Designated Nonreactive Material (dnrm) Has Numerically Specified Characteristics, E.g., Particle Size, Density, Etc., Other Than Viscosity, M.p., B.p., Molec. Wt., Chemical Composition Or Percentage Range Patents (Class 523/440)
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Patent number: 5605945Abstract: The invention relates to polyamide molding compounds with increased viscosity, high thermal stability and favorable mechanical properties, to a process for their production and to their use.Type: GrantFiled: May 22, 1995Date of Patent: February 25, 1997Assignee: Bayer AktiengesellschaftInventors: Aziz E. Sayed, Edgar Ostlinning, Karsten-Josef Idel, Hubert Goldbach, Dieter L ohr, Ralf Lange
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Patent number: 5589523Abstract: Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.Type: GrantFiled: June 6, 1995Date of Patent: December 31, 1996Assignee: Toray Industries, Inc.Inventors: Ryuji Sawaoka, Shinji Kouchi, Toshio Muraki
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Patent number: 5576362Abstract: An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree.C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C.Type: GrantFiled: April 20, 1993Date of Patent: November 19, 1996Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Chiharu Watanabe, Tatsuo Nakano, Kazuo Kato
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Patent number: 5554240Abstract: A method of joining metal parts together and the joints thereby produced having great strength and thermal conductivity by means of an adhesive filled with small, hard, thermally conductive particles. The filled adhesive is applied to the surfaces to be joined and the surfaces are pressed together with a force in the range of 35 to 105 Kg/sq cm while the adhesive is curing. A fixture is disclosed made of a metal with a coefficient of thermal expansion less than the parts being joined. When the parts are held in the fixture and heated, differential thermal expansion causes the fixture to apply the necessary pressure during curing while also providing a measure of the applied pressure. For joining a cooling fin normal to the surface of a part, a tapered plug is formed in the fin edge and it is forced into a tapered slot in the part after adhesive application. A low external perpendicular force applied to the fin yields a high pressure to the mating surfaces through the inclined plane.Type: GrantFiled: May 1, 1995Date of Patent: September 10, 1996Inventor: William W. Toy
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Patent number: 5552459Abstract: The invention relates to flame-retarded compositions comprisingA) an epoxy resin mixture consisting ofA1) 15-35% by weight of at least one liquid epoxy resin,A2) 55-85% by weight of aluminum oxide trihydrate having a particle size of D.sub.50 20-25 .mu.m as determined by sieving,A3) 0-20% by weight of at least one further filler andA4) 0-5% by weight of at least one conventional additiveandB) at least one carboxylic acid anhydrideora cycloaliphatic diamine of the formula I or II ##STR1## in which the radicals R.sub.1 to R.sub.4 independently of one another are hydrogen or C.sub.1 -C.sub.4 alkyl and Z is a direct bond, --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --S--, --O--, --SO.sub.2 -- or --CO--, in an amount sufficient to cure component A,the content of components A2 and A3 together being 63-80% by weight, with respect to the total weight of the composition. These compositions are suitable for use in high voltage components, such as flyback transformers.Type: GrantFiled: May 10, 1994Date of Patent: September 3, 1996Assignee: Ciba-Geigy CorporationInventors: Dieter Baumann, Werner Hollstein, Claus W. Rabener, Peter R uger
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Patent number: 5547758Abstract: An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree. C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C.Type: GrantFiled: March 2, 1995Date of Patent: August 20, 1996Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Chiharu Watanabe, Tatsuo Nakano, Kazuo Kato
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Patent number: 5540998Abstract: This invention relates to a solar heat-shielding coating composition which consists mainly of two kinds or more of pigments selected from red, orange, yellow, green, blue and purple pigments in such a manner as to yield a color of low lightness, particularly achromatic black, by additive mixture and a weather-resistant vehicle and a structure covered with said coating composition, with the composition capable of covering the outside of said structure exposed directly to the sun and suppressing a rise in the inside temperature.Type: GrantFiled: November 30, 1994Date of Patent: July 30, 1996Assignee: Nippon Steel Chemical Co. Ltd.Inventors: Naofusa Yamada, Hatsuo Inagaki, Hironobu Kawasaki
