Abstract: Clay stabilization compositions include one or a plurality of triamino compounds and/or derivatives thereof, fluids containing an effective amount of the clay stabilization compositions and methods for making and using same.

Abstract: A chemical composition for eliminating and inhibiting formation of scaling in pipes caused by, for example, barium sulfate, calcium sulfate, calcium carbonate, magnesium carbonate, barium carbonate and ferric oxide. The chemical composition is comprised of a volume of an inorganic salt (0-12%), an organic monocarboxylic acid (0-45%), an organic di- or tricarboxylic acid (0-45%), an inorganic acid (0-15%), a salt derived from an organic carboxylic acid (0-15%), a corrosion inhibitor comprised of a mixture of amines or alcohols of high molecular weight (0-15%), and potable or sea water (0-92%). A biocide provides for gradual decomposition of precipitates without forming insoluble agglomerates. Elimination occurs through solubilization and dissolution of precipitates in an aqueous medium. Inhibition occurs through interference of anion-cation interactions of potential precipitation-forming ions preventing precipitate formation.

Abstract: A liquid composition comprising (A) at least one polar organic solvent, selected from the group consisting of solvents exhibiting in the presence of from 0.06 to 4% by weight of dissolved tetramethylammonium hydroxide (B), the weight percentage being based on the complete weight of the respective test solution (AB), a constant removal rate at 50° C. for a 30 nm thick polymeric barrier anti-reflective layer containing deep UV absorbing chromophoric groups, (B) at least one quaternary ammonium hydroxide, and (C) at least one aromatic amine containing at least one primary amino group, a method for its preparation and a method for manufacturing electrical devices, employing the liquid composition as a resist stripping composition and its use for removing negative-tone and positive-tone photoresists and post etch residues in the manufacture of 3D Stacked Integrated Circuits and 3D Wafer Level Packagings by way of patterning Through Silicon Vias and/or by plating and bumping.

Abstract: A photoresist and post etch cleaning solution for semiconductor wafers comprising: A. a polar aprotic solvent, B. an inorganic base; C. a co-solvent for said inorganic base; D. a unsaturated cycloaliphatic compound having a ring ether group and at least one substituent bearing a primary hydroxyl group; E. an organic base comprising an amine compound; and F. a nonionic surfactant bearing at least one ether group. The wafer containing photoresist residue or post etch residue can be cleaned by contacting the solution in a spray or immersion.

Abstract: The present invention relates to a corrosion-protection system suitable for producing aqueous metal treatment and metal processing fluids, particularly corrosion-protection, cleaning and cooling lubricant emulsions. The corrosion-protection system comprises carbonic and/or phosphonic acids, as well as at least one amine with at least one oxybis(alkylamine) unit. Such corrosion-protection systems effectively protect metal surfaces from corrosion and have a high level of water solubility, which is essential for formulating aqueous concentrates for metal treatment and metal processing fluids. The present invention further relates to an aqueous surface-active and corrosion-protecting preparation containing the corrosion protection system and an emulsifier system, as well as an oil-containing water-miscible emulsion concentrate, which supplies the ready-to-use corrosion-protection, cleaning and cooling lubricant emulsions by dilution with water.

Abstract: A biodegradable concentrated neutral detergent composition comprises various chelate compounds, various corrosion inhibitors, an alkaline compound, at least one sequestrant, various surfactants and hydrotropes, and water. The detergent can be highly concentrated, has a good long term shelf life, and when diluted is very effective in cleaning metals such as surgical instruments and prevents corrosion resistance of the metal even in a hard water environment.

Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Abstract: The invention provides a method for pre-treating a metal surface with a corrosion inhibitor prior to painting, a method for inhibiting corrosion in a cooling system, wherein the cooling system includes a metal surface and a coolant; and a method for inhibiting corrosion of a reinforcement steel in concrete wherein the method comprising the step of adding to a concrete mixture an anti-corrosive mixture.

Abstract: The present invention relates to the use of an alkyl di(lower alkyl)mono(polyoxyethylene) quaternary ammonium compound as a hydrotrope in 5 aqueous solutions for a nonionic surfactant, preferably a C8-C18-alcohol alkoxylate containing 1-20 ethyleneoxy units and 0-5 propyleneoxy units. It also relates to a composition comprising said quaternary ammonium compound and said nonionic surfactant. The cationic surfactant has the formula 10 R2+R(1)N(CH2CH2O)n H X R1 wherein R?C6-C22 alkyl; R1 and R2 are independently a C1-C4 alkyl group; n=8-25; and X? is an anion. The compositions may be used for the cleaning of hard surfaces, for example for vehicle cleaning or machine dishwashing.

