Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novolac epoxy resin; (b) a toughening agent; and (c) a latent curative.

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: A composition comprising a cationic polymerization compound and a porous fine particle, a coating made from the composition and a laminated plate comprising a substrate and the coating are provided. The coating is superior in adhering properties to a substrate and is equipped with an adequate hardness.

Abstract: A method for manufacture of particles for powder coating is disclosed in which the particles are prepared from a suspension obtained from a mixture of a thermosetting resin solution and an aqueous solution containing a water-soluble polymer.

Abstract: A method for manufacture of particles for powder coating is disclosed in which the particles are prepared from a suspension obtained from a mixture of a thermosetting resin solution and an aqueous solution containing a water-soluble polymer. The thermosetting resin solution contains A resin, B resin and an organic solvent wherein: (a) 0.5≦{(SP value of the A resin)−(SP value of the B resin)}≧1.5; (b) {(Tg of the A resin)−(Tg of the B resin)}≧10° C.; (C) 40° C.≦(Tg of the A resin)≦100° C., and, 20° C.≦(Tg of the B resin)≦50° C.; and (d) 5/95≦(a ratio in solids weight of the A resin to B resin)≦50/50.

Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferable is triazine. The preferred thermoplastic resin is a poly(phenylene ether). The inventive curable compositions advantageously can be combined with reinforcement in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: Arc-quenching fuse tubes comprising an elongated tubular body having an inner arc-quenching surface layer which comprises an arc-quenching matrix comprising a fibrous material and an arc-quenching composition. The arc-quenching compositions comprise a cured composition of an aromatic epoxy resin and a linear aliphatic epoxy resin.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.

Abstract: A resin matrix with resistances to alkali and acid includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative component particles have a particle diameter in the range of 1-20 micrometers.

Abstract: Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers.

Abstract: The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: The present invention relates to a curable resin composition for use in water-based coating materials which includes as essential components an emulsion polymer (A) containing tertiary amino groups obtained by carrying out emulsion polymerization of a vinyl monomer containing a tertiary amino group with another copolymerizable vinyl monomer in a water-based medium, and a compound (B) containing, at least, an epoxy group and a hydrolyzable silyl group, with this composition preferably also including a water-based compound (C) obtained by adding a neutralizing agent to a vinyl polymer (I) containing acidic groups and/or tertiary amino groups so as to neutralize at least 10% of the acidic groups and/or the tertiary amino groups, and then dispersing or dissolving in water, and/or a compound (D), which is not included in compound (B), and contains hydrolyzable silyl group and/or a silanol group.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

Abstract: The present invention relates to a method for crosslinking an isoprene-isobutylene rubber with resins, and a crosslinked rubber product obtained by said method. According to the present invention, there are provided:a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 8-25 parts by weight of an alkylphenol-formaldehyde resin and 0.3-10 parts by weight of an epoxy resin such as bisphenol A epoxy resin, anda crosslinked rubber product obtained by the above method.

Abstract: Fiber-reinforced prepregs with superior tack containing thermosetting resin systems containing particulate, elastomers having a Tg of 25.degree. C. and below, as well as the composites prepared therefrom are disclosed.

Abstract: A sheet molding composition is disclosed which includes a four component resinous system which comprises (a) an unsaturated polyester comprising a polycondensation product of one or more dihydric alcohols and one or more ethylenically unsaturated polycarboxylic acids; (b) one or more low-profile additives which are thermoplastic polymers which cause phase separation and porosity during the curing reaction; (c) one or more olefinically unsaturated monomers which copolymerize with the unsaturated polyester; and, (d) one or more compatible components comprising at least one polysiloxane polyalkylene copolymer. The compatible components are compatible with the reacted unsaturated polyester and monomer during cure and impart improved surface characteristics when added to low-profile resin systems.

Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Abstract: The invention is based on the surprising and unexpected finding that the impact performance of a thermoplastic composition containing aromatic polycarbonate resin and glass fibers is improved upon incorporation therewith of a particular silicone rubber powder. The silicone rubber powder, added at a level of about 0.5 to 4 percent, relative to the weight of the composition, is characterized in that it contains a mixture of (a) a polydiorganosiloxane and (b) silica, said glass fibers being of the type which do not, per se, adhere to the polycarbonate matrix in which they are incorporated.

Abstract: The subject invention pertains to toughened thermosetting resin systems useful as structural adhesives and as matrix resins for thermosetting fiber-reinforced prepregs. These toughened resins employ a most minor amount of functionalized elastomeric particles having a T.sub.g of 10.degree. C. or below dispersed in a thermosetting base resin system.

Abstract: The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: Bismaleimide resin systems and fiber reinforced prepregs prepared therefrom having exceptional toughness are prepared by dispersing into a bismaleimide base resin system preformed functionalized elastomer particles having a T.sub.g of less than 10.degree. C.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.

Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder comprises an acrylic polymer having at least two reactive anhydride groups, an epoxy-containing crosslinker, and an alkoxysilane copolymer. The composition may be used as a one-package system with a reasonable pot life. The composition is characterized by improved environmental resistance.