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Patent number: 5438084Abstract: A flame retardant capable of imparting a polyamide-containing resin with excellent flame retardancy without deteriorating the impact strength of the polyamide-containing resin even when it is incorporated in a small amount, and a flame-retardant polyamide-containing resin composition containing the above flame retardant and having practically sufficient impact strength. The flame retardant comprises 100 parts by weight of magnesium hydroxide, 2 to 750 parts by weight of red phosphorus and 0.2 to 250 parts by weight of an epoxy resin, and the flame-retardant polyamide-containing resin composition comprises 100 parts by weight of a polyamide-containing resin, 2 to 50 parts by weight of magnesium hydroxide, 1 to 15 parts by weight of red phosphorus and 0.1 to 5 parts by weight of an epoxy resin.Type: GrantFiled: January 12, 1995Date of Patent: August 1, 1995Assignee: Kyowa Chemical Industry Co., Ltd.Inventor: Takeshi Imahashi
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Patent number: 5434199Abstract: Epoxy molding compositions for surface mount applications are disclosed. The compositions contain multifunctional epoxy resin and multifunctional hardener along with silicone rubber particles, organofunctional silicone fluid and a high loading of silica.Type: GrantFiled: October 7, 1994Date of Patent: July 18, 1995Assignee: Rohm and Haas CompanyInventors: Michael K. Gallagher, Michael A. Petti
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Patent number: 5418265Abstract: A powder coating composition useful for fixation of rotor and stator windings is disclosed, which includes100 parts by weight of an epoxy resin;5-35 parts by weight of an acid anhydride;2-30 parts by weight of a phenol resin;0.05-5 parts by weight of a curing accelerator; and130-270 parts by weight of an inorganic filler consisting of 99.7-87.0% by weight of a first filler component having an average particle size of 0.5-100 .mu.m and 0.3-13.0% by weight of a second filler component having an average particle size of 0.1 .mu.m or less.Type: GrantFiled: December 21, 1993Date of Patent: May 23, 1995Assignee: Somar CorporationInventors: Kunimitsu Matsuzaki, Kazuya Ono, Seitaro Iwamoto, Mikio Osa, Takeshi Watanabe
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Patent number: 5409970Abstract: A coating composition and method of use thereof for coating metal substrates, especially galvanically active metals, containing a resinous organic polymer, a corrosion inhibiting leachable pigment and an ion reactive pigment generally in the form of metallic spheroid particles. Coated materials have improved corrosion resistance.Type: GrantFiled: March 31, 1992Date of Patent: April 25, 1995Assignee: Sermatech International, Inc.Inventors: Mark F. Mosser, William A. Harvey, III
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Patent number: 5368922Abstract: A thermosettable resin composition having a viscosity that decreases during processing temperatures and increases as the temperature is raised to curing temperatures is provided. The composition comprises thermosettable resins and thermoplastic particles that are insoluble in the thermosettable resins at processing temperatures but soluble in the thermosettable resins at curing temperatures. Prepregs prepared from the thermosettable resin composition are also provided.Type: GrantFiled: November 4, 1993Date of Patent: November 29, 1994Assignee: Minnesota Mining and Manufacturing CompanyInventors: Gene B. Portelli, William J. Schultz, John T. Boden, Daniel M. Kaufer
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Patent number: 5331016Abstract: To arrive at an economical method of producing water-expanded polymer resin moldings, it is proposed that a monomer component and a cross-linker on an acrylate basis and/or a PMMA prepolymer be used as resin-forming components of a curable mixture.Type: GrantFiled: October 18, 1993Date of Patent: July 19, 1994Assignee: Schock & Co., GmbHInventors: Lothar Frank, deceased, Gunter Hieber
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Patent number: 5290883Abstract: An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.Type: GrantFiled: October 7, 1992Date of Patent: March 1, 1994Assignee: Nitto Denko CorporationInventors: Toshitsugu Hosokawa, Takeshi Yamanaka, Hiraku Yamamoto, Koichi Hashimoto, Akihisa Murata, Katsuhito Kamiya
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Patent number: 5276073Abstract: A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes:a liquid epoxy resin;a curing agent including an acid anhydride;a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; andfinely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.Type: GrantFiled: August 6, 1992Date of Patent: January 4, 1994Assignees: Somar Corporation, Hitachi, Ltd.Inventors: Ichiro Akutagawa, Kunimitsu Matsuzaki, Toshio Matsuo, Ryuichi Fujii, Satoru Umeki, Yoshimichi Ono, Takeo Miyamoto, Koki Ueta, Naoki Kamada
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Patent number: 5268223Abstract: Composites comprising structural fiber and matrix resin formulated from epoxys selected from the group consisting of polyglycidyl ethers of polycyclic bridged hydroxy-substituted polyaromatic compounds and N,N,N',N'-tetraglycidyl-bis(4-amino- 3-ethylphenyl)methane with from about 6 to about 150 pbw, per hundred parts by weight of the epoxy resin components, of a solid aromatic diamine hardener, toughened with porous rigid resin particles having a spheroidal spongy structure. The resulting composites exhibit surprising improvement in interlaminar strength characteristics as measured by G.sub.IC.Type: GrantFiled: May 31, 1991Date of Patent: December 7, 1993Assignee: Amoco CorporationInventors: Shahid P. Qureshi, Richard E. Hoffman, Richard H. Newman-Evans
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Patent number: 5254599Abstract: To arrive at an economical method of producing water-expanded polymer resin moldings, it is proposed that a monomer component and a cross-linker on an acrylate basis and/or a PMMA prepolymer be used as resin-forming components of a curable mixture, with the weight ratio of the water component to the resin-forming component being at least 1:1.Type: GrantFiled: February 12, 1992Date of Patent: October 19, 1993Assignee: Schock & Co. GmbHInventor: Lothar Frank, deceased
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Patent number: 5204387Abstract: A powder coating composition is disclosed which includes a particulate material containing an epoxy resin and a curing agent, and fine powder of a charge controlling agent such as an acrylic resin, silica or a mixture thereof. The charge controlling agent is deposited on surfaces of the particles of the particulate material. Additionally, a powder coating composition is disclosed in which two different charge controlling agents are used and are separately deposited on different particles of epoxy resin consisting particulate material.Type: GrantFiled: December 20, 1991Date of Patent: April 20, 1993Assignee: Somar CorporationInventors: Kunimitsu Matsuzaki, Seitaro Iwamoto, Takeshi Watanabe, Kazuya Ono, Katsuji Kitagawa
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Patent number: 5179140Abstract: A filled resin composition is provided which is particularly adapted for the formation of wear-resistant, lubricious surfaces. The compositions when formed into integral threads with the bodies of plastic-reinforced pipe provide superior thread action and extended thread life.The compositions comprise a thermosetting resin such as epoxy resin and hardener, in combination with a filler which in turn comprises ceramic powder, graphite and short fiber lengths. The compositions may vary widely as will hereinafter become apparent.Type: GrantFiled: March 8, 1991Date of Patent: January 12, 1993Assignee: Fiber Glass Systems, Inc.Inventor: Gholamhossein Ariannejad
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Patent number: 5137941Abstract: A composition for forming the keys of a keyboard musical instrument consists predominantly of a synthetic resin. The addition of ceramic whiskers in cluster form significantly improves the workability, sweat absorption and texture of the composition.Type: GrantFiled: November 27, 1989Date of Patent: August 11, 1992Assignee: Yamaha CorporationInventor: Yutaka Oshima
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Patent number: 5096762Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.Type: GrantFiled: February 27, 1990Date of Patent: March 17, 1992Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tetsuo Yoshida, Yoshio Fujimura, Minoru Takei
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Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom
Patent number: 5095047Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.Type: GrantFiled: April 2, 1990Date of Patent: March 10, 1992Assignee: Somar CorporationInventors: Osamu Ogitani, Ryuichi Fujii, Toru Shirose -
Patent number: 5053476Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.Type: GrantFiled: June 23, 1989Date of Patent: October 1, 1991Assignee: Somar CorporationInventors: Ichiro Akutagawa, Kunimitsu Matsuzaki, Toshio Matsuo, Toru Shirose
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Patent number: 5028641Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.Type: GrantFiled: August 2, 1989Date of Patent: July 2, 1991Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5025045Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles that reside primarily between plies of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition. Alternatively, the infusible particles may be disposed directly on the epoxy resin surface of the prepreg.Type: GrantFiled: December 20, 1988Date of Patent: June 18, 1991Assignee: Hercules IncorporatedInventors: Irena Gawin, Brian J. Swetlin
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Patent number: 5011872Abstract: A thermal conductive polymer composition comprising a mixture of a polymer and a thermally conductive filler material, said filler material having a median particle size of between about 130 to 260 microns and a size distribution characterized by the formula: ##EQU1## where % represents the wt. % of the particles below or above the median particle size and M represents the median particle size in microns.Type: GrantFiled: March 22, 1989Date of Patent: April 30, 1991Assignee: The Carborudum CompanyInventors: Carol A. Latham, Michael F. McGuiggan
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Patent number: 4999389Abstract: A filled resin composition is provided which is particularly adapted for the formation of wear-resistant, lubricious surfaces. The compositions when formed into integral threads with the bodies of plastic-reinforced pipe provide superior thread action and extended thread life.The compositions comprise a thermosetting resin such as epoxy resin and hardener, in combination with a filler which in turn comprises ceramic powder, graphite and short fiber lengths. The compositions may vary widely as will hereinafter become apparent.Type: GrantFiled: December 27, 1988Date of Patent: March 12, 1991Assignee: Fiber Glass Systems, Inc.Inventor: Gholamhossein Ariannejad
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Patent number: 4997863Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed circuit board is disclosed which includes an aromatic epoxy resin having at least two epoxy groups, an aromatic polyamine mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.Type: GrantFiled: August 24, 1989Date of Patent: March 5, 1991Assignee: Somar CorporationInventors: Osamu Ogitani, Takashi Shimizu, Ryuichi Fujii
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Patent number: 4959400Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also contain a bishenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.Type: GrantFiled: August 24, 1989Date of Patent: September 25, 1990Assignee: The Dow Chemical CompanyInventor: Diane Sexton
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Patent number: 4940852Abstract: A liquid or viscous curable adhesive composition having a prolonged pot life which is composed of a liquid or viscous curable resin which has, preferably evenly and randomly dispersed therethroughout, a multiplicity of rupturable microcapsules containing a curing agent in an amount sufficient to cure the resin. The microcapsules are rupturable upon the application thereto of external pressure, or other mechanical manipulation. Upon rupture, the curing agent is released into coacting relationship with the curable resin and forms therewith an activated adhesive composition.Type: GrantFiled: November 14, 1988Date of Patent: July 10, 1990Assignee: Milton P. ChernackInventor: Milton Chernack
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Patent number: 4923908Abstract: An epoxy resin composition, especially useful as an encapsulant and exhibiting a low dissipation factor, is prepared from a first component comprising an epoxy of a polyglycidal ether of a polyhydroxyl phenol and filler, and a second component comprising a cycloaliphatic acid anhydride curing agent, filler and catalyst. Each component is mixed separately under high shear, and the filler for each component comprises at least about 50 percent by weight. The two components are admixed, applied as an encapsulant, and cured at an elevated temperature.Type: GrantFiled: October 14, 1988Date of Patent: May 8, 1990Assignee: Zenith Electronics CorporationInventors: Arthur J. Lostumo, Bernard M. Wiltgen
