Composition Wherein Two Or More Polymers Or A Polymer And A Reactant All Contain More Than One 1,2-epoxy Group, Or Product Thereof Patents (Class 523/427)
  • Patent number: 10793711
    Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yoon Man Lee, Jae Hyun Kim, Tae Shin Eom, Eun Jung Lee, Su Mi Im
  • Patent number: 10787997
    Abstract: A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: September 29, 2020
    Assignee: HEXCEL CORPORATION
    Inventors: Kathlyn Lizette Baron, Gordon Emmerson, Yen-Seine Wang
  • Patent number: 10787590
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 29, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei Liao, Wei-Cheng Tang, Yi-Tzu Peng, Ya-Tin Yu, Yi-Che Su
  • Patent number: 10756294
    Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: August 25, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Michael Popp, Andrew Ingle, Christoph Kefes, Johannes Rosenberger, Stefan Dechand, Egbert Hoefling, Benjamin Claus Krummacher
  • Patent number: 10682791
    Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: June 16, 2020
    Assignee: Cytec Industries Inc.
    Inventors: Jonathan E. Meegan, Olivia Denman, Marco Aurilia
  • Patent number: 10658314
    Abstract: Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 19, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato
  • Patent number: 10563007
    Abstract: An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: February 18, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Juergen Huber, Bernhard Klaussner, Dieter Schirm, Matthias Uebler
  • Patent number: 10557015
    Abstract: The invention relates to a two-component or multi-component system having at least one epoxy resin component (1) that comprises i. at least one epoxy resin, ii. at least one inorganic thickener (a1) and iii. at least one wetting and dispersing agent (a2) that inhibits the thickening effect of said inorganic thickener (a1); as well as a curing component (2) which comprises i.) at least one component (b1) that at least partially cancels the inhibition of the thickening effect of the inorganic thickener (a1); said wetting and dispersing agent (a2) being non-reactive to the at least one epoxy resin, and the curing component (2) being reactive to said epoxy resin component (1). The invention also relates to substrates coated with a two-component or multi-component system according to the invention. The invention also relates to the use of a combination of (a1) and (a2) in epoxy resin compositions, in order to give the formulation a latent thickening effect.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: February 11, 2020
    Assignee: BYK-Chemie GmbH
    Inventors: Frederik Piestert, Wolfgang Pritschins, Sascha Kockoth, Jürgen Omeis
  • Patent number: 10505425
    Abstract: The present disclosure relates to electrical machines. The teachings thereof may be embodied in insulation systems for electrical machines, more particularly in the high-voltage range, for example, in an insulation system for electrical machines including: an insulator comprising a porous insulating material; an impregnator comprising a catalytically or thermally curable resin material having oxirane functionalities, or a mixture of different reactive resin materials having oxirane functionalities; and at least one thermally activatable or encapsulated hardener material.
    Type: Grant
    Filed: September 7, 2015
    Date of Patent: December 10, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Juergen Huber, Bernhard Klaussner, Dieter Schirm, Matthias Uebler
  • Patent number: 10472474
    Abstract: A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: November 12, 2019
    Assignee: HEXCEL CORPORATION
    Inventors: Kathlyn Lizette Baron, Gordon Emmerson, Yen-Seine Wang
  • Patent number: 10457806
    Abstract: Methods for preparing pre-dynamic cross-linked polymer compositions are described. Methods of preparing dynamic cross-linked polymer compositions using pre-dynamic cross-linked polymer compositions are also described.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: October 29, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Ramon Groote, Chiel Albertus Leenders, Johannes Martinus Dina Goossens, Robert Borst, Tim Bernardus van Erp, Bart Vandormael, Domenico La Camera
  • Patent number: 10400076
    Abstract: An epoxy resin composition including [A1] a hardener represented by Formula (1), and [B] an aromatic epoxy resin having tri- or higher functionality, wherein a carbon nuclear relaxation time T1C corresponding to a benzene ring carbon atom in the main backbone of Formula (1) assigned to 130 ppm in a solid-state 13C-NMR spectrum is 42 seconds or longer, and a prepreg and a carbon fiber-reinforced composite material obtained using the epoxy resin composition: wherein X represents any one selected from —CH2—, —O—, —CO—, —C(?O)O—, —S—, —SO2—, and —NHC(?O)—; n represents 1 to 5; and R1 to R6 each represent at least one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and an a halogen atom, wherein when X is —C(?O)O— or —NHC(?O)—, X may be in either direction.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: September 3, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Shizue Ueno, Nobuyuki Arai, Jun Misumi, Hiroshi Taiko
  • Patent number: 10280251
    Abstract: Provided is an epoxy resin composition for giving a carbon fiber-reinforced composite material that simultaneously achieves tensile strength and compressive strength. An epoxy resin composition containing at least the following constituent elements [A]-[D] wherein the epoxy resin composition contains 5-50 mass % of constituent element [A] and 20-95 mass % of constituent element [B] relative to 100 mass % of total epoxy resin weight. [A]: at least one epoxy resin selected from 1,2-bis(glycidyloxy)benzene, 1,3-bis(glycidyloxy)benzene, 1,4-bis(glycidyloxy)benzene, derivatives of these, and epoxy resins having a structure represented by general formula [1] (in general formula [1], at least one of R1-R5 and at least one of R6-R10 is a glycidyl ether group, and the other R1-R10 represent any of a hydrogen atom, halogen atom, or aliphatic hydrocarbon group having four or fewer carbon atoms.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: May 7, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Junichi Aoki, Atsuhito Arai, Hiroaki Sakata, Takashi Ochi
  • Patent number: 9951217
    Abstract: A copolymer exhibiting improved heat resistance relative to phenolic resins is formed by the reaction of a bisphenol diglycidyl ether and a phenolphthalein and/or a phenolphthalimidine in a molar ratio of 0.98:1 to 1.02:1 in the presence of a catalyst. The copolymer can be used to mold plastic parts. The copolymer is also useful as a flexibilizer in thermoset compositions, and useful as a compatibilizer in blends of polar and non-polar polymers, and blends of non-polar polymers and polar fillers.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 24, 2018
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventor: Edward Norman Peters
  • Patent number: 9932439
    Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: April 3, 2018
    Assignee: DAICEL CORPORATION
    Inventors: Tamaki Son, Takashi Kubo
  • Patent number: 9890277
    Abstract: The liquid thermosetting resin composition of the present invention comprises an epoxy resin in which at least one selected from the group consisting of a linear epoxy resin having a degree of polymerization of 2 or more and an epoxy acrylate resin and at least one selected from the group consisting of a novolac-type epoxy resin and a naphthalene-type epoxy compound are linked to each other via an ether linkage, and which has a weight average molecular weight of from 2,000 to 10,000. When the liquid thermosetting resin composition of the present invention is used for insulating a stator coil of a rotating electric machine, mechanical characteristics can be improved without causing a reduction in the heat resistance.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: February 13, 2018
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigeyuki Yamamoto, Takahiro Mabuchi, Kazuki Kubo, Yuhei Awano
  • Patent number: 9850375
    Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: December 26, 2017
    Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.
    Inventors: Rongtao Wang, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv, Ningning Jia
  • Patent number: 9765215
    Abstract: Curable compositions are provided comprising (i) at least one epoxy resin as specified (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30 C to about 100 C and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50 C to about 180 C and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10 C and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; and (iii) a filler as specified. Also provided are compositions obtainable by curing the curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: September 19, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Sohaib Elgimiabi, Frank Neuroth
  • Patent number: 9695294
    Abstract: An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: July 4, 2017
    Assignee: Cheil Industries, Inc.
    Inventors: Min Gyum Kim, Seung Han, Hwan Sung Cheon
  • Patent number: 9607916
    Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: March 28, 2017
    Assignees: MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD, CHULALONGKORN UNIVERSITY
    Inventors: Sathid Jitjongruck, Anongnat Somwangthanaroj
  • Patent number: 9529122
    Abstract: The present invention relates to a polarizing plate including a hard coating film, and, more particularly, to a polarizing plate including a hard coating film which exhibits high hardness and superior physical properties. The polarizing plate according to the present invention is high in hardness, scratch resistance, durability, light resistance, and light transmittance and can thus be efficiently utilized in a variety of fields.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: December 27, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Joon-Koo Kang, Yeong-Rae Chang, Sung-Don Hong, Soon-Hwa Jung, Eun-Kyu Her
  • Patent number: 9434811
    Abstract: Disclosed is a carbon-fiber-reinforced composite material that is suitable for use as a construction material and exhibits high mechanical strength in harsh usage environments such as low-temperature environments and high-temperature moisture-absorbing environments. Also disclosed are an epoxy resin composition for producing the aforementioned carbon-fiber-rein-forced composite material and a prepreg obtained through the use of said epoxy resin composition. Said epoxy resin composition comprises at least the following constituents, by mass with respect to the total mass of the composition: (A) between 20% and 80% of an epoxy resin having the structure represented by formula (1); and (B) between 10% and 50% of an epoxy resin that has at least two ring structures with four or more members each and also has one amine glycidyl or ether glycidyl directly connected to a ring structure.
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: September 6, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Atsuhito Arai, Hiroaki Sakata, Hiroshi Taiko, Michiya Ishikawa, Hidetoshi Kato, Jiro Nakatani
  • Patent number: 9315664
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: April 19, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George C. Jacob, Marty J. Null
  • Publication number: 20150122433
    Abstract: Creping adhesives and methods for making and using same are provided. The creping adhesive can include a first thermosetting polyamidoamine-epihalohydrin resin that includes a reaction product of a first epihalohydrin and a first polyamidoamine containing one or more secondary amine groups, a first thermoplastic polyamidoamine-epihalohydrin resin that includes a reaction product of a second epihalohydrin and a second polyamidoamine containing one or more secondary amine groups, and one or more re-wetting agents. The first thermosetting polyamidoamine-epihalohydrin resin can have a weight average molecular weight of about 800,000 to about 1,200,000 and a molar ratio of the first epihalohydrin to the secondary amine groups of about 0.002:1 to about 0.1:1. The first thermoplastic polyamidoamine-epihalohydrin resin can have a weight average molecular weight of about 40,000 to about 200,000 and a molar ratio of the second epihalohydrin to the secondary amine groups of about 0.001:1 to about 0.1:1.
    Type: Application
    Filed: November 7, 2014
    Publication date: May 7, 2015
    Applicant: GEORGIA-PACIFIC CHEMICALS LLC
    Inventors: Clay E. Ringold, David F. Townsend, Cornel Hagiopol, Karla D. Favors, Thomas L. Wright
  • Publication number: 20150119500
    Abstract: This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.
    Type: Application
    Filed: April 24, 2012
    Publication date: April 30, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Amy Song, Hongyu Chen
  • Patent number: 9018282
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Patent number: 9012009
    Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hae Kwang Co., Ltd.
    Inventor: Myun Soo Kim
  • Publication number: 20150099831
    Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 9, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Guillaume Metral, Bernd Hoevel, Joseph Gan, Michael J. Mullins, Robert E. Hefner, JR.
  • Patent number: 8986799
    Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: March 24, 2015
    Assignee: Akzo Nobel Coatings International B.V.
    Inventors: Paul Anthony Jackson, Peter Robert Jones
  • Patent number: 8974905
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20150064847
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Application
    Filed: August 5, 2013
    Publication date: March 5, 2015
    Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
  • Publication number: 20150056756
    Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
    Type: Application
    Filed: April 5, 2013
    Publication date: February 26, 2015
    Inventors: Sathid Jitjongruck, Anongnat Somwangthanaroj
  • Publication number: 20150051317
    Abstract: This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating.
    Type: Application
    Filed: March 20, 2012
    Publication date: February 19, 2015
    Inventors: Yan Wu, Chen Chen, Yue Shen, Yurun Yang
  • Publication number: 20150048495
    Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 19, 2015
    Inventors: Kazutaka Honda, Akira Nagai, Makoto Satou
  • Publication number: 20150044484
    Abstract: To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent. A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007.
    Type: Application
    Filed: March 21, 2013
    Publication date: February 12, 2015
    Applicant: MITSUBISHI GAS CHEMCIAL COMPANY, INC.
    Inventors: Shoichi Ito, Michio Yaginuma, Naoki Oka, Masataka Kudo
  • Publication number: 20150037575
    Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
    Type: Application
    Filed: February 21, 2013
    Publication date: February 5, 2015
    Applicant: SHOWA DENKO K.K.
    Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
  • Publication number: 20150037561
    Abstract: This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material.
