Abstract: A filled, tough-elasticized casting compound comprised of resin, hardener, accelerator, and filler, for electrical and electronic components which excellently eliminates the heat in cast components and which can also withstands extreme temperature shocks.

Abstract: The specification describes and claims substantially odourless compositions having a pot life after mixing acceptable for use in manufacture and repair of aircraft and which cure at room temperature to provide a mass of heat and aircraft fuel resistant elastomeric material. The compositions comprise components which are at least substantially free of thiol and comprise a fluorocarbon copolymer, organic solvent, metallic oxide, epoxy compound and as crosslinking agent a diamino silane according to the general formula (i) namely ##STR1## Examples disclose compositions formed from admixture of two components comprising Viton A, methyl ethyl ketone, magnesium oxide, Epikote 828 and N-beta(aminoethyl) gamma-aminopropyl-trimethoxysilane. The compositions are suitable for forming coatings, adhesive bonds and seals, to metal parts of titanium and aluminium alloys which have resistance to aviation fuels and high temperatures.

Abstract: Cured polyfunctional epoxy resins including tris(hydroxyphenyl)methane triglycidyl ether are toughened by addition of polybrominated polymeric additives having an EE below 1500 to the pre-cure composition. Carboxy-terminated butadiene-acrylonitrile rubber is optionally present in the pre-cure mixture as such or as a pre-formed copolymer with other reactants. Reinforced composites, particularly carbon-reinforced composites, of these resins are disclosed and shown to have improved toughness.

Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Abstract: A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Abstract: An epoxy resin composition having excellent adhesive and high mechanical strength is disclosed. The composition comprises:(A) a bisphenol A type epoxy resin present in an amount of at least 45 wt % of the total epoxy resin;(B) a novolak type epoxy resin present in an amount of at least 8 wt % of the total epoxy resin;(C) a glycidyl amine type epoxy resin (including the one used in (D)) present in an amount of at least 15 wt % of the total epoxy resin;(D) a reaction product of a butadiene-acrylonitrile copolymer having carboxyl groups on at least both ends of the molecule and a glycidyl amine type epoxy resin, said butadiene-acrylonitrile copolymer being present in an amount of 1.

Abstract: Provides new and improved water-reducible coating compositions and methods of making them. Three preferred processes are disclosed. These differ in the manner of incorporating and chemical nature of an extender polymer.Broadly, the process of the invention is one for forming an aqueous dispersion of a fluent resinous composition ofa. a mixture in an organic solvent of(i) an ionizable graft polymer of an epoxy resin and an addition polymerized resin, the addition polymerized resin being bonded to aliphatic backbone carbon atoms of the epoxy resin by carbon-to-carbon bonds, and(ii) an extender resin;b. an aqueous vehicle, andc. an ionizing agent;the ionization present from said combined components being sufficient to establish the components as a dispersion in the aqueous vehicle, and then addition polymerizing a quantity of addition polymerizable monomer, under addition polymerizing conditions, in said aqueous dispersion, the aqueous dispersion serving as a vehicle therefor.