Organic Chalcogen Compound Dnrm Patents (Class 523/456)
  • Patent number: 11009656
    Abstract: Small-radius coated optical fibers having large mode field diameter and low bending losses. The coated fiber may have an outer radius of 110 ?m or less, while providing a mode field diameter of 9.0 ?m or greater and a bending loss when wrapped about a 15 mm mandrel of 0.5 dB/km or less at wavelength of 1550 nm. The coated fiber may have a mode field diameter of 9.2 ?m or greater and may have a bending loss at 1550 nm of 0.25 dB/km or less when wrapped about a 20 mm mandrel or a bending loss at 1550 nm of 0.02 dB/km or less when wrapped about a 30 mm mandrel.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: May 18, 2021
    Assignee: Corning Incorporated
    Inventors: Dana Craig Bookbinder, Steven Bruce Dawes, Inna Igorevna Kouzmina, Ming-Jun Li, Manuela Ocampo, Pushkar Tandon
  • Patent number: 11009655
    Abstract: Small-radius coated optical fibers having large mode field diameter and low bending losses. The coated fiber may have an outer radius of 110 ?m or less, while providing a mode field diameter of 9.0 ?m or greater and a bending loss when wrapped about a 15 mm mandrel of 0.5 dB/km or less at wavelength of 1550 nm. The coated fiber may have a mode field diameter of 9.2 ?m or greater and may have a bending loss at 1550 nm of 0.25 dB/km or less when wrapped about a 20 mm mandrel or a bending loss at 1550 nm of 0.02 dB/km or less when wrapped about a 30 mm mandrel.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: May 18, 2021
    Assignee: Corning Incorporated
    Inventors: Dana Craig Bookbinder, Steven Bruce Dawes, Inna Igorevna Kouzmina, Ming-Jun Li, Manuela Ocampo, Pushkar Tandon
  • Patent number: 10119047
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino
  • Patent number: 10066125
    Abstract: Disclosed is an ultrafine fiber including lignin, a carrier polymer and a carbon material. The ultrafine fiber, which includes lignin, can exhibit the properties of lignin such as antibacterial property, biodegradability, etc. Accordingly, it can be used widely in medical materials such as nanofiber, nanofiber web, nanofiber sheet, etc. for wound healing of the skin's dermal layer. Also, the ultrafine fiber can be used in sheath of electric cables because it contains a carbon material and has superior conductivity. In addition, because the ultrafine fiber can hold a large quantity of water, it can be used in various fields including sanitary pads for women, diapers for babies and adults, etc.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 4, 2018
    Assignee: Korea Institute of Science and Technology
    Inventors: Yong Chae Jung, Eun Sil Lee, Daun Lim, Cheol-Min Yang, Jaesang Yu, Seong Yun Kim, Junyeon Hwang, Hun-su Lee, Min Park
  • Patent number: 9975101
    Abstract: The present invention disclosed a process for the preparation of microcapsules containing epoxy resin which comprises water-insoluble and/or water-soluble components prepared by in-situ polymerization using non-aqueous continuous phase which acts as healing agents for the micro-cracks when embedded in composite structures.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: May 22, 2018
    Assignee: Council of Scientific and Industrial Research
    Inventors: Parshuram Gajanan Shukla, Arun Savalaram Jadhav
  • Patent number: 9938436
    Abstract: The present disclosure relates to UV resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, Also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: April 10, 2018
    Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
    Inventors: Frank Tran, Derek S. Kincaid, K. P. Subrahmanian, Surendar N. Kaul
  • Patent number: 9868863
    Abstract: Anti-slip coating compositions having improved optical properties, such that they can emit visible light in a dark or dimly lit environment, or otherwise in the presence of ultraviolet (UV) light, are disclosed. Coatings obtained from these compositions, as well as coated substrates treated with these coatings, are also described.
    Type: Grant
    Filed: February 8, 2014
    Date of Patent: January 16, 2018
    Assignee: Swift IP, LLC
    Inventor: Philip Swift
  • Patent number: 9635230
    Abstract: A method of assembling a camera suitable for vehicular use includes providing a lens accommodated in a lens barrel, a camera front housing, and a printed circuit board with an imager disposed thereat. An adhesive is dispensed to establish a layer of uncured adhesive one of (i) between the lens barrel and a front portion of the camera front housing and (ii) between the printed circuit board and a rear portion of the camera front housing. With the lens in focus with the imager and optically center-aligned therewith, the adhesive is initially cured to an initially-cured state in an initial radiation curing process that includes exposure to UV light for a first period of time. The initially-cured adhesive is further cured to a further-cured state in a secondary curing process. The further-cured state is achieved within a second period of time that is longer than the first period of time.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: April 25, 2017
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Brian J. Winden, Robert A. Devota, Matthew C. Sesti, Joseph A. Stemmer, Steven V. Byrne, John R. Garcia, David F. Olson
  • Patent number: 9308929
    Abstract: A compact collapsible stroller in accordance with the present disclosure includes a mobile cart and a seat coupled to the mobile cart. The mobile cart includes a rolling base and a foldable frame that folds inwardly and outwardly from the rolling base.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: April 12, 2016
    Assignee: Dorel Juvenile Group, Inc.
    Inventors: Paul Dowd, Christopher D Miller, Joseph F Brewin, Brian C Sundberg, Kurt Nygren, Joseph D Langley, Walter S Bezaniuk
  • Patent number: 9266998
    Abstract: The present invention relates to a process for the coating of polycarbonate substrates, in particular of transparent polycarbonate substrates, by applying a transparent coating composition encompassing at least one radiation-curing binder resin (A) and/or reactive diluent (C), nanoparticles (B), optionally solvent and at least one light stabilizer (L), to a polycarbonate substrate, wherein the coating composition comprises at least one light stabilizer (L) which comprises, per molecule, an average of at least one ethylenically unsaturated group bonded by way of a urethane group. The present invention also relates to the coating compositions used in said process, and to the coated polycarbonate substrates obtainable via the process, and to their use.
    Type: Grant
    Filed: March 27, 2010
    Date of Patent: February 23, 2016
    Assignee: BASF COATINGS GMBH
    Inventors: Jan-Bernd Kues, Matthijs Groenewolt, Karin Homann, Stefanie Schroeder, Andre Brosseit
  • Patent number: 9102786
    Abstract: Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: August 11, 2015
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takashi Sato, Shuichi Ueno, Takeshi Koyama
  • Publication number: 20150135992
    Abstract: In accordance with the present invention, by using a resin composition including lignin and a curing agent in which the lignin is soluble in an organic solvent and contained in the resin composition in an amount of from 10 to 90% by mass, there are provided a molded product and a composite molded product which are obtained from plant resources as a main raw material and to which a good flame retardance and a good antibacterial property are imparted.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Inventors: Mika KOBUNE, Naoyuki KOYAMA, Akihito GOTOU, Ikuko KIKUCHI, Tomofumi SUKEGAWA
  • Publication number: 20150137166
    Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.
    Type: Application
    Filed: December 3, 2014
    Publication date: May 21, 2015
    Inventors: Hidenori ONISHI, Shinya OTA, Kazuhiro FUKE
  • Publication number: 20150141549
    Abstract: In antibiotic particles, an antibiotic compound is dispersed in a polymer containing an epoxy group.
    Type: Application
    Filed: June 27, 2013
    Publication date: May 21, 2015
    Inventors: Junji Oshima, Takayuki Sugiyama
  • Patent number: 9034944
    Abstract: Aqueous copolymer dispersions for a variety of uses, including coating compositions or binders for plasters and paints, are disclosed. The aqueous copolymer dispersions may comprise one or more silicon containing compounds, in particular hydrolyzable silane compounds without any additional reactive group.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: May 19, 2015
    Assignee: CELANESE EMULSIONS GMBH
    Inventors: Stephan Krieger, Harald Petri, Kerstin Gohr, Lizandra Belmonte Rodrigues de Castro, Hendrikus van Boxtel
  • Publication number: 20150132584
    Abstract: The invention relates to a flame retardant composition comprising at least one radiation curable oligomer and at least one reactive aliphatic halogenated flame retardant additive and its use to make fire-resistant glass laminates with impact resistance.
    Type: Application
    Filed: June 13, 2013
    Publication date: May 14, 2015
    Inventor: Hugues Van Den Bergen
  • Publication number: 20150111987
    Abstract: Disclosed herein are self-healing systems that include corrosion inhibitors and self-healing materials that are capable of repairing themselves without any external intervention when they are damaged. The self-healing materials and corrosion inhibitors may be microencapsulated, and damage to a matrix containing the microcapsules may rupture the microcapsules and cause the self-healing materials and corrosion inhibitors to be released into the site of damage. The self-healing materials then may polymerize and restore the functional capabilities of the matrix, and the corrosion inhibitors may work in concert with the self healing materials to prevent corrosion at the site of damage.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 23, 2015
    Inventor: Gerald O. Wilson
  • Publication number: 20150111993
    Abstract: Composite compositions and machine and contact tools, for example, metal boring tools and face mills that are manufactured from them. The tools are provided with composite structure to lighten the tools and yet retain the strength and durability of the tool. The novelty resides in the use of additives to certain composites that make up a portion of the tool, especially tool bars.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 23, 2015
    Inventor: Gregory James Kay
  • Patent number: 9012009
    Abstract: The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hae Kwang Co., Ltd.
    Inventor: Myun Soo Kim
  • Publication number: 20150099833
    Abstract: Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described.
    Type: Application
    Filed: September 25, 2014
    Publication date: April 9, 2015
    Inventors: Kristin L. Thunhorst, Wendy L. Thompson
  • Patent number: 8980376
    Abstract: Epoxy resin compositions that include an epoxy resin component that includes at least one epoxy resin and a solvent blend that includes methyl ethyl ketone and glycol methyl ether acetate are provided. The compositions are well-suited for use in the fabrication of prepregs and composite electrical laminates made therefrom.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: March 17, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Robert L. Hearn, William E. Mercer, II
  • Publication number: 20150068426
    Abstract: There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C.
    Type: Application
    Filed: November 13, 2014
    Publication date: March 12, 2015
    Inventors: Yasushi Kumashiro, Naoki Maruyama, Maki Inada
  • Patent number: 8975312
    Abstract: Described herein is an epoxy composition comprising: a first component comprising an amine-based curing agent and a first dye, having a first color; and a second component comprising a curable epoxy resin and a second dye, having a second color. Also described herein is a shelf-life-indicating composition comprising: an amine-based curing agent; and a dye selected from (i) a cationic triarylmethane dye, wherein the cationic triarylmethane dye reversibly reacts with a primary amine; (ii) a halochromic dye having a color transition range between 7-12 when measured in an aqueous solution; or (iii) combinations thereof.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: March 10, 2015
    Assignee: 3M Innovative Properties Company
    Inventor: Adrian T. Jung
  • Publication number: 20150056756
    Abstract: The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
    Type: Application
    Filed: April 5, 2013
    Publication date: February 26, 2015
    Inventors: Sathid Jitjongruck, Anongnat Somwangthanaroj
  • Publication number: 20150051318
    Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.
    Type: Application
    Filed: March 22, 2013
    Publication date: February 19, 2015
    Inventors: Franz Grohmann, Martin Breineder, Thomas Breineder
  • Publication number: 20150044476
    Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.
    Type: Application
    Filed: October 23, 2014
    Publication date: February 12, 2015
    Applicant: VALSPAR SOURCING, INC.
    Inventors: Owen H. Decker, Thomas E. Reno, Robert D. Breitzman, Carlos A Concha, Jeffrey D. Rogozinski, Keith M. Kirkwood
  • Patent number: 8951639
    Abstract: A method of making capsules includes forming a mixture including a core liquid, a polyurethane precursor system, a first component of a two-component poly(urea-formaldehyde) precursor system, and a solvent. The method further includes emulsifying the mixture, adding a second component of the two-component poly(urea-formaldehyde) precursor system to the emulsified mixture, and maintaining the emulsified mixture at a temperature and for a time sufficient to form a plurality of capsules that encapsulate at least a portion of the core liquid. The capsules made by the method may include a polymerizer in the capsules, where the capsules have an inner capsule wall including a polyurethane, and an outer capsule wall including a poly(urea-formaldehyde). The capsules may include in the solid polymer matrix of a composite material.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: February 10, 2015
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Scott R. White, Jeffrey S. Moore, Nancy R. Sottos, Benjamin J. Blaiszik, Mary M. Caruso, Christian L. Mangun
  • Publication number: 20150024145
    Abstract: A semi-transparent coating material for coating glass or glass ceramics includes at least one sol-gel hybrid-polymer coating system having a hybrid-polymer or inorganic sol-gel-based matrix, and nanoparticles and nanoscale pigments and/or dyes are added to the hybrid-polymer or inorganic sol-gel-based matrix.
