Abstract: An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 ?m, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film.

Abstract: A composition for an adhesive material, comprising at least one epoxide resin mixture and a hardening accelerator, in which the epoxide resin mixture has 25 to 80% by weight of a first epoxide resin—whereby the first epoxide resin is a bifunctional aliphatic, cycloaliphatic or aromatic epoxide resin—and 12.5 to 40% by weight of a second epoxide resin—whereby the second epoxide resin is a polyfunctional aliphatic or aromatic epoxide resin—and in which the hardening accelerator is an imidazole derivative, which is not soluble in the epoxide resin mixture at temperatures of below 50° C.

Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.

Abstract: The invention relates to an epoxy/rubber composition comprising an epoxy resin which comprises an epoxy compound X, the epoxy compound X has epoxy equivalent weight (EEW) from 150 up to 200 and viscosity from 2,000 up to 10,000 cps (25 C), a curing agent, a liquid rubber that is liquid at room temperature and comprises at least 1.5 reactive terminated group, a fluorine contained organic matter, selected from a group, including where: n=1-20; X=—COOH, —CONH2, —CON(C6H5)2, —CH2OH. b) CF3(CF2)nCOOH, where: n=7-9. where: n=3-20.

Abstract: Epoxy containing phosphonate monomers, polymers, copolymers, oligomers and co-oligomers and methods for making the same are describes herein. These materials can be used to make polymers, and can be combined with other polymers, oligomers or monomer mixtures to make resins with excellent fire resistance that can be used in a variety of industrial and consumer products.

Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.

Abstract: A curable liquid formulation comprising: (i) one or more near-infrared absorbing polymethine dyes; (ii) one or more crosslinkable polymers; and (iii) one or more casting solvents. The invention is also directed to solid near-infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.

Abstract: Provided are polyhydroxy-diamine compounds of the formula I: or salt thereof, wherein R1, R2, and R3 are as defined herein. The compounds are useful as low additives for paints, coatings and epoxy formulations.

Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

Abstract: The subject matter of the present application is a cold-curing two-component-epoxy adhesive, comprising (a) an epoxy-resin-component and (b) a curing agent-component, comprising a mercaptan curing agent, in which the epoxy-resin-component comprises a color change indicator. Also described is a method for monitoring the curing progress of cold-curing two-component-epoxy adhesive via color change of the adhesive.

Abstract: An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.

Abstract: The present invention relates to a fluorine-containing polymer comprising a structure represented by the following general formula (I), as well as the preparation process and use thereof. According to the technical solution of the invention, a novel fluorine-containing polymer with a larger molecular weight and an aromatic side group is obtained through a simple reaction, and it can be used as a non-ionic fluorine carbon surfactant, and especially, is applicable to the preparation of a pigment dispersion. Additionally, the invention further relates to a pigment dispersion and the preparation process thereof.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.

Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120° C.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B.

Abstract: The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: Wherein, n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good heat resistance and flame retardance. The laminated material and the metal clad laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance and low coefficients of thermal expansion in X, Y directions, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant, so they are fit for making a substrate material for high density PCB.

Abstract: The present invention relates to a thermally curable liquid resin composition capable of being used in the manufacture of abrasive articles, and to the resulting abrasive articles.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.

Abstract: The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.

Abstract: Disclosed is a polyamideimide-based film coating composition free from any restricted substance or a substance which might possibly be a restricted one such as N-methyl pyrrolidone and N-ethyl pyrrolidone and capable of replacing a conventional coating composition using a solvent such as N-methyl pyrrolidone. The polyamideimide-based film coating composition of the present invention is a polyamideimide-based film coating composition comprising a polyamideimide resin and a solvent, the polyamideimide resin being dissolved as a binder in the solvent, wherein the solvent contains ?-butyrolactone and cyclopentanone, and a volume of ?-butyrolactone is 50% by volume or more compared to a total volume of ?-butyrolactone and cyclopentanone.

Abstract: A pigment dispersion and a method for preparing the same are provided. The pigment dispersion comprises the following components in the following mass percentage: 10%˜20% pigment, 1.5%˜12% dispersant, 0.75%˜7.5% binder resin, 58.5%˜87.3% solvent and 0.45%˜2% nonionic surfactant, based on the total mass of the pigment dispersion. The pigment dispersion is improved in stability, and is applicable to a colored filter.

Abstract: The invention concerns a biologically degradable polymeric composition containing 5 to 95 wt % of polyhy droxyalkanoate and 95 to 5 wt % of polylactic acid or lactide with addition of 2 to 67 parts of plasticizer or mixture of plasticizers per 100 parts of the polymeric blend. The invention covers also composition containing 0.05 to 5 wt % of a reactive additive. Plasticizers are selected from chemicals, such as esters of citric acid, esters of glycerol, esters of phosphoric acid, esters of sebacic acid and other liquid organic low-molecular polyesters. The reactive additive is selected from a group of chemicals such as acrylic polymers, epoxidized acrylic polymers, diisocyanates and their derivatives, epoxidized oils, oligomeric copolymers of various monomers with glycidyl methacrylate and other species.

Abstract: The invention relates to a polymer composition comprising high impact polystyrene (HIPS) and a combination of flame retardants which are brominated epoxy oligomers and polymers. A process for preparing the HIPS composition through a masterbatch route and a masterbatch composition which contains the flame retardants are also disclosed.

Abstract: To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).

Abstract: The invention relates to a composition that can be used as a coating and that can protect a substrate coated with this composition from high heat. The composition comprises: a polysulfide, an epoxy resin, a compound selected from compounds having a secondary and/or a tertiary amine group, and compounds having an amide group, a polysiloxane, and fibres.

Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Abstract: The invention provides a pigment-containing heat-curable composition including a pigment dispersion solution obtained by dispersing a composition containing a heat-curable resin, a solvent, and a pigment, wherein the concentration of the pigment is 50% or more and less than 100% with respect to the total solid contents.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: The recycled crumb rubber coating is a corrosion-proof coating for piping and the like. The coating is formed from recycled crumb rubber mixed with an epoxy resin and a hardener. Crumb rubber is first mixed with a liquid epoxy resin. An agent for reducing the viscosity of the liquid epoxy resin may also be added. A hardener is then added to this mixture. Finally, powdered crumb rubber is added and mixed to form the recycled crumb rubber coating. The total crumb rubber forms about 23 wt % of the coating. If no viscosity reducing agent is added, then the liquid epoxy resin forms about 51.6 wt % of the coating. If the viscosity reducing agent is added, then the liquid epoxy resin forms about 50.1 wt % of the coating, and the viscosity reducing agent forms about 1.5 wt % of the coating. The hardener forms about 25.4 wt % of the coating.

Abstract: To provide a curable epoxy resin composition that exhibits excellent fluidity during molding without having adverse effects on the physical properties of the cured material. A curable epoxy resin composition, containing (I) a curable epoxy resin, and (II) an epoxy functional group- and aromatic hydrocarbon group-containing organopolysiloxane having an epoxy equivalent weight of 3,000 or lower, a content of aromatic hydrocarbon groups of 45 to 80% by weight (mass), and a glass transition point of less than 0° C.

Abstract: Aqueous copolymer dispersions for a variety of uses, including coating compositions or binders for plasters and paints, are disclosed. The aqueous copolymer dispersions may comprise one or more silicon containing compounds, in particular hydrolyzable silane compounds without any additional reactive group.

Abstract: There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance.

Abstract: Halogen-free flame retardant compositions comprising copolyetherester thermoplastic elastomers, melamine cyanurate and epoxy-containing compounds and cables and wires made from such flame retardant polymer composition provide good electrical insulation resistance during use.

Abstract: Provided is a resin composition for light scattering layer for use in forming a light scattering layer of an organic EL device, including: a binder composition including at least one type of resin (A); and light scattering particles (B). In a resin composition for light scattering layer of the invention, the light scattering particles (B) have an average particle diameter of 200 nm to 500 nm in the resin composition and have a content of 20 vol % or less of particles with a particle diameter of 600 nm or more with respect to a total amount of the light scattering particles (B); and a refractive index difference between the binder composition and the light scattering particles (B) is 0.1 or more.

Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.

Abstract: In dispersing a fine carbon fiber in a thermosetting resin, the invention disperses and disentangles the fine carbon fiber being aggregates form in the thermosetting resin solution, maintains the stable dispersed state, lowers the viscosity of the thermosetting resin solution in which the fine carbon fiber is dispersed, and provides a thermosetting resin formed article containing the fine carbon fiber by curing the fine carbon fiber dispersion solution and a production method thereof. The thermosetting resin-containing solution in which a fine carbon fiber is dispersed, comprises a thermosetting resin, the fine carbon fiber and a viscosity-decreasing agent for fine carbon fiber having a chemical structure represented by the following general formula (1), wherein R1 to R7 are hydrogen atoms or the like, R5 and R6 may be bonded together to form a ring, and all of them have not more than 30 carbon atoms.

Abstract: A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites.

Abstract: A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine.

Abstract: A joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid.

Abstract: A coating that includes: (a) a silane derivative of the formula (I) in which: R1, R2, R3 and R4, which may be the same or different, are selected from alkyl, acyl, alkyleneacyl, cycloalkyl, aryl and alkylenearyl, which may optionally be substituted; and/or a hydrolysis and/or condensation product of the silane derivative of the formula (I); (b) a silane derivative of the formula (II) R6R73.nSi(OR5)n ??(II) in which: R5 is an unsubstituted or substituted alkyl, acyl, alkyleneacyl, cycloalkyl, aryl or alkylenearyl group; R6 is an organic radical containing an epoxide group; R7 is an unsubstituted or substituted alkyl, cycloalkyl, aryl or alkylenearyl group; n is 2 or 3; and/or a hydrolysis and/or condensation product of the silane derivative of the formula (II); (c) a colloidal inorganic oxide, fluoride or oxyfluoride; (d) an epoxide compound; and (e) a catalyst system.

Abstract: Disclosed is a device for treating the outer surface of a cork plug (3), including: a first so-called reactive liquid composition including: a so-called bi-epoxyde composition of at least one compound having a molecular mass between 340 g/mol and 800 g/mol; a so called reactive solvent; a so-called curing liquid composition including at least one polyamine adapted for forming a protection film by polymerization at the surface of a cork plug (3); characterized in that the reactive composition includes a load of a solid in the divided state dispersed in the reactive composition, the solid in the divided state including barium sulphate.

Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1: wherein, n represents an integer of 0-10. The epoxy resin composition of the present invention can provide the prepreg and copper clad laminate made therefrom with high glass transition temperature, high heat resistance, low expansion coefficient and low moisture absorption, which can meet demands of high reliability of high density multi-layer PCBs.