Solid Polymer Derived From Reactant Containing Element Other Than C, H, O, Or N Or Chlorine-containing Reactant Of Three Or More Carbon Atoms Patents (Class 523/435)
  • Patent number: 10434685
    Abstract: A release agent for being coated onto a tire bladder made of a zinc-oxide-incorporated butyl rubber during pneumatic-tire molding, the release agent containing (A) organopolysiloxane, which contains a carboxy group indicated by the general formula (1) below (in the formula, R1 is a substituted or unsubstituted C1-C30 monovalent hydrocarbon group excluding R2, R2 is a carboxy-group-substituted C1-C30 monovalent organic group, R3 is R1 or R2, and n is an integer of 3 to 2000.). This release agent produces a longer service life of a tire bladder and leads to reduced tire production cost because the amount of silicone that migrates to the tire side is low when the tire is released, and repeated mold-release performance is enhanced.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: October 8, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Inokuchi, Takakazu Minato, Nobuaki Honsho
  • Patent number: 10392505
    Abstract: There is provided a thermoplastic polyester resin composition, comprising a specified amount of a multivalent hydroxyl compound (B) having five or more hydroxyl groups and a specified amount of an epoxy compound (C) that are to be blended with a thermoplastic polyester resin (A).
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 27, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Patent number: 10311346
    Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: June 4, 2019
    Assignee: CompoSecure, LLC
    Inventor: John Herslow
  • Patent number: 10040896
    Abstract: Compositions comprising Silane functionalized compounds are provided. In one embodiment, the silane functionalized compounds include an epoxy resin derived backbone having silane functional groups pendant to the backbone or serving as end caps. The compositions comprising silane functionalized compounds may be utilized in a variety of applications including in coating formulations, adhesive formulations, composite materials, and combinations thereof.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: August 7, 2018
    Assignees: HEXION, INC., MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Antonina Nikitenko, Matthew Pinnow, Amitabh Bansal
  • Patent number: 9902803
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 27, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Patent number: 9773958
    Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: September 26, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Nan Chan, Shu-Chen Huang, Chih-Hao Lin, Wen-Bin Chen, Kai-Chi Chen
  • Patent number: 9732182
    Abstract: Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: August 15, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sung-Hwan Park, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sang-Yong Tak
  • Patent number: 9670309
    Abstract: A novolac epoxy compound having an alkoxysilyl group of which composite has low CTE and increase of glass transition temperature, and requiring no coupling agent, a production method thereof, an epoxy composition including the same and a cured article thereof, are provided. A novolac epoxy compound having an alkoxysilyl group of Formulae I-1 to I-4, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation, alkenylation and alkoxysilylation of a novolac epoxy compound, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation and alkoxysilylation of a novolac epoxy compound, an epoxy composition including the novolac epoxy compound having an alkoxysilyl group, and a cured article, are provided. The cured article, i.e., the composite of the epoxy composition has improved chemical bonding efficiency due to alkoxysilyl groups. Low CTE and high glass transition temperature are exhibited.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: June 6, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Sang-Yong Tak, Su-Jin Park, Sung-Hwan Park
  • Patent number: 9392689
    Abstract: A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: July 12, 2016
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshihisa Yamamoto, Hiroyuki Yoshimoto, Hideto Nakagawa
  • Patent number: 9353259
    Abstract: Provided is a thermoplastic resin composition having high flame resistance and high fluidity during injection molding, and improved impact resistance in a molded article. A method for producing a thermoplastic resin composition, the method including the step (1) of obtaining a polyester resin mixture by melt-kneading 50 to 80 parts by weight of crystalline polyester resin and 20 to 50 parts by weight of amorphous polyester resin with an extruder, and the step (2) of mixing the polyester resin mixture, a polycarbonate resin, a flame retardant, a dripping inhibitor and a toughening agent, wherein the cylinder temperature of the extruder is 250 to 280° C.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: May 31, 2016
    Assignee: KONICA MINOLTA, INC.
    Inventors: Yiqiang Yu, Masashi Mamino, Ryuji Kitani
  • Patent number: 9346942
    Abstract: A thermoplastic resin composition includes a thermoplastic resin including a polycarbonate resin; a siloxane compound represented by Formula 1; and surface-modified hydrophobic silica: wherein R1 and R2 are the same or different and are each independently C1 to C5 alkyl; R3 and R4 are the same or different and are each independently C2 to C10 alkylene; A1 and A2 are the same or different and are each independently a glycidoxy group, an epoxy group, an amine group, a hydroxyl group, a hydrogen atom, a vinyl group, a (meth)acryloyl group, or an aryl group; and n is an integer from 2 to 80. The thermoplastic resin composition can exhibit excellent properties in terms of impact resistance, heat resistance, scratch resistance, surface gloss, mar resistance, and the like.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: May 24, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Yeon Wook Chung, Yong Hee Kang, Kyu Young Kim, Byeong Yeol Kim, Joong In Kim
  • Patent number: 9267029
    Abstract: There is provided a method of making a nano-composite having individual nano-sized silica particles dispersed in a polymer matrix, the method comprises the step of curing a substantially homogeneous mixture of surface-functionalized nano-sized silica particles, a polymerizable resin and a curing agent, wherein said substantially homogeneous mixture is substantially free of alcoholic solvent to form the nano-composite.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: February 23, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Nopphawan Phonthammachai, Chaobin He, Xu Li, Hong Ling Chia
  • Publication number: 20150111044
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
  • Patent number: 9012537
    Abstract: There may be provided a process for producing a polyimide siloxane solution composition having a further improved long-term viscosity stability; and a polyimide siloxane solution composition. In the process for producing the polyimide siloxane solution composition by polymerizing/imidizing a tetracarboxylic acid component and a diamine component consisting of (a) a diaminopolysiloxane, (b) a diamine having a polar group and (c) a diamine other than (a) and (b) in a solvent, the tetracarboxylic acid component and the diamine component excluding (b) the diamine having a polar group are polymerized/imidized to provide a reaction mixture solution, and then (b) the diamine having a polar group is added to the reaction mixture solution last, and the mixture is polymerized/imidized.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 21, 2015
    Assignee: Ube Industries, Ltd.
    Inventors: Susumu Takasaki, Hiroo Yamashita, Seiichirou Takabayashi, Tomoko Hayashida, Mitsuo Yamanaka, Takafumi Hirakawa
  • Publication number: 20150105493
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Application
    Filed: March 14, 2013
    Publication date: April 16, 2015
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Publication number: 20150099070
    Abstract: There is provided a composition for curing a resist underlayer film used as an underlayer of a resist for nanoimprint in nanoimprint lithography of a pattern forming process by heat-baking, light-irradiation or both of them to form the resist underlayer film. A composition for forming a resist underlayer film used for nanoimprint in a pattern forming process using nanoimprint by performing heat-baking, light-irradiation, or both of them, the composition comprising a silicon atom-containing polymerizable compound (A), a polymerization initiator (B) and a solvent (C). The polymerizable compound (A) may contain silicon atoms in a content of 5 to 45% by mass. The polymerizable compound (A) may be a polymerizable compound having at least one cation polymerizable reactive group, a polymerizable compound having at least one radical polymerizable reactive group, or a combination of them, and the polymerization initiator (B) may be a photopolymerization initiator.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 9, 2015
    Inventors: Satoshi TAKEI, Tomoya OHASHI
  • Patent number: 8987354
    Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 24, 2015
    Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
  • Publication number: 20150080486
    Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.
    Type: Application
    Filed: May 19, 2012
    Publication date: March 19, 2015
    Inventor: Robert Valentine Kasowski
  • Publication number: 20150073069
    Abstract: The present invention provides a curable coating composition comprising at least one linear or cyclic polysiloxane containing at least one quaternary ammonium group, a process for producing the aforesaid coating composition, and a process for producing a coating with the curable coating composition, and also the coatings and coating compositions themselves that are obtainable by the processes described.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 12, 2015
    Inventors: Berend-Jan De Gans, Sascha Herrwerth, Alexandra Trambitas, Verena Dahl, Sylvia Hicking, Giuseppe Giuffre
  • Publication number: 20150064909
    Abstract: Provided are: a resin mold material and a resin replica mold material composition for imprinting having a superior mold releasability; a resin mold and a resin replica mold resulting from containing the material composition; and a method for producing them. The resin mold material or resin replica mold material composition for imprinting contains 100 parts by weight of a mold resin or replica mold resin for imprinting and 0.1 to 10 parts by weight of a curable fluoropolymer (A). Preferably, the fluoropolymer (A) has a weight-average molecular weight of 3,000 to 20,000 and results from including as repeating units (a1) an ?-position substituted acrylate having a fluoroalkyl group having 4 to 6 carbon atoms and (a2) and 5 to 120 parts by weight of a high-softening-point monomer exhibiting a glass transition point or softening point of at least 50° C. in the homopolymer state.
