Abstract: Ceramic shaped abrasive particles have four major sides joined by six common edges. Each one of the four major sides contacts three other of the four major sides. The six common edges have substantially the same length. Methods of making the ceramic shaped particle are disclosed. The ceramic shaped abrasive particles are useful for abrading a surface of a workpiece. An abrasive article includes the ceramic shaped abrasive particles retained in a binder.

Abstract: Disclosed is cerium oxide powder for a CMP abrasive, which can improve polishing selectivity of a silicon oxide layer to a silicon nitride layer and/or within-wafer non-uniformity (WIWNU) during chemical mechanical polishing in a semiconductor fabricating process. More particularly, the cerium oxide powder is obtained by using cerium carbonate having a hexagonal crystal structure as a precursor. Also, CMP slurry comprising the cerium oxide powder as an abrasive, and a shallow trench isolation method for a semiconductor device using the CMP slurry as polishing slurry are disclosed.

Abstract: The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.

Abstract: Abrasive aggregates and fixed abrasive articles comprising formaldehyde-free polymer binder and a plurality of abrasive grains are provided that are particularly suitable for machining operations, in which abrasion is carried out to remove material and improve surface quality. Certain embodiments combine an abrasive grain, which can be in the form of microparticles, and a formaldehyde-free polymer binder, which can be in the form of a polymer resin and cross-linking agent. Optionally, the abrasive aggregate can contain a secondary cross-linking agent, or a functional filler, such as a grinding aid.

Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section of metal or alloy-bonded abrasive grains on the outer periphery of the base is provided. The abrasive grains are diamond and/or cBN grains having an average grain size of 45-310 ?m and a TI of at least 150. The blade section includes overlays having a thickness tolerance (T3max?T3min) of 0.001 mm to 0.1×T2 mm. The blade section has a roundness (ODmax/2?ODmin/2) of 0.001 mm to 0.01×ODmax mm.

Abstract: Aggregate abrasive grains (10) for use in the production of abrading or cutting tools are formed. Each aggregate abrasive grain comprises an abrasive core particle and a plurality of abrasive peripheral particles disposed around the core particle. The abrasive particles intended as the core particles (12) are provided with a coating containing a binder. These binder-coated core particles (26) are then surrounded with those particles that are intended to become the peripheral particles (28) of the aggregate grains. The binder-coated core particles surrounded with the peripheral particles are heated up to a temperature at which the binder softens so that the peripheral particles are caused to attach to the core particles.

Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.

Abstract: A structured abrasive article includes a backing having a structured abrasive layer disposed on and secured thereto. The structured abrasive layer includes shaped abrasive composites that comprise abrasive particles and nonionic polyether surfactant dispersed in a crosslinked polymeric binder. The abrasive particles have a mean particle size of less than 10 micrometers. The nonionic polyether surfactant is not covalently bound to the crosslinked polymeric binder and is present in an amount of from 2.5 to 3.2 percent by weight based on a total weight of the shaped abrasive composites. The structured abrasive articles are useful for abrading a workpiece.

Abstract: Methods of treating a plurality of particles comprise functionalizing a plurality of microscale diamond particles by covalently bonding one or more molecular groups selected from the group consisting of —OH functional groups, —COOH functional groups, —R—COOH functional groups, wherein R comprises alkyls, —Ph—COOH functional groups, wherein Ph comprises phenolics, polymers, oligomers, monomers, glycols, sugars, ionic functional groups, metallic functional groups, and organo-metallic functional groups to outer surfaces of at least some particles of the plurality of microscale diamond particles. A stability of the functionalized plurality of microscale diamond particles in dispersion is increased as compared to a plurality of microscale diamond particles that has not been functionalized.

Abstract: An abrasive article includes a bonded abrasive body having abrasive particles contained within a bond material. The abrasive particles include silicon carbide and are essentially free of carbon-based and boron-based sintering aid materials. In an embodiment, the bond material can include a phenolic resin. In another embodiment, the bonded abrasive body can include an oxide phase disposed interstitially between the silicon carbide abrasive particles. In an additional embodiment, the abrasive particles can consist essentially of silicon carbide and aluminum oxide in a ratio of silicon carbide to alumina of at least about 8:1.

Abstract: An abrasive article includes a bonded abrasive having a body made of abrasive grains contained within a composite bond material. The composite bond material can include an organic material and a metal material. The body can also include a filler material made of a superabrasive material. In an embodiment, the filler material can have an average particle size at least about 10 times less than an average particle size of the abrasive grains.

Abstract: An abrasive article can include an abrasive segment. The abrasive segment can have a body that includes a plurality of abrasive aggregates. In addition, the abrasive aggregates can include a plurality of silicon carbide particles bonded together by a binder material phase. The abrasive aggregates can be contained within a bond material that includes a magnesia-based cement. In an embodiment, the binder material phase can include a vitreous phase material and a crystalline phase material. In particular instances, the binder material phase can include a certain porosity. In another embodiment, the abrasive segment can be formed from a mixture of abrasive aggregates including silicon carbide and a magnesia-based bond material.

Abstract: The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.

Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b). (a) Producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %. (b) Producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.

Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: Coated particles comprise a core particle comprising a superhard material and having an average diameter of between 1 ?m and 500 ?m. A coating material is adhered to and covers at least a portion of an outer surface of the core particle, the coating material comprising an amine terminated group. A plurality of nanoparticles selected from the group consisting of carbon nanotubes, nanographite, nanographene, non-diamond carbon allotropes, surface modified nanodiamond, nanoscale particles of BeO, and nanoscale particles comprising a Group VIIIA element is adhered to the coating material.

Abstract: An abrasive product is disclosed. The abrasive product includes a binder support substrate, a binder, an abrasive material affixed to the support substrate by the binder, and an antiloading composition on the surface of the abrasive product. The antiloading composition is a lauryl sulfate. The lauryl sulfate is the only organic antiloading compound included in the antiloading composition.

Abstract: A CMP slurry for metallic film is provided, which includes water, 0.01 to 0.3 wt %, based on a total quantity of the slurry, of polyvinylpyrrolidone having a weight average molecular weight of not less than 20,000, an oxidizing agent, a protective film-forming agent containing a first complexing agent for forming a water-insoluble complex and a second complexing agent for forming a water-soluble complex, and colloidal silica having a primary particle diameter ranging from 5 to 50 nm.

Abstract: A chemical mechanical polishing pad includes a polishing layer formed using a composition that includes a thermoplastic polyurethane, the polishing layer having a specific gravity of 1.15 to 1.30, and a durometer D hardness of 50 to 80.

Abstract: The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.

Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Abstract: Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (a1) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.

Abstract: An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.

Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of bundles of first long fibers and an elastomer embedded into the bundles. The bundles of first long fibers are entangled with each other.

Abstract: An abrasive article can include a bonded abrasive body having abrasive particles comprising microcrystalline alumina (MCA) contained within a bond material. In an embodiment, the bonded abrasive body has a porosity of at least about 42 vol % of the total volume of the bonded abrasive body. Additionally, in an embodiment, the bonded abrasive body is capable of grinding a workpiece comprising metal at a speed of at least about 60 m/s at a material removal rate of at least about 0.4 in3/min/in (258 mm3/min/mm).

Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.

Abstract: A bonded abrasive tool includes a bonded abrasive body having a bond matrix material comprising an organic bond material, abrasive grains contained within the bond matrix material, and chopped fiber bundles within the bond matrix material. The tool further has a porosity within the bonded abrasive body, wherein a majority of the porosity comprises pores surrounding the chopped fiber bundles.

Abstract: The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained.

Abstract: A superabrasive resin product includes a superabrasive grain component, an oxide component, and a continuous phase defining a network of interconnected pores. The oxide component consists of an oxide of a lanthanoid, and the continuous phase includes a thermoplastic polymer component. The superabrasive grain component and the oxide component are distributed in the continuous phase.

Abstract: An abrasive that can impart a mirror finish, glossiness, or the like to a surface of a workpiece by blasting is provided. A crosslinked polyrotaxane compound having a network structure where crosslinking points are circular molecules of polyrotaxane and also having abrasive grains dispersedly mixed therein is obtained by causing chemical bonding between the circular molecules of the polyrotaxane in a state where the abrasive grains and the polyrotaxane are mixed. Then, the crosslinked polyrotaxane compound is granulated to a predetermined grain diameter to obtain a gel-like abrasive where a part of the dispersedly mixed abrasive grain is exposed at the surface. By using the thus-obtained gel-like abrasive in blasting by projecting the abrasive at an angle tilted with respect to a surface of a workpiece, mirror finishing or the like is possible without making the surface of the workpiece pearskin-like.

Abstract: There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing with respect to the urethane foam pad with a pressure of 15000 g/cm2 or above, a polishing pad manufactured by this method, and a method for polishing a wafer by using this polishing pad. There can be provided a method for manufacturing a polishing pad that can stably obtain a wafer with high flatness, etc.

Abstract: The disclosure is directed to a radiation curable composition including abrasive grains and a binder composition. The binder composition includes about 10 wt % to about 90 wt % cationically polymerizable compound, not greater than about 40 wt % radically polymerizable compound, and about 5 wt % to about 80 wt % particulate filler based on the weight of the binder composition. The particulate filler includes dispersed submicron particulates.

Abstract: A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.

Abstract: The present invention provides an abrasive article, e.g. a sheet of sandpaper, comprising a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and an exposed non-slip coating layer on the first major surface, the non-slip coating layer comprising at least a base resin and a tackifying resin.

Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor which make use of this abrasive.

Abstract: An abrasive article includes a polymer binder, an infrared radiation absorbing dye, and abrasive grains. In particular embodiments, the abrasive articles have been at least partially cured using infrared radiation. The abrasive articles of the present invention can include, for example, coated abrasives, structured abrasives, and bonded abrasives. Methods for manufacturing abrasive articles include at least partially curing an article that includes a polymer binder precursor, an infrared radiation absorbing dye, and abrasive grains using infrared radiation.

Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.

Abstract: A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive.

Abstract: A cleaning apparatus includes a cleaning tank having a space to contain flexible flake cleaning media, a cleaning target object holding unit holding a cleaning target object having adherent substances inside the cleaning tank, a gas flow generator unit generating a gas flow to move the cleaning media toward the cleaning target object such that the cleaning media contact the cleaning target object to remove the adherent substances from the cleaning target object, and an adherent substance collection unit moving the gas flow to collect the adherent substances removed from the cleaning target. A surface of the cleaning medium includes abrasive grains to remove the adherent substances from the cleaning target object by causing the surface of the cleaning medium having the abrasive grains to slide on the cleaning target object while the surface of the cleaning medium having the abrasive grains is in contact with the cleaning target object.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: A bonded abrasive tool includes a bonded abrasive body having a bond matrix material comprising an organic bond material, abrasive grains contained within the bond matrix material, and not greater than about 5 vol % chopped fiber bundles within the bond matrix material. The tool further has a porosity within the bonded abrasive body, wherein a majority of the porosity comprises pores surrounding the chopped fiber bundles.

Abstract: An abrasive material is fabricated. The material is made of bamboo charcoal. The charcoal has vascular bundles and abrasive particles are uniformly distributed and fixed on inner surfaces of the vascular bundles. Thus, the abrasive material can be used with self-sharpening for grinding, polishing, lubricating, etc.

Abstract: Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

Abstract: This invention provides a polishing pad, which includes a substrate and a plurality of discrete abrasive blocks fixed on the substrate, wherein the abrasive blocks are of at least two kinds of heights. This invention would not reduce the polishing rate dramatically during the process for polishing a wafer by using the polishing pad in the long run. Therefore a thickness of the wafer to be polished is able to be controlled accurately, thereby improving the effect and yield of polishing the wafer. The present invention further provides a method for manufacturing the polishing pad. The polishing pad according to this invention is manufactured conveniently by using this method. Correspondingly, a method for using the polishing pad is also provided in this invention.

Abstract: An abrasive particle includes a substantially spheroid metal containing matrix having a circumference and a super abrasive material having an average diameter of less than about 8 micrometer at least partially embedded the circumference of the metal containing matrix. The abrasive particle having an average diameter of less than about 200 micrometer.

Abstract: An abrasive tool includes a matrix material and an abrasive grain contained within the matrix material. The matrix material includes a binder and an block copolymer. The block copolymer including a binder miscible block and a binder immiscible block. The binder immiscible block of the block copolymer can form toughening domains within the matrix material. A method of forming an abrasive tool includes blending a binder powder, an block copolymer powder, and an abrasive grain to form a blended powder, shaping the blended powder, and curing the blended powder.

Abstract: A superabrasive product, such as a superabrasive tool, includes a superabrasive grain component and a porous continuous phase that includes a thermoplastic polymer component in which the superabrasive grain component is distributed. A superabrasive product precursor to the superabrasive product includes a superabrasive grain component, a bond component and a polymer blowing agent of encapsulated gas. A method of forming a superabrasive product includes combining a superabrasive, a bond component and a polymer blowing agent of encapsulated gas to form, for example, a superabrasive product precursor. The combined superabrasive, bond component and polymer blowing agent of encapsulated gas are heated to a temperature and for a period of time that causes release of at least a portion of the gas from encapsulation within the blowing agent.

Abstract: An abrasive element consisting substantially of a glass material that is at least partially devitrified.

Abstract: An abrasive article includes a fibrous substrate, a binder disposed on the fibrous substrate, and abrasive grains in contact with the binder. The binder includes an imide cross-linked urethane derived from a blocked isocyanate component and an anhydride component.

Abstract: An abrasive article comprising an abrasive particle including a core comprising a compressible material, an intermediate layer comprising a binder material overlying an exterior surface of the core, and an outer layer comprising abrasive grains overlying the intermediate layer.