    Type: Application
    Filed: April 13, 2012
    Publication date: January 22, 2015
    Applicant: Schott AG
    Inventors: Matthias Bockmeyer, Andrea Anton, Vera Breier, Angelina Milanovska, Andreas Gier, Axel Kallender, Silke Knoche
  • Patent number: 8937115
    Abstract: An adhesive for filling gaps between stones, the adhesive including at least 100 weight parts of an unsaturated polyester resin suitable for air-drying, between 1 and 5 weight parts of hydrogenated castor oil, between 10 and 250 weight parts of a filler, and between 1 and 15 weight parts of an anti-shrinking agent. The adhesive has good permeability and shrinkage resistance, and high brightness after being polished.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: January 20, 2015
    Assignee: Wuhan Keda Marble Protective Materials Co., Ltd.
    Inventors: Kunwen Du, Ziqiang Xin, Kunwu Du
  • Patent number: 8937116
    Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: January 20, 2015
    Assignee: LG Hausys, Ltd.
    Inventors: Yun-Bong Kim, Won-Kook Kim, Dong-Joo Gwon, Yang-Gu Kang, Jin-Woo Kim, Mu-Seon Ryu
  • Publication number: 20150018458
    Abstract: The present invention provides a technique for suppressing the consolidation a portion of a granular encapsulating resin composition which may occur after accommodating the granular encapsulating resin composition in a packaging material. Provided is a method of packaging a granular encapsulating resin composition, in which, when the bulk density of the granular encapsulating resin composition is M (g/cc) and the height of the deposited material of the granular encapsulating resin composition is L (cm) in a state of being accommodated in the packaging material, the method satisfies the relationship M×L?19.
    Type: Application
    Filed: February 26, 2013
    Publication date: January 15, 2015
    Inventor: Yusuke Ito
  • Publication number: 20150002254
    Abstract: The invention relates to a process for the impregnation of air core reactors or parts of air core reactors and impregnated air core reactors or parts thereof obtainable by said process.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 1, 2015
    Applicant: Huntsman International LLC
    Inventors: Astrid Beigel, Christian Beisele, Ulrich Massen
  • Patent number: 8921459
    Abstract: Disclosed are a kind of ink used for ink-jet computer-to-plate (CTP) technology and the preparation method thereof. The ink comprises, in mass percent, 5% to 20% of cosslinkable resin, 5% to 25% of light solvent, and 55% to 90% of deionized water. The preparation method includes: mixing the components with stirring at room temperature; multistage filtering for removing insoluble substance and impurity in mixed solution after the crosslinkable resin being completely dissolved in the solvent; and thus to obtain the ink. An image with high resolution can be formed upon printing the ink on a treated aluminum plate and thermocuring. The aluminum plate can be printed directly by a printer, which reduces post treatment.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: December 30, 2014
    Assignee: Institute of Chemistry, Chinese Academy of Sciences
    Inventors: Huiling Li, Mingming Qin, Yanlin Song
  • Publication number: 20140377565
    Abstract: A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.
    Type: Application
    Filed: October 30, 2012
    Publication date: December 25, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hiroaki Kobayashi, Masanobu Sogame, Yoshihiro Kato
  • Patent number: 8916622
    Abstract: A heat-curable composition comprises—from 25 to 65% by weight of a mixture of epoxy-functional monomers, said mixture consisting of at least one polyfunctional epoxy monomer selected from monomers comprising from 4 to 8 glycidyl groups and/or cycloaliphatic epoxy groups, and at least one bi- or tri-functional epoxy monomer selected from monomers comprising two or three glycidyl groups and/or cycloaliphatic epoxy groups, —from 25 to 70% by weight of at least one organic solvent selected from glycol monoethers, —from 2.5 to 5% by weight, relative to the total weight of epoxyfunctional monomers (a) and (b), of at least one blocked strong acid catalyst, said heat-curable composition not containing any non-epoxyfunctional monomers, in particular not containing any acrylic, methacrylic or silane monomers.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: December 23, 2014
    Assignee: Essilor Internatonal (Compagnie Générale d'Optique)
    Inventor: Robert Valeri
  • Publication number: 20140357764
    Abstract: The invention relates to a thermoplastic molding composition comprising: A) from 69 to 98% by weight, based on components A and B, of a thermoplastic selected from the group consisting of polyvinyl chloride, polystyrene, polymethyl methacrylate, polyamide, polybutylene terephthalate, and polyoxymethylene; B) from 2 to 31% by weight, based on components A and B, of a polymer mixture comprising: i) from 30 to 70% by weight, based on the total weight of components i to ii, of at least one polyester based on aliphatic and/or aromatic dicarboxylic acids and on an aliphatic dihydroxy compound; ii) from 70 to 30% by weight, based on the total weight of components i to ii, of polylactic acid; iii) from 0 to 10% by weight, based on the total weight of components i to iv, of a copolymer which contains epoxy groups and which is based on styrene, acrylate, and/or methacrylate; iv) from 0 to 15% by weight, based on the total weight of components i to iv, of nucleating agents, lubricants and antiblocking agents, waxes,
    Type: Application
    Filed: September 12, 2012
    Publication date: December 4, 2014
    Applicant: BASF SE
    Inventors: Sachin Jain, Sameer Nalawade
  • Publication number: 20140349120
    Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 27, 2014
    Applicant: Shengyi Technology Co., Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140350141
    Abstract: The invention relates to a hydrophilically modified multifunctional amine AC which has more than one primary ammo group per molecule, and at least one group per molecule derived from the reaction of an epoxide group with a reactive group selected from the group consisting of secondary amino groups >NH, hydroxyl groups —OH, mercaptan groups —SH, amide groups —CO—NHR, where R can be hydrogen or an alkyl group having from one to twelve carbon atoms, hydroxyester groups, and acid particularly carboxyl groups —COOH, sulphonic acid groups —SO3H, and phosphonic acid groups —PO3H2, and preferably, also moieties which are compatible with an epoxy resin, as well as a process for its preparation, and a method of use thereof.
    Type: Application
    Filed: May 3, 2012
    Publication date: November 27, 2014
    Applicant: ALLNEX AUSTRIA GMBH
    Inventors: Florian Lunzer, Rudolf Schipfer, Günther Monschein, Ursula Meisner, Albine Kernbichler
  • Publication number: 20140348776
    Abstract: The invention provides a composition comprising: (a) about 0% to 99% by weight of at least one resin wherein the resin is selected from the group consisting of epoxy, latex, polyurethane, polyurea, polyspartic, or alkyd resins; (b) about 1%-99% by weight of tristyrenated phenol or distyrenated phenol; and (c) optionally about 2% to 98% by weight of an additional solvent.
    Type: Application
    Filed: April 22, 2014
    Publication date: November 27, 2014
    Inventors: Charles Francis Palmer, JR., Gerald Vandezande
  • Publication number: 20140342161
    Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 20, 2014
    Applicant: Shengyi Technology Co. Ltd.
    Inventor: Xianping Zeng
  • Publication number: 20140307224
    Abstract: A coating composition includes a colloidal suspension of specific zirconia nano-particles, at least one epoxysilane and at least one catalyst. A method for preparing this composition, and its use for coating a transparent optical substrate, an optical article, such as an ophthalmic lens, including a transparent polymer substrate, especially an acrylic substrate, and a coating prepared from the composition, which is directly applied on the substrate, are also described.
