Polymer Derived From Ethylenic Reactants Only Patents (Class 523/434)
  • Patent number: 10975265
    Abstract: A radical-curable adhesive composition containing a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, and a radical polymerization initiator (c). The rubber (a) is preferably a polymer of a monomer containing at least acrylonitrile.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: April 13, 2021
    Assignee: SHOWA DENKO K.K.
    Inventors: Ryohei Ito, Tsunehiko Nishimura, Akifumi Tamura, Nobuyuki Takahashi
  • Patent number: 10858541
    Abstract: A curable composition comprising an epoxy-siloxane oligomer comprising as polymerized units one or more difunctional silane monomers of formula (1) and one or more trifunctional silane monomers of formula (2) in a mole ratio of 95:5 to 10:30 Si(R1)(R2)(Y1)2??(1) SiR3(Y2)3??(2) wherein R1, R2, and R3 are independently chosen from a C5-20-aliphatic group comprising an oxirane ring fused to an alicyclic ring, C1-20-alkyl, C6-30-aryl group, and a C5-20-aliphatic group having one or more heteroatoms; each Y1 and Y2 is independently chosen from halogen, C1-4-alkoxy, and —O—C1-4-acyl group; wherein at least one of R1, R2, and R3 is a C5-20-aliphatic group comprising an oxirane ring fused to an alicyclic ring; (b) organic particles having an average diameter of 50 to 250 nm; (c) a reactive carrier having one or more epoxy moieties or oxetane moieties; (d) a curing agent; and (e) one or more organic solvents, and methods of forming cured coatings using such compositions are described.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael Mulzer, Yusuke Matsuda
  • Patent number: 10861828
    Abstract: A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality of leads and a semiconductor die attached to the die pad and electrically connected to the leads. An electrically insulative spacer separates the first and the second leadframe assemblies from one another. A mold compound embeds part of the first leadframe assembly, part of the second leadframe assembly and the electrically insulative spacer.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: December 8, 2020
    Assignee: Infineon Technologies AG
    Inventors: Hui Teng Wang, Swain Hong Yeo
  • Patent number: 9862828
    Abstract: A composition may include a resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The polymer nanoparticles may alter the properties of the resin mixture and improve the processing, manufacturability, and performance of an article manufactured with the polymer nanoparticles.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: January 9, 2018
    Assignee: The Boeing Company
    Inventors: Mark S. Wilenski, Samuel J. Meure
  • Patent number: 9719027
    Abstract: A composition useful for scavenging hydrogen sulfide by admixing metal carboxylates which have high viscosity due to polymerization and a viscosity improver selected from the group consisting of glycol ethers having from about 4 to about 10 carbons and alkyl alcohols having from about 1 to about 4 carbons.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: August 1, 2017
    Assignee: Baker Hughes Incorporated
    Inventors: Corina L. Sandu, Yun Bao, Jerry J. Weers, Ross Poland, Philip L. Leung, Lei Zhang, John A. Schield
  • Patent number: 9068067
    Abstract: Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: June 30, 2015
    Assignee: INTEL CORPORATION
    Inventors: Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket Raravikar, Gregory S. Constable
  • Publication number: 20150148451
    Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.
    Type: Application
    Filed: June 5, 2013
    Publication date: May 28, 2015
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Yukihiro Harada, Satoshi Okamoto, Kenta Narumori, Tomoo Sano, Akihiro Ito, Masayuki Sugiura, Tatsuhiro Kishikawa, Shinya Katou, Sanae Kita
  • Publication number: 20150037575
    Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
    Type: Application
    Filed: February 21, 2013
    Publication date: February 5, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
  • Publication number: 20150025176
    Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 22, 2015
    Inventors: Glenn G. Eagle, Andreas Lutz, Gary L. Jialanella
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Publication number: 20140309338
    Abstract: Coating compositions are disclosed. In some embodiments, the coating compositions are used to coat substrates such as packaging materials and the like for the storage of food and beverages. The coating compositions can be prepared by reacting an epoxidized vegetable oil and a hydroxyl functional material in the presence of an acid catalyst to form a hydroxyl functional oil polyol, mixing the hydroxyl functional oil polyol (with or without epoxidized polybutadiene) and a functional polyolefin copolymer to form a mixture, reacting the mixture with an ethylenically unsaturated monomer component in the presence of an initiator to form a graft copolymer, and crosslinking the graft copolymer with a crosslinker to form the coating composition, wherein the graft copolymer or the crosslinked graft copolymer is inverted into water.
    Type: Application
    Filed: December 18, 2012
    Publication date: October 16, 2014
    Inventors: Cathy Li, Timothy I Memmer, Daniel Bode, Stefan Posakiwsky
  • Publication number: 20140291655
    Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Inventors: Toshihiro SUZUKI, Satoshi HATTORI, Tetsuya MIEDA, Hideto FUKUDA, Takanori YAMAKAWA, Toshimitsu NAKAMURA
  • Publication number: 20140243453
    Abstract: A conductive resin composition which includes an epoxy resin (A), a compound (B) having a (meth)acryloyl group and a glycidyl group, a phenolic resin curing agent (C), a radical polymerization initiator (D) and a conductive particle (E). The conductive resin composition which may be B-staged (semi-cured) at a relatively low temperature to exhibit sufficient tack-free properties and excellent pressure-sensitive tackiness. This permits temporary bonding of parts without involving solvent evaporation or light illumination, thereby reducing or avoiding an increase in facility costs. The conductive resin composition may thereafter be cured (C-staged) to provide a cured product having a desirable bond strength, while maintaining a low specific resistivity.
    Type: Application
    Filed: September 4, 2012
    Publication date: August 28, 2014
    Inventors: Noritsuka Mizumura, Takashi Yamaguchi, Yoko Nagara
  • Publication number: 20140194555
    Abstract: An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Inventors: Jun Woo LEE, Sung Min KIM, In Hwan KIM, Baek Soung PARK, Su Mi LIM, Jae Won CHOI
  • Publication number: 20140154939
    Abstract: A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 parts by weight of epoxidized polybutadiene resin; 10 to 90 parts by weight of benzoxazine resin; 10 to 90 parts by weight of epoxy resin; 1 to 50 parts by weight of curing agent; 10 to 50 parts by weight of organic fire retardant; 0.01 to 1 part by weight of curing catalyst; 0.1 to 10 parts by weight of initiator; and 10 to 100 parts by weight of packing. The halogen-free low-dielectric resin composition of the present invention uses the epoxidized polybutadiene resin, so as to not only solve the defect of the polybutadiene but also maintain the advantages on the dielectric property and flexibility, thereby improving the adhesive force thereof with the copper foil.
    Type: Application
    Filed: October 18, 2011
    Publication date: June 5, 2014
    Inventors: Qianping Rong, Yueshan He, Shiguo Su
  • Publication number: 20140079953
    Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one divinylarene dioxide; (b) at least one epoxy resin different from the divinylarene dioxide of component (a); (c) at least one anhydride hardener; (d) at least one filler; and (e) at least one cure catalyst; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 100° C.
    Type: Application
    Filed: April 13, 2012
    Publication date: March 20, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Mohamed Esseghir, William J. Harris
  • Patent number: 8668983
    Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 11, 2014
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Masayuki Kawazoe, Hiroyuki Okuhira, Koichiro Miyoshi, Tomohiro Ito, Takashi Kousaka, Mitsuhiro Iwata
  • Publication number: 20130281571
    Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.
    Type: Application
    Filed: June 11, 2013
    Publication date: October 24, 2013
    Inventors: Hyun Jee YOO, Dong Han Kho, Jang Soon Kim, Hyo Soon Park, Jong Wan Hong, Hyo Sook Joo
  • Patent number: 8519067
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: August 27, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yosinori Nishitani
  • Publication number: 20130197130
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130146816
    Abstract: An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films.
    Type: Application
    Filed: February 7, 2013
    Publication date: June 13, 2013
    Applicant: Trillion Science Inc.
    Inventors: Rong-Chang Liang, Yuhao Sun, Chin-Jen Tseng
  • Publication number: 20130137797
    Abstract: A thermoplastic polyester composition comprises polyalkylene terephthalate, a block copolymer comprising a semi-crystalline polyolefin block and at least one of a vinyl aromatic polymer block and an elastomeric polyolefin block, and reinforcing filler. The composition is capable of providing insert-molded articles, comprising a metal part, with high durability and resistance to cracking when subjected to a rigorous thermal cycle.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Inventor: Kayoko Onda
  • Patent number: 8445590
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: May 21, 2013
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Publication number: 20130119564
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 16, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: SUMITOMO BAKELITE CO., LTD.
  • Publication number: 20130113122
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 9, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Sumitomo Bakelite Co., Ltd.
  • Publication number: 20130115442
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
    Type: Application
    Filed: October 16, 2012
    Publication date: May 9, 2013
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventor: Cytec Technology Corp
  • Publication number: 20130085208
    Abstract: [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: Taiyo Ink MFG. Co. Ltd.
    Inventor: Taiyo Ink MFG. Co., Ltd.
  • Patent number: 8324326
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: December 4, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Publication number: 20120259042
    Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
    Type: Application
    Filed: November 22, 2010
    Publication date: October 11, 2012
    Inventors: Stephanie L. Potisek, Mark B. Wilson
  • Publication number: 20120168814
    Abstract: An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.
    Type: Application
    Filed: September 9, 2010
    Publication date: July 5, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
  • Patent number: 8198381
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 12, 2012
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Patent number: 8173745
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: May 8, 2012
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Publication number: 20120034458
    Abstract: The present invention relates to a lacquer composition, particularly an adhesive and corrosion-protective lacquer for rare earth magnets, on the basis of an epoxy resin mixture, a setting accelerator, a silane-based epoxy functional adhesion promoter and a solvent or a solvent mixture, wherein the lacquer composition includes 5 to 20 wt. %, with respect to the amount of solid resin in the base of the epoxy resin mixture, of a highly viscous epoxy resin based on bisphenol-A with an elastomer content of more than 30 wt. %.
    Type: Application
    Filed: February 2, 2011
    Publication date: February 9, 2012
    Applicant: Vacuumschmelze GmbH & Co. KG
    Inventor: Lothar Zapf
  • Publication number: 20120029117
    Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicant: CHEIL INDUSTRIES, INC.
    Inventors: Han Nim CHOI, Ki Tae Song, Chi Seok Hwang, Hea Kyung Kim, Chang Beom Chung
  • Publication number: 20110288201
    Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.
    Type: Application
    Filed: January 28, 2010
    Publication date: November 24, 2011
    Applicant: Huntsman International LLC
    Inventor: Philippe Gottis
  • Patent number: 8044154
    Abstract: Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: October 25, 2011
    Assignee: Trillion Science, Inc.
    Inventors: John J. McNamara, Yurong Ying, Rong-Chang Liang
  • Publication number: 20110256342
    Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.
    Type: Application
    Filed: December 3, 2009
    Publication date: October 20, 2011
    Inventors: Hideaki Toshioka, Yasuhiro Okuda
  • Publication number: 20110086174
    Abstract: The present invention relates to a polymer paint composition for waterproof and anticorrosion of concrete, which prevents neutralization and salt damage of concrete gradually degraded by external environment, by fundamentally blocking the material causing such damage, and a method for waterproof and anticorrosion of concrete structure using the same. In particular, the present invention relates to a paint polymer composition for preventing neutralization and salt damage of concrete structures in the atmosphere or under water, such as concrete structures in various marine environments, harbor structures, underground structures, exposed structures, structures neutralized by aging, bridge structures repeatedly exposed to wetness and dryness, structures exposed to chemical erosion by calcium chloride, SOx, NOx, etc.
    Type: Application
    Filed: October 11, 2010
    Publication date: April 14, 2011
    Applicant: HAN TO INDUSTRY CO., LTD
    Inventors: Sang Woo LEE, Yang Gu KIM, Tae Ju CHUNG, Chi Moon WON, Soo Jong KIM
  • Patent number: 7722950
    Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: May 25, 2010
    Assignee: World Properties, Inc.
    Inventors: David Guo, Carlos L. Barton
  • Patent number: 7713621
    Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: May 11, 2010
    Assignee: Isola USA Corp.
