Abstract: The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one cycloaliphatic epoxide. The reaction product may have a glass transition temperature greater than or equal to 140° C. as measured by DMA.

Abstract: An epoxy-based adhesive composition and methods of manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

Abstract: The present invention relates to new compounds based on polyetheramine modified phenalkamine, their use as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these compositions, in particular in a potting process in electrical and electronic components and devices.

Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising the epoxy resin composition and reinforcing fibers; and a fiber-reinforced composite material obtained by curing the prepreg and excellent especially in terms of 0° and 90° bending strength. An embodiment of the epoxy resin composition of the present invention for achieving such purpose is an epoxy resin composition which comprises the following components [A], [B], and [C] and satisfies a specific requirement. Component [A]: a trifunctional amine type epoxy resin. Component [B]: a bisphenol F type epoxy resin which is solid at 25° C. Component [C]: an aromatic amine compound.

Abstract: A curable resin composition contains a curable resin that comprises at least one non-aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid:Lewis base complexes, and a cure accelerating amount of one or more anhydride compounds. A method accelerating the cure of a curable resin composition, comprising adding a cure accelerating amount of one or more anhydride compounds to a curable resin composition comprising a curable resin that comprises at least one non-aromatic epoxy compound or non-aromatic oxetane compound and a curing agent that comprises one or more Lewis acid-base complexes. The composition and method are useful in making fiber reinforced resin matrix composite articles.

Abstract: A hardener component is useful for a multi-component epoxy resin material, and includes a benzoxazine amine adduct as an accelerator and an amine as a hardener. The benzoxazine amine adduct is present in the hardener component in a proportion of from 8.5 wt. % to 75 wt. %. The multi-component material including the benzoxazine amine adduct in the hardener component already has a quick curing time at room temperature and can therefore be used advantageously for the chemical fastening of construction elements.

Abstract: A prepreg comprising the following constituent elements (A), (B), and (C), the constituent element (C) being present in a surface layer of the prepreg: Constituent element (A): a reinforcing fiber base material; Constituent element (B): an epoxy resin composition containing a curing agent, the epoxy resin composition being cured within the range of from 90° C. to 140° C. (inclusive); and Constituent element (C): particles of a thermoplastic resin having a melting point or a glass transition temperature within the range of from 90° C. to 140° C. (inclusive).

Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

Abstract: A solution containing an ionic liquid, a polymer compound including at least one of a hydrolyzable polymer compound and a thermally-decomposable polymer compound, and a laminate of layered substances is irradiated with at least one of sonic waves and radio waves. Alternatively, a solution containing an ionic liquid, a polymer compound including at least one of a hydrolyzable polymer compound and a thermally-decomposable polymer compound, and a laminate of layered substances is heated.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.

Abstract: A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.

Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.

Abstract: Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

Abstract: An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

Abstract: The invention relates to a two-component or multi-component system having at least one epoxy resin component (1) that comprises i. at least one epoxy resin, ii. at least one inorganic thickener (a1) and iii. at least one wetting and dispersing agent (a2) that inhibits the thickening effect of said inorganic thickener (a1); as well as a curing component (2) which comprises i.) at least one component (b1) that at least partially cancels the inhibition of the thickening effect of the inorganic thickener (a1); said wetting and dispersing agent (a2) being non-reactive to the at least one epoxy resin, and the curing component (2) being reactive to said epoxy resin component (1). The invention also relates to substrates coated with a two-component or multi-component system according to the invention. The invention also relates to the use of a combination of (a1) and (a2) in epoxy resin compositions, in order to give the formulation a latent thickening effect.

Abstract: The present disclosure relates to electrical machines. The teachings thereof may be embodied in insulation systems for electrical machines, more particularly in the high-voltage range, for example, in an insulation system for electrical machines including: an insulator comprising a porous insulating material; an impregnator comprising a catalytically or thermally curable resin material having oxirane functionalities, or a mixture of different reactive resin materials having oxirane functionalities; and at least one thermally activatable or encapsulated hardener material.

Abstract: A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

Abstract: Methods for preparing pre-dynamic cross-linked polymer compositions are described. Methods of preparing dynamic cross-linked polymer compositions using pre-dynamic cross-linked polymer compositions are also described.

Abstract: An epoxy resin composition including [A1] a hardener represented by Formula (1), and [B] an aromatic epoxy resin having tri- or higher functionality, wherein a carbon nuclear relaxation time T1C corresponding to a benzene ring carbon atom in the main backbone of Formula (1) assigned to 130 ppm in a solid-state 13C-NMR spectrum is 42 seconds or longer, and a prepreg and a carbon fiber-reinforced composite material obtained using the epoxy resin composition: wherein X represents any one selected from —CH2—, —O—, —CO—, —C(?O)O—, —S—, —SO2—, and —NHC(?O)—; n represents 1 to 5; and R1 to R6 each represent at least one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and an a halogen atom, wherein when X is —C(?O)O— or —NHC(?O)—, X may be in either direction.

Abstract: Provided is an epoxy resin composition for giving a carbon fiber-reinforced composite material that simultaneously achieves tensile strength and compressive strength. An epoxy resin composition containing at least the following constituent elements [A]-[D] wherein the epoxy resin composition contains 5-50 mass % of constituent element [A] and 20-95 mass % of constituent element [B] relative to 100 mass % of total epoxy resin weight. [A]: at least one epoxy resin selected from 1,2-bis(glycidyloxy)benzene, 1,3-bis(glycidyloxy)benzene, 1,4-bis(glycidyloxy)benzene, derivatives of these, and epoxy resins having a structure represented by general formula [1] (in general formula [1], at least one of R1-R5 and at least one of R6-R10 is a glycidyl ether group, and the other R1-R10 represent any of a hydrogen atom, halogen atom, or aliphatic hydrocarbon group having four or fewer carbon atoms.

Abstract: A copolymer exhibiting improved heat resistance relative to phenolic resins is formed by the reaction of a bisphenol diglycidyl ether and a phenolphthalein and/or a phenolphthalimidine in a molar ratio of 0.98:1 to 1.02:1 in the presence of a catalyst. The copolymer can be used to mold plastic parts. The copolymer is also useful as a flexibilizer in thermoset compositions, and useful as a compatibilizer in blends of polar and non-polar polymers, and blends of non-polar polymers and polar fillers.

Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

Abstract: The liquid thermosetting resin composition of the present invention comprises an epoxy resin in which at least one selected from the group consisting of a linear epoxy resin having a degree of polymerization of 2 or more and an epoxy acrylate resin and at least one selected from the group consisting of a novolac-type epoxy resin and a naphthalene-type epoxy compound are linked to each other via an ether linkage, and which has a weight average molecular weight of from 2,000 to 10,000. When the liquid thermosetting resin composition of the present invention is used for insulating a stator coil of a rotating electric machine, mechanical characteristics can be improved without causing a reduction in the heat resistance.

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Abstract: Curable compositions are provided comprising (i) at least one epoxy resin as specified (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30 C to about 100 C and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50 C to about 180 C and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10 C and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; and (iii) a filler as specified. Also provided are compositions obtainable by curing the curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.

Abstract: An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.

Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.

Abstract: The present invention relates to a polarizing plate including a hard coating film, and, more particularly, to a polarizing plate including a hard coating film which exhibits high hardness and superior physical properties. The polarizing plate according to the present invention is high in hardness, scratch resistance, durability, light resistance, and light transmittance and can thus be efficiently utilized in a variety of fields.

Abstract: Disclosed is a carbon-fiber-reinforced composite material that is suitable for use as a construction material and exhibits high mechanical strength in harsh usage environments such as low-temperature environments and high-temperature moisture-absorbing environments. Also disclosed are an epoxy resin composition for producing the aforementioned carbon-fiber-rein-forced composite material and a prepreg obtained through the use of said epoxy resin composition. Said epoxy resin composition comprises at least the following constituents, by mass with respect to the total mass of the composition: (A) between 20% and 80% of an epoxy resin having the structure represented by formula (1); and (B) between 10% and 50% of an epoxy resin that has at least two ring structures with four or more members each and also has one amine glycidyl or ether glycidyl directly connected to a ring structure.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: Creping adhesives and methods for making and using same are provided. The creping adhesive can include a first thermosetting polyamidoamine-epihalohydrin resin that includes a reaction product of a first epihalohydrin and a first polyamidoamine containing one or more secondary amine groups, a first thermoplastic polyamidoamine-epihalohydrin resin that includes a reaction product of a second epihalohydrin and a second polyamidoamine containing one or more secondary amine groups, and one or more re-wetting agents. The first thermosetting polyamidoamine-epihalohydrin resin can have a weight average molecular weight of about 800,000 to about 1,200,000 and a molar ratio of the first epihalohydrin to the secondary amine groups of about 0.002:1 to about 0.1:1. The first thermoplastic polyamidoamine-epihalohydrin resin can have a weight average molecular weight of about 40,000 to about 200,000 and a molar ratio of the second epihalohydrin to the secondary amine groups of about 0.001:1 to about 0.1:1.

Abstract: This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.

Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.

Abstract: This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating.

Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract: To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent. A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007.

Abstract: This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material.

Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

Abstract: An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.