Boron Atom Dnrm Patents (Class 524/404)
  • Publication number: 20030139510
    Abstract: A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
    Type: Application
    Filed: November 13, 2002
    Publication date: July 24, 2003
    Inventors: E. Mikhail Sagal, Kevin McCullough, James D. Miller
  • Publication number: 20030139504
    Abstract: Disclosed are flame retardant resinous compositions comprising (i) at least one aromatic polycarbonate, (ii) at least one silicone source, (iii) at least one boron source, and (iv) optionally at least one member selected from the group consisting of an antidrip agent, a second thermoplastic resin which is not a polycarbonate resin, and a rubber modified graft copolymer. Also disclosed are methods for making said compositions.
    Type: Application
    Filed: November 12, 2001
    Publication date: July 24, 2003
    Applicant: General Electric Company
    Inventors: Thomas Miebach, John Robert Campbell, Monica Marugan, Thomas Arnold Ebeling
  • Patent number: 6597575
    Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: July 22, 2003
    Assignee: Intel Corporation
    Inventors: James C. Matayabas, Jr., Paul Koning, Jinlin Wang
  • Publication number: 20030134935
    Abstract: The present invention is a composition comprised of an adhesive with particulate inclusions disposed within or along the adhesive. Adhesive/ceramic composition forms a thin, anti-skid layer along a wear surface. In preferred embodiments, adhesive is a self-leveling liquid hardening to form a flexible, compressible layer along a surface. Particulate is irregular-shaped or uniform-shaped ceramic particles. In alternate embodiments, composition is aerosolizable, thereby dispensable from a pressurized container.
    Type: Application
    Filed: April 26, 2002
    Publication date: July 17, 2003
    Inventor: David C. Schirmer
  • Patent number: 6592997
    Abstract: A polydiorganosiloxane with a polar radical with a dipole moment greater than 2 debye provides a polydiorganosiloxane with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise. Further embodiments of the present invention include a silicone composition, a method for substantially increasing the thermal conductivity of a silicone composition, and a thermal interface material containing a silicone composition wherein the silicone composition includes the aforementioned polydiorganosiloxane.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 15, 2003
    Assignee: General Electric Company
    Inventors: Larry Neil Lewis, Steven Kenneth Gifford
  • Publication number: 20030111776
    Abstract: The present invention provides a composition of reinforced polyamide (PA) for use in a cooling circuit of an engine. The composition may be processed by a gas injection technique (GIT) into shaped parts having smooth inner surfaces and a good hydrolytic stability against cooling medium such as glycol/water mixtures.
    Type: Application
    Filed: November 18, 2002
    Publication date: June 19, 2003
    Inventors: Detlev Joachimi, Roland Sauer
  • Patent number: 6576694
    Abstract: The present invention provides blends comprising 30-70 parts by weight of poly(3-hydroxyalkanoate) (PHA) resin, 70-30 parts by weight of higher molecular weight carbon dioxide-propylene oxide copolymers (PPC) with over 98% alternating copolymer structure, 1-10 parts by weight of talcum powder, 0.2-3 parts by weight of boron nitride, and 0.1-2 parts by weight antioxidant(s), where the sum of parts of PHA and PPC is 100 parts by weight. The present invention also provides for a method of preparing the blends, which may comprise the step of extrusion and pelletization in a conventional twin-screw extruder. The melt mass in the twin-screw extruder is kept in the range of 175° C.-185° C. The blends can be used in extrusion of plates and sheets, preparation of films and in injection molding. These fabricated articles possess biodegradable property, good mechanical properties, good printing property, good barrier property and sealing property.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: June 10, 2003
    Assignee: Changchun Institute of Applied Chemistry Chinese Academy of Science
    Inventors: Jingjiang Liu, Chunrong Sun
  • Patent number: 6569794
    Abstract: Compositions for use as thermal insulation or barriers in articles that are required to function under transient elevated temperature conditions, such as are experienced during a fire. Articles in which compositions according to the invention may be used include electrical and optical cables which have fire resistant properties, electrical fittings such as terminals and cable clips, and void-filling compounds which are required to act as fire barriers. The invention provides a composition that is ductile or flexible at the elevated temperatures experienced during a fire and retains integrity so as to stay in place throughout the fire enabling it to continue to function as a thermal barrier.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: May 27, 2003
    Assignee: Draka U.K. Limited
    Inventors: Gregor Joseph Reid, Lawrence Stanley Letch, Hazel Jennifer Rickman
  • Patent number: 6565938
    Abstract: A resin composition comprising a saponified ethylene-vinyl acetate copolymer (A), a polyamide resin having a melting point not exceeding 160° C. (B), and a small proportion of a boron compound (C) and a laminate comprising a multi-lamellar shaped article comprised of the above resin composition layer (X) and a thermoplastic resin layer (Y).
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: May 20, 2003
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masahiko Toyosumi, Kenji Ninomiya
  • Patent number: 6558794
    Abstract: Material compositions for use in orthopedic implants comprising blends of ultra high molecular weight polyethylene (UHMWPE) and hard ceramic powders prepared by blending powdered UHMWPE and the ceramic powder in a high shear mixer are described. Orthopedic implants are then fabricated by pressure/thermo-forming the ceramic/polymer blend into a net shape prosthesis or a rod suitable for subsequently machining the desired components using diamond tooling. Net shape forming is the preferred method for preparing the orthopedic implants.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: May 6, 2003
    Assignee: Technology Assessment & Transfer, Inc.
    Inventors: Larry Lee Fehrenbacher, Mark Patterson, Walter Zimbeck
  • Publication number: 20030073769
    Abstract: The present invention relates to a method for making a hexagonal boron nitride slurry and the resulting slurry. The method involves mixing from about 0.5 wt. % to about 5 wt. % surfactant with about 30 wt. % to about 50 wt. % hexagonal boron nitride powder in a medium under conditions effective to produce a hexagonal boron nitride slurry. The present invention also relates to a method for making a spherical boron nitride powder and a method for making a hexagonal boron nitride paste using a hexagonal boron nitride slurry. Another aspect of the present invention relates to a hexagonal boron nitride paste including from about 60 wt. % to about 80 wt. % solid hexagonal boron nitride. Yet another aspect of the present invention relates to a spherical boron nitride powder, a polymer blend including a polymer and the spherical hexagonal boron nitride powder, and a system including such a polymer blend.
    Type: Application
    Filed: August 7, 2001
    Publication date: April 17, 2003
    Inventors: Vimal K. Pujari, William T. Collins, Jeffrey J. Kutsch
  • Publication number: 20030073770
    Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
    Type: Application
    Filed: July 29, 2002
    Publication date: April 17, 2003
    Inventors: Philip T Klemarczyk, Andrew D Messana, Afranio Torres-Filho, Erik K Yaeger, Takahisa Doba
  • Publication number: 20030069332
    Abstract: The invention relates to an elastomer/reinforcing filler composite in which said elastomer contains a dispersion therein of said reinforcing filler wherein said composite is prepared by forming said filler reinforcement in situ within the elastomer host. Such in-situ formation of reinforcement filler is created by a condensation reaction of a filler precursor within a solvent solution of a diene hydrocarbon based elastomer and with the aid of a phase transfer agent and a condensation reaction promoter. The invention further relates to a tire having at least one component comprised of the resulting elastomer/filler composite. The invention includes a rubber composition of at least two elastomers wherein one of said elastomers is a said pre-formed composite of said elastomer/filler reinforcement. A tire having a component of such rubber composition, particularly a tire tread, is specifically contemplated.
    Type: Application
    Filed: August 29, 2002
    Publication date: April 10, 2003
    Inventors: Giorgio Agostini, Thierry Florent Edme Materne, Robert Jerome, Cedric Calberg
  • Patent number: 6541564
    Abstract: In a process for the metal-catalyzed preparation of copolymers of carbon monoxide and an olefinically unsaturated compound having from 2 to 20 carbon atoms in an aqueous medium, the copolymerization is carried out in the presence of a water-soluble macromolecular host compound which has a hydrophobic cavity and a hydrophilic shell.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: April 1, 2003
    Assignee: BASF Aktiengesellschaft
    Inventors: Markus Schmid, Reinhold J. Leyrer, Mubarik Mahmood Chowdhry, Marc Oliver Kristen
  • Patent number: 6541555
    Abstract: High density, low epsilon ballast materials are disclosed. The materials comprise dielectric ceramic particles in a polymeric matrix. The composite material possesses higher density/dielectric ratios in comparison with conventional ballast materials.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: April 1, 2003
    Assignee: Lockheed Martin Corporation
    Inventor: Kirk T. Roetcisoender
  • Patent number: 6538064
    Abstract: In the present invention, particles of an ethylene-vinyl alcohol copolymer (EVOH) are contacted with a solution containing a boron compound, whereby to obtain a substantially homogeneous distribution of the boron compound within the particles. For example, EVOH and the solution are continuously fed into a treatment apparatus and brought into contact with each other in the treatment apparatus, and the EVOH when continuously removed from the apparatus is in contact with the solution containing the boron compound in a concentration of at least 0.7 times but not more than 1.3 times a solution equilibrium concentration.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: March 25, 2003
    Assignee: Kuraray Co., Ltd.
    Inventors: Takaharu Kawahara, Toshio Tuboi, Tetsuya Hikasa, Naoyuki Himi
  • Publication number: 20030055138
    Abstract: A resin composition useful for wire and cable covering material is formed by compounding a phosphate ester retardant, boron phosphate, and zinc borate hydrate with a polyphenylene ether group resin or a combination of a polyphenylene ether group resin and an aromatic vinyl group resin, in a specific ratio.
    Type: Application
    Filed: June 28, 2002
    Publication date: March 20, 2003
    Inventors: Ming Yin, Takuro Kitamura, Atsuo Oshiro, Kenichi Ishiwa, Kazunari Kosaka, Hiroshi Kubo
  • Patent number: 6531529
    Abstract: This invention is a flame-retardant, anti-dripping polyamide composition comprising a high temperature polyphthalamide, a halogen-containing organic compound, and an anti-drip effective amount of an anti-drip component comprising a polymer formed from at least one ethylenically unsaturated monomer and at least one carboxylic acid containing monomer.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: March 11, 2003
    Assignee: Solvay Advanced Polymers, L.L.C.
    Inventors: Bruce H. Bersted, Mark G. Reichmann
  • Publication number: 20030040563
    Abstract: This invention relates to a thermally conductive molding composition having a thermal conductivity greater than 3 W/m° K. The composition consists essentially of: a) 30% to 60% of a polymer matrix; b) 25% to 60% of boron nitride; and c) 25% to 60% of alumina. The boron nitride and alumina are dispersed throughout the polymer matrix. The composition can be molded or cast into a variety of articles such as packaging materials for semiconductor devices.
    Type: Application
    Filed: August 22, 2002
    Publication date: February 27, 2003
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James Miller
  • Patent number: 6524694
    Abstract: The invention provides compositions and methods for imparting a translucent optical effect to transparent thermoplastic polymers. The compositions comprise the thermoplastic polymer and 0.01 to 15 parts per hundred by weight (preferably 0.1 to 6, more preferably 0.2 to 5 parts by weight, even more preferably 0.5 to 2 parts by weight, and most preferably 0.5 to 1.5 parts by weight) of at least one particulate, light diffusing material in the form of powders, fibers, whiskers, platelets, flakes, aggregates, agglomerates, and mixtures of these, comprising a average maximum particle size of from about 0.1 microns to about 200 microns (preferably from about 1 to about 100 microns). A first embodiment of the invention comprises a one step method for imparting the translucent optical effect. A second embodiment comprises a two step method, including the use of a concentrate composition.
    Type: Grant
    Filed: January 11, 2000
    Date of Patent: February 25, 2003
    Assignee: PolyOne Corporation
    Inventor: Tracy L. Phillips
  • Publication number: 20030027910
    Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.
    Type: Application
    Filed: September 5, 2001
    Publication date: February 6, 2003
    Applicant: The Bergquist Company
    Inventors: Sanjay Misra, Gm Fazley Elahee
  • Patent number: 6515061
    Abstract: A paste composition having a high thermal conductivity and a relatively low viscosity is used to provide a thermal conductive connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The paste composition comprises a non-aqueous dielectric carrier, thermally conductive filler particles and a specially defined dispersant comprising the self-condensation reaction product of a hydroxy fatty acid, the reaction product having an acid number of about 30-100. A 12-hydroxy stearic acid self condensed reaction product is the preferred dispersant.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: February 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, Keith Scott Olsen, Krishna Gandhi Sachdev
  • Publication number: 20030013794
    Abstract: According to the present invention, there provided a wet-type compacting method of powder using a solvent, wherein homogeneity of a compact is kept while generating no problem during each process and excellent plasticity and/or strength are applied to the compact, and if a sintering process follows a compacting process, sintering characteristics are improved.
    Type: Application
    Filed: June 4, 2002
    Publication date: January 16, 2003
    Inventors: Akio Matsumoto, Akira Kawakami, Tatsuya Goto
  • Publication number: 20030008961
    Abstract: There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.
    Type: Application
    Filed: March 5, 2001
    Publication date: January 9, 2003
    Inventor: Takao Uematsu
  • Patent number: 6492449
    Abstract: The present invention concerns polymers obtained by anionic initiation and bearing functions that can be activated by cationic initiations that are not reactive in the presence of anionic polymerization initiators. The presence of such cationic initiation functions allow an efficient cross-linking of the polymer after moulding, particularly in the form of a thin film. It is thus possible to obtain polymers with well-defined properties in terms of molecular weight and cross-linking density. The polymers of the present invention are capable of dissolving ionic compounds inducing a conductivity for the preparation of solid electrolytes.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: December 10, 2002
    Assignee: Hydro-Quebec
    Inventors: Christophe Michot, Alain Vallée, Paul-Étienne Harvey, Michel Gauthier, Michel Armand
  • Publication number: 20020165304
    Abstract: Method and apparatus for producing objects from fibrous monolith composites are provided. Two- and three-dimensional objects can be prepared from a continuous fibrous monolith filament. The objects can have complex geometries.
    Type: Application
    Filed: December 4, 2001
    Publication date: November 7, 2002
    Inventors: Anthony C. Mulligan, Mark J. Rigali, Manish P. Sutaria, Gregory J. Artz, Felix H. Gafner, K. Ranji Vaidyanathan
  • Patent number: 6469086
    Abstract: An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: October 22, 2002
    Assignee: Infineon Technologies AG
    Inventors: Achim Neu, Alexandra Atzesdorfer, Thies Janczek
  • Patent number: 6469085
    Abstract: A cooling agent including a metal salt aqueous solution and a nonionic polymer as an agent for extending cooling duration, wherein the nonionic polymer has a group with an affinity due to interaction with a water molecule, and is free of an ionic group ionically bound to a metallic ion in the aqueous solution, a cooling pack in which the cooling agent is charged into a pack made of a resin, and a cooling box in which the cooling pack is placed in a cooling box made of a resin foam. The cooling agent, the cooling pack and the cooling box provide long-term cooling duration, and are suited for long-term cooled transportation, cooled storage and cooled display.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: October 22, 2002
    Inventor: Koji Mizutani
  • Publication number: 20020132896
    Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition.
    Type: Application
    Filed: January 14, 2002
    Publication date: September 19, 2002
    Inventor: My Nguyen
  • Patent number: 6444739
    Abstract: The polyamide resin composition comprises a copolyamide resin, a nucleating agent for crystallization, and optionally an inorganic filler. The copolyamide resin is produced by polycondensing a carboxylic acid component mainly comprising adipic acid with a diamine component containing trans-1,4-bis(aminomethyl)cyclohexane, cis- 1,4-bis(aminomethyl)cyclohexane, and optionally another diamine. The nucleating agent for crystallization is selected from an organic nucleating agent and an inorganic nucleating agent. The polyamide resin composition exhibits a good molding cycle and provides a shaped article excellent in the retention of rigidity at a high temperature condition, the durability under a high temperature condition, and the retention of mechanical properties after water-absorption. Therefore, the polyamide resin composition is useful as a metal replacement in various applications such as automobile parts, mechanical parts and electric or electronic parts.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: September 3, 2002
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Koji Yamamoto, Takeo Hayashi, Takahiro Takano
  • Patent number: 6423773
    Abstract: Polymer coating composition for a plastics substrate including a polymeric binder and an inert filler. The composition also includes polyamide epichlorohydrin and an ionic insolubilizing agent that is capable of reacting with the binder to render the binder insoluble in water.
    Type: Grant
    Filed: May 19, 2000
    Date of Patent: July 23, 2002
    Assignee: Arjobex Limited
    Inventor: John Victor Shepherd
  • Patent number: 6420463
    Abstract: Hindered amines substituted on the N-atom with an -O-E-OH moiety are particularly effective in stabilizing polyolefin and automotive coating compositions against the deleterious effects of oxidative, thermal and actinic radiation where the presence of the OH group on the compounds adds important properties not attainable by the use of normal -O-E moieties.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: July 16, 2002
    Assignee: Ciba Specialty Chemicals Corp.
    Inventors: James P. Galbo, Gerald A. Capocci, Nancy N. Cliff, Robert E. Detlefsen, Michael P. DiFazio, Ramanathan Ravichandran, Peter Solera
  • Publication number: 20020086926
    Abstract: A polyvinyl butyral composition is disclosed which is comprised of polyvinyl butyral resin containing an IR absorbing effective amount of lanthanum hexaboride or a mixture of lanthanum hexaboride and at least one of tin oxide and antimony tin oxide. Also disclosed are a sheet of the IR absorbing polyvinyl butyral and a glass laminate having the IR absorbing polyvinyl butyral sheet disposed between two sheets of glass.
    Type: Application
    Filed: November 14, 2001
    Publication date: July 4, 2002
    Inventor: W. Keith Fisher
  • Publication number: 20020086927
    Abstract: A flame retardant molding composition which comprises a blend formed from at least the following components: (A) a thermoplastic polyamide or thermoplastic polyester polymer (B) at least one organic halogen-containing flame retardant, (C) a zinc borate, a mixed oxide of zinc and boron, or zinc sulfide, or a mixture of any two or more of the foregoing; and (D) an olefin-based polymer. The composition produces molded articles which exhibit increased comparative tracking index ratings.
    Type: Application
    Filed: January 23, 2002
    Publication date: July 4, 2002
    Inventors: Daniel A. De Schryver, Dominique Fasbinder
  • Patent number: 6414064
    Abstract: The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin (A) having dicarboxylic acid units (a) comprising from 60 to 100 mol % of terephthalic acid repeat units and diamine units (b) comprising from 60 to 100 mol % of C6-18 aliphatic alkylenediamine repeat units, and from 1 to 100 parts by weight of a polybromostyrene (B), comprising from 0.5 to 100% by weight of a polybromostyrene having an epoxy group. Molded articles prepared from the polyamide resin composition of the present invention have good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 2, 2002
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideharu Matsuoka, Hideaki Oka, Shigeru Sasaki
  • Patent number: 6410642
    Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: June 25, 2002
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Kimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
  • Patent number: 6403681
    Abstract: Hindered amines substituted on the N-atom with an —O—E—OH moiety are particularly effective in stabilizing polyolefin and automotive coating compositions against the deleterious effects of oxidative, thermal and actinic radiation where the presence of the OH group on the compounds adds important properties not attainable by the use of normal —O—E moieties.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: June 11, 2002
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: James P. Galbo, Gerald A. Capocci, Nancy N. Cliff, Robert E. Detlefsen, Michael P. DiFazio, Ramanathan Ravichandran, Peter Solera
  • Patent number: 6399209
    Abstract: A thermally conductive conformable interface pad for inter-position between a heat generating solid state electronic device and a heat sinking surface. The interface comprises a laminate of at least two layers, including a relatively soft conformable body layer with at least one surface consisting of an integrally bonded anti-blocking layer. The conformable body layer preferably comprises a thermally stable wax consisting of an alkyl substituted poly (hydro, methyl-siloxane) wax and a thermally conductive particulate solid, while the anti-blocking layer may comprise a mixture of an alkyl substituted poly (hydro, methyl-siloxane) wax and a silicone wax, a glassy polyester layer, or a cross-linked acrylic layer.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: June 4, 2002
    Assignee: The Bergquist Company
    Inventors: Sanjay Misra, Robert E. Kranz, Radesh Jewram
  • Patent number: 6391949
    Abstract: Hindered amines substituted on the N-atom with an —O—E—OH moiety are particularly effective in stabilizing polyolefin and automotive coating compositions against the deleterious effects of oxidative, thermal and actinic radiation where the presence of the OH group on the compounds adds important properties not attainable by the use of normal —O—E moieties.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: May 21, 2002
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: James P. Galbo, Gerald A. Capocci, Nancy N. Cliff, Robert E. Detlefsen, Michael P. DiFazio, Ramanathan Ravichandran, Peter Solera
  • Patent number: 6391951
    Abstract: The invention provides a copolymer of propylene and pentene, together with a process for producing such copolymer and a polymer composition. In the process, propylene and pentene are reacted in a reaction zone at a pressure of 60 kg/cm2 and temperature of 0-100° C. for 20-480 minutes in the presence of a Ziegler-Natta catalyst or catalyst system. The polymer composition has several components, namely the above copolymer, a phenolic stabilizer, an organic phosphite stabilizer, a thioether stabilizer and at least one metal salt of a higher aliphatic acid, with the proviso that at least one of the organic phosphite stabilizer, the thioether stabilizer and said salt must be present, so that up to two thereof can optionally be omitted.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: May 21, 2002
    Assignee: Sasol Technology (Proprietary) Limited
    Inventors: Dawid Johannes Joubert, Antonie Hermanus Potgieter, Ignatius Hendrik Potgieter, Ioan Tincul
  • Publication number: 20020058736
    Abstract: A polymer composition formed by:
    Type: Application
    Filed: September 26, 2001
    Publication date: May 16, 2002
    Applicant: AUSIMONT S.p.A.
    Inventors: Mikhail Zolotnitsky, Julio A. Abusleme
  • Patent number: 6380320
    Abstract: There is provided a process for improving the color of anhydride-grafted polymers. The process includes the steps of admixing in an extruder a polyolefin, a free radical initiator, and an anhydride-providing monomer at a temperature above the melting point of the polyolefin, adding an effective amount of an oxo-boron compound to the admixture; and extruding the resultant anhydride-grafted polymer into a shaped article.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: April 30, 2002
    Assignee: DuPont Canada Inc.
    Inventor: Chun Sing Wong
  • Patent number: 6376584
    Abstract: Hindered amines substituted on the N-atom with an hydroxy-substituted alkoxy moiety are particularly effective in stabilizing organic polymer compositions against the deleterious effects of oxidative, thermal and actinic radiation where the presence of the OH group on the compounds adds important properties not otherwise attainable.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: April 23, 2002
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: James Peter Galbo, Gerald A. Capocci, Nancy N. Cliff, Robert E. Detlefsen, Michael P. DiFazio, Ramanathan Ravichandran, Peter Solera, Christophe Bulliard
  • Publication number: 20020037952
    Abstract: To obtain a coating material with which high temperature resistant sealing elements can be made, particularly in the form of coatings on metal surfaces, it is proposed that the coating material should comprise a film-forming binding agent, a solvent for it and a high temperature resistant solid lubricant.
    Type: Application
    Filed: June 25, 2001
    Publication date: March 28, 2002
    Inventor: Hans-Rainer Zerfass
  • Patent number: 6361738
    Abstract: The method of producing an R—Fe—B magnet of the present invention is characterized in that R—Fe—B alloy fine powder is molded in a magnetic field and sintered using a lubricant for molding magnets containing specific components, individually or as a mixture, of specific amounts of methyl caproate and/or methyl caprylate, which provide high crystal orientation, and lubricant comprising depolymerized polymer for improving molded article strength, or a lubricant for molding magnets wherein Ti coupling agent that improves crystal orientation is added to this lubricant for molding magnets. Each particle of the fine powder has a high degree of crystal orientation in the direction of the magnetic field, and molded article strength is markedly improved, leading to improved mass-productivity and yield. Moreover, the above-mentioned lubricants do not react with this magnet powder during sintering and are emitted as a gas.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: March 26, 2002
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Yuji Kaneko, Junichiro Baba, Kazuo Tanaka, Shizuo Mori
  • Publication number: 20020035184
    Abstract: A method for reducing degradation during processing of polymers. An effective amount of a foam cell nucleating agent to reduce degradation in a polymer is added to the polymer. The polymer and the foam cell nucleating agent are mixed to obtain a molten plastic and processed to obtain an unfoamed product, resulting in a reduction of degradation in the unfoamed product. The processing is preferably selected from extrusion and injection molding.
    Type: Application
    Filed: May 17, 2001
    Publication date: March 21, 2002
    Inventors: Deborah E. Plaver, Michael L. Mounts, Patrick M. Russell, Albert H. Case, Michael W. Potts
  • Publication number: 20020035185
    Abstract: In the present invention, particles of an ethylene-vinyl alcohol copolymer (EVOH) are contacted with a solution containing a boron compound, whereby to obtain a substantially homogeneous distribution of the boron compound within the particles. For example, EVOH and the solution are continuously fed into a treatment apparatus and brought into contact with each other in the treatment apparatus, and the EVOH when continuously removed from the apparatus is in contact with the solution containing the boron compound in a concentration of at least 0.7 times but not more than 1.3 times a solution equilibrium concentration.
    Type: Application
    Filed: June 6, 2001
    Publication date: March 21, 2002
    Applicant: KURARAY CO., LTD.
    Inventors: Takaharu Kawahara, Toshio Tuboi, Tetsuya Hikasa, Naoyuki Himi
  • Patent number: 6353039
    Abstract: A composite material is described which contains polymerizable monomers plus a special transparent glass having high release of calcium ions and fluorine ions and, because of this release property and in particular of its optical properties, can be used as a restoration material in dentistry.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: March 5, 2002
    Assignee: Ivoclar AG
    Inventors: Volker Rheinberger, Ulrich Salz, Wolfram Höland, André Rumphorst, Kurt Grabher, Urs Karl Fischer, Marcel Schweiger, Norbert Moszner
  • Patent number: 6347411
    Abstract: A composition suitable for use in linings for articles of clothing is disclosed, which is a mixture of a discontinuous solid phase of microballoons, and a viscous liquid continuous phase comprising a polydimethylsiloxane; the polydimethylsiloxane of the continuous phase has a viscosity between 100,000 cs and 2,000,000 cs; the viscosity of the polydimethylsiloxane of the continuous phase is achieved by incorporating polydimethylsiloxane molecules of sufficiently high molecular weight; containment within other materials is optional; additional dyes, pigments, particles, fibers, felts or fabrics can confer additional visibility, strength, stiffness, dryness or friction; accompanying properties of malleability, and thermal, electrical, vibratory, shock and acoustical insulation, also make this composition useful for other applications that require such qualities.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: February 19, 2002
    Assignee: Marine Manufacturing Industries Inc.
    Inventor: Graham D. Darling
  • Publication number: 20020006373
    Abstract: The present invention relates to a powder including agglomerates of hexagonal boron nitride platelets, wherein the agglomerates have an agglomerate size distribution of from about 10 to about 125 microns and the powder is substantially free of non-agglomerated platelets of boron nitride and its use in a polymer blend. The present invention also relates to a method of making a powder including agglomerates of hexagonal boron nitride platelets. This method involves providing a briquette formed from agglomerated hexagonal boron nitride platelets, crushing the briquette to produce a powder including hexagonal boron nitride agglomerates and non-agglomerated boron nitride platelets, and removing the non-agglomerated boron nitride platelets from the powder under conditions effective to produce a powder including agglomerates of hexagonal boron nitride platelets having an agglomerate size distribution of from about 10 to about 125 microns.
    Type: Application
    Filed: May 18, 2001
    Publication date: January 17, 2002
    Inventor: Thomas M. Clere