    Inventors: Martin Choate, Jyoti Sharma, Steve Peters, Kevin Rafferty
  • Patent number: 7521494
    Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: April 21, 2009
    Assignee: Isola USA Corp.
    Inventors: Martin Choate, Jyoti Sharma, Steve Peters, Kevin Rafferty
  • Patent number: 7465477
    Abstract: This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/or a polythioether, (c) an epoxy resin, (d) a rubber toughening agent, and (e) an optional fire retardant, a glass fiber thixotrope and impact toughening agent, an optional pigment, an optional corrosion inhibitor, an optional moisture penetration inhibitor, an optional ultraviolet light stabilizer, an optional abrasive aggregate, or a combination thereof.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: December 16, 2008
    Assignee: Texas Research International, Inc.
    Inventors: George P. Hansen, Rock A. Rushing, John W. Bulluck, Joshua B. Lightfoot, Brad A. Rix
  • Patent number: 7435451
    Abstract: This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/or a polythioether, (c) an epoxy resin, (d) a rubber toughening agent, and (e) an optional fire retardant, a glass fiber thixotrope and impact toughening agent, an optional pigment, an optional corrosion inhibitor, an optional moisture penetration inhibitor, an optional ultraviolet light stabilizer, an optional abrasive aggregate, or a combination thereof.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: October 14, 2008
    Assignee: Texas Research International, Inc.
    Inventors: George P. Hansen, Rock A. Rushing, John W. Bulluck, Joshua B. Lightfoot, Brad A. Rix
  • Patent number: 7435767
    Abstract: This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/or a polythioether, (c) an epoxy resin, (d) a rubber toughening agent, and (e) an optional fire retardant, a glass fiber thixotrope and impact toughening agent, an optional pigment, an optional corrosion inhibitor, an optional moisture penetration inhibitor, an optional ultraviolet light stabilizer, an optional abrasive aggregate, or a combination thereof.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: October 14, 2008
    Assignee: Texas Research International, Inc.
    Inventors: George P. Hansen, Rock A. Rushing, John W. Bulluck, Joshua B. Lightfoot, Brad A. Rix
  • Patent number: 7037958
    Abstract: This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/or a polythioether, (c) an epoxy resin, (d) a rubber toughening agent, and (e) an optional fire retardant, a glass fiber thixotrope and impact toughening agent, an optional pigment, an optional corrosion inhibitor, an optional moisture penetration inhibitor, an optional ultraviolet light stabilizer, an optional abrasive aggregate, or a combination thereof.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 2, 2006
    Assignee: Texas Research International, Inc.
    Inventors: George P. Hansen, Rock A. Rushing, John W. Bulluck, Joshua B. Lightfoot, Brad A. Rix
  • Patent number: 6955739
    Abstract: The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: October 18, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Hiroaki Yamaguchi, Tetsu Kitamura
  • Patent number: 6939431
    Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: September 6, 2005
    Assignees: Mitsui Chemicals, Inc., Sharp Corporation
    Inventors: Yasushi Mizuta, Tatsuji Murata, Makoto Nakahara, Takatoshi Kira, Daisuke Ikesugi
  • Patent number: 6924328
    Abstract: A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: August 2, 2005
    Assignee: Valspar Sourcing, Inc.
    Inventors: Jason M. Legleiter, Robert M. O'Brien
  • Patent number: 6884854
    Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.
    Type: Grant
    Filed: March 31, 2001
    Date of Patent: April 26, 2005
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Rainer Schoenfeld, Hubert Schenkel, Harald Kuester
  • Patent number: 6881768
    Abstract: A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is workable and easy to clean up after grouting the tiles. The grout composition employs a water dispersible epoxy polymer and a water compatible polyamine epoxy resin adduct as the curing agent in combination with a water repellent component. For colored grouts, a color coated filler such as sand is employed to obtain the enhanced tile grout properties. Luminescent and fluorescent additives and sparkle additives may be used in the grout to provide special visual effects in the light or dark.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: April 19, 2005
    Assignee: Laticrete International, Inc.
    Inventor: Rezvan Rooshenas