Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ? CV value of 0 to 10% and water.

Abstract: Disclosed is a monofilament allowing contrast X-ray radiography. At least part of the monofilament is formed of a thermoplastic resin containing a radiopaque agent. The monofilament contains the radiopaque agent in the thermoplastic resin in a content of 30 to 80% by mass, and has a Young's modulus of 0.1 to 5.0 cN/dtex and a fineness of 500 to 20000 dtex.

Abstract: A method for producing a highly uniform and highly dense sintered cubic boron nitride compact having high hardness by sintering at a milder condition without a binder, is provided. The method includes deflocculating secondary particles in cubic boron nitride starting powders by dispersing the starting powders in a solution of a deflocculant; molding the green compact after removing the solution of the deflocculant from the starting powders; and then sintering the green compact in the presence of a supercritical fluid source in a supercritical state by pressing and heating the green compact together with the supercritical fluid source. The supercritical fluid source can be one or more selected from a group consisted of polyvinylidene chloride, polyvinyl chloride, polyethylene, polypropylene, polystyrene, a polyester and an ABS resin. In the sintering, the pressure is 5 GPa or higher, and the temperature is 1400° C. or higher.

Abstract: There is provided a polishing composition, containing abrasive grains and an acid represented either by R2—R1—SO3H (wherein R1 is a linear alkylene or hydroxyalkylene group having 1 to 4 carbon atoms, and R2 is a hydroxy group, a carboxy group, or a sulfonic acid group when R1 is the linear alkylene group, or R2 is a carboxy group or a hydroxymethyl group when R1 is the linear hydroxyalkylene group), or by C6H5—R3 (wherein R3 is a sulfonic acid group or a phosphonic acid group). The acid contained in the polishing composition is preferably isethionic acid or benzenesulfonic acid. The polishing composition is mainly used in the application of polishing silicon oxide materials including glass substrates for hard disks, synthetic quartz substrates for photomasks, and low-dielectric-constant films such as silicon dioxide films, BPSG films, PSG films, FSG films, and organosiloxane films of semiconductor devices.

Abstract: Lofty open nonwoven abrasive articles, unitized abrasive wheels, and convolute abrasive wheels include a dipodal aminosilane. Methods of making the abrasive articles are also included.

Abstract: A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad comprising an ultrafine fiber-entangled body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex, and a polymeric elastomer. The polymeric elastomer has a glass transition temperature of ?10° C. or below, storage moduli at 23° C. and 50° C. of 90 to 900 MPa, and a water absorption ratio, when saturated with water at 50° C., of 0.2 to 5 mass %.

Abstract: A cloth backing for an abrasive article is treated by combining a phenolic resin, a latex and a colloidal silicon oxide composition to prepare a colloidal formulation, which is then applied to the cloth backing and cured. Coated abrasive articles are formed by applying a make coat formulation to the treated cloth backing, applying an abrasive and then curing the make coat formulation.

Abstract: An abrasive article comprising abrasive grains bonded with a binder comprising a matrix polymer and an amphiphilic block copolymer dispersed in the matrix polymer. The abrasive article can be a coated abrasive article, such as an engineered abrasive article, including a backing. The binder can bind the abrasive grains to the backing.

Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.

Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.

Abstract: Abrasive articles, and methods of making abrasive articles by using a laser to convert (e.g., cut) at least a portion of the abrasive coating to form the abrasive article. The method includes laser propagation impinging on the abrasive back side (opposite the abrasive coating) and progressing through to the abrasive side. Such a process inhibits ridging effects around cut regions (e.g., openings) on the front side.

Abstract: Flexible, sheet-like substrates having an abrasive surface, which are obtainable by applying an aqueous solution or dispersion of at least one precondensate of a heat-curable resin to the top and/or bottom of a flexible, sheet-like substrate in an amount in the range from 0.1 to 90% by weight, based on the uncoated, dry substrate, crosslinking the precondensate and drying the treated substrate, wherein the aqueous solution or dispersion of at least one precondensate of a heat-curable resin comprises (i) a polymeric thickener selected from the group consisting of biopolymers, associative thickeners and wholly synthetic thickeners in an amount ranging from 0.01% by weight to 10% by weight and optionally (ii) a curative that catalyzes further condensation of the heat-curable resin at from about 60° C.

Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.

Abstract: Post-CMP treating liquids are provided, one of which includes water, an amphoteric surfactant, an anionic surfactant, a complexing agent, resin particles having carboxylic group and sulfonyl group on their surfaces, a primary particle diameter thereof ranging from 10 to 60 nm, and tetramethyl ammonium hydroxide. Another includes water, polyphenol, an anionic surfactant, ethylene diamine tetraacetic acid, resin particles having carboxylic group and sulfonyl group on their surfaces, a primary particle diameter thereof ranging from 10 to 60 nm, and tetramethyl ammonium hydroxide. Both of the treating liquids have a pH ranging from 4 to 9, and exhibit a polishing rate both of an insulating film and a conductive film at a rate of 10 nm/min or less.