    Type: Application
    Filed: December 27, 2012
    Publication date: October 16, 2014
    Applicant: ESSILOR INTERNATIONAL (COMPAGNIE GENERALE D'OPTIQUE)
    Inventors: Yves Leclaire, Stephanie Pega
  • Patent number: 8853303
    Abstract: The recycled crumb rubber coating is a corrosion-proof coating for piping and the like. The coating is formed from recycled crumb rubber mixed with an epoxy resin and a hardener. Crumb rubber is first mixed with a liquid epoxy resin. An agent for reducing the viscosity of the liquid epoxy resin may also be added. A hardener is then added to this mixture. Finally, powdered crumb rubber is added and mixed to form the recycled crumb rubber coating. The total crumb rubber forms about 23 wt % of the coating. If no viscosity reducing agent is added, then the liquid epoxy resin forms about 51.6 wt % of the coating. If the viscosity reducing agent is added, then the liquid epoxy resin forms about 50.1 wt % of the coating, and the viscosity reducing agent forms about 1.5 wt % of the coating. The hardener forms about 25.4 wt % of the coating.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: October 7, 2014
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Nasser Al-Aqeeli, Hamoud M. Assehdi Al Hajri
  • Publication number: 20140296386
    Abstract: A thermoplastic polyester resin composition having: 100 parts by weight total of a resin composition, wherein the resin composition has 75 to 99 wt % of (A) a polybutylene terephthalate resin, and 1.0 to 25 wt % of (B) a polyester elastomer resin and/or an olefin elastomer; and 0.01 to 5 parts by weight of (C) a sorbitan fatty acid ester. The thermoplastic polyester resin composition is useful for making electric/electronic device parts, automobile parts and machine parts, as well as connectors.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Applicant: TORAY RESIN COMPANY
    Inventors: Yasuo MAEDA, Dennis GODWIN, Jason KAISER, Hiroshi SATO, Kenji OTA
  • Publication number: 20140290994
    Abstract: Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to bond fluorine (F) to a part of the surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to another part of the surface of the inorganic filler, this other part of the surface thereof being not bonded with fluorine.
    Type: Application
    Filed: August 9, 2013
    Publication date: October 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Seok Kim, Ji Hye Shim, Hwa Young Lee, Joon Ho Bae
  • Publication number: 20140264822
    Abstract: Thermosetting resin compositions with low coefficient of thermal expansion are provided herein.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Masashi Horikiri, Jie Bai
  • Publication number: 20140256855
    Abstract: The present invention provides: a carbon fiber sizing agent that can obtain a carbon fiber bundle having a superior effect of improving mechanical properties when composited using a resin; an aqueous dispersion thereof; a carbon fiber bundle; a sheet-shaped article having a carbon fiber bundle; and a composite material. The carbon fiber sizing agent contains: a compound (A) that is an ester of an unsaturated monobasic acid and an epoxy compound having a plurality of epoxy groups in the molecule, and that has at least one epoxy group in the molecule; a urethane acrylate oligomer (B) that is bifunctional and that has a tensile elongation rate of the cured product of at least 40%; and a polyurethane resin (C) having a tensile elongation rate of a dried coating film of 350-900% inclusive. The amounts of A-C contained satisfy the conditions described in the description. The aqueous dispersion disperses the sizing agent. The carbon fiber bundle contains 0.6-3.0 mass % inclusive of the sizing agent.
    Type: Application
    Filed: August 21, 2012
    Publication date: September 11, 2014
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Kouki Wakabayashi, Naoki Sugiura, Masahiro Hata, Shigekazu Takeda, Keigo Yoshida, Shuuichi Nakamura
  • Publication number: 20140256856
    Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.
    Type: Application
    Filed: November 1, 2011
    Publication date: September 11, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Rajesh H. Turakhia, Cui-ping Chen, Bill Z. Dellinger, Ludovic Valette, Itaru Kudose, Ha Q. Pham
  • Publication number: 20140242867
    Abstract: Lignin compositions, products produced from them or containing them, methods to produce them, spinning methods, methods to convert lignin to a conversion product and conversion products produced by the methods are described.
    Type: Application
    Filed: April 4, 2012
    Publication date: August 28, 2014
    Inventors: Robert Jansen, Aharon Eyal, Noa Lapidot, Bassem Hallac, Ziv-Vladimir Belman, Shmuel Kenig
  • Publication number: 20140239516
    Abstract: A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.
    Type: Application
    Filed: May 5, 2014
    Publication date: August 28, 2014
    Inventor: Ari Karkkainen
  • Publication number: 20140243452
    Abstract: A pre-dispersion composition comprising (i) a silsesquioxane; (ii) a dispersing agent; and (iii) a curable resin.
    Type: Application
    Filed: July 30, 2012
    Publication date: August 28, 2014
    Inventor: David A. Smetana