    Type: Application
    Filed: April 9, 2013
    Publication date: March 5, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tsuneo Yamashita, Masamichi Morita, Yoshiko Kuwajima
  • Publication number: 20150065608
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.
    Type: Application
    Filed: April 9, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Jin Seok Moon, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim
  • Publication number: 20150057393
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.
    Type: Application
    Filed: December 3, 2013
    Publication date: February 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Seong Hyun Yoo, Jin Young Kim, Geum Hee Yun
  • Publication number: 20150031798
    Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.
    Type: Application
    Filed: August 18, 2014
    Publication date: January 29, 2015
    Inventors: Jens ROCKS, Walter Odermatt
  • Publication number: 20150004374
    Abstract: A plasticized ultraviolet or electron beam (UV/EB) cationically cured coating, such as a release layer or print from UV/EB cured inks, comprises polymers with a reactive plasticizer incorporated therein. The cured coating contains the plasticizing additives permanently attached to the polymer matrix, locking them in place, and permanently flexibilizing the cured coating. The cured coating finds use on varied substrates including printable substrates used in conventional printers and those with release layers for adhesive labels. Coating formulations which form these cationically cured coatings comprise cationically polymerizable monomers and/or oligomers, a reactive plasticizer which is food grade, cosmetic grade, medical grade or biologically benign when incorporated in the polymer backbone, and a catalyst.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Steven Nahm, Larry G. Venable
  • Publication number: 20140378579
    Abstract: The present invention relates to a thermosetting resin composition comprising (A) An unsaturated polyester resin comprising fumaric acid building blocks and/or a methacrylate functional resin, whereby the resin has a molecular weight Mn of from 450 up to and including 10000 Dalton and the amount of such unsaturated polyester resin and methacrylate functional resin is from 30 up to and including 80 wt. %; (B) An ethylenically unsaturated compound copolymerizable with (A); present in an amount from 10 up to and including 60 wt. %; (C) A core-shell rubber in an amount from 0.1 up to 6 wt. %, whereby the core has a Tg of less than ?30° C. and the average particle diameter of the core-shell rubber is from 50 up to and including 1000 nm; and (D) An epoxy compound in an amount from 0.3 up to and including 10 wt. %; whereby the amounts are given relative to the total weight (in g) of the summed amount of (A), (B), (C) and (D).
    Type: Application
    Filed: March 11, 2013
    Publication date: December 25, 2014
    Applicant: DSM IP Assets B.V.
    Inventors: Giacomo Perfetti, Johan Franz Gradus Antonius Jansen, Bahri Widjanarko
  • Patent number: 8916622
    Abstract: A heat-curable composition comprises—from 25 to 65% by weight of a mixture of epoxy-functional monomers, said mixture consisting of at least one polyfunctional epoxy monomer selected from monomers comprising from 4 to 8 glycidyl groups and/or cycloaliphatic epoxy groups, and at least one bi- or tri-functional epoxy monomer selected from monomers comprising two or three glycidyl groups and/or cycloaliphatic epoxy groups, —from 25 to 70% by weight of at least one organic solvent selected from glycol monoethers, —from 2.5 to 5% by weight, relative to the total weight of epoxyfunctional monomers (a) and (b), of at least one blocked strong acid catalyst, said heat-curable composition not containing any non-epoxyfunctional monomers, in particular not containing any acrylic, methacrylic or silane monomers.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: December 23, 2014
    Assignee: Essilor Internatonal (Compagnie Générale d'Optique)
    Inventor: Robert Valeri
  • Publication number: 20140367149
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed circuit board including the build-up film or a prepreg.