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Patent number: 4920163Abstract: A paint for use on surfaces subject to lightning strikes includes a film-forming binder and a pigment, the pigment comprising at least one alkali metal salt or alkaline earth metal salt with a low first ionization potential, of a mono- or polyfunctional organic acid, carbonic acid or a polymer having an acidic group, the pigment being present in an amount sufficient to render the paint ionizable under the action of a strong electric current.Type: GrantFiled: July 22, 1988Date of Patent: April 24, 1990Assignee: Centre Nationale d'Etudes SpatialesInventors: Jean-Claude Guillaumon, Louis J. C. Blet
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Patent number: 4920161Abstract: A high strength, room temperature curable epoxy tooling compositions containing interstitially-matched filler systems for making cast-to-size forming tools for metal sheet stamping. The composition can be fully cured by at least one aliphatic amine catalyst in twelve hours producing a rigid article having a tensile strength of at least 40 MPa and a compressive strength of at least 100 MPa.Type: GrantFiled: June 24, 1988Date of Patent: April 24, 1990Assignee: General Motors CorporationInventors: Chen-Shih Wang, Richard P. Atkins, Elio Eusebi, Thomas J. Dearlove
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Patent number: 4920002Abstract: The coating is constituted by a uniform mixture of solvent-free epoxy resin containing the usual additives, solid glass microbeads, and pigment-colored aluminum flakes, said coating thus being pigmented in its bulk, translucent, and glittering in durable manner. The flakes are advantageously colored using a colored and irridescent epoxy varnish. The coating is suitable for application in a single coat and the single coat may be from 1 mm to 5 mm thick. It is obtained by spreading the uniform mixture of the various components on a key-providing undercoat which is initially applied to the surface to be coated. The mixture is obtained by using pre-measured quantities.Type: GrantFiled: June 24, 1988Date of Patent: April 24, 1990Assignee: Societe Francaise BitumasticInventors: Christian Cussot, Jean-Didier Delage
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Patent number: 4898620Abstract: Novel finely divided particulate calcium carbonate compositions comprising mixtures of a preponderance of dry ground calcium carbonate with a smaller amount of wet ground calcium carbonate, each of these components having particular particle size characteristics and particle size distributions, are disclosed. When used as all or part of the filler in thermosetting and thermoplastic resinous compositions, e.g., thermosetting polyester resinous molding compositions, paints and other finishes, sealants and the like, such mixtures provide compositions having high filler loadings coupled with acceptably low viscosities and better processability than resinous compositions containing all dry-ground fillers.Type: GrantFiled: May 16, 1989Date of Patent: February 6, 1990Assignee: ECCA Calcium Products, Inc.Inventors: Jerry W. Rayfield, Robert Baker, Kenneth E. Weber
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Patent number: 4835195Abstract: Novel finely divided particulate calcium carbonate compositions comprising mixtures of a preponderance of dry ground calcium carbonate with a smaller amount of wet ground calcium carbonate, each of these components having particular particle size characteristics and particle size distributions, are disclosed. When used as all or part of the filler in thermosetting and thermosplastic resinous compositions, e.g., thermosetting polyester resinous molding compositions, paints and other finishes, sealants and the like, such mixtures provide compositions having high filler loadings coupled with acceptably low viscosities and better processability than resinous compositions containing all dry-ground fillers.Type: GrantFiled: August 12, 1988Date of Patent: May 30, 1989Inventors: Jerry W. Rayfield, Robert A. Baker, Kenneth E. Weber
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Patent number: 4808639Abstract: A liquid or viscous curable adhesive composition having a prolonged pot life which is composed of a liquid or viscous curable resin which has, preferably evenly and randomly dispersed therethroughout, a multiplicity of rupturable microcapsules containing a curing agent in an amount sufficient to cure the resin. The microcapsules are rupturable upon the application thereto of external pressure, or other mechanical manipulation. Upon rupture, the curing agent is released into coacting relationship with the curable resin and forms therewith an activated adhesive composition.Type: GrantFiled: July 22, 1987Date of Patent: February 28, 1989Assignee: Production Previews, Inc.Inventor: Milton Chernack
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Patent number: 4795592Abstract: A polymer composition has a filler of particulate conductive material including at least 0.5% by weight of char carbon produced by carbonization of plant material, particularly herbaceous straw. The filler may also contain other conductive materials such as carbon black. Compositions with electrical resistivities over a wide range may be produced, preferably with polymers adapted for use as coatings. In particular compositions with surface resistivities between 10.sup.6 and 10.sup.9 ohms per square are available and find use as antistatic coatings, avoiding the excessively rapid discharge of static electricity that occurs with fillers of carbon black alone.Type: GrantFiled: June 17, 1987Date of Patent: January 3, 1989Assignee: Carbon Research LimitedInventors: Jacqueline R. Lander, John A. Griffiths
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Patent number: 4767802Abstract: Epoxy resin composition comprising a uniform mixture of an epoxy resin and fine particles of a rubber adhered uniformly on the surface thereof with fine particles of an inorganic material, said composition having improved peel strength and toughness when cured and being useful as an adhesive or a molding material.Type: GrantFiled: October 20, 1987Date of Patent: August 30, 1988Assignee: Sunstar Giken Kabushiki KaishaInventors: Toshimori Sakakibara, Hirohide Tomoyasu
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Patent number: 4766162Abstract: Disclosed is a resin composition for sealing electronic parts, which comprises a thermosetting resin and, incorporated therein, high-purity magnesium oxide. A hydration-resistant magnesia powder having the particle surfaces covered with a continuous and uniform coating of silica is advantageously used as the magnesium oxide. This hydration-resistant magnesia powder is prepared by introducing a heated vapor of an organic silicate compound into a reactor of a fluidized bed of magnesia powder heated at 100.degree. to 600.degree. C. so that the concentration of the organic silicate compound is 1 to 20 mole %, and precipitating a coating of silica on the surfaces of magnesia particles by thermal decomposition and/or hydrolysis of the organic silicate compound on the surfaces of magnesia particles.Type: GrantFiled: April 3, 1987Date of Patent: August 23, 1988Assignee: Ube Industries, Ltd.Inventors: Toshikazu Hamamoto, Motojirou Aoi, Kozaburo Yoshida, Yasuhiko Toda
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Patent number: 4756935Abstract: A primer composition for metallic material comprising (a) a urethane epoxy ester resin having primary hydroxyl groups and a number average molecular weight of 6000 to 12,000, (b) a chromate anticorrosive pigment and (c) a polyethylene wax having a density of 0.94 or more, a molecular weight of 1000 to 10,000 and an acid value of 15 or less (KOH mg/g), the pigment volume concentration being 24 to 45% of the total solids of the composition.A chemical pretreatment on various metallic materials for improvements in scratch resistance, corrosion resistance and the like can be obviated by the use of said primer composition.Type: GrantFiled: September 12, 1986Date of Patent: July 12, 1988Assignee: Nippon Paint Co., Ltd.Inventors: Masaaki Takimoto, Tamotsu Sobata, Shinji Nakano, Yuichi Yoshida
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Patent number: 4753969Abstract: A diaphragm for an electroacoustic transducer comprising stratiform mineral of layers into which a hardener or an agent for facilitating hardening is adsorbed between the layers, thermosetting resin monomer, and carbonfibers which constitute a composite material which is formed under heat and pressure. The diaphragm is increased in rigidity which is required as physical properties therefor and is easy in forming.Type: GrantFiled: July 18, 1985Date of Patent: June 28, 1988Assignee: Onkyo KabushikikaishaInventors: Shinya Mizone, Tamotsu Abe, Minoru Adachi, Takashi Kizawa
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Patent number: 4711916Abstract: An inorganic filler dispersed-resin composition comprising a resin matrix and fused and spherical inorganic particles, such as ceramic particles produced by flame jet melting added in the resin matrix. The ceramic particles are selected from the group consisting of alumina, silica, magnesia, zircon, zirconia, and calcia, and the resin is selected from the group consisting of epoxy, phenol, acrylic polyester, silicone and ABS resins.Type: GrantFiled: February 10, 1986Date of Patent: December 8, 1987Assignees: Nippon Steel Corporation, Harima Refractory Co., Ltd.Inventors: Takeshi Hagiwara, Masataka Matsuo, Tanezoh Tamehiro, Taizo Tamehiro, Kakuichi Murakami
