Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin such as silicone oil to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin.

Abstract: A process for preparing an anti-static film comprising incorporating a conductivity inