Abstract: There is described a new material for jewelry and commodities which has a relatively low density and also is low carat but resistant to oxidation and corrosion. It consists of a noble metal or alloy and 1 to 70 volume % glass, whereby as glass there is used a glass frit having a transformation temperature of 300.degree. to 500.degree. C. and a softening interval of over 80.degree. C. There is also described a process for its production.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A glaze resistor composition composed of a glass frit, molybdenum disilicide, tantalum disilicide, magnesium silicide and aluminum. This glaze resistor composition has a small temperature coefficient of resistivity, a high resistivity stability and small current noises, and can be used in a wide resistivity range.

Abstract: A temperature sensitive electrical element and method of making the same comprising the steps of applying to the surface of a substrate and firing a mixture of glass frit and particles of titanium dioxide (TiO.sub.2), and titanium metal. The mixture is fired in a non oxidizing, inert, or reducing atmosphere at a temperature which softens of the glass frit. When cooled, an element is provided with a glass film strongly bonded to the substrate and having dispersed therein conductive particles mainly of titanium oxide (Ti.sub.2 O.sub.3). The element produced can be terminated by the use of electroless plating and provides a substantially linear resistance to temperature characteristic and a relatively high temperature coefficient of resistance.

Abstract: The forming of hermetic seals suitable for sealing materials having dissimilar thermal expansions which are formed by reacting an effective amount of a metal powder, selected from the group consisting of aluminum, antimony and zirconium, with glass frit having a softening point of <750.degree. C. and a coefficient of thermal expansion sufficiently compatible with the materials being sealed to yield seals characterized by a coefficient of thermal expansion closely matching or similar to those of the materials being sealed and a use temperature equal to or greater than 1000.degree. C. The seals of this invention are particularly suitable for bonding ceramic to ceramic.