Abstract: Polymers may include a plurality of tetradecahydroanthracene moieties. Such polymers may be used to make food or beverage containers or medical devices. Food or beverage containers or medical devices may be coated with polymers including a plurality of tetradecahydroanthracene moieties.

Abstract: Methods are disclosed for providing lignin product of a small particle size for improving burning efficiency and for avoiding typical equipment fouling problems while maximizing energy recovery.

Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.

Abstract: Enhanced media transport systems and structures are provided for printing environments. Enhanced vacuum table structures and associated methods may also be implemented for a variety of printer systems. Enhanced rail systems and associated carriage structures may preferably be used within a variety of printing environments, such as for but not limited to grand scale printers. Water-based binary epoxy ink compositions and associated processes provide adhesion and material compatibility that exceeds that of currently available UV curable products, while providing ultra-low volatile organic carbon (VOCs), and no hazardous air pollutants (HAPs). An integrated system and method for identification of consumables through a central database may also be implemented within different printing systems.

Abstract: The present invention relates to a rubber composition based on at least one elastomeric matrix comprising an epoxidized synthetic rubber (ESR) having an epoxy function content ranging from 7% to 25%, a reinforcing filler, of which at least 50% by weight of the reinforcing filler is constituted of an inorganic filler, and a plasticizing agent comprising a polar liquid plasticizer for the manufacture of a tyre tread having an improved compromise of properties: grip on wet ground/rolling resistance.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.

Abstract: Methods and compositions for forming a transparent clear coat characterized by a desired property, such as a color effect, resistance to UV light-induced degradation and/or scratch resistance, on a substrate are detailed according to embodiments of the present invention. Particular compositions and methods for producing a transparent clear coat layer include nanoparticles formed in-situ during curing of a transparent clear coat. Curable clear coat compositions are described according to embodiments of the present invention which include one or more substantially dissolved nanoparticle precursors.

Abstract: The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing mieroballoons.

Abstract: A composition suitable for forming a paint marking on a roadway comprises a polyfunctional acrylate having at least four acrylate groups, an epoxy component and a polyfunctional amine. The polyfunctional acrylate reacts with the polyfunctional amine to form an adduct with secondary amine groups. The secondary amine reacts with the epoxy component to yield a chemically high crosslinked material having a no track time of less than about five minutes.

Abstract: The present disclosure is directed to coalescing agent for waterborne coatings. The coalescing agent comprises low molecular weight polytrimethylene ether glycol having a Mn (number average molecular weight) in a range of from 100 to 490. This disclosure is further directed to a waterborne coating composition comprising the coalescing agent. The waterborne coating compositions can be used as interior and exterior top coats, basecoats, primers, primer surfacers and primer fillers. The waterborne coating compositions can be used as architecture coatings, automotive original equipment manufacturer (OEM) coatings, automotive refinish coatings, sports equipment coatings or any other coatings. The disclosure is particularly directed to a coating composition comprising components derived from renewable resources.

Abstract: A resin composition for LED encapsulation is provided. The resin composition includes an epoxy resin, a curing agent and a stress adjusting agent. The resin composition of the present invention improves reliability of LED products and meets requirements in industry.

Abstract: The present invention relates to an inkjet composition for forming transparent films, which is highly economical and environmentally friendly and has excellent physical properties, including excellent transmittance, chemical resistance, heat resistance, adhesion, jetting stability and storage stability.

Abstract: Disclosed are a resin composition for encapsulating a semiconductor containing a phenol resin (A), an epoxy resin (B) and an inorganic filler (C), wherein the phenol resin (A) contains a polymer (a1) having a structure represented by the general formula (1), and the epoxy resin (B) contains at least one kind of epoxy resin selected from the group consisting of a triphenol methane type epoxy resin, a naphthol type epoxy resin and a dihydroanthracene type epoxy resin, and a semiconductor device, obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A method of promoting the adhesion between a coating based on at least one polymer and a substrate surface that can be made of different materials in which an adhesion promoter comprising at least one, optionally oligomeric, addition product having no terminal C?C double bonds and has hydrolyzable silane groups and other functional groups is included in the coating composition, included in a preliminary coating applied to the substrate surface prior to the actual coating, is applied between the coating and substrate surface, or any combination thereof.

Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.

Abstract: Underfill materials include inorganic fill materials (e.g., functionalized CNT's, organo clay, ZnO) that are functionalized reactive with other organic constituents (e.g., organics with epoxy groups, amine groups, or PMDA). The underfill materials also beneficially include polyhedral oligomeric silsesquioxane and/or dendritic siloxane groups that are functionalized with a reactive group (e.g., glycidyl) that reacts with other components of an epoxy system of the underfill.

Abstract: The invention relates to a hydrophobic fumed silica which is obtained by grinding a fumed silica which, as a result of silanization, has trimethylsilyl groups fixed on the surface; and to coating formulations comprising this silica.

Abstract: The invention relates to a two-component composition consisting of a component A containing a polymer with a molecular weight of 250 to 5000 g/mol which has at least 2 epoxy groups per molecule, a component B containing a compound of the formula (I) R1-phenyl-(—O—R2)a where R1=H, C1 to C6-alkyl, a=1, 2, or 3, R2=—O—CH2—CHOH—CH2—NH—CH2-phenyl-CH2—NH2, wherein the epoxy/NH ratio of the components A to B is between 0.75:1 to 1.25:1.

Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.

Abstract: The invention relates to an epoxy/rubber composition comprising an epoxy resin which comprises an epoxy compound X, the epoxy compound X has epoxy equivalent weight (EEW) from 150 up to 200 and viscosity from 2,000 up to 10,000 cps (25 C), a curing agent, a liquid rubber that is liquid at room temperature and comprises at least 1.5 reactive terminated group, a fluorine contained organic matter, selected from a group, including where: n=1-20; X=—COOH, —CONH2, —CON(C6H5)2, —CH2OH. b) CF3(CF2)nCOOH, where: n=7-9. where: n=3-20.

Abstract: Disclosed is an adhesive composition including 100 parts by weight of lignin, 150 to 400 parts by weight of epoxy resin, and 7.5 to 200 parts by weight of flexibilizer. The lignin and the flexibilizer can be pre-reacted to enhance the physical properties, e.g. glass transition temperature (Tg) and flexural endurance (MIT), of the cured adhesive composition. Furthermore, the adhesive composition and a flexible metal foil can be laminated to form a flexible substrate.

Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.

Abstract: Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, wherein said sol-gel composition includes: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a)]; (b) a glycidoxypropane-tri(C1-4)alkoxysilane [component (b)]; (c) a gamma-aminopropyl-tri(C1-4)alkoxysilane [component (c)]; (d) a mineral filler material [component (d)]; and (e) a hydrophobic compound [component (e)] or a mixture of such hydrophobic compounds being selected from fluorinated or chlorinated hydrocarbons or organopolysiloxanes.

Abstract: Three types of trisiloxane surfactants having the basic formula: MDM? are described wherein the substituents on the differing M and M? groups, in conjunction with pendant polyalkylene oxide substituents on the D group render the surfactant resistant to hydrolysis under either basic or acidic conditions outside the pH range of 6.0 to 7.5. The compositions are useful in agricultural, household and cosmetic applications.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Abstract: Premixes suitable for the production of membrane materials are described. Products of this invention are suitable for the formation of membranes and membrane modules that may be in the form of flat sheets, tubes, or hollow fibers.

Abstract: The invention relates to a biodegradable polymer composition comprising the following components (a)-(f) and/or product(s) formed from a reaction between the components: (a) one or more biodegradable polyesters; (b) polysaccharide; (c) polymer having pendant carboxylic acid groups; (d) transesterification catalyst; (e) polyepoxide; and (f) fatty acid sodium salt.

Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

Abstract: The use of nanoparticles, including surface-modified silica and calcite nanoparticles, as processing aides for pultrusion is described. The methods include combining a resin system containing a resin and the nanoparticles with continuous fibers, pultruding this combination, and at least partially curing the resin. The methods are suitable for use with a wide variety of resins and fibers, and may be used to reduce the pull-force at a fixed fiber volume loading, increase the fiber volume loading, or both. Pultruded parts made by these methods and pultruded parts with high volume loadings of fibers are also described.

Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.

Abstract: A halogenated non-polymeric phenyl ether flame retardant is described having the general formula (I): wherein each X is independently Cl or Br, n is an integer of 1 or 2, and each p is independently an integer of 1 to 4, provided that, when each X is Cl, the total amount halogen in the ether is from about 50 to about 65 wt % and when each X is Br, the total amount halogen in the ether is from at least 70 wt % to about 79 wt % and wherein from about 30% to about 80%, for example from about 35% to about 75% of the halogenated ethers are fully halogenated the remainder being partially halogenated. The present flame retardant provides superior mechanical properties when incorporated into a polymer than similar flame retardants which contain a higher amount of fully halogenated species.

Abstract: The present invention relates to a method of producing an aqueous dispersion of silanized colloidal silica particles comprising mixing in an aqueous medium a) at least one silane compound containing an epoxy-functionality, b) at least one silane compound having no epoxy-functionality capable of modifying colloidal silica particles; and c) colloidal silica particles in any order to form an aqueous dispersion of silanized colloidal silica particles containing silane compounds originating from a) and b). It also relates to a dispersion obtainable by said method and to the use thereof in coating applications.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: Disclosed is a novel method for manufacturing a semiconductor package, which can suppress the formation of voids in an encapsulating resin. Specifically disclosed is a method for manufacturing a semiconductor package, which comprises: (1) a step wherein a first member, which is selected from a group consisting of semiconductor chips and circuit boards, is coated with solvent borne semiconductor encapsulating epoxy resin composition that essentially contains (A) an epoxy resin, (B) a phenol novolac resin in such an amount that the mole number of phenolic hydroxyl groups is 0.8-1.

Abstract: Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.

Abstract: A resin composition that is storable at ambient temperatures. The resin composition forms a cured resin when exposed to a curing agent and heated to a curing temperature that is relatively close to ambient temperature. The resin composition includes a resin component that is composed of a liquid part that is made up of one or more liquid thermosetting resins and a solid part that includes particles of one or more solid thermosetting resins. The liquid part further includes a gelation agent that is present in a sufficient amount to maintain the particles in suspension within the liquid part at ambient temperatures. The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature. The high viscosity state is substantially more viscous than the low viscosity state.

Abstract: A process for producing a composition of a polymerizable organic compound containing silica particles characterized by comprising: (a) a process of preparing an amine-added organic solvent-dispersed silica sol, in which an amine compound is added to an organic solvent-dispersed silica sol that contains colloidal silica particles having an average primary particle size of 5 to 100 nm and that has a pH of 2.5 to 4.0 at 20° C. as measured in a diluted solution obtained by a method in which the same mass of the organic solvent-dispersed silica sol, methanol, and pure water are mixed together, so that the diluted solution obtained by the mixing method has a pH of 4.5 to 11.0 at 20° C.; and (b) a process of mixing the amine-added organic solvent-dispersed silica sol obtained in the process (a) with a polymerizable organic compound.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: Provided are nanomaterial-reinforced resin compositions and related methods. The compositions include a reinforcing material, such as graphene, polyamic acid, carbon nanotubes, or dimethylacetamide that is dispersed into a resin. The reinforcing material is present in the resin at from about 0.001 to about 10 wt %. Also provided are methods of fabricating these compositions and methods of tailoring a composition to achieve a particular set of mechanical properties.

Abstract: The present invention discloses a thermosetting resin composition comprising: a bifunctional or multifunctional epoxy resin, a styrene-maleic anhydride (SMA) copolymer with a styrene/maleic anhydride molar ratio of 5-12:1 as a curing agent, a BPA epoxy resin with a low or high bromine content or tetrabromobisphenol A as a flame retardant agent, an accelerator and a solvent. The cured resin composition of the invention has a very low dielectric property, improved thermal reliability and better toughness. A copper clad laminate made of the resin composition and a reinforced material such as glass fiber cloth has a very low dielectric constant and dissipation factor, high Td, better toughness and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs and also applied to the common use of epoxy resins, such as molding resins, and composite materials for construction, automobiles and aviation.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.