with a liquefied medium, such as a high melting alcohol, and casting the hot mix onto a cold sheet to immediately solidify the medium.

Abstract: Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

Abstract: An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.

Abstract: Enamel-like coatings consisting of glass frits and pigments are used for auto glass panes. An improved opacity of these enamel layers relative to silver conducting tracks on these layers is achieved if 0.1 to 10% by weight silicon, boron, carbon, lead and/or silver in elemental form are added to the enamel.

Abstract: There is disclosed a sealing material based on a lead sealing glass having a mill addition of a crystalline material having the crystalline structure of magnesium pyrophosphate. The effective coefficient of thermal expansion in a seal is substantially reduced by the mill addition, thereby permitting use with low expansion materials.

Abstract: Mill additions are disclosed which lower the CTE of, and are compatible with, tin-phosphorus oxyfluoride glasses. The sealing materials provide fusion-type seals having a CTE not over about 110.times.10.sup.-7 /.degree.C. and a sealing temperature not over about 350.degree. C.Also disclosed is a family of glass compositions in the tin-phosphorus oxyfluoride system that exhibit very low glass transition temperatures and coefficients of thermal expansion not over about 160.times.10-7/.degree.C. (25.degree.-150.degree. C.). In addition to the four basic elements, the glasses contain up to 11% Nb, and may additionally contain up to 10%, taken individually or in combination, of V, Fe and/or Mo to further decrease the Tg and CTE values.

Abstract: An improved sliver-glass paste for bonding a semiconductive element to a substrate comprising silver flake, glass frit, a surfactant, a thixotrope and a low boiling paraffinic hydrocarbon solvent.

Abstract: Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks for multilayer printed-circuit boards.

Abstract: A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.

Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.

Abstract: An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

Abstract: A surface conductive paste composition to be applied to the surface of a green sheet for a cermaic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glas frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Abstract: An abrasion resistant low temperature air fired thick film ink composition is disclosed. The composition includes a glass matrix material having a softening point below about 700.degree. C., a particulate conductive material and a particulate reinforcing material.

Abstract: This specification is directed to a UV-base ceramic paint composition and a method of forming a glass sheet with a UV-base ceramic paint thereon. The method has the following steps. A UV-base ceramic paint is applied to the glass sheet. The UV-base ceramic paint includes selected ceramic paint components along with, as a new component thereof, finely divided zinc metal powder. The glass sheet is subjected to UV radiation and then heated to a temperature which softens the glass sheet sufficiently so that the glass sheet can be formed. The glass sheet and the ceramic paint thereon are engaged with a fiberglass covered forming die to form the heated glass sheet to a desired shape. The forming die is removed from engagement with the glass sheet. The finely divided zinc metal powder addition to the ceramic paint is credited with being effective to prevent sticking of any of the ceramic paint to the forming die. The glass sheet is cooled to obtain a formed glass sheet with a ceramic paint thereon.

Abstract: A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

Abstract: A metallizing composition is described that comprises 100 parts by weight of Au powder, from 2 to 7 parts by weight of CuO powder, from 0.3 to 2 parts by weight of a glass-based inorganic powder free from PbO, and from 3 to 8 parts by weight of a resin.

Abstract: Silver-filled glass pastes useful for the attachment of silicon semi-conductor devices (dies) to substrates comprise particulate silver and a lead phosphate glass, together with conventional organic components. The pastes have low bonding temperatures, and give good adhesion at firing temperatures of 350.degree. to 460.degree. C.

Abstract: The invention relates to glaze resistors which are used for electronic parts of hybrid integrated circuit devices, chip resistors, resistor network, etc. The glaze resistor comprises 4.0 to 70.0 wt % of a conductive component composed of a metal silicide and a metal boride and 30.0 to 96.0 wt % of glass in which a rate of said metal boride is 1.0 to 68.0 wt %. Thus, the glaze resistor can be formed by sintering in a non-oxidizing atmosphere and can provide a circuit, together with conductor pattern of base metals such as Cu.

Abstract: A surface conductive paste composition to be applied to the surface of a green sheet for a ceramic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glass frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Abstract: A solder paste for fastening semiconductors onto ceramic bases in a temperature range below 380.degree. C., consisting essentially of (1) 75 to 90% by weight of a mixture of silver powder and a low-melting glass powder with the weight ratio of silver to glass being between 2:1 and 9:1 and (2) 10 to 25% by weight of an organic solvent which contains 1 to 10% by weight of a thermally readily decomposable resin, the glass powder consisting essentially of 75 to 85% by weight lead oxide, 8 to 15% by weight boron oxide, 0.5 to 10% by weight silver (I) oxide 0.5 to 10% by weight bismuth (III) oxide, 0 to 5% by weight silicon dioxide, 0 to 2% by weight aluminum oxide 0 to 2% by weight tin oxide, 0 to 2% by weight zinc oxide, the glass powder having a glass transition temperature (Tg) of 250.degree. to 300.degree. C.

Abstract: In glass enamel coating compositions containing a glass frit system, optionally a metal oxide pigment and a vehicle therefor, the improvement comprising the presence therein of a series of metal powders to provide anti-stick, color maintenance and adhesion properties; the resulting coatings being particularly effective for application to glass sheets which are subsequently subjected to high temperature forming procedures.

Abstract: A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.

Abstract: A composition which is useful for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit and fatty acid-based surfactant dispersed, in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents and an acrylic polymer which is free of polar functional groups.

Abstract: PbO-B.sub.2 O.sub.3 -Ag.sub.2 O glasses having a preferred weight ratio range of 76-88:10-15:2-10 have glass transition temperatures of less than 300.degree. C. and are especially useful for adhering together ceramic substrates such as for attaching integrated circuits to ceramic substrates. The glasses can be formulated with Ag particulates and organics and applied as pastes to provide conductive adhesives.

Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.

Abstract: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

Abstract: This specification is directed to a UV-base ceramic paint composition and a method of forming a glass sheet with a UV-base ceramic paint thereon. The method has the following steps. A UV-base ceramic paint is applied to the glass sheet. The UV-base ceramic paint includes selected ceramic paint components along with, as a new component thereof, finely divided zinc metal powder. The glass sheet is subjected to UV radiation and then heated to a temperature which softens the glass sheet sufficiently so that the glass sheet can be formed. The glass sheet and the ceramic paint thereon are engaged with a fiberglass covered forming die to form the heated glass sheet to a desired shape. The forming die is removed from engagement with the glass sheet. The finely divided zinc metal powder addition to the ceramic paint is credited with being effective to prevent sticking of any of the ceramic paint to the forming die. The glass sheet is cooled to obtain a formed glass sheet with a ceramic paint thereon.

Abstract: A matrix of a glass or a plastic is mixed with 1% to 10% of a niobium substance, 1% to 10% of a magnesium compound, 1% to 10% of barium fluoride, and 5% to 30% of lead, the percentages indicating the weight of these substances the matrix. The mixture is heat-molded to form an anti-fogging material.

Abstract: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and underlying substrate or dielectric film is required.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

Abstract: An electrically stable radio frequency interference suppressing glass-type resistor seal composition forming a gas-tight seal within the center bore of a ceramic insulator is disclosed that contains borosilicate glass, barium borate glass, mullite, zirconia, carbon black, bentonite, sucrose, lithium carbonate and small, approximately equal amounts of antimony and silicon.

Abstract: An ink for use in forming resistive structures for use in a gas discharge display panel containing mercury vapor to inhibit cathode sputtering, the ink comprising a mixture of silver and nickel with the nickel being controllably oxidized to impart the desired resistivity to the mixture and the final resistive body in the display panel.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a novel zinc-aluminum-lead-borosilicate glass frit, bismuth oxide and a suitable organic vehicle. The inks are advantageous in that the films formed therefrom are oxidation resistant and have a reduced tendency for flux components to leach into adjacent dielectric films.

Abstract: A silver-glass composition for use in attaching a semiconductor support and a method for making the attachment are disclosed. The glass component of the composition is a low melting point glass comprising about 75-85 wt. % lead oxide, about 8-15% boron oxide, about 0.75 to 2.5 wt. % silicon-dioxide, 0-10 wt. % zinc oxide, 0 to 3 wt. % alumina, 0.5 to 5.5 wt. % cuprousoxide and a non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1.0:0.25 to 1.0:10. The weight ratio of silver to glass in the composition is in the range about 2:1 to 9:1.

Abstract: A continuous process for making a solid solution of two or more metals or metal oxides by ionic reaction and coprecipitation during high intensity mixing.

Abstract: The invention comprises a solid material that is an electrical conductor in a single direction which comprises an amorphous glass matrix containing a plurality of microscopically thin metal filaments, all of which are oriented in the direction of conductivity and extend to or near the surfaces of the solid material. This directionally conducting material is produced by subjecting a metastable glass supersaturated with metal to directed ionic radiation. On irradiation parallel microscopic holes or pores are formed which become filled with molten metal during tempering, which cool to form metallic dipole filaments. The thickness of the material and the angle of irradiation may be selected to produce dipole filaments of lengths appropriate to act as antennas for electromagnetic radiation of wavelengths from less than about 0.1 micron to about 1 mm. The direction of conductivity, i.e.

Abstract: Disclosed is a method for making glass bonded metal oxide electric resistors involving including in the mixture a refractory oxide for providing configuration stability during firing.

Abstract: A composition for a dielectric ink used in a screening process including a lead-free glass frit binder, silica, and a vehicle. The dielectric composition is particularly suited for use in gas plasma display panels.