Transition Metal Patents (Class 523/458)
  • Patent number: 10682732
    Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 16, 2020
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
  • Patent number: 10681808
    Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: June 9, 2020
    Assignees: Waseda University, Fuji Electric Co., Ltd.
    Inventors: Yoshimichi Ohki, Yuichi Hirose, Genta Wada, Toshikatsu Tanaka, Kenji Okamoto
  • Patent number: 10287420
    Abstract: A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: May 14, 2019
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Toshitaka Yoshitake, Masaki Tono, Kenji Otsuka, Hideaki Yano
  • Patent number: 10011736
    Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: July 3, 2018
    Assignee: Akzo Nobel Coatings International B.V.
    Inventor: Chad Lucas
  • Patent number: 9086548
    Abstract: One embodiment of the disclosure relates to an optical connector. The optical connector may include a ferrule, a waveguide, and an inorganic adhesive composition. The ferrule may include a fiber-receiving passage defining an inner surface. The inorganic adhesive composition may be disposed within the ferrule and in contact with the inner surface of the ferrule and the waveguide. The inorganic adhesive composition may include at least about 50% by weight of metal oxide.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: July 21, 2015
    Assignee: Corning Cable Systems LLC
    Inventors: Michael Edward DeRosa, Shawn Michael O'Malley, Vitor Marino Schneider
  • Publication number: 20150148452
    Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
    Type: Application
    Filed: February 15, 2013
    Publication date: May 28, 2015
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Su-Jin Park, Sook-Yeon Park, Yun-Ju Kim, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang
  • Publication number: 20150140337
    Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition, which in turn includes a polymeric material in a first weight percent, a non-metallic fibrous material in a second weight percent, and a metallic fiber material in a third weight percent and being intermixed with the non-metallic fibrous material. The polymeric material may include at least one of epoxy, vinyl ester, and/or polyester. The fibrous material may include at least one of glass fiber and carbon fiber. The metallic fiber material may include at least one of steel and aluminum.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Rick H. Wykoff, Mohammed Omar Faruque, Fubang Wu, Yijung Chen, Matthew John Zaluzec
  • Patent number: 9018282
    Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventor: Yoke Ai Gan
  • Publication number: 20150105497
    Abstract: An inorganic filler coated with molybdenum compound used as an additive is added into a resin mixture in an amount of 20 to 80 wt % of the resin mixture, resulted in that printed circuit boards if made from a laminate or a prepreg containing the resin mixture have properties of a low coefficient of thermal expansion, good heat tolerance and excellent drilling processability.
    Type: Application
    Filed: October 1, 2014
    Publication date: April 16, 2015
    Inventors: Dein-Run FUNG, Te-Chao LIAO, Hao-Sheng CHEN, Chun-Lai CHEN
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Patent number: 8987354
    Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 24, 2015
    Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
  • Publication number: 20150069877
    Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Takuya OTOWA, Hiroshi MORITA, Atsushi OHTAKE, Kinya KOBAYASHI, Keiji SUZUKI
  • Publication number: 20150069457
    Abstract: An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a polyester-based curing agent, wherein the epoxy resin comprises a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 12, 2015
    Inventors: Sungbae MOON, Jaehun JEONG, Mi Jin LEE, Soomin LEE, Yuwon LEE
  • Publication number: 20150065612
    Abstract: An electrical insulation body for a high-voltage rotary machine is provided. The electrical insulation body has a synthetic resin which is produced by reacting an epoxy with a hardener, and to which a filler component comprising particles is added, wherein the mass fraction of chlorine in the epoxy is less than 100 ppm.
    Type: Application
    Filed: February 1, 2013
    Publication date: March 5, 2015
    Applicant: Siemens Aktiengesellschaft
    Inventors: Peter Groppel, Christian Meichsner, Friedhelm Pohlmann
  • Patent number: 8963180
    Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: February 24, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Hidenori Onishi, Shinya Ota, Kazuhiro Fuke
  • Publication number: 20150051318
    Abstract: A roll cover is produced, in particular for use in a machine for producing and/or processing a fibrous web such as a web of paper or cardboard. The roll cover includes least one layer of a resin matrix that is filled with at least one particulate filler. The filler particles are produced in a polymer component of the resin matrix and/or introduced into the resin matrix from a dispersion via matrix exchange.
    Type: Application
    Filed: March 22, 2013
    Publication date: February 19, 2015
    Inventors: Franz Grohmann, Martin Breineder, Thomas Breineder
  • Publication number: 20150044475
    Abstract: The present invention includes an electrical steel sheet with an insulation coating having a large interlaminar insulation resistance when laminated; a coating material for forming the insulation coating that is used for the electrical steel sheet and the coating material for forming the insulation coating, which includes apart from a solvent an aqueous carboxy group-containing resin as component (A), an aluminum-containing oxide as component (B), and at least one crosslinking agent as component (C) selected from the group consisting of melamine, isocyanate and oxazoline. There are component (A); 100 parts by mass; 40 parts by mass<component (B)<150 parts by mass; 20 parts by mass<component (C)<100 parts by mass.
    Type: Application
    Filed: February 25, 2013
    Publication date: February 12, 2015
    Applicants: JFE STEEL CORPORATION, DAI NIPPON TORYO CO., LTD.
    Inventors: Nobuko Nakagawa, Tomofumi Shigekuni, Takahiro Kubota, Osamu Tanida
  • Patent number: 8946323
    Abstract: The present invention relates to an acidic aqueous particulate composition containing, in addition to iron(III) ions, fluoride ions and at least one water-insoluble, dispersed organic binder, a water-insoluble, dispersed oxide pigment with elevated resistance to agglomeration for the autophoretic deposition of organic-inorganic hybrid layers onto metal surfaces, the composition additionally containing at least one anionic wetting agent which comprises functional groups selected from sulfonates, phosphonates and/or carboxylates. The invention furthermore comprises the use of such a composition for the autodeposition of a film-forming organic-inorganic hybrid coating onto metal surfaces which are at least in part selected from surfaces, the main constituents of which are iron, zinc and/or aluminum.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: February 3, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventors: Ulrike Schmidt-Freytag, Ute Herrmann
  • Patent number: 8940827
    Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: January 27, 2015
    Assignee: Globe Composite Solutions, Ltd.
    Inventor: Xiujun Wang
  • Patent number: 8937115
    Abstract: An adhesive for filling gaps between stones, the adhesive including at least 100 weight parts of an unsaturated polyester resin suitable for air-drying, between 1 and 5 weight parts of hydrogenated castor oil, between 10 and 250 weight parts of a filler, and between 1 and 15 weight parts of an anti-shrinking agent. The adhesive has good permeability and shrinkage resistance, and high brightness after being polished.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: January 20, 2015
    Assignee: Wuhan Keda Marble Protective Materials Co., Ltd.
    Inventors: Kunwen Du, Ziqiang Xin, Kunwu Du
  • Patent number: 8921461
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: December 30, 2014
    Assignee: Sumitomo Bakelite Co., Ltd
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8916656
    Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 23, 2014
    Assignee: Marabu GmbH & Co., KG
    Inventors: Saskia Lehmann, Wolfgang Schaefer
  • Patent number: 8912254
    Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: December 16, 2014
    Assignee: Huntsman International LLC
    Inventor: Philippe Gottis
  • Publication number: 20140362494
    Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 11, 2014
    Inventors: Tao Cheng, Qilin Chen, Zhou Jin
  • Publication number: 20140356532
    Abstract: A coating material for an aluminum substrate for inkjet computer-to-plate and preparation method and use of same. The composition of the coating material is: high polymer 5-40 wt %; nano-sized and/or micro-sized oxide particles 5-30 wt %; organic solvent constituting the remainder. The high polymer is at least one selected from the group consisting of MMA-BMA-MA terpolymer resin, phenolic resin, epoxy resin, polyurethane, polyester, urea-formaldehyde resin, polyvinyl formal, polyvinyl butyral and gum arabic. The preparation method for obtaining the coating material is to mix the ingredients together and stir at room temperature. A spin coating method or a roll coating method is used to coat the coating material onto a clean aluminum substrate having not undergone electrolytic graining and anodic oxidation treatment, and then the substrate is baked, resulting in the required roughness.
    Type: Application
    Filed: July 12, 2012
    Publication date: December 4, 2014
    Inventors: Yanlin Song, Ming Yang, Haihua Zhou, Lianming Yang, Gang Li
  • Publication number: 20140349121
    Abstract: To provide a chromium-free paint composition which can provide paint films which are excellent in terms of corrosion resistance on the edge surfaces, scratched surfaces and worked parts of a pre-coated steel sheet, and the paint films which can be obtained by coating this chromium-free paint composition. A chromium-free paint composition which includes paint film-forming resin (A), anti-rust pigment (B), comprising at least one type of amorphous MgO—V2O5-based compound, and crosslinking agent (C) which is characterized in that the mass content proportion of the aforementioned anti-rust pigment (B) is from 10 to 80 mass % with respect to the sum of the resin solid fraction mass of the aforementioned paint film-forming resin (A) and the aforementioned crosslinking agent (C), and the overall eluted ion content in a 10% aqueous solution of the aforementioned anti-rust pigment (B) is from 10 ppm to 100 ppm.
    Type: Application
    Filed: December 4, 2012
    Publication date: November 27, 2014
    Applicant: BASF Coating GmbH
    Inventors: Takahiro Tsujita, Nobuhiro Nishida, Yoshitomo Takeuchi, Katsuhiko Ohsawa
  • Patent number: 8889761
    Abstract: A method for making a composite material with non-spherical reinforcing particles embedded in a matrix, is disclosed. In this method, in a first step magnetic and/or superparamagnetic nanoparticles are attached to the non-spherical reinforcing particles, in a second step the resulting reinforcing particles are introduced into a liquid matrix material and/or a liquid matrix-precursor material, and in a third step the material of the matrix is solidified and/or polymerized and/or cross-linked. In accordance with the proposed invention prior to and/or during solidification and/or polymerization and/or cross-linking of the matrix material or the matrix precursor material, respectively, a magnetic field is applied so as to align the reinforcing particles in the matrix and this alignment is fixed in the matrix during and after the third step, wherein the non-spherical reinforcing particles preferably have a length (l) in one dimension of at least 0.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: November 18, 2014
    Assignee: ETH Zurich
    Inventors: André Studart, Randall M. Erb, Rafael Libanori
  • Publication number: 20140329935
    Abstract: The invention provides a method for forming a TiO2-latex composite particle dispersion comprising combining an aqueous TiO2 dispersion with a latex manufactured with a phosphate-containing ethylenically unsaturated reactive surfactant. The dispersions have improved opacity or hiding.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 6, 2014
    Applicant: ETHOX CHEMICALS, LLC
    Inventors: Charles Francis Palmer, JR., Gerald Vandezande
  • Publication number: 20140329080
    Abstract: A highly structured composite material, which can be applied and cured as a protective layer on corroding metal substrates, particularly on steel is provided. Due to its highly structured composition it is a particularly effective barrier to protect metals against attack by corrosive sub-stances such as hydrogen sulfide, carbon dioxide and sea water, if necessary under hydrothermal conditions. At the same time it is also abrasion stable, for example against a grinding effect by sand, as well as resistant to the impact of mechanical load e.g. by tools. This is achieved by a coating composition comprising a binder comprising at least one cross-linkable resin, wherein the resin comprises at least one of polar group; at least one type of hydrophilic flakes with an aspect ratio of more than 10, wherein the surface of the flakes at least partially comprises a metal oxide; and an organic solvent.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 6, 2014
    Inventors: Carsten Becker-Willinger, Frank Hollmann, Marlon Jochum, Michael Opsoelder, Sabine Schmitz-Stoewe, Douglas Espin
  • Publication number: 20140323612
    Abstract: An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 ?m, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film.
    Type: Application
    Filed: July 2, 2014
    Publication date: October 30, 2014
    Inventor: Reiko Kubota
  • Publication number: 20140316033
    Abstract: The invention relates to an inorganic-organic hybrid material which comprises an inorganic component and an organic component, has a content of the inorganic component of 20-80% by mass, and has a refractive index of 1.60 or higher, wherein, when preparing a strip specimen having a thickness of 1,000 ?m, a width of 5 mm and a length of 70 mm by using the inorganic-organic hybrid material and winding the specimen by 180° on a cylindrical metal rod having a diameter of 10 mm at 25° C., the specimen does not crack.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Applicant: NIPPON KASEI CHEMICAL COMPANY LIMITED
    Inventors: Masanori YAMAZAKI, Takahiko Takewaki, Ritsuko Yamauchi, Yuuichi Katou, Atsushi Takaki
  • Publication number: 20140308489
    Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.
    Type: Application
    Filed: September 12, 2012
    Publication date: October 16, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Tetsuro Miyahira, Yoshihiro Kato, Takaaki Ogashiwa, Hiroshi Takahashi
  • Publication number: 20140307224
    Abstract: A coating composition includes a colloidal suspension of specific zirconia nano-particles, at least one epoxysilane and at least one catalyst. A method for preparing this composition, and its use for coating a transparent optical substrate, an optical article, such as an ophthalmic lens, including a transparent polymer substrate, especially an acrylic substrate, and a coating prepared from the composition, which is directly applied on the substrate, are also described.
    Type: Application
    Filed: December 27, 2012
    Publication date: October 16, 2014
    Applicant: ESSILOR INTERNATIONAL (COMPAGNIE GENERALE D'OPTIQUE)
    Inventors: Yves Leclaire, Stephanie Pega
  • Publication number: 20140299268
    Abstract: An adhesive bonding film comprises at least one layer of thermally curable resin. The thermally curable resin includes embedded metal particles adapted to be excited to produce heat for curing the resin.
    Type: Application
    Filed: April 9, 2013
    Publication date: October 9, 2014
    Applicant: THE BOEING COMPANY
    Inventor: THE BOEING COMPANY
  • Publication number: 20140296387
    Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.
    Type: Application
    Filed: January 24, 2013
    Publication date: October 2, 2014
    Inventors: Toshihiko Matsukura, Hiroyoshi Iijima, Masanari Shimakawa
  • Patent number: 8828519
    Abstract: A composition includes polymer and dispersed infrared-reflective clusters of titanium dioxide primary particles. The titanium dioxide primary particles are cemented together with precipitated silica and/or alumina to form clusters. The titanium dioxide primary particles have an average particle diameter in the range of from about 0.15 to about 0.35 micron, while the clusters of titanium dioxide primary particles have an average cluster diameter in the range of from about 0.38 to about 5 microns and a geometric standard deviation (GSD) in the range of from about 1.55 to about 2.5.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: September 9, 2014
    Assignee: Cristal USA Inc.
    Inventors: Fu-Chu Wen, Deborah E. Busch, Richard L. Fricker, Robert Provins, Brian David Kiessling, David Edwin Bell
  • Publication number: 20140231148
    Abstract: A composite including a dispersed phase of an inorganic material of a metal chalcogenide composition with a fullerene-like or tubular-like geometry that is present in a polymeric matrix, wherein the inorganic material of the metal chalcogenide has a molecular formula MX2, where M is a metallic element selected from the group consisting of titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), zinc (Zn), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), hafnium (Hf), tantalum (Ta), tungsten (W), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt), gold (Au), mercury (Hg) and combinations thereof, and X is a chalcogen element selected from the group consisting of sulfur (5), selenium (Se), tellurium (Te), oxygen (O) and combinations thereof.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 21, 2014
    Applicant: NANOTECH INDUSTRIAL SOLUTIONS, INC.
    Inventors: Eugene Kverel, Ronen Kreizman, George Diloyan, Alon Shapira
  • Patent number: 8809421
    Abstract: An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 ?m, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: August 19, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Reiko Kubota
  • Patent number: 8802776
    Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: August 12, 2014
    Assignee: Dexerials Corporation
    Inventors: Taichi Koyama, Hironobu Moriyama, Takashi Matsumura, Takayuki Saito
  • Patent number: 8795837
    Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: August 5, 2014
    Assignee: Diemat, Inc.
    Inventors: Terence L Hartman, Stavros Anagnostopoulos, Peter Crudele
  • Publication number: 20140203771
    Abstract: An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils. Further, the adhesive compound comprises a metal oxide. Compared with the conventional ferrite, the adhesive compound is flexible and not easy to crack or break during transportation or assembly, thereby greatly improving the charging efficiency of the electronic package.
    Type: Application
    Filed: August 6, 2013
    Publication date: July 24, 2014
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Tsung-Hsien Hsu, Hsin-Lung Chung, Te-Fang Chu, Chia-Yang Chen, Kwok-Yan Lam
  • Patent number: 8785525
    Abstract: There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: July 22, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hayato Kotani, Naoyuki Urasaki, Makoto Mizutani
  • Publication number: 20140187676
    Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.
    Type: Application
    Filed: March 17, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Lee, Boum Seock Kim, Eun Tae Park, Se Hoon Jeong
  • Publication number: 20140177194
    Abstract: A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.
    Type: Application
    Filed: December 26, 2012
    Publication date: June 26, 2014
    Inventors: Hitesh Arora, Mihir A. Oka, Chandra M. Jha
  • Patent number: 8748541
    Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: June 10, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenichi Mori, Syouichi Itoh
  • Publication number: 20140151605
    Abstract: A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications.
    Type: Application
    Filed: April 12, 2013
    Publication date: June 5, 2014
    Inventor: Xiujun Wang
  • Patent number: 8735469
    Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: May 27, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akihiro Sano, Atsushi Ohtake
  • Publication number: 20140121301
    Abstract: A composite material includes a polymer matrix material and filler material that includes vitreous china. The composite material has a water absorption of less than about one percent. Such a composite material may be used in the production of articles such as sinks, bathtubs, shower receptors, and other articles that may benefit from low water absorption properties.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 1, 2014
    Inventors: Mark W. Schibur, John A. Teubert
  • Patent number: 8697803
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: April 15, 2014
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: RE47418
    Abstract: One embodiment of the disclosure relates to an optical connector. The optical connector may include a ferrule, a waveguide, and an inorganic adhesive composition. The ferrule may include a fiber-receiving passage defining an inner surface. The inorganic adhesive composition may be disposed within the ferrule and in contact with the inner surface of the ferrule and the waveguide. The inorganic adhesive composition may include at least about 50% by weight of metal oxide.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: June 4, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Michael Edward DeRosa, Shawn Michael O'Malley, Vitor Marino Schneider