    Type: Application
    Filed: January 30, 2013
    Publication date: February 5, 2015
    Applicant: Momentive Specialty Chemicals
    Inventors: Helga De Velder, Alain Leroy, Jean Riviere, Eckard Ruehle
  • Publication number: 20150035175
    Abstract: An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 5, 2015
    Inventors: Kazutaka Honda, Akira Nagai, Makoto Satou
  • Patent number: 8945365
    Abstract: The present invention relates to electrodepositable coating compositions that produce cured coatings that exhibit resistance to cratering. The coating compositions include an active hydrogen-containing cationic salt group-containing polymer; and 0.1 to 20 percent by weight, based on the total weight of resin solids in the coating composition, of an ungelled acrylic polymer.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: February 3, 2015
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Ellor J. VanBuskirk, Joseph Swanger, Craig Wilson
  • Patent number: 8937114
    Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: January 20, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Guillaume Metral, Bernd Hoevel, Joseph Gan, Michael J. Mullins, Robert E. Hefner, Jr.
  • Patent number: 8937116
    Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: January 20, 2015
    Assignee: LG Hausys, Ltd.
    Inventors: Yun-Bong Kim, Won-Kook Kim, Dong-Joo Gwon, Yang-Gu Kang, Jin-Woo Kim, Mu-Seon Ryu
  • Publication number: 20150017410
    Abstract: A resin binder for use in formaldehyde emission-free stator insulation. The resin binder includes an epoxy, a catalyst, and a polymer material. The polymer material is hydroxyl-terminated. The resin binder is used in mica tape for groundwall insulation for stator windings.
    Type: Application
    Filed: July 10, 2013
    Publication date: January 15, 2015
    Inventors: James Jun Xu, Jeffrey David Sheaffer
  • Publication number: 20150014729
    Abstract: A resin composition for reflecting light of the present invention includes an epoxy resin B having a unit structure X of alicyclic acid anhydride and a unit structure Y of hydrogenated bisphenol, and a colorant. The epoxy resin B preferably further has a unit structure Z of bisphenol-type epoxy. In addition, the resin composition for reflecting light of the present invention preferably further includes an epoxy resin A having a structure represented by the following formula (1). Then, when a content of the epoxy resin A is M [% by mass], and a content of the epoxy resin B is N [% by mass], it is preferable to satisfy a relationship of 0.1?M/N?10. (In the formula (1), R represents a monovalent organic group having 2 to 10 carbon atoms, and n represents an integer of 3 to 50.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 15, 2015
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Masaharu Ito, Keiichi Tsukurimichi
  • Publication number: 20150011681
    Abstract: A curable epoxy resin formulation useful for making an insulator for a high-voltage gas insulated switchgear, the curable formulation including (A) an epoxy resin composition comprising a mixture of: (A1) at least one solid epoxy resin, (A2) at least one novolac epoxy resin, and (A3) at least one cycloaliphatic epoxy resin; (B) at least one anhydride hardener; (C) at least one filler; and (D) optionally, at least one catalyst or at least one accelerator.
    Type: Application
    Filed: March 29, 2012
    Publication date: January 8, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Ming Lei Ji, Yong-jiang Li, Yi Zhang
  • Patent number: 8928158
    Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Seung Han, Ju Mi Kim, Sung Su Park, Eun Jung Lee
  • Publication number: 20140377453
    Abstract: The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 25, 2014
    Inventors: Chan Sup Park, Rae-Hong Cho, Dong Hyon Kim, Kyung Ho Park, Sang-Kwon Han, Chong Soo Park, Bae Geun Lee, Jung Bong Kim, Jae Man Han, Tae Kyoo Shin, Dae Chul Bae
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8912254
    Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: December 16, 2014
    Assignee: Huntsman International LLC
    Inventor: Philippe Gottis
  • Publication number: 20140309336
    Abstract: Embodiments herein relate to a prepreg comprising a thermosetting resin, and reinforcing fibers in the thermosetting resin, wherein when the prepreg is cured in vacuum bag only conditions, and a method of making the same. The method also applies for autoclave processing. Embodiments also relate to a cured fiber reinforced composite material made by thermally curing the prepreg.
    Type: Application
    Filed: December 26, 2012
    Publication date: October 16, 2014
    Applicant: TORAY INDUSTRIES. INC
    Inventors: Jonathan C Hughes, Jeffrey A Satterwhite, Nobuyuki Arai, Atsuhito Arai, Alfred P Haro, Kenichi Yoshioka
  • Publication number: 20140291870
    Abstract: A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond.
    Type: Application
    Filed: October 24, 2012
    Publication date: October 2, 2014
    Inventors: Yoichi Shimba, Koichi Fujimaru, Toshihisa Nonaka