Abstract: A detergent composition for metal according to the present invention contains a specific non-ionic surfactant, a specific nitrogen-containing organic compound, a specific carboxylic acid or salt thereof, and a specific alkanol amine, and has a pH of at least 9 that is measured at 25° C. when the detergent composition is diluted to 1% by mass of an aqueous solution. According to the present invention, the detergent composition for metal having excellent corrosion inhibition properties, excellent effluent treatment properties, excellent foaming suppressing properties and excellent liquid stability in addition to high detergent properties for metal, can be provided.

Abstract: The present invention is directed to a metal cleaner polisher and anti-tarnish solution which comprises the following ingredients per 32 fluid ounces: 5.00 to 10.00 percent mineral spirits by volume; 1.50 to 4.50 percent ethanol by volume; 0.50 to 1.50 percent ammonia by volume; 0.50 to 1.50 percent thiourea by volume; 0.25 to 1.00 percent sulfamic acid by volume; less than 0.20 percent disodium cocoampho-diproprionate by volume; and deionized water. Optionally, the following ingredients may be added individually, in any combination or all together: thickening/suspension agents; abrasive additives; and a modifying/stabilizing agent; and optionally varying amounts of fragrance and colorizing agents.

Abstract: The present invention is a formulation for wet clean removal of post etch and ash residue from a semiconductor substrate having a CoWP feature, comprising; Deionized water; Organic acid; Amine and/or quaternary ammonium hydroxide; wherein the formulation is compatible with the CoWP feature and either (a) the molar ratio of amine and/or quaternary ammonium hydroxide to organic acid provides a pH in the range of 7-14; or (b) the formulation includes a corrosion inhibitor. A method of using the formulation is also described.

Abstract: Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to ILD materials, and excellent removal performance in relation to a resist film and a bottom antireflective coating film, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water soluble organic solvent, water, and an inorganic base. The water soluble organic solvent contains a highly polar solvent having a dipole moment of no less than 3.0 D, a glycol ether solvent and a polyhydric alcohol, and the total content of the highly polar solvent and the glycol ether solvent is no less than 30% by mass relative to the total mass of the liquid for lithography.

Abstract: There is disclosed a cleaning composition comprising (i) 0.1 to 10 percent by weight of the cleaning composition of a biofilm removing detergent solution comprising a combination of an alkyl (C8-18) polysaccharide, a non-ionic surfactant and a nitrogen containing surfactant-biocide (ii) 2 to 80 percent by weight of the cleaning composition of one or more polar solvent (iii) 0.5 to 15 percent by weight of the cleaning composition of one or more primary amine (iv) two or more chelating agents (v) 0.1 to 5.0 percent by weight of the cleaning composition of an alkaline buffer system providing a pH of about 11.5 to 13.3 in aqueous solution (vi) 0.005 to 5.0 percent by weight of the cleaning composition of an alkoxyaminosilane. Also disclosed is a process of cleaning, decontaminating and/or passivating metallic surgical instruments and/or equipment using the composition of the invention.

Abstract: A detergent composition for metal according to the present invention contains a specific non-ionic surfactant, a specific nitrogen-containing organic compound, a specific carboxylic acid or salt thereof, and a specific alkanol amine, and has a pH of at least 9 that is measured at 25° C. when the detergent composition is diluted to 1% by mass of an aqueous solution. According to the present invention, the detergent composition for metal having excellent corrosion inhibition properties, excellent effluent treatment properties, excellent foaming suppressing properties and excellent liquid stability in addition to high detergent properties for metal, can be provided.

Abstract: An acid inhibitor concentrate is provided which contains water, at least one polyamino-aldehyde resin such as a quaternized polyethylenepolyamine-glyoxal resin, and at least one compound selected from the group consisting of acetylenic alcohols, ethoxylated fatty amines, ethoxylated fatty amine salts, and aldehyde-releasing compounds (such as hexamethylenetetramine). Such concentrates form useful metal cleaning and pickling solutions when combined with aqueous acid, wherein such solutions, when contacted with a metal surface, are effective in removing scale, smut and other deposits from the metal surface but exhibit a reduced tendency for the aqueous acid to attack or etch the metal itself.

Abstract: The present invention relates to sulfuric/nitric blended acid cleaners which employ the use of ethoxylated amines and/or ethoxylated alcohols as a corrosion and stain inhibitor in the vapor phase for cleaning metal and other surfaces, particularly stainless steel. Method of use and manufacturing of the same are also disclosed.

Abstract: Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to tungsten, and excellent removal performance in relation to a resist film or the like, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water-soluble organic solvent, water, an inorganic salt and an anti-corrosion agent represented by a general formula (1) below. In the general formula (1), R1 represents an alkyl group or an aryl group having 1-17 carbon atoms, and R2 represents an alkyl group having 1-13 carbon atoms.

Abstract: Disclosed are cleaning solvents and cleaning methods for metallic compounds deposited on the equipment that supplies organometallic compounds to the manufacturing tool in the photovoltaic industry or the semiconductor industry. The cleaning solvents and the cleaning methods disclosed not only selectively remove the metallic compound without corroding the equipment, but also improve the ordinary cleaning process. Moreover, the cleaning solvents and the cleaning methods disclosed improve maintenance costs for the supply system because the equipment may be cleaned without being detached from the supply system.

Abstract: A method and composition for removing bulk and ion-implanted photoresist and/or post-etch residue material from densely patterned microelectronic devices is described. The composition includes a co-solvent, a chelating agent, optionally an ion pairing reagent, and optionally a surfactant. The composition may further include dense fluid. The compositions effectively remove the photoresist and/or post-etch residue material from the microelectronic device without substantially over-etching the underlying silicon-containing layer(s) and metallic interconnect materials.

Abstract: A biodegradable concentrated neutral detergent composition comprises various chelate compounds, various corrosion inhibitors, an alkaline compound, at least one sequestrant, various surfactants and hydrotropes, and water. The detergent can be highly concentrated, has a good long term shelf life, and when diluted is very effective in cleaning metals such as surgical instruments and prevents corrosion resistance of the metal even in a hard water environment.

Abstract: A chelating composition suitable for low-temperature use or storage is disclosed. The chelating compositions include 20 to 70 wt. percent of a polar solvent and 30 to 80 wt. percent of a first component of the formula: wherein R is a hydroxyalkyl group and each R? is individually selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups, carbonyl-containing alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; R? is selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups; carbonyl-substituted alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; M1 and M2 are alkali metal ions, wherein the M1 has a higher atomic weight than M2; wherein x+y=n and the mole fraction of M1 is greater than 0.70 to 1. Methods of suppressing crystallization and methods of cleaning surfaces employing the compositions described herein are also disclosed.

Abstract: A chelating composition suitable for low-temperature use or storage is disclosed. The chelating compositions include 20 to 70 wt. percent of a polar solvent and 30 to 80 wt. percent of a first component of the formula: (I) wherein R is a hydroxyalkyl group and each R? is individually selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups, carbonyl-containing alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; R? is selected from the group consisting of hydrogen, unsubstituted or inertly substituted alkyl groups; carbonyl-substituted alkyl groups, carboxylate-containing alkyl groups, hydroxyalkyl groups and alkoxy groups; M1 and M2 are alkali metal ions, wherein the M1 has a higher atomic weight than M2; wherein x+y=n and the mole fraction of M1 is greater than 0.70 to 1. Methods of suppressing crystallization and methods of cleaning surfaces employing the compositions described herein are also disclosed.

Abstract: The invention relates to compositions and methods of removing silicon-based anti-reflective coatings/hardmask layers.

Abstract: A wet cleaning solution, comprising 0.01-3 wt % of an amphoteric imidazolium surfactant capable of forming a complex with metal ions, a pH adjuster, and balanced deionized water. The wet cleaning solution is substantially free of corrosion inhibitor other than the imidazolium amphoteric surfactant.

Abstract: Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor polymer having multiple hydroxyl- or amino-functional groups pendant from the polymer backbone.

Abstract: A method of removing metallic copper from a steel surface defining a bore or cylinder of a gun is provided. The method involves contacting the surface with a composition comprising a polyphosphonic acid, a hydroxyl-substituted primary amine, and water.

Abstract: An alkaline concentrated detergent composition for use in cleaning hard surfaces, medical instruments and other metal components (parts, tools, utensils, vessels, equipment) having superior cleaning efficacy at much lower alkali content than traditional alkaline cleaners and enhanced scale control properties even when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water and even in exceptionally hard water. The inventive composition maintains its superior cleaning efficacy and scale control properties during use.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: A biodegradable acid cleaning composition for cleaning stainless steel, and other surfaces is disclosed. The composition comprises urea sulfate in combination with gluconic acid which serves as a corrosion inhibitor. The composition retains the cleaning and corrosion prevention properties of similar phosphoric acid solutions but is safe for the environment and is less expensive to produce. Applicants have surprisingly found that the traditionally alkaline corrosion inhibitor, gluconic acid, can work effectively in an acidic cleaning composition.

Abstract: A stabilizer composition comprising a) an amine and b) a compound selected from aliphatic, non-cyclic monomeric polyunsaturated hydrocarbons and terpenes is useful for stabilizing an organic solvent against degradation.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: Disclosed are aqueous conditioning shampoo compositions which comprise an anionic detersive surfactant component; from about 0.025% to about 5% by weight of an water soluble or dispersible, cationic, non crosslinked, deposition or conditioning polymer; the conditioning shampoo may additionally comprise dispersed, liquid, droplets of a water insoluble, hair conditioning agent having a volume average particle diameter of from about 5 microns to about 125 microns. A homopolymer has a cationic charge density from about from about 2 meq/gm to about 4 meq/gm or a cationic charge density of from about 5 meq/gm to about 10 meq/gm; or an average molecular weight of at least 500,000. A copolymer is formed from one or more cationic monomer units and one or more nonionic monomer units or monomer units bearing a negative charge wherein the subsequent charge of the copolymer is positive.

Abstract: An aqueous mixture AB comprising, in its solids, a mass fraction of from 5 % to 40 % of a polyvinyl butyral B, and a mass fraction of from 60 % to 95 % of a Mannich base A which is made by a two-step reaction wherein an epoxy amine adduct A1 prepared in the first step from an epoxy resin A11 with a mixture A12 of a primary linear or branched aliphatic amine A121 having from 2 to 30 carbon atoms and a further aliphatic linear, branched or cyclic amine A122 having from 4 to 16 carbon atoms and having one primary and at least one tertiary amino group, which epoxy amine adduct A1 is reacted in die second step with formaldehyde and a phenolic compound A2 to form a Mannich base, and a method of use thereof as a binder in wash primers.

Abstract: An aqueous acidic cleaning composition suitable for the cleaning of metal parts is constituted by urea phosphate, a surfactant, a corrosion inhibitor, and water. The corrosion inhibitor can be a phosphatizing compound such as iron phosphate, zinc phosphate, manganese phosphate, and the like.

Abstract: An acid inhibitor concentrate is provided which contains water, at least one polyamino-aldehyde resin such as a quaternized polyethylenepolyamine-glyoxal resin, and at least one compound selected from the group consisting of acetylenic alcohols, ethoxylated fatty amines, ethoxylated fatty amine salts, and aldehyde-releasing compounds (such as hexamethylenetetramine). Such concentrates form useful metal cleaning and pickling solutions when combined with aqueous acid, wherein such solutions, when contacted with a metal surface, are effective in removing scale, smut and other deposits from the metal surface but exhibit a reduced tendency for the aqueous acid to attack or etch the metal itself.

Abstract: A process for reducing the corrosive action of hypochlorite on metal surfaces in hypochlorite-containing aqueous liquid cleaning agents by the use of a combination of alkali hydroxide, alkali silicate, and alkyl(alkoxy)n sulfate, where n=0.5 to 10.

Abstract: The invention relates to a method for cleaning semiconductor surfaces to achieve to removal of all kinds of contamination (particulate, metallic and organic) in one cleaning step. The method employs a cleaning solution for treating semiconductor surfaces which is stable and provokes less or no metal precipitation on the semiconductor surface.

Abstract: The invention relates to a method for cleaning semiconductor surfaces to achieve to removal of all kinds of contamination (particulate, metallic and organic) in one cleaning step. The method employs a cleaning solution for treating semiconductor surfaces which is stable and provokes less or no metal precipitation on the semiconductor surface.

Abstract: The present invention provides a metal brightener and surface cleaner, which provides significant etching of aluminum and other metals, without detrimentally affecting other surfaces such as painted surfaces, glass, rubber and plastic. The inventive composition is especially suited for aluminum brightening for large vehicles, and may be utilized in an alkaline step of a multi-step vehicle wash. One of the exemplary compositions includes an alkali metal hydroxide; a polycarboxylic acid; an alkali metal salt of an organic acid; a first, amphoteric surfactant; a second, betaine surfactant; and a third, nonionic surfactant.

Abstract: The present invention relates to methods and compositions for treating a surface of a substrate by foam technology that includes at least one treatment chemical. The invention more particularly relates to the removal of undesired matter from the surface of substrates with small features, where such undesired matter may comprise organic and inorganic compounds such as particles, films from photoresist material, and traces of any other impurities such as metals deposited during planarization or etching. A method according to the present invention for treating a surface of a substrate comprises generating a foam from a liquid composition, wherein the liquid composition comprises a gas; a surfactant; and at least one component selected from the group consisting of a fluoride, a hydroxylamine, an amine and periodic acid; contacting the foam with the surface of a substrate; and, removing the undesired matter from the surface of the substrate.

Abstract: Degreasing compositions that may be used, for example, to degrease substrates such as contaminated surfaces of automobile engines are disclosed. The degreasing compositions comprise a builder, an amphoteric surfactant, and an alkoxylated acetylenic diol having the structure of formula (I) or (II): where: R1 and R4 are, independently, alkyl radicals containing from 3 to 10 carbon atoms; R2 and R3 are, independently, selected from the group consisting of methyl and ethyl; and (x+y)=2 to 50; ?where: r and t are each, independently, 1 or 2; (n+m)=1 to 30; and (p+q)=1 to 30. Certain embodiments of the degreasing composition are non-caustic, low VOC and may be low phosphate or phosphate-free.

Abstract: A remover composition and method for removing resists from substrates containing nucleophilic amine and at least one solvent is described. Optionally, a chelating agent can also be included in the remover composition. The remover composition is especially suitable for removing a variety of resists from substrates at different stages in the process of manufacturing integrated circuits.

Abstract: A method for chemical etching is disclosed for taking away oxidized film and removing cut as well as punched edge burs of harden-treated carbon steel (SK3, SK4 and SK5). Thereby, the fillet edge of the cut section is achieved. An oxidized film with a thickness of several micrometers is formed when a cut and punched steel is quenched and tempered at high temperature. Due to high strength and hardness of the steel, the oxidized film and edge burs are difficult to be removed by mechanical grinding. Therefore, a suitable electrolyte composes of only a little chemical reagent and oxidizer in deionized water is used to remove the oxidized film and punched bur simultaneously using chemical etching method.

Abstract: The present invention is directed to resist and etching residue removing compositions containing at least one nucleophilic amine compound possessing reduction and oxidation potentials, a two-carbon atom linkage alkanolamine compound, and optionally water and/or one or more corrosion inhibitors. The compositions may be substantially free of hydroxylamine, polar organic solvents, water, corrosion inhibitors, or a combination thereof. The compositions are useful in processes for removing resists and etching residue from metal or metal alloy substrates or substrate layers used in micro-circuitry fabrication.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: The invention relates to a method for one-bath chemical cleaning and preservation of interior surfaces of hollow steel bodies, without any organic solvents, comprising controlled change of the liquid bath in that in a circuit of hoses running from a mobile tank equipped with a pump unit and steam generator there is circulated a liquid stream to a defined cavity of steel. The composition of the liquid is changed methodically by the addition of fresh chemical additives until the end of the process. Fresh water at 80° C. has added thereto an alkaline degreasing liquid A containing chlorine-free tensides, which is circulated, whereupon cleaning liquid B, consisting of citric acid with added cationic tensides, is added to a pH of 4.5 and is circulated. There is then added a complexing derusting liquid C, with active modified aminocarboxykate made biologically degradable, with adjustment of the pH to 4.5–5.

Abstract: The invention relates to water blown integral skin polyurethane foams made with a particular isocyanate quasi-prepolymer and resin side ingredients to yield a foam having good overall mechanical properties. The isocyanate quasi-prepolymer component of the present invention comprises from 0.5 weight percent to 30.0 weight percent or less uretonimine-carbodiimide-modified diphenylmethane diisocyanate, from 50 weight percent to 80 weight percent 4,4'-diphenylmethane diisocyanate and reacted with from 15 weight percent to 40 weight percent of a polyether polyol containing predominately secondary hydroxyl groups and having an average molecular weight from about 2,000 to 10,000, an average functionality from 1.5 to about 3.2, and a hydroxyl number from about 20 to 60, and optionally with a low molecular weight diol in an amount of from 1.0 weight percent to 10 weight percent, the weight percentages based on the weight of the quasi-prepolymer reactants.