    Type: Application
    Filed: November 12, 2013
    Publication date: December 18, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jun Young Kim
  • Publication number: 20140332159
    Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).
    Type: Application
    Filed: July 25, 2014
    Publication date: November 13, 2014
    Inventors: Masayoshi UENO, Yoshihiro KATO, Takeshi NOBUKUNI
  • Publication number: 20140333999
    Abstract: There is provided a polyester-based primer composition including 100 parts by weight of a polyester resin, 1 to 20 parts by weight of water-dispersible particles, and water as a remainder. Since a polyester-based primer composition of the present disclosure is excellent in water resistance and solvent resistance differently from a urethane primer composition, the polyester-based primer composition may obtain sufficient adhesive strength between a protection film and a functional coating layer even without assistance from additives such as a cross-linking agent, and may retain stable adhesive strength for a long period of time.
    Type: Application
    Filed: December 20, 2013
    Publication date: November 13, 2014
    Inventors: Hwa-Sub Shim, Yi-Rang Lim, Jun-Wuk Park, Kyoung-Won Kim, Sung-Hyun Jeon
  • Publication number: 20140323611
    Abstract: The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured.
    Type: Application
    Filed: November 9, 2012
    Publication date: October 30, 2014
    Inventors: Deheng Zhang, Junshi Kong, Wenli Li, Huan Wu, Yajuan Yang
  • Patent number: 8859651
    Abstract: Compositions including a blend of a) a polysulfone (PSU); b) a polyphenylene sulfide (PPS); and, c) a polyetherimide and epoxy. The polyetherimide and epoxy can be present in an amount effective to act as a compatibilizer for the polysulfone (PSU) and polyphenylene sulfide (PPS). Various embodiments relate to a method of compatibilizing a blend of polysulfone (PSU) and polyphenylene sulfide (PPS). The method can include a) melt mixing a polysulfone (PSU) and a polyetherimide; and b) melt mixing a polyphenylene sulfide (PPS) and an epoxy. Step a) and b) can be carried out by one of sequential mixing and simultaneous mixing.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: October 14, 2014
    Assignee: Sabic Global Technologies B.V.
    Inventors: Hariharan Ramalingam, Kapil Sheth
  • Publication number: 20140303284
    Abstract: The present invention is directed to a resin composition, comprising a blend of: (1) an epoxy polysiloxane resin; (2) an epoxyfluorosilicone resin; and (3) a fluorinated (or non-fluorinated) silane-modified polyacrylic resin. Further, the present invention is directed to a coating composition comprising the above resin blend composition and a curing agent. Further, the invention is directed to coating composition comprising an epoxy polysiloxane resin and a fluorinated (or non-fluorinated) silane-modified polyacrylic resin.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 9, 2014
    Applicant: THE SHERWIN-WILLIAMS COMPANY
    Inventor: THE SHERWIN-WILLIAMS COMPANY
  • Publication number: 20140296383
    Abstract: A copier/printer exterior part uses a halogen-free flame-retardant resin composition. The halogen-free flame-retardant resin composition includes 5 wt % to 50 wt % of unused polycarbonate, 20 wt % to 63 wt % of recycled polycarbonate 5 wt % to 35 wt % of recycled polyethylene terephthalate, 0.2 wt % to 2 wt % of a styrene-acrylonitrile-glycidyl methacrylate terpolymer, 5 wt % to 15 wt % of a toughener, 10 wt % to 20 wt % of a flame retardant, 0.1 wt % to 0.8 wt % of a flame-retardant antidrip agent, 0.1 wt % to 1 wt % of an antioxidant, and 0.1 wt % to 2 wt % of a lubricant. The styrene-acrylonitrile-glycidyl methacrylate terpolymer includes 1 wt % to 5 wt % of glycidyl methacrylate and 20 wt % to 33 wt % of acrylonitrile.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Applicants: SHANGHAI KUMHOSUNNY PLASTICS CO., LTD., KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.
    Inventors: Minqi XIN, Minghua LUO, Wenqiang LI, Lei GAO, Qiang LI, Ryuji KITANI, Yasuharu SAITA
  • Publication number: 20140287589
    Abstract: It is aimed to enhance adhesiveness between a resist pattern formed on a resist underlayer film and to reduce an undercut of the resist pattern. An additive for a resist underlayer film-forming composition, including: a polymer having a structural unit of Formula (1): (where R1 is a hydrogen atom or a methyl group; L is a divalent linking group; X is an acyloxy group having an amino group protected with a tert-butoxycarbonyl group or a nitrogen heterocycle protected with a tert-butoxycarbonyl group).
    Type: Application
    Filed: October 12, 2012
    Publication date: September 25, 2014
    Inventors: Takafumi Endo, Rikimaru Sakamoto, Noriaki Fujitani
  • Publication number: 20140272287
    Abstract: Curable compositions containing thiol-terminated polythioethers and encapsulated polyepoxy curing agents are disclosed. The compositions exhibit extended pot life.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: PRC-DESOTO INTERNATIONAL INCORPORATED
    Inventor: PRC-DESOTO INTERNATIONAL INCORPORATED
  • Publication number: 20140272420
    Abstract: The disclosure relates to curable polyepoxysilane compounds and compositions, methods related to curing of such compounds via hydrolysis and/or condensation to form coatings on a substrate, and coated articles formed from the curable polyepoxysilane compounds. The polyepoxysilane compounds are silane-functional precursors and can be used as coatings (or pretreatments) on various substrates (e.g., metals such as aluminum) and provide a substantial improvement in corrosion resistance relative to other anti-corrosion coatings. The silane-functional precursors can be prepared by reaction of functional silanes (e.g., amino-functional silanes or other epoxide-reactive functionalized silanes) with epoxide-containing organic or hydrocarbon compounds and oligomers/polymers thereof (e.g., glycidyl-type ethers or other epoxide-/oxirane-functionalized hydrocarbon compounds), for example including hydrocarbons with one or more aromatic hydrocarbon groups (e.g., in an aromatic polyether).
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicant: EASTERN MICHIGAN UNIVERSITY
    Inventor: Vijaykumar M. Mannari
  • Publication number: 20140272175
    Abstract: A dual curable composition is provided, comprising a compound represented by formula (I): (acrylate)a-(A)-(silane)b??(I) in which a and b are identical or different and are each represented by an integer greater than or equal to 1; and wherein the dual curable composition is radiation curable and/or moisture curable. The moiety A comprises at least one of an aliphatic hydrocarbon, a cycloaliphatic hydrocarbon, an aryl moiety, an ether, an ester, an amide, a urethane, a urea, a hydroxyl group-containing organic moiety, an acrylic oligomer, an epoxy oligomer, a urethane oligomer, a polyester oligomer, or mixtures thereof, and the dual curable composition has a molecular weight greater than or equal to 300.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventor: Benedict S. CURATOLO
  • Publication number: 20140255832
    Abstract: A hardcoat composition comprises (a) an epoxy silane compound, (b) a reactive silicone additive and (c) photo-acid generator. The reactive silicone additive has one of the following general structures:formula (I) or X—SiR1R2—(O—SiR1R2)n-X (Formula 2) wherein: R1, R2, and R3 are independently a C1-C6 alkyl group or aromatic group with or without substitution; X is a curable group selected from —OH, —OR, —OC(0)R, —OSiY?Y3, —CHzCHrL-SiYVY3, and —C(O)(R)3, wherein: L is a divalent linkage group; Y1, Y2, and Y3 are independently selected from a C1-C6 alkyl group, and a curable group selected from —OH, —OC(O)R, and —OR, with the proviso that at least one of Y1, Y2, and Y3 is a curable group; R is a C1-C4 alkyl group; and n is at least 2 and m is at least 1, provided that the weight average molecular weight (Mw) of the reactive silicone additive is no more than 4200.