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Patent number: 4711917Abstract: A method of cationic electrodeposition, electrocoated articles and novel electrocoating compositions are disclosed. The compositions comprise a cationic resin containing blocked isocyanate functionality and are capable of being electrodeposited over rough steel and producing extremely smooth films upon curing.Type: GrantFiled: June 27, 1986Date of Patent: December 8, 1987Assignee: PPG Industries, Inc.Inventors: Gregory J. McCollum, Roger L. Scriven, Roger M. Christenson, George W. Mauer, Robert R. Zwack
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Patent number: 4690961Abstract: A sealant composition which is particularly useful for sealing and locking pipe threads is provided. The composition is comprised of a hardenable liquid resin, a powdered inert filler dispersed in the resin, and a dispersing and thixotropy imparting agent comprised of a precipitated alkaline earth metal carbonate or a mixture of such carbonates.Type: GrantFiled: October 8, 1986Date of Patent: September 1, 1987Assignee: Halliburton CompanyInventors: R. Clay Cole, Bobby K. Bowles
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Patent number: 4686250Abstract: Curable thermosetting resin compositions comprising at least one cycloaliphatic epoxy resin having at least two 1,2-epoxy groups per molecule, and certain aromatic diamines having three aromatic rings in the molecule are disclosed. Resin compositions comprised of, for example, bis(2,3-epoxycyclopentyl)ether and 1,3-bis(4-aminophenoxy)benzene exhibit a highly desirable balance of physical and chemical properties which renders such compositions ideally suited for use in the fabrication of wet winding composites. The resin compositions prepared in accordance with the invention have unexpectedly low viscosity, high glass transition temperatures, high tensile properties and unexpectedly low water uptake. Accordingly, the resin compositions find particular application in the preparation of composites by wet winding procedures.Type: GrantFiled: December 27, 1985Date of Patent: August 11, 1987Assignee: Amoco CorporationInventor: Shahid P. Qureshi
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Patent number: 4664983Abstract: A polyester composition according to the subject invention is composed of thermoplastic polyesters and the titanium dioxide and/or aluminum oxide having specific particle diameters.The polyester composition provides the molded articles which display reduced warpage.The polyester composition has high plating characteristic and provide superior metal-plated moldings.Type: GrantFiled: January 8, 1985Date of Patent: May 12, 1987Assignee: Toray Industries Inc.Inventors: Kiyokazu Nakamura, Kiichi Kometani, Toshihide Inoue
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Patent number: 4654382Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.Type: GrantFiled: May 24, 1985Date of Patent: March 31, 1987Assignee: The Yokohama Rubber Co., Ltd.Inventors: Misao Hiza, Hajime Yamazaki, Shigeo Omote
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Patent number: 4650819Abstract: A coating composition, which is excellent in abrasion resistance, comprises spherical .alpha.-alumina particles, a binder and a solvent, in which said spherical .alpha.-alumina particles are contained in an amount of from 35 to 85% by weight of the solid content in the coating composition.Type: GrantFiled: August 16, 1985Date of Patent: March 17, 1987Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Hideo Nakamoto, Tsutomu Okaya
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Patent number: 4636536Abstract: An electromagnetic interference-shielding, flame-retardant ABS resin composition exhibiting high retentions of electromagnetic interference-shielding performance, which comprises a blend of a flame-retardant ABS resin (A) with 5 to 20% by weight of stainless steel fibers (B) having an average diameter of 3 to 50 .mu.m and an average fiber length of 3 to 50 mm and with 4 to 30% by weight of glass fibers (C) having an aspect ratio of at least 50 and an average diameter of at least 5 .mu.m, wherein the total amount of the components (A), (B), and (C) is 100% by weight.Type: GrantFiled: September 17, 1985Date of Patent: January 13, 1987Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Sumio Kamiyo, Mitsuto Yoshihiro