Abstract: Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

Abstract: The present invention relates to a coating agent containing A) a component containing carboxyl and tertiary amino groups and a polyepoxy resin B). A) consists of 10 to 90% by weight of a carboxyl- and amino-containing polyacrylate (A1) having an acid number from 20 to 140 and an amine number from 5 to 60 and 90 to 10% by weight of a carboxyl- and amino-containing polyester (A2) having an acid number from 10 to 160 and an amine number from 3 to 90.(A2) is obtainable by reaction ofa) polycarboxylic acids or anhydrides thereof, if desired together with monocarboxylic acids,b) polyols, if desired together with monools, andc) further modifying components and, if desired,d) a component which reacts with the reaction product from a), b) and possibly c),with the proviso that the final product contains tertiary amino groups originating from component a) and/or b) and/or d), the sum of components (A1) to (A2) being 100% by weight.

Abstract: This invention is directed to a setting resin composition comprising (A) a radically polymerizable monomer, (B) a thermoplastic resin soluble or dispersible in said monomer (A), (C) an epoxy resin, (D) at least one polyfunctional carboxylic acid compound selected from said group consisting of polyfunctional carboxylic acids and anhydrides thereof, and (E) an inorganic filler and using said components in proportions such that, based on said amount of said radically polymerizable monomer (A) taken as 100 parts by weight, the amount of said thermoplastic resin (B) is in the range of 5 to 75 parts by weight, that of said epoxy resin (C) in the range of 10 to 100 parts by weight, that of said inorganic filler (E) in the range of 100 to 1,000 parts by weight, and that of said polyfunctional carboxylic acid compound (D) in the range of 0.5 to 4.

Abstract: An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.

Abstract: A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:(a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener;(b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;(c) at least one free radical initiator for polymericing said unsaturated monomer; and(d) finely divided silver particles.

Abstract: A powder coating composition suitable for slot insulation is disclosed which includes an epoxy resin containing at least 60% by weight of a mixture of a first glycidyl ether of bisphenol A having a number average molecular weight of 2500-8000 with a second glycidyl ether of bisphenol A having a number average molecular weight of 350-1700, the mixture having a number average molecular weight of 1600-4600, a carboxyl group-terminated polyester resin in an amount of 5-100 parts by weight per 100 parts by weight of the epoxy resin, a curing agent, and an inorganic filler in an amount of 10-80% by weight.

Abstract: A molding additive composition comprising a mixture of low profile additive and a surfactant additive containing a silicon-oxyalkylene copolymer flow control agent and surface modifying agent; and a molding composition comprising a polyester molding resin, a low profile additive, a silicon-oxyalkylene copolymer flow control agent and surface modifying agent and a crosslinking monomer. In another embodiment, the invention embraces a molding composition comprising a polyester molding resin, a crosslinking monomer, a low profile additive, a reinforcing fiber, and a silicon-oxyalkylene copolymer flow control agent and surface modifying agent.

Abstract: An epoxy resin powder coating composition which comprises:(A) an epoxy resin comprising mainly of a bisphenol A epoxy resin mixture of (a) a bisphenol A epoxy resin having a number average molecular weight of from 2,500 to 8,000 and (b) a bisphenol A epoxy resin having a number average molecular weight of from 350 to 1,700, said mixture having a number average molecular weight of from 1,700 to 4,500;(B) rubber powder in an amount of 2 to 30 parts by weight per 100 parts by weight of said epoxy resin (A);(C) at least one hardener; and(D) a filler.The coating composition is particularly useful for the insulation of slots for motor rotors, exhibiting excellent thermal resistance, adhesiveness, impact resistance and coverage.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: Composition for coating, filling, binding and protection, comprising rubber, whereby it comprises rubber having a particle size of at most 0.4 mm present in an amount of 20-50% by weight, and a curable polymer base present in an amount of 40-50% by weight, which components after curing of said polymer base are the elastic and adhesive part of the composition. The invention further relates to a process for preparation, and a process for applying said composition.

Abstract: The present invention provides self-extinguishing polymer compositions containing components A, B, and C described below, characterized in that the proportions of components A and B are 90 to 99.99 wt % and 10 to 0.01 wt %, respectively, relative to the total amount of components A and B, and the proportion of component C is 35 to 80 wt % relative to the total amount of components A, B, and C.Component A: thermoplastic resins or elastomers other than component B described below or mixtures thereofComponent B: copolymers comprising ethylene and 0.5 to 50% by weight of ethylenic unsaturated epoxy compoundsComponent C: magnesium hydroxide granules having an average size of 0.2 to 2 microns.

Abstract: Novel 3-ring tetraglycidates having the formula ##STR1## wherein ##STR2## Y=halogen, C.sub.1 -C.sub.4 alkyl; and n=0 to 4, are disclosed.Epoxy resin systems exhibiting good tensile properties and moisture sensitivity can be made by copolymerizing the tetraglycidates with a polyamine curing agent. Prepregs can be made by combining the epoxy resin systems with a fiber reinforcement. The epoxy resin system may include a co-epoxide.

Abstract: Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).