Abstract: The present invention relates to a composition having a pH of less than about 7, for treating a hard surface comprising: at least one low residue surfactant and/or an alkyl ethoxylate surfactant; and a polymeric biguanide.

Abstract: The present invention relates to a composition having a pH of less than about 7, for treating a hard surface comprising: at least one low residue surfactant and/or an alkyl ethoxylate surfactant; and a polymeric biguanide.

Abstract: The cleaning composition of the present invention is characterized by containing N-hydroxyformamide. The cleaning composition is capable of easily removing patterned photoresist masks or resist residues remaining on substrates after the etching process or removing resist residues remaining after the etching process and the subsequent ashing process within a short period of time without causing the corrosion of wiring materials and insulating films, thereby ensuring the fine processing to provide high-precision wiring circuits.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: Cleaning and multifunctional coating compositions containing hydrogen peroxide and an organosilane quaternary compound in aqueous formulations are used to improve water and soil repellency and residual antimicrobial activity. Various surfaces may be treated including metal, glass, plastics, rubber, porcelain, ceramic, marble, granite, cement, tile, sand, silica, enameled appliances, polyurethane, polyester, polyacrylic, melamine/phenolic resins, polycarbonate, siliceous, painted surfaces, wood, and the like.

Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

Abstract: The present invention relates to a composition having a pH of less than about 7, for treating a hard surface comprising: at least one low residue surfactant and/or an alkyl ethoxylate surfactant; and a polymeric biguanide.

Abstract: The invention concerns polyalkoxylated superamides of the following formulae: [R1—CONR2—CH2CHR3—O—CHR4—CHR5O)m—(CH2CH2O)n]9 p(I); R1—CON—[CH2CHR3—O—(CHR4—CHR5O)m—(CH2CH2O)n—X]2, formulae wherein: R1 presents a C7-C22 hydrocarbon radical; R2, R3, represent a hydrogen or a C1-C4 hydrocarbon radical; R4, R5 represent a hydrogen or an alkyl radical comprising 1 to 2 carbon atoms, provided that one or more of said two radicals is a hydrogen; X represents a hydrogen, a C1-C6 hydrocarbon radical, a phosphate, carboxylate, sulphate, sulphonate group; m ranges between 0 and 20 exclusive; n ranges between 0 and 50 exclusive; p is equal to 1 or 2, depending on what X represents. The invention also conerns a method for obtaining said compounds and their use in particular as emulsifying agent for oils.

Abstract: A hard surface cleaning composition for removing cooked-, baked- or burnt-on soils from cookware and tableware, the composition comprising an organoamine solvent and wherein the composition has a liquid surface tension of less than about 24.5 mN/m and a pH, as measured in a 10% solution in distilled water, or least than 10.5. The composition can be used as pre-treatment prior to the dishwashing process. The composition provides excellent removal of polymerized grease from metal and glass substrates.

Abstract: Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof.

Abstract: Multipurpose cleaners are comprised of an alkoxylated carboxylic acid ester corresponding to the formula (I): wherein R1CO is an aliphatic acyl group, AlkO is CH2CH2O, CHCH3CH2O, CH2CHCH3O, or a combination thereof, n is a number from 1 to 20 and R2 is an aliphatic alkyl group, and a betaine, an amine oxide or a combination thereof.

Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

Abstract: To provide a detergent which does not comprise a halogen-based solvent having high cleaning capabilities. The detergent of the present invention comprises (A) a glycol ether having low compatibility with water, preferably propylene glycol alkyl ether having a solubility in water at 60° C. of 50 vol % or less, (B) an imidazolidinone compound represented by the following formula (I): wherein R1 and R2 are each independently a methyl group or ethyl group, and (C) water, and forms a homogeneous phase.

Abstract: An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.

Abstract: A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: Engine cleaner compositions are reported comprising a single phase solution comprising a polar solvent having a Hildebrand solubility parameter of about 10 cal½ cm−3/2 or greater; a non-polar solvent, immiscible with the polar solvent, having a Hildebrand solubility parameter of about 10 cal½ cm−3/2 or less; and a fugitive cosolvent having a higher evaporation rate than the polar solvent and the non-polar solvent. The engine cleaner compositions are suitable for cleaning internal combustion engines.

Abstract: To provide a cleaner composition suitable for removing oxidized grease stains adhering to the surface of floor, wall and cooking instruments in the kitchen. A cleaner composition is constructed to have the concentrated form and comprise a water-insoluble organic solvent, amines and a nonionic amine oxide-based surfactant.

Abstract: A process for metal cutting using a water-mixed cutting compound and subsequent cleansing and corrosion protective treatment wherein an oil in water emulsion is used as a cutting compound which contains; (I) an amount emulsifier system consisting of: (a) ethyoxylates/propoxylates of fatty alcohols having 8 to 18 carbon atoms in the alcohol, which contains 2 to 6 ethylene oxide units and 4 to 8 propylene oxide units; (b) fatty alcohols and/or fatty alcohols propoxylates having 12 to 24 carbon atoms in the alcohol and 0 to 3 propylene oxide units and/or distillation residues of such fatty alcohols; In a ratio by weight, a:b=1:0.2 to 0.2:1; and (ii) corrosion inhibitory; and an aqueous solution or suspension is used for cleansing an anti-corrosion treatment which contains the same emulsifier system and the corrosion inhibitors as the cutting compound.

Abstract: Methods and acidizing compositions for reducing the corrosion of the metal surfaces of tubular goods and the like and reducing the precipitation of metal sulfide from the acidizing compositions are provided. The methods basically comprise the steps of combining an aldol-amine adduct with an aqueous acid solution to preferentially react with sulfide ions subsequently dissolved by the aqueous acid solution and thereby prevent subsequently dissolved metal ions from reacting therewith and precipitating, and then introducing the aqueous acid solution containing the aldol-amine adduct into a well or other location to be acidized.

Abstract: A cleaning corrosion inhibitor based on N-alkyl-beta-alanine derivatives and their salts.

Abstract: Methods for cleaning screw extruder, especially powder-coating extruders, include filling the extruder barrel with a gel purge formulation comprised of a high-boiling pyrrolidone or piperidone (lactam) solvent (most preferably N-methyl pyrrolidone (NMP)), thickened with 5-50 wt. % of a thermoplastic resin thickening agent, most preferably polystyrene (PS). Once the extruder barrel is filled with the gel purge formulation, the screws are stopped and the gel allowed to soak for between about 10 to about 30 minutes. The screws are then restarted and the gel is discharged from the extruder. Immediately after the gel purge formulation exits the machine, a small amount of a thermoplastic “rinse” polymer (e.g., polyethylene) may be added so as to remove any vestigial amount of the gel purge formulation therefrom.

Abstract: Aqueous cleaning compositions in which the pH is controlled comprise an acidic metal cleaning compound; at least one nitrogen containing compound to provide a stabilized pH; an emulsifier, a nonionic surfactant and optionally at least one water soluble solvent having a vapor pressure of less than 4 mm Hg at 20° C.

Abstract: An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.

Abstract: A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.

Abstract: A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

Abstract: An ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof residue cleaning composition removes photoresist and other residue from integrated circuit substrates. The balance of the composition is desirably made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the ethylenediaminetetraacetic acid or a mono-, di-, tri- or tetraammonium salt thereof in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

Abstract: Polymethylenepolyaminedipropionamides are carbonic corrosion inhibitors devoid of toxicity to the marine environment.

Abstract: A water based cleaning solvent primarily containing urea hydrochloride and also containing, in lesser amounts, an amphoteric and/or nonionic surfactant, an ethylamine, and a lesser amount of corrosion inhibitor based upon butyne cleans stainless steel and aluminum surfaces, especially exterior and interior surfaces associated with transportation of both materials, edible and otherwise, and people, most particularly railway transportation comprehensive of both tanks for liquids and other containers for fluent materials, and also including passenger rail cars possessing polycarbonate glazed acrylic windows. This solvent is proposed as a replacement for phosphate based cleaners as an environmentally superior alternative and when used in a conventional pressurized spraying system is effective in obtaining a bright finish on stainless steel and aluminum surfaces with consequent corrosion of neither of these nor polycarbonate surfaces if present.

Abstract: An aqueous resist stripping composition contains (a) an oxidizing agent, (b) a chelating agent, (c) a water-soluble fluorine compound, and optionally (d) an organic solvent. Also provided is a process of stripping resist films and resist residues remaining after etching treatment utilizing the aqueous resist stripping composition. In the process, corrosion of semiconductor materials, circuit-forming materials, insulating films, etc. is minimized and the rinsing is sufficiently made with only water without needing organic solvent such as alcohol.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: For the stripping of photoresists, the invention proposes to use a mixture of dimethyl sulphoxide DMSO) or N-methylpyrrolidone (NMP) and 3-methoxypropylamine (MOPA). Advantageously, a little water and a corrosion inhibitor, such as sodium tolyltriazolate, are added to the mixture.

Abstract: A method for removing a resist from a substrate comprising contacting a substrate having a resist coating present thereon with a composition comprising hydroxylamine and at least one alkanolamine which is miscible with hydroxylamine is described. Optionally, the composition may comprise one or more polar solvents. The method is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.

Abstract: A composition for the cleaning of residues from substrates from about 0.01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an lactam solvent and from 0 to about 50 weight percent of an organic sulfoxide or glycol solvent. The composition has a pH between about 6 and about 10. Additionally, the composition optionally contains corrosion inhibitors, chelating agents, surfactants, acids and bases. In use of the composition, a substrate is contacted with the composition for a time and at a temperature that permits cleaning of the substrate.

Abstract: A cleaning fluid for use with an inkjet printer having orifices for injecting ink, the surface of the orifices at the injection point being formed by a predetermined material includes a liquid for cleaning the surface of the orifices, such liquid including a di or trihydroxysilane which acts as a biocide, surfactant, and humectant.

Abstract: A hydroxylamine-gallic compound composition comprises a hydroxylamine compound, at least one alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound. A process for removing photoresist or other polymeric material or a residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, in accordance with this invention comprises contacting the substrate with a hydroxylamine compound, an alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound for a time and at a temperature sufficient to remove the photoresist, other polymeric material or residue from the substrate. Use of a gallic compound in place of catechol in the composition and process reduces attack on titanium metallurgy by, e.g., about three times.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.

Abstract: The process for removing a soap-contaminated conversion layer remaining on a metal workpiece after cold-forming with an aqueous acidic cleaning composition containing water, a surfactant such as an alkyl amine ethoxylate and nitric acid, phosphoric acid and/or amidosulphonic acid includes immersing the contaminated metal workpiece in the aqueous acidic cleaning composition at a temperature above 60.degree. C. until it has a clean bright surface and a fatty acid formed by reaction of the soap in the conversion layer is dispersed in the cleaning composition and then subsequently separating the metal workpiece from the cleaning solution and, after the separating, cooling the recovered aqueous acidic cleaning composition to a temperature below 55.degree. C. until a fatty acid layer including the fatty acid is separated from the aqueous acidic cleaning composition.

Abstract: A surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt: ##STR1## wherein X.sub.1 and X.sub.2 are hydroxyl groups; Y.sub.1 to Y.sub.8 are respectively independently a hydrogen atom, a hydroxyl group, a halogen atom, a carboxyl group, a phosphonic acid group, a sulfonic acid group, a carbonyl group, a nitro group, a nitroso group, an amino group, an imino group, a nitrilo group, a nitrile group, a thiocyanate group, a hydroxyamino group, a hydroxyimino group, or an alkyl or alkoxy group which may have a substituent, provided that at least one of Y.sub.1 to Y.sub.8 is not a hydrogen atom; Z.sub.1 to Z.sub.4 are respectively independently a hydrogen atom, a carboxyl group or a sulfonic acid group; and R.sub.1 to R.sub.4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent.

Abstract: A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined. Following use of the composition, the non-used portion of the composition can be disposed of or be reactivated by the addition of a chelating agent.

Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: A light duty liquid detergent with desirable cleansing properties and mildness to the human skin comprising: a water soluble nonionic surfactant, an alkali metal or ammonium salt of a C.sub.8-18 ethoxylated alkyl ether sulfate anionic surfactant, a magnesium salt of a sulfonate surfactant, a betaine surfactant and water.

Abstract: The invention relates to novel compositions of 1-bromopropane, nitromethane or acetonitrile and at least one alcohol selected from the group consisting of ethanol, 2-propanol and 2-methyl-2-propanol and more particularly to azeotrope-like compositions based on these compounds which are useful as solvents in refrigeration flushing, oxygen system cleaning and vapor degreasing applications.

Abstract: A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofuctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper surface comprises applying the above composition to the copper surface, and polishing the surface in the presence of the composition.

Abstract: Alkaline earth and transition metal scaling such as calcium and magnesium scaling can be controlled or removed in pipes, vessels, heat exchanges, evaporators, and filters, and in the oil field applications such as, for example, for drilling, production, and recovery operations with the addition of an effective amount of 2-hydroxyethyl iminodiacetic acid (HEIDA) or a salt thereof.

Abstract: The anti-corrosive draining agent for use in a rinsing process includes a polyoxyalkylene alkyl ether as an essential component. The anti-corrosive draining agent further includes an amine compound as an essential component, wherein the polyoxyalkylene alkyl ether (a) and the amine compound (b) are contained in a blending weight ratio (a/b) of from 99/1 to 80/20. The rinsing process using water following a cleaning process, includes the steps of adding the above anti-corrosive draining agent to a rinsing water, and rinsing an object in the rinsing water.

Abstract: The present invention relates to a cleaning composition for cleaning airct wheel wells. The cleaning composition broadly comprises from about 0.1 to about 15% of a D-limonene composition, containing less than 0.5% of a stabilizing anti-oxidant, acting as a solvent for said greasy soils, from about 0.1% to about 5.0% of a material for increasing the flash point of said cleaning composition above 140.degree. F., such as an isoparrafinic hydrocarbon solvent, from about 10% to about 50% of a mixture of linear alcohol ethoxylates having a HLB in the range of 2 to 15 as a stabilizer, and the balance water. The cleaning composition may also contain from 0.1% to about 10% capryolamphopropionate, from about 0.1% to about 15% dipropylene glycol, from about 0.1% to about 5.0% benzotriazole, and 0.1% to about 5.0% sodium bicarbonate.

Abstract: The invention provides a solvent mixture including n-propyl bromide, a mixture of low boiling solvents and, preferably, a defluxing and/or ionics removing additive and/or at least one saturated terpene. The invention also provides a method of cleaning an article (e.g., an electrical, plastic, or metal part) in a vapor degreaser using the solvent mixture. The solvent mixture of the invention is non-flammable, non-corrosive, and non-hazardous. In addition, it has a high solvency and a very low ozone depletion potential. Thus, using the solvent mixture of the invention, oil, grease, rosin flux, and other organic material can be readily removed from the article of interest in an environmentally safe manner.