Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

Abstract: The present invention provides a low-bake powder coating composition comprising A) 10 to 60 wt % of at least one glycidyl-functionalised (meth)acrylic resin, B) 40 to 90 wt % of at least one carboxyl functionalised polyester resin produced by reacting of at least one hydroxyl functionalised polyester resin with cyclic, aliphatic and/or aromatic dicarboxylic acids and/or their anhydrides, and C) 0.01 to 50 wt % of at least one coating additive, pigment and/or filler, Wherein the wt % based on the total weight of the powder coating composition. The powder coating composition of this invention provides compositions which are low-bake compositions providing coatings having high grade of flexibility for outdoor applications. Particularly and surprisingly, the powder coating composition of this invention furthermore provides no blooming of the coatings and excellent flow and appearance properties.

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: This invention relates to a resin composition using a dicarboxylic acid diester derivative as a plasticizer, and particularly to a resin composition, which is obtained by adding the plasticizer to one or more resins selected from among aliphatic or aromatic polycarbonate resins, polyurethane resins, polyvinyl chloride resins and epoxy resins, and which has a low glass transition temperature (Tg) and can be easily processed and can impart flexibility to products. This plasticizer exhibits high plasticization efficiency, and a resin composition including the plasticizer can manifest a low glass transition temperature and good flexibility at low temperature, thus improving physical properties such as tensile strength, even when only a small amount of the plasticizer is added.

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract: An epoxy resin composition comprises an epoxy resin, a plurality of particles, and a diluent. The particles can comprise a magnesium oxysulfate compound. The diluent can be selected from the group consisting of monoglycidyl compounds, diglycidyl compounds, bisphenol-A alkoxylates, and mixtures thereof. The epoxy resin composition can be reacted with an activator composition to produce an epoxy polymer. The activator composition can comprise one or more compounds selected from the group consisting of polyamine compounds, anhydride compounds, and mixtures thereof.

Abstract: A polymerizable composite composition comprising a) a hydrolysate and/or condensate of at least one hydrolysable alkylsilane having at least one alkyl group, at least one hydrolysable arylsilane having at least one aryl group or at least one hydrolysable alkylarylsilane having at least one alkylaryl group, and at least one hydrolysable silane containing an epoxy group, b) at least one organic compound having at least 2 epoxy groups, and c) a cationic initiator, is suitable to provide, upon curing, substrates with a patterned coating or patterned molded articles. The patterned coatings and molded articles obtained show high relaxation ability, high chemical resistance and mechanical stability. Micropatterns can be obtained with high stability of shape.

Abstract: An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. 1 wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C.

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: Technologies are generally described for a nanocomposite polymer dielectric that may incorporate two types of nanoparticles and a polymer. One of the two types of nanoparticle may be a first, smaller nanoparticle, that may occupy spaces between larger second nanoparticles. Another of the two types of nanoparticle may be the second, larger, “high-?” nanoparticle, which supports the overall dielectric constant of the material. In an applied electric field, the first, smaller nanoparticle may redistribute local charge to homogenize electric fields in the dielectric material, tending to avoid the development of “hot spots”. Such a two-nanoparticle nanocomposite dielectric material may provide increased dielectric breakdown strength and voltage endurance in comparison with a nanoparticle dielectric which only contains a single type of “high-?” nanoparticle.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (R1COO)n-R2 (wherein the substituent R1 represents a hydrocarbon group having 5 or more carbon atoms; the substituent R2 represents a hydrogen atom, an metal alkoxide group or a metal atom; and n is 1 to 4).

Abstract: A composition comprising polycarbonate, polyethylene terephthalate, organopolysiloxane-polycarbonate block copolymer, and epoxy-functional block copolymer for providing an improved balance of properties, including heat aging performance in combination with impact resistance. Articles molded from the composition are advantageously useful for automotive applications.

Abstract: A barrier layer is provided for impeding the flow of inflation gas through an inflatable article, the barrier layer constructed of a material that is based upon a cross-linkable rubber composition, the cross-linkable rubber composition comprising, per 100 parts by weight of rubber (phr), between 50 phr and 90 phr of a butyl rubber and between 10 phr and 50 phr of a total amount of a GCO copolymer comprising epichlorohydrin derived units and allyl glycidyl ether derived units and a GECO terpolymer comprising epichlorohydrin derived units, allyl glycidyl ether derived units and ethylene oxide derived units, wherein the GECO terpolymer is between 1 percent by weight and 50 percent by weight of the total and also including a sulfur cure system.

Abstract: The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.

Abstract: The present invention relates to the speeded curing of a composition comprising an epoxy compound, an amino or anhydride hardener and a high-branched polyether amine accelerant. The high-branched polyether amine may have terminal hydroxyl groups (polyol) and/or amino groups (amino modified). The amino-modified high-branched polyether amines are obtainable by subsequently modifying the terminal hydroxyl groups of high-branched polyether amine polyols.

Abstract: A surface-modified titania particle manufacturing method is a method for manufacturing surface-modified titania particles having crystal particles of titanium dioxide and a surface modifier that coats a surface of the crystal particles, including: [1] a first step of preparing a starting solution containing a titanalkoxide compound, an alkoxysilane, an alcohol, an acid, and water; and [2] a second step of performing heating treatment on the starting solution. Furthermore, this method preferably further includes, after the second step, [3] a third step of removing a liquid phase component in the starting solution through evaporation, by reducing a pressure around the starting solution.

Abstract: Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate.

Abstract: A curable epoxy resin composition according to the present invention is a curable epoxy resin composition which includes a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles. The curable epoxy resin composition further includes an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25° C. The rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm. The curable epoxy resin composition gives a cured product having a refractive index with a difference from the refractive index of the rubber particles of within ±0.03.

Abstract: A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin, an unsaturated glycidyl group-containing polymer, and a lubricant. In the composition, the unsaturated glycidyl group-containing polymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) polyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, R1 may be selected from the group of hydrogen, C1-C6 alkyl, C6-C14 aryl, —C(?O)R4, —C(?O)OR5, and —C(?O)NHR6 (in which R4, R5, and R6 may each independently be selected from C1-C6 alkyl and C6-C14 aryl), R2 may be C1-C6 alkyl, and R3 may be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C1-C6 alkyl-substituted benzyl group, and a naphthylmethyl group.

Abstract: A mica-based insulation based on impregnating resin for rotating electrical machines is provided. The mica-based impregnating resin includes an epoxy resin/anhydride mixture and a nanoparticulate filler, wherein the nanoparticulate filler is a nanoparticulate silicon dioxide and/or aluminum oxide modified by a silanizing reagent. Further, a method of producing the mica-based impregnating resin is provided.

Abstract: Disclosed are a kind of ink used for ink-jet computer-to-plate (CTP) technology and the preparation method thereof. The ink comprises, in mass percent, 5% to 20% of cosslinkable resin, 5% to 25% of light solvent, and 55% to 90% of deionized water. The preparation method includes: mixing the components with stirring at room temperature; multistage filtering for removing insoluble substance and impurity in mixed solution after the crosslinkable resin being completely dissolved in the solvent; and thus to obtain the ink. An image with high resolution can be formed upon printing the ink on a treated aluminum plate and thermocuring. The aluminum plate can be printed directly by a printer, which reduces post treatment.

Abstract: A high emissive paint comprises organic materials with different functional groups, one or more inorganic materials, and optionally other paint property adjusting agents. The infrared absorption range of the paint derives from organic functional groups, such as C—C, C—H, N—H, C—N, C—O and C—X groups, and the one or more inorganic materials. One or more inorganic materials may also be present as micro- or nano-sized particles.

Abstract: The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture. The present invention provides a green, environmentally friendly epoxy resin composition with high reliability and low warpage properties that can satisfy the requirement of lead-free high temperature reflux process.

Abstract: The invention relates to a polymer composition comprising high impact polystyrene (HIPS) and a combination of flame retardants which are brominated epoxy oligomers and polymers. A process for preparing the HIPS composition through a masterbatch route and a masterbatch composition which contains the flame retardants are also disclosed.

Abstract: A method of making a powder coating composition includes obtaining functionalized particles by reacting inorganic particles with alkoxysilanes having the general structural formula (I) R1Si(OR2)3, silane oligomers having the general structural formula (II) (R1)(OR2)2Si-O-[-Si(R1)(OR2)-O-]m-Si(R1)(OR2)2 or mixtures thereof.

Abstract: The present invention provides an ester plasticizer for polyvinyl chloride (PVC) resin, epoxy resin or urethane resin and a method of preparing the same. More particularly, the present invention provides an ester plasticizer using triacetin and coconut oil-based biodiesel as raw materials, which can prepare a resin composition having excellent plasticizing efficiency and improved physical properties such as tensile strength and the like. When a polyvinyl chloride resin or the like is manufactured using the ester plasticizer, there are advantages in that an environment-friendly product having an excellent plasticizing efficiency and in that the physical properties such as hardness, tensile strength, etc. of the product are improved.

Abstract: A method of making capsules includes forming a mixture including a core liquid, a polyurethane precursor system, a first component of a two-component poly(urea-formaldehyde) precursor system, and a solvent. The method further includes emulsifying the mixture, adding a second component of the two-component poly(urea-formaldehyde) precursor system to the emulsified mixture, and maintaining the emulsified mixture at a temperature and for a time sufficient to form a plurality of capsules that encapsulate at least a portion of the core liquid. The capsules made by the method may include a polymerizer in the capsules, where the capsules have an inner capsule wall including a polyurethane, and an outer capsule wall including a poly(urea-formaldehyde). The capsules may include in the solid polymer matrix of a composite material.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.

Abstract: A curable divinylarene dioxide resin composition having a stoichiometric excess of divinylarene dioxides cured with amines, anhydrides, or polyphenols. The curable divinylarene dioxide resin composition includes (a) a stoichiometric excess of at least one divinylarene dioxide, (b) a co-reactive curing agent, and a catalyst. A process for making the above curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom are also disclosed. The curable divinylarene dioxide resin composition has a longer pot life prior to cure and produces a thermoset having a higher heat resistance after cure than analogous prior art compositions made using stoichiometric compositions. The curable compositions of the present invention are advantageously useful as thermoset materials, coatings, composites, and adhesives.

Abstract: There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: Provided are (i) a one-pack epoxy resin which exhibits excellent storage stability in terms of not only composition viscosity but also flowability and (ii) use thereof. The one-pack type epoxy resin composition, contains, as main components, (A) epoxy resin; (B) a modified aliphatic polyamine compound; and (C) inorganic filler treated with a long-chain hydrocarbon-group containing compound. Therefore, the present invention achieves (i) the one-pack type epoxy resin composition which exhibits the excellent storage stability in terms of not only the viscosity but also the flowability and (ii) use thereof.

Abstract: Encapsulation of silica aerogel powder. At least some of the illustrative embodiments are directed to methods including encapsulating silica aerogel powder. The encapsulating may include: providing the silica aerogel powder in a reaction chamber; supplying a monomer to the reaction chamber; creating an activated form of the monomer; and associating at least a portion the activated monomer with the silica aerogel powder.

Abstract: The present invention is relative to a heat-curable coating composition forming transparent tintable abrasion-resistant coatings, said compositions comprising, in an aqueous or hydro-organic solvent: (A) a hydrolysate of an epoxy-functional silane compound containing at least two alkoxy groups, (B) colloidal silica having an average particle diameter of 1 to 100 ?m, (C) an aluminium chelate compound of formula Al(O—C1-4 alkyl)nY3-n wherein n is 0, 1 or 2 and Y is a ligand selected from the group consisting of M-C(?O)—CH2—C(?O)-M and M-C(?O)—CH2—C(?O)O-M, wheren each M is independently a C1-4 alkyl group, and (D) a hydrolysate of a silylated poly(tetrahydrofurane) of formula (Ia) or (Ib) said heat-curable composition not containing any multifunctional cross-linking agents selected from the group consisting of multifunctional carboxylic acids and multifunctional anhydrides.

Abstract: Disclosed is a resin composition for semiconductor encapsulation, containing an epoxy resin (A), a curing agent (B), and an inorganic filler material (C), the epoxy resin (A) including an epoxy resin (A-1) represented by formula (1), and the epoxy resin (A-1) containing a component represented by the formula (1) in which n?1, and a component (a1) represented by the formula (1) in which n=0 (wherein in the formula (1), R1 represents a hydrocarbon group having 1 to 6 carbon atoms; R2 represents a hydrocarbon group having 1 to 6 carbon atoms, or an aromatic hydrocarbon group having 6 to 14 carbon atoms, while R1s and R2s may be respectively identical with or different from each other; a represents an integer from 0 to 4; b represents an integer from 0 to 4; and n represents an integer of 0 or larger).

Abstract: There is provided a method of making a nano-composite having individual nano-sized silica particles dispersed in a polymer matrix, the method comprises the step of curing a substantially homogeneous mixture of surface-functionalized nano-sized silica particles, a polymerizable resin and a curing agent, wherein said substantially homogeneous mixture is substantially free of alcoholic solvent to form the nano-composite.

Abstract: The invention relates to a fixing mortar system for embedding anchoring means in mortar in holes or crevices, based on one or more hardening epoxy-based reactive resins, characterised in that it includes silanes which may or may not have reactive groups capable of participating in the polymerisation with a synthetic resin based on the hardening epoxy-based reactive synthetic resin(s) but which in any case have Si-bonded hydrolysable groups, and to related inventive subject matter such as processes, kits and uses.

Abstract: A heat-curable composition comprises from 25 to 65% by weight of a mixture of epoxy-functional monomers, said mixture consisting of at least one polyfunctional epoxy monomer selected from monomers comprising from 4 to 8 glycidyl groups and/or cycloaliphatic epoxy groups, and at least one bi- or tri-functional epoxy monomer selected from monomers comprising two or three glycidyl groups and/or cycloaliphatic epoxy groups, from 25 to 70% by weight of at least one organic solvent selected from glycol monoethers, from 2.5 to 5% by weight, relative to the total weight of epoxyfunctional monomers (a) and (b), of at least one blocked strong acid catalyst, said heat-curable composition not containing any non-epoxyfunctional monomers, in particular not containing any acrylic, methacrylic or silane monomers.

Abstract: A method of manufacturing an organic montmorillonite is disclosed. The manufacturing method includes the steps hereinafter. A montmorillonite solution and an intercalation agent solution are prepared respectively. The montmorillonite solution and the intercalation agent solution are mixed at high temperature to form an organic montmorillonite solution. The organic montmorillonite is purified to obtain an organic montmorillonite solution.

Abstract: An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 ?m, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: One aspect of the present invention provides a polymer having repeating units represented by the formulas (1-1), (1-2) and (1-3) and weight-average molecular weight of from 3,000 to 500,000, as determined by GPC using tetrahydrofuran as a solvent, reduced to polystyrene. Another aspect of the present invention provides an adhesive composition comprising (A) the polymer, (B) a thermosetting resin, and (C) a compound having flux activity. Further, the present invention provides an adhesive sheet having an adhesive layer made of the adhesive composition, a protective material for a semiconductor device, which has the adhesive layer, and a semiconductor device having a cured product obtained from the adhesive composition.

Abstract: Formulations containing a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin, the mixture having nano-materials dispersed or dissolved therein. These formulations can be used for the preparation of nanocomposites. Methods of preparing nanocomposites by curing a dispersion of nano-materials in a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin. Nanocomposites comprising a cured product formed by curing an epoxy resin with an ionic liquid or an adduct of an epoxy resin and an ionic liquid having nano-materials dispersed or dissolved therein. Embodiments of the invention permit manufacture of nanocomposites having relatively high fracture toughness, relatively high loadings of nano-materials and the ability to tailor the properties of the nano-composites.

Abstract: A coating for a substrate is a cured coating composition which includes binder and particles, wherein the particles are inorganic, organic or organo-metallic; have diameters between about 1 and 500 nm; may be treated with a surface modifer; and wherein the cured coating composition is in direct or indirect contact with the substrate.

Abstract: A resin composition which comprises polylactic acid, does not release an isocyanate group at the time of production and has excellent hydrolysis resistance and a low environmental burden. The resin composition comprises: (A) 100 parts by weight of a resin component (component A) containing polylactic acid (component A-?); (B) 0.001 to 10 parts by weight of a compound (component B) having one carbodiimide group and a cyclic structure in which first nitrogen and second nitrogen are bonded to each other via a bonding group, the cyclic structure consisting of 8 to 50 atoms; and (C) 0.001 to 2 parts by weight of at least one antioxidant (component C) selected from the group consisting of a hindered phenol-based compound, a phosphite-based compound, a phosphonite-based compound and a thioether-based compound.

Abstract: Methods are disclosed for providing lignin product of a small particle size for improving burning efficiency and for avoiding typical equipment fouling problems while maximizing energy recovery.