Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.

Abstract: A resin composition which comprises 100 parts by weight of a synthetic resin and 50 to 1,500 parts by weight of magnesium oxide particles, wherein the magnesium oxide particles satisfy the following requirements (i) to (v): (i) an average secondary particle diameter of 0.1 to 130 &mgr;m, (ii) a BET method specific surface area of 0.1 to 5 m2/g, (iii) a total content of an Fe compound and an Mn compound of 0.01 wt % or less in terms of metals, (iv) an Na content of 0.001 wt % or less, and (v) a Cl content of 0.005 wt % or less, and a molded product formed therefrom. Since the resin composition of the present invention has excellent flame retardancy, heat conductivity and water resistance, it is advantageously used as a material for sealing a heat generating electronic member such as a semiconductor.

Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.

Abstract: A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 &mgr;m and a mean particle size of 0.5-10 &mgr;m, (C) 0.1-6 parts of a reactive functional group-containing silicone compound, and (D) 0.01-10 parts of a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and eliminates voids and other defects.

Abstract: An object is to remarkably improve the water resistance and weather resistance of the cured coating film in the aqueous curable resin composition. An aqueous dispersion is used as a main agent which contains, as essential components, gel-like resin dispersed particles having a functional group selected from a salt of a tertiary amino group or a salt of an acid group and an aqueous medium, and a compound having both an epoxy group and a hydrolyzable silyl group is used as a curing agent.

Abstract: In the present invention, provided are i) an encapsulant epoxy resin composition comprising an epoxy resin, a curing agent, a non-conductive carbon and an inorganic filler, and ii) an electronic device having an encapsulating member comprising a cured product of this composition.

Abstract: A barrier for halogenated aromatic compounds is provided, especially fluorinated hydrocarbon films useful for containing precise quantities of halogenated aromatic compounds used as thermally sensitive materials in reversible chemical thermometers. A new shape of chemical thermometer is also disclosed.

Abstract: A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, a polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

Abstract: A waterborne coating composition having a crosslinking agent and a dispersion of polymeric microparticles in an aqueous medium wherein the microparticles are prepared by first forming a mixture in the aqueous medium of ethylenically unsaturated monomers and a substantially hydrophobic, saturated fatty acid-containing polyester. The amount of fatty acid used to prepare the polyester ranges from about 20 to 80 weight percent of the total weight of the fatty acid-containing polyester. The fatty acid-containing polyester contains functional groups which are capable of reacting with the crosslinking agent. The mixture is particularized into microparticles by high stress techniques, followed by polymerization of polymerizable species within the microparticles to produce the polymeric microparticles. The amount of the fatty acid-containing polyester in the dispersion is at least 10 and up to 70 weight percent based on weight of the ethylenically unsaturated monomers and fatty acid-containing polyester.

Abstract: A crosslinked material of a polyether copolymer comprising: (A) 1 to 98% by mol of a repeating unit derived from a monomer represented by the formula (I): (B) 95 to 1% by mol of a repeating unit derived from a monomer represented by the formula (II): (C) 0.005 to 15% by mol of a repeating unit derived from a monomer having one epoxy group and at least one reactive functional group; provides a polymer solid electrolyte which is superior in ionic conductivity and also superior in processability, moldability, mechanical strength and flexibility, furthermore thermal resistance.

Abstract: An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.

Abstract: By removing a fraction of fine particles having a particle size of less than 2 &mgr;m from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 &mgr;m and a specific surface area of 3-10 m2/g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 &mgr;m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.

Abstract: The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Abstract: A polymer-based blend which may be cured to form a non-cementious concrete-like material. The polymer-based blend includes 90 to 100 parts by weight low viscosity epoxy resin, 1 to 10 parts by weight of an aliphatic glycidyl ether epoxy diluent, 40 to 50 parts by weight polyoxy-propyleneamine curing agent, 30 to 100 parts by weight intumescent powder, 90 to 110 parts by weight hollow ceramic microspheres having a density of between 0.30 and 0.60 grams per cubic centimeter and 0.01 to 0.10 part by weight air release agent. The hollow ceramic microspheres are dispersed uniformly throughout the polymer-based blend to provide a non-cementious material which, upon curing, becomes a concrete-like material. The non-cementious concrete-like material is well-suited for use as a substitute for concrete and may be used alone or in combination with reinforcing materials.

Abstract: This invention relates to materials containing polyreaction products, which contain reaction products of dicarboxylic acids or polycarboxylic acids or derivatives thereof with epoxidation products of carboxylic acid esters and at least one filler, methods for the production thereof, and the use thereof for the production of planar structures based on renewable raw materials.

Abstract: Provided is a black sealant for liquid crystal cell comprising (a) an epoxy resin, (b) a novolac resin, (c) a curing accelerator and (d) a titanium-type black pigment. The use of the black sealant for liquid crystal cell of the present invention can provide a liquid crystal cell which prevents light leakage of the liquid crystal cell from the sealed portion, which has a high electrical insulation property and which is excellent in an adhesion strength and a humidity resistance.

Abstract: A resinous composition which comprises a compound having, in one molecule, one or more structures of the formula (1) ##STR1## wherein R.sup.1 is a hydrocarbon having 1 to 10 carbon atoms; R.sup.2, R.sup.3 and R.sup.4 are each hydrogen or a hydrocarbon group having 1 to 10 carbon atoms; and X is S or O, and a ratio of S to the total of S and O constituting the three-membered ring is 50% or more on the average; and another compound having one or more SH groups in one molecule. The resinous composition can be used for an optical material having improved oxidation resistance.

Abstract: An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) a cure accelerator and (d) silica powder. The silica powder (d) is composed of (d1) a first silica powder having a particle diameter ranging from 5 to 75 .mu.m, (d2) a second silica powder having a particle diameter ranging from 0.2 to 0.9 .mu.m, and (d3) a third silica powder having a particle diameter ranging from 0.01 to 0.08 .mu.m.

Abstract: Free-flowing compression molding compositions made up of from about 40 to about 80 wt. % of organic filler, from about 20 to about 60 wt. % of an organic reactive resin, and optionally further auxiliary substances and additives. The reactive resin contains an epoxide which may be liquid, a latent catalyst and a powdered polyisocyanate which is solid at room temperature.

Abstract: A polymer concrete composition preparable by combining components comprising: a resin blend comprising at least one unsaturated vinyl ester resin and at least one unsaturated polyester resin; at least about 10 weight percent, based on the total weight of the composition, of extremely filler material having an average particle size of less than about 500 microns; and at least about 20 weight percent, based on the total weight of the composition, of fine filler material having an average particle size of about 500-1000 microns.

Abstract: The present invention provides a prepreg having an excellent self adhesiveness to a honeycomb core, a low porosity when used as skin panels, an excellent surface smoothness due to a low surface porosity, and good tackiness and drapability. This invention also provides a honeycomb sandwich panel having a skin panel peel strength, an excellent impact resistance and an excellent hot water resistance, and a composition for a fiber reinforced composite material made from the prepreg and honeycomb sandwich panel. The fiber reinforced composite material made from the prepreg of the present invention can be used for airplanes, automobiles and other industrial applications, particularly as structural materials of airplanes, because of its excellent mechanical properties.

Abstract: A polymer concrete composition preparable by combining components comprising: a resin blend comprising a major amount of at least one rigid unsaturated polyester resin; a minor amount of at least one flexible unsaturated polyester resin; a minor amount of at least one vinyl ester resin; and a minor amount of at least one thermoplastic resin; at least about 10 weight percent, based on the total weight of the composition, of extremely filler material having an average particle size of less than about 500 microns; and at least about 20 weight percent, based on the total weight of the composition, of fine filler material having an average particle size of about 500 microns to about 1000 microns.

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.

Abstract: In the process according to the invention molding compounds based on duroplastic bonding agents are produced thereby that the bonding agents are mixed as a melt with the filler and additive substances. Curing is achieved thereby that the temperature of the mixture during the mixing process increases above the onset temperature of the curing reaction and, after the desired degree of curing has been attained, is suddenly lowered.

Abstract: A golf ball having a dimpled surface is coated with a paint layer having a constant film thickness even at the edges of the dimples wherein the paint layer comprises a polyurethane and/or epoxy resin, and 0.1 to 3% by weight based on the paint resin solids content of silica, clay, calcium carbonate or a mixture thereof optionally surface-treated with a silane coupling agent, silicone oil, fatty acid, organic acid salt or ammonium salt.

Abstract: The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.

Abstract: An abrasive article, and methods of making and using same, containing an inorganic metal orthophosphate salt. The abrasive article including a coated abrasive article having a size or supersize coating layer containing an alkali metal or alkaline earth metal orthophosphate salt devoid of hydrogen. The inventive abrasive article reduces the grinding energy required while improving abrading efficiency in some cases.

Abstract: Fiber-reinforced prepregs with superior tack containing thermosetting resin systems containing particulate, elastomers having a Tg of 25.degree. C. and below, as well as the composites prepared therefrom are disclosed.

Abstract: A non-aqueous dispersion type coating resin composition which is excellent in pigment dispersibility and adhesive properties to various base material surfaces, can be made to have a high solid content, can be applied thick, and can form coat having good physical properties such as water resistance, alkali resistance and weatherability, and comprises(A) an organic solvent comprising an aliphatic hydrocarbon solvent as a main component,(B) an acrylic polymer which contains therein 0.2 to 30 weight % of a repeating unit represented by the following formula ##STR1## wherein, R.sup.1 represents a hydrogen atom or methyl group,m is an integer of 3 to 11, andn is a number of 1 to 10,and is soluble in the above organic solvent (A), and(C) polymer fine particles substantially insoluble in the above organic solvent (A).

Abstract: A water-permeable material having good chemical resistance, water resistance and weatherability and in which cracks do not form in the material. The composition for forming a water-permeable material includes aggregate grains, a polysulfide-modified epoxy resin and a curing agent for the polysulfide-modified epoxy resin.

Abstract: Disclosed is a multilayer packaging material which is suitable for use as a container for malt beverages and which is tinted so as to block at least 90% of light with wavelengths of electromagnetic radiation ranging from 300 nm to 500 nm. The tinted multilayer packaging materials of the present invention includes: (a) at least one layer of a carbon dioxide (CO.sub.2)-permeable polymeric packaging material, and (b) at least one layer of a CO.sub.2 -treated gas barrier coating, which has an oxygen permeability constant not more than 0.05 cubic centimeter-mil/100 square inches/atmosphere/day. The CO.sub.2 -permeable packaging material can be any polymeric material through which CO.sub.2 can pass and which can be used as a packaging material for food or beverages. The gas barrier coating has an oxygen permeability constant, before CO.sub.2 treatment, of less than 0.3. This gas barrier coating includes the reaction product of a polyamine (A) and a polyepoxide (B).

Abstract: Proposed is a flame-retardant heat-curable flowable epoxy resin composition suitable for use in case potting of film capacitors exhibiting very little settling of the particulate ingredients in storage and excellent impregnability in case potting as well as excellent flame retardancy, moisture resistance and tracking resistance of the composition after curing. The composition comprises, as a uniform blend:(a) 100 parts by weight of a bisphenol-based epoxy resin which is liquid at a temperature of working in case potting;(b) from 10 to 40 parts by weight of an alkyleneglycol diglycidyl ether or cycloalkyleneglycol diglycidyl ether;(c) from 80 to 120 parts by weight of a polycarboxylic acid anhydride;(d) from 4 to 20 parts by weight of a powder of red phosphorus; and(e) from 100 to 200 parts by weight of a powder of hydrated alumina which characteristically is a combination of (e1) from 80 to 95% by weight of a first powder of hydrated alumina having an average particle diameter in the range from 10 to 25 .mu.

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: The present invention provides a hydrophilic resin composition which is obtained by adding, to a hydrophilic resin selected from a carboxyl group-containing hydrophilic acrylic copolymer resin, a carboxyl group-containing hydrophilic polyester resin and a carboxyl group-containing hydrophilic polyurethane resin, a hydrophilic carbodiimide represented by the following general formula (1): ##STR1## (wherein n is an average polymerization degree and is an integer of 1-30; m is an integer of 4-30; R.sub.1 is a lower alkyl group; and R.sub.2 is a hydrogen atom or a methyl group) and which has an acid value based on the carboxyl group of the hydrophilic resin, of 10-400 mg KOH/g and a molar ratio of the carbodiimide group to the carboxyl group, of 0.2-5.0.

Abstract: The present invention relates to a process for preparing a pigment composition whereby a mixture of an organic pigment and an inorganic filler is subjected to an air jet milling step. The inventive process is an environmentally friendly process which yields pigments having outstanding dispersibility and wetting characteristics when incorporated in plastics, aqueous or solvent based coatings and inks.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

Abstract: A coating composition comprising a glue, a particulate material and a solvent, which imparts a surface microstructure to a coated object (29) is disclosed. The particulate material projects above the glue line (28) of the coated object creating the microstructure which provides boiling heat transfer enhancement. A horizontally oriented, rectangular surface immersed in FC-72, indicates up to an 85% decrease in incipient superheat, a 70% to 80% reduction in nucleate boiling superheats, and a .about.109% increase in the critical heat flux (CHF), beyond that of the non-painted surface. The enhanced surface heat transfer coefficients are four to nine times higher than those from the reference surface. The coatings are applicable to electronic component surfaces. A coated silicon test chip tested at subcooled (45.degree. C. conditions using FC-72 had heat dissipation rates of .about.100 W/cm.sup.2 at junction temperatures of .about.85.degree. C., and the highest CHF observed was 159 W/cm.sup.

Abstract: Disclosed is a coated golf ball having a constant film thickness even at the edge part of the dimple.The coated golf ball is obtained by coating a paint on a golf ball having dimples on the surface. The paint is an polyurethane paint and/or epoxy resin paint and contains silica, clay, calcium carbonate or a mixture thereof in an amount of 0.1 to 3% by weight based on 100 parts by weight of the paint resin solid content.

Abstract: The invention relates to colored luster pigments consisting of a transparent or metallic reflecting core, of a coating consisting of at least one silicon oxide of the composition SiO.sub.0.25 to SiO.sub.0.95 and of further optional coatings, to coating processes by coating metallic silicon in the presence of oxygen, if required with changing its partial pressure, as well as to the use of these luster pigments for pigmenting plastic materials, paints and printing inks, and to pigmented compositions comprising these luster pigments.

Abstract: A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.

Abstract: Disclosed is a multilayer packaging material which is suitable for use as a container for malt beverages and which is tinted so as to block at least 90% of light with wavelengths of electromagnetic radiation ranging from 300 nm to 500 nm. The tinted multilayer packaging materials of the present invention includes: (a) at least one layer of a carbon dioxide (CO.sub.2)-permeable polymeric packaging material, and (b) at least one layer of a CO.sub.2 -treated gas barrier coating, which has an oxygen permeability constant not more than 0.05 cubic centimeter-mil/100 square inches/atmosphere/day. The CO.sub.2 -permeable packaging material can be any polymeric material through which CO.sub.2 can pass and which can be used as a packaging material for food or beverages. The gas barrier coating has an oxygen permeability constant, before CO.sub.2 treatment, of less than 0.3. This gas barrier coating includes the reaction product of a polyamine (A) and a polyepoxide (B).

Abstract: Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.

Abstract: A significantly improved plasticizer-polymer composition embraces a polymer containing a di-, tri- and/or tetra- ethyl-, propyl- and/or butylbiphenyl plasticizer which constitutes the major proportion by weight of any other plasticizing/softening additive, provided that the polymer is not polyvinyl chloride and when the polymer is an elastomer or rubber, or is a polystyrene, said plasticizer is diisopropylbiphenyl and/or triisopropylbiphenyl, and when the polymer is of a plastisol, essentially no ester plasticizing additive is present. As well, a polymer fabrication composition comprises a monomer and/or oligomer component in combination with said plasticizer. A method for preparing the plasticizer-polymer composition and/or the fabrication composition comprises contacting the monomer and/or oligomer component with said plasticizer, mixing to provide a uniform mixture, and carrying out further processing as may be desired so as to optionally prepare the plasticized-polymer composition.

Abstract: An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

Abstract: Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 .mu.m. The primer compositions are environmentally superior to solvent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.