Abstract: A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.

Abstract: An abrasive article includes a binder and abrasive grains. The binder is formed from a formulation including a polymer component, a curing agent, and an acid bonding agent.

Abstract: An aqueous slicing fluid comprising (A) 0.01-20 wt % of a modified silicone is combined with abrasive grains to form an aqueous slicing slurry which has advantages of dispersion stability of abrasive grains, viscosity stability, and a higher machining accuracy.

Abstract: An abrasive article which is made from a liquid resin composition containing no formaldehyde, which replaces the resol or urea-formaldehyde resin used as an adhesive in coated abrasives and the resol used as an impregnation resin in bonded abrasives. The liquid resin composition comprises a product that results from the oxidative cleavage of an unsaturated plant or animal oil, chosen from aldehydes, peroxides and mixtures of these compounds. The liquid resin composition can be used for the manufacture of coated and bonded abrasive articles.

Abstract: An abrasive article with improved grain retention and performance and method of making are disclosed. The abrasive article with improved grain retention results in an article with improved performance and longer article life.

Abstract: A flexible, hand-held sanding pad comprises a conformable, multi layered, semicircle pad having a surface capable of providing temporary adhesive attachment for a sheet of pressure-sensitive adhesive-coated abrasive material.

Abstract: A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.

Abstract: A bonded abrasive article is provided which includes abrasive grains made of cubic boron nitride within a bond matrix including a silicate. The bonded abrasive further includes a reaction product at the interface between the abrasive grains and bond matrix comprising a transition metal nitride.

Abstract: A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

Abstract: Fluoroalkyl phosphates containing a tertiary carbon and a nonfluorinated chain are useful as surfactants and additives. The f can be used to alter a surface property of a medium and to provide resistance to blocking, open time extension, or oil repellency to a substrate.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.

Abstract: A structured abrasive article includes a backing having a structured abrasive layer disposed on and secured thereto. The structured abrasive layer includes shaped abrasive composites that comprise abrasive particles and nonionic polyether surfactant dispersed in a crosslinked polymeric binder. The abrasive particles have a mean particle size of less than 10 micrometers. The nonionic polyether surfactant is not covalently bound to the crosslinked polymeric binder and is present in an amount of from 2.5 to 3.2 percent by weight based on a total weight of the shaped abrasive composites. The structured abrasive articles are useful for abrading a workpiece.

Abstract: A method of producing an abrasive cutting string provides for coating a plastomeric string with a solution of a solvent and the plastomeric material of the string, applying an abrasive and removing the solvent to thereby provide a cutting string with excellent abrasive bind and string coverage, that can be manufactured at high speeds, and then used on a spool in the rotary cutting assembly of a string trimmer to incrementally feed at least one extremity of the abrasive string for rotation through a cutting swath.

Abstract: An exemplary method of processing a polycrystalline diamond element is disclosed. According to the method, a protective layer may be formed over only a selected portion of a polycrystalline diamond element. The polycrystalline diamond element may include a polycrystalline diamond table. At least a portion of the polycrystalline diamond element may be exposed to a leaching solution such that the leaching solution contacts an exposed surface region of the polycrystalline diamond table and at least a portion of the protective layer. The protective layer may be substantially impermeable to the leaching solution. An exemplary method of manufacturing a polycrystalline diamond element is also disclosed.

Abstract: A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulae (II) to (IV). Methoxypolyethylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (I), stearyl methacrylate etc. are used as monomers for forming the constitutional unit of the formula (II), polypropylene glycol methacrylate etc. are used as monomers for forming the constitutional unit of the formula (III), and styrene etc. are used as monomers for forming the constitutional unit of the formula (IV).

Abstract: A compression molding apparatus and method for the manufacture of abrasive layers for abrasive tooling which provides a compression mold space defined between an inflexible wall surface and a flexible wall surface. The apparatus and method of the present invention is particularly well suited to making annular or hollow cylindrical shaped abrasive layers of novel configurations during a single mold cycle useful for grinding wheel and the like, as well as other shapes such as laps, wherein the flexible wall expanded with fluid pressure provides a highly uniform distribution of pressure against the surface of the mold composition being formed. In an annular configuration, the flexible wall is used to radially direct pressure against a molding composition disposed in an annular configuration wherein the axial length of the annular mold shape formed may be many times greater than priorly obtained by the prior art means.

Abstract: Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.

Abstract: The method of the subject invention, which comprises (a) forming a plurality of abrasive structures having a three-dimensional shape on a backing by using a first abrasive slurry and drying the abrasive structures, and (b) spray-coating in a specific way a second abrasive slurry over the three-dimensional abrasive structures to form a coating layer and drying the coating layer, provides a coated abrasive having improved flexibility, surface roughness, and use life.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: Composite abrasive bodies, which include abrasive product supports, abrasive particles and cured adhesives bonding the abrasive product supports and the abrasive products, are provided. The cured adhesives may be two-component polyurethane or (meth)acrylate adhesives. In addition, methods for preparing the composite abrasive bodies are also provided.

Abstract: A rapid structuring media cartridge includes a cartridge body, a first binder and first abrasive particles. The cartridge is operable to deposit successive patterned layers including the first binder and first abrasive particles to form an abrasive structure.

Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.

Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.

Abstract: An abrasive that can impart a mirror finish, glossiness, or the like to a surface of a workpiece by blasting is provided. A crosslinked polyrotaxane compound having a network structure where crosslinking points are circular molecules of polyrotaxane and also having abrasive grains dispersedly mixed therein is obtained by causing chemical bonding between the circular molecules of the polyrotaxane in a state where the abrasive grains and the polyrotaxane are mixed. Then, the crosslinked polyrotaxane compound is granulated to a predetermined grain diameter to obtain a gel-like abrasive where a part of the dispersedly mixed abrasive grain is exposed at the surface. By using the thus-obtained gel-like abrasive in blasting by projecting the abrasive at an angle tilted with respect to a surface of a workpiece, mirror finishing or the like is possible without making the surface of the workpiece pearskin-like.

Abstract: A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.

Abstract: A method of facilitating abrasive article manufacturing includes providing a rapid tooling system to a consumer and providing a cartridge to the consumer. The cartridge has a cartridge body, a first binder and first abrasive particles. The cartridge is configured to operate as part of the rapid tooling system and is operable to deposit the first binder and the first abrasive particles in successive patterned layers to form an abrasive structure.

Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.

Abstract: A back pad comprising a nonwoven fabric, and at least one carbon and polyester fiber textile layers stacked thereon has an improved flexibility and provides an improved working environment, and thus, it can be advantageously used in the manufacturing of an abrasive disk.

Abstract: The present invention relates to composites comprising an elastic and/or thermoplastic-elastic carrier medium and hard magnetic particles which are polarised in a magnetic field, a magnetisation remaining after switching off the magnetic field.

Abstract: A CMP slurry for metallic film is provided, which includes water, 0.01 to 0.3 wt %, based on a total quantity of the slurry, of polyvinylpyrrolidone having a weight average molecular weight of not less than 20,000, an oxidizing agent, a protective film-forming agent containing a first complexing agent for forming a water-insoluble complex and a second complexing agent for forming a water-soluble complex, and colloidal silica having a primary particle diameter ranging from 5 to 50 nm.

Abstract: This invention is to provide a dope that has excellent formability and can be formed into a fiber, a film, pulp-shaped particles and the like by a wet method. This invention is also to provide a process for the production of a fiber excellent in heat resistance, strength and elastic modulus. This invention provides a dope and a process for the production of a fiber from the dope, the dope including a polyamide and a basic solvent, the polyamide containing a recurring unit of the following formula (I), wherein Ar1 represents at least one substituent selected from the group consisting of and having an inherent viscosity of 1.0 or more, the dope has a polyamide concentration of over 10% by weight but not more than 25% by weight and exhibits optical anisotropy at 50° C.

Abstract: The invention relates to a pigment preparation containing (a) 50-99 percent by weight of at least one pigment, (b) 1 to 50 percent by weight of an additive based on polyalkylene glycols, and (c) 0 to 10 percent by weight of an auxiliary agent from among the group comprising fillers, fire retardants, preservatives, light-stability agents, pigmentary and non-pigmentary dispersing agents, surfactants, antioxidants, foam inhibitors, resins, and antistatic agents, the percentages being in relation to the total weight of the pigment preparation. The additive that is based on polyalkylene glycols corresponds to formula Z?-[-(AO—)n1—B-T-X—Y]m—Z (1), wherein AO represents a C2-C10 alkyleneoxy unit, B represents a C2-C10 alkylene radical, and T represents —NR—, X represents one of the groups (formula), and Y represents a chemical bond or —NR3—.

Abstract: Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.

Abstract: A window of solid light-transmissive polymer is formed in a polishing pad, and at least one surface of the window is treated to increase the smoothness of the at least one surface.

Abstract: A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.