    Type: Application
    Filed: October 17, 2012
    Publication date: September 11, 2014
    Inventor: Zai-Ming Qiu
  • Patent number: 8822832
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: September 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Seong Hyun Yoo, Keun Yong Lee, Hyun Jun Lee
  • Patent number: 8815400
    Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: August 26, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsuya Kanamaru, Shinsuke Yamaguchi
  • Publication number: 20140234785
    Abstract: A pattern is formed by coating a chemically amplified resist composition comprising a resin having a dissolution rate in an organic solvent developer that lowers under the action of acid onto a processable substrate, prebaking, exposing the resist film, PEB, developing in an organic solvent developer to form a negative pattern, coating a solution comprising Si, Ti, Zr, Hf or Al, prebaking, and dry etching to effect image reversal for converting the negative pattern into a positive pattern.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 21, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Tsutomu Ogihara, Yusuke Biyajima
  • Publication number: 20140205843
    Abstract: Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.
    Type: Application
    Filed: June 26, 2012
    Publication date: July 24, 2014
    Inventor: Christian Beisele
  • Publication number: 20140194556
    Abstract: Blends of a polyphenylene sulfone (PPSU); a polyphenylene sulfide (PPS); and, a polyetherimide and epoxy. The polyetherimide and epoxy are present in an amount effective to act as a compatibilizer for the polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). Methods of compatibilizing a blend of polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). The method can include melt mixing a polyphenylene sulfone (PPSU) and a polyetherimide; and melt mixing a polyphenylene sulfide (PPS) and an epoxy.
    Type: Application
    Filed: March 8, 2013
    Publication date: July 10, 2014
    Applicant: SABIC Innovative Plastics IP B.V.
    Inventors: Hariharan Ramalingam, Mark Sanner, Kapil Sheth
  • Patent number: 8772376
    Abstract: A curable liquid formulation comprising: (i) one or more near-infrared absorbing polymethine dyes; (ii) one or more crosslinkable polymers; and (iii) one or more casting solvents. The invention is also directed to solid near-infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: July 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Wu-Song Huang, Martin Glodde, Dario L. Goldfarb, Wai-Kin Li, Sen Liu, Libor Vyklicky
  • Publication number: 20140187673
    Abstract: The invention relates to a high solids tint paste that is preferably substantially free of solvents that are volatile organic compounds. Preferably the universal tint paste is 100% solids and substantially free of any solvents. The universal tint paste is formed using a functional silicone resin intermediate that is end-capped with an alcohol, catalyzed to form a silicone resin product and combined with one or more desired pigments. The universal tint paste preferably can be used in a wide variety of solvent-borne and high solids coatings.
    Type: Application
    Filed: January 2, 2013
    Publication date: July 3, 2014
    Applicant: Jones-Blair
    Inventors: Jasmine Keuk, Paul Anthony Lum, Michael S. Davis, Miguel Angel Gutierrez, Chiew W. Koay, Douglas E. Johnston, JR., Carolina A. Flanigan, Larry Dale Wyman, Roland L. Gasmena
  • Publication number: 20140187674
    Abstract: This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jik Lee, Joon Seok Kang, Jang Bae Son, Sang Hyun Shin, Hye Sook Shin, Hyun Chul Jung
  • Publication number: 20140179187
    Abstract: A liquid binder composition for binding fibrous materials in the fabrication of resin-infusible preform is disclosed. The binder composition is an aqueous dispersion containing (a) one or more multifunctional epoxy resins, (b) at least one thermoplastic polymer, (c) one or more surfactants selected from anionic surfactants, nonionic surfactants, and combinations thereof, (d) water, and is essentially free of organic solvents. Also disclosed is an emulsification process for producing the liquid binder composition.
    Type: Application
    Filed: June 12, 2013
    Publication date: June 26, 2014
    Inventors: Carmelo Luca Restuccia, Gerald Hobisch, William Jacobs, Dominique Ponsolle
  • Publication number: 20140163139
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes a mixture of polyamide 12 particles and polyamide 11 particles.
    Type: Application
    Filed: February 13, 2014
    Publication date: June 12, 2014
    Applicant: Hexcel Corporation
    Inventors: Yen-Seine Wang, Maureen Boyle
  • Publication number: 20140154479
    Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.
    Type: Application
    Filed: March 17, 2013
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Jin Ho Hong, Sa Yong Lee, Jin Young Kim, Keun Yong Lee
  • Publication number: 20140150963
    Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material.
    Type: Application
    Filed: September 2, 2011
    Publication date: June 5, 2014
    Inventor: Yueshan He