Abstract: A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include sericite powders. The sericite powders have composition of SiO2 in weight ratio of 55±3%. Furthermore, the Mohs' scale of hardness of the sericite powder is between 2 to 3. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: Underfill materials include inorganic fill materials (e.g., functionalized CNT's, organo clay, ZnO) that are functionalized reactive with other organic constituents (e.g., organics with epoxy groups, amine groups, or PMDA). The underfill materials also beneficially include polyhedral oligomeric silsesquioxane and/or dendritic siloxane groups that are functionalized with a reactive group (e.g., glycidyl) that reacts with other components of an epoxy system of the underfill.

Abstract: A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include inorganic mineral powders. The inorganic mineral powders have composition of SiO2 in weight ratio of 55±5% and a composition of aluminum compound in weight above 35%. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

Abstract: A plastic molding material contains at least one filler and a polymer resin, selected from the group made up of cyanate ester resins, epoxy novolac resins, multifunctional epoxy resins, bismaleimide resins and their mixtures. The proportion of filler in the plastic molding material is in the range of 65 to 92 wt. %, with reference to the overall mass of the plastic molding material.

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.

Abstract: An aluminum chelate latent curing agent includes an aluminum chelate curing agent, and a porous resin that holds the aluminum chelate curing agent and is obtained by subjecting a polyfunctional isocyanate compound to interfacial polymerization while simultaneously subjecting a polyfunctional radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator. In the aluminum chelate latent curing agent, a silanol compound of the formula (A) is further held in the porous resin. (Ar)mSi(OH)n??(A) In the formula, m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group.

Abstract: Disclosed are reduced density coating compositions and articles, such as aerospace vehicles, at least partially coated with an opaque coating deposited from such compositions. The reduced density coating compositions include low density microspheres comprising a core and a solid opacifying coating covering a surface of the core.

Abstract: The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m2/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition.

Abstract: Curable sol-gel composition useful for modifying the surface of a conventional electrical insulation system and providing said surface with an improved tracking and erosion resistance, wherein said sol-gel composition includes: (a) cyclo-aliphatic epoxy resin compound containing at least two 1,2-epoxy groups per molecule [component (a)]; (b) a glycidoxypropane-tri(C1-4)alkoxysilane [component (b)]; (c) a gamma-aminopropyl-tri(C1-4)alkoxysilane [component (c)]; (d) a mineral filler material [component (d)]; and (e) a hydrophobic compound [component (e)] or a mixture of such hydrophobic compounds being selected from fluorinated or chlorinated hydrocarbons or organopolysiloxanes.

Abstract: In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

Abstract: A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

Abstract: A resin composition is provided.

Abstract: Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: A simultaneous interpenetrating polymer network—geopolymer epoxy composition includes a first component comprised of a waterborne epoxy curing agent, an aluminosilicate source, and an amorphous silica, and a second component comprised of an epoxy resin and an alkaline silicate solution. The two components are mixed to produce a SIN-GE composition that cures at ambient temperatures. The SIN-GE composition may be a low-viscosity, sprayable composition, or may be a higher-viscosity composition. The compositions may be used as coatings, adhesives, mortars, casting materials, and the like.

Abstract: The present invention relates to coating compositions for metallic devices, especially for aircrafts, to provide protection against corrosion. The coating composition comprises ceramic particles having at least one active material substantially homogeneously distributed throughout each particle. The active material being releasable in the presence of a liquid by solubilization into the liquid.

Abstract: Polymer composite roofing materials are provided which contain resin, and about 20-75 wt. % fillers and additives, in which the fillers contain at least one bulk filler for reducing the amount of resin needed to make the roofing material, and at least one aesthetically functional filler for providing the roofing material with an aesthetic appearance. The bulk filler and the aesthetically functional filler of this embodiment are non-toxic, resistant to microbial attack, and have a Mohs hardness of less than about 5.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: Disclosed is a curable system comprising at least two compositions (A) and (B), a method for the manufacturing of a cured product as well as cured products obtainable by the method.

Abstract: A coating composition is provided, the starting materials of which comprise nano SiO2, film-forming substance, film-forming aid, accelerator, acid, and water. The composition has pH of 3-9. A passivated zinc-plated material is also provided. The zinc-plated material comprises zinc-plated substrate and passivated coat adhered to the surface of the zinc-plated substrate, wherein the passivated coat is formed by curing the coating composition. The coating composition can impart to the zinc-plated material excellent corrosion resistance, water resistance, high temperature resistance, surface conductivity, and adhesion to the zinc-plated substrate. Additionally, the coating composition contains no Cr6+, and satisfies the requirement of EU RoHS Directive.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: An epoxy resin composition has a glass transition temperature between 20° C. and 75° C. The epoxy resin composition includes an epoxy resin, a plurality of water vapor-proof particles, and at least two kinds of amino-functional curing agents. One of the amino-functional curing agents is a polyamine-type curing agent. The weight percent of the curing agent corresponding to the epoxy resin is between 10% and 95%.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).

Abstract: A method for preparing a filler composition useful for preparing a nanocomposite polymer is provided. The method includes a first step of dispersing a water dispersible filler material in a liquid comprising water to form a dispersion and a second step of replacing at least a portion of the water of the liquid with an organic solvent. The resulting filler composition features a water concentration of the liquid of less than six percent by weight, and the average size of at least one dimension of the filler material is less than two hundred nanometers upon examination by transmission electron microscopy of a representative freeze dried sample of the dispersion of the first step. A nanocomposite polymer, particularly and epoxy resin composition, can be prepared by mixing the above-made filler composition with one or more polymer, polymer component, monomer or prepolymer.

Abstract: Curable epoxy resin composition including an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) the curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, prior to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) the mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.

Abstract: Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.

Abstract: Curable epoxy resin compositions, cured epoxy resin compositions, and processes of forming the same, including at least one epoxy resin, at least one sterically hindered amine curing agent and at least one non-sterically hindered amine curing agent which provides toughness properties to the curable composition and resultant cured product made from the curable composition.

Abstract: A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.

Abstract: There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid composition including an epoxy resin composition containing alicyclic epoxy compound and a curing agent and curing a glass filler together, the alicyclic epoxy compound contains, as a principal component thereof, a diepoxybicyclohexyl compound represented by Formula (1) below, with amounts of isomers of the diepoxybicyclohexyl compound being 20% or less, of a sum of the diepoxybicyclohexyl compound and the isomers, in terms of a ratio of its peak area determined by a gas chromatography.

Abstract: A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R1 and R2 each represents a hydrogen atom or an alkyl group.

Abstract: A corrosion inhibiting structure includes a mineral tubule having a first end, a second end, and a lumen extending from the first end to the second end. The lumen terminates in a first opening at the first end and a second opening at the second end. The corrosion inhibiting structure also includes an anticorrosion deposit disposed within the lumen, and first and second precipitate stoppers covering the first and second openings, respectively. A coating composition includes a population of corrosion inhibiting structures and a coating material. A method of inhibiting corrosion includes loading anticorrosion agent deposits into lumens, forming stoppers at first and second openings by mixing loaded mineral tubules with a solution containing a predetermined concentration of transition metal ions, mixing the loaded mineral tubules having stoppers with a coating material to form a composite material, and applying the composite material to a metal surface.

Abstract: The present invention relates to an epoxy resin composition for optical use including the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler including (c1) an inorganic filler having a refractive index larger than a refractive index of a cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler and (c2) an inorganic filler having a refractive index smaller than the refractive index of the cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler.

Abstract: Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low. Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition. The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 [mu]m or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less. Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800 DEG C.

Abstract: Suspensions having good flow properties are produced by including a particulate thickener containing chemically or physically bound polymer.

Abstract: Fire retardant or flame retardant additives are incorporated into thermoplastic, thermoset, and/or elastomeric polymer materials to form polymer compositions having improved fire retardant properties. More particularly, the polymer compositions of the present invention comprise additive compositions which have the effect of improving the FR effectiveness, the additive compositions comprising a mesoporous silicate additive. In addition, the polymer compositions of the present invention comprise additive compositions comprising a mesoporous silicate additive and a filler, wherein the filler is a flame retardant addition, an inert filler, or combinations thereof.

Abstract: A process for producing a composition of a polymerizable organic compound containing silica particles characterized by comprising: (a) a process of preparing an amine-added organic solvent-dispersed silica sol, in which an amine compound is added to an organic solvent-dispersed silica sol that contains colloidal silica particles having an average primary particle size of 5 to 100 nm and that has a pH of 2.5 to 4.0 at 20° C. as measured in a diluted solution obtained by a method in which the same mass of the organic solvent-dispersed silica sol, methanol, and pure water are mixed together, so that the diluted solution obtained by the mixing method has a pH of 4.5 to 11.0 at 20° C.; and (b) a process of mixing the amine-added organic solvent-dispersed silica sol obtained in the process (a) with a polymerizable organic compound.

Abstract: An insulating material and the method of applying the insulating material to products and systems. The material, method and system may be applied to tubulars used in deep water projects. The insulating material is composed of ceramic particles, epoxy and an acrylate monomer that is a precurser to an acrylic resin, and additives. Equal volumes of a epoxy component mixtures and a curing agent component mixture when heated and mixed together create a liquid insulating material that can be applied to the outer surface of pipe involving a repetitive series of steps controlled by an operator at a main control panel. Pipe unrolled from a pipe reel is straightened and heated. In a heated retort, liquid insulating material is applied to the surface of pipe and cured to the final insulation coating. The final coated pipe can be replaced on the reel for shipment to the job site.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including an amino-triazine-novolac resin and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: Curable adhesive compositions comprising i. a curable epoxy resin ii. an amine curing agent, iii. a polymeric toughening agent, iv. a filler and v. a phosphoric acid ester according to the formula as an adhesion promoter, wherein R represents an aliphatic or aromatic residue that contains one or more carboxylic acid ester units and/or one or more urethane units and that further contains at least one ether group and n represents an integer of 1 or 2, methods of making them, bonded articles and methods for bonding.

Abstract: Provided are nanomaterial-reinforced resin compositions and related methods. The compositions include a reinforcing material, such as graphene, polyamic acid, carbon nanotubes, or dimethylacetamide that is dispersed into a resin. The reinforcing material is present in the resin at from about 0.001 to about 10 wt %. Also provided are methods of fabricating these compositions and methods of tailoring a composition to achieve a particular set of mechanical properties.

Abstract: The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 ?m; that observed for the second peak falls within the range of from 2 to 7 ?m; the content of the particles having a particle size of greater than 7 ?m and less than 12 ?m is not more than 18% (including 0%); and wherein the ratio (F2/F1) of the frequency value F2 of the maximum particle size for the second peak to that F1 of the maximum particle size for the first peak ranges from 0.5 to 1.3.

Abstract: A glass fiber and a method of manufacturing a glass fiber for reinforcing a transparent composite matrix is disclosed. The glass fiber includes a first glass material having a first refractive index, a first modulus, and a first durability characteristic and a second glass material having a second refractive index, a second modulus, and second durability characteristic. The second durability characteristic is greater than the first durability characteristic. Durability characteristic is selected from the group comprising resistance to chemical attack, resistance to acid attack, resistance to fading from exposure to ultra-violet radiation, and resistance to mechanical abrasion.

Abstract: A glass fiber and a method of manufacturing a glass fiber for reinforcing a transparent composite matrix are disclosed. The glass fiber includes a first glass material having a first set of mechanical properties including a first modulus and a first coefficient of thermal expansion (CTE) and a second glass material having a second set of mechanical properties including a second modulus and a second CTE. The second glass material forms a substantially uniform coating on the first glass material. The second CTE is less than the first CTE. The glass fiber is formed by reducing the cross-section of a glass fiber preform of the first glass material coated with the second glass material by hot working. Because of the selected difference in the CTE's, the first glass material imparts a compressive force upon the second glass material, which improves the strength of the glass fiber.

Abstract: Provided is: a semi-cured body capable of reducing the surface roughness of a roughening-treated surface, and, when a metal layer is formed on the surface of a cured body after curing, increasing the adhesive strength between the cured body and the metal layer; and a laminated body obtained by using the semi-cured body. A semi-cured body 1 is formed by performing a roughening treatment on a reactant obtained by reacting a resin composition which includes an epoxy resin, a curing agent, and a silica component in which silica particles with a mean particle diameter equal to or less than 1 ?m are surface treated with a sane coupling agent, such that the reactant has a gel fraction equal to or higher than 90% after being immersed in methyl ethyl ketone for 24 hours at 23° C. A laminated body comprises a cured body obtained by curing the semi-cured body 1, and a metal layer formed by having a plate processing performed on the surface of the cured body.

Abstract: The present invention relates to a resin composition for electronic component encapsulation including: A: a cyanate ester resin; B: at least one selected from the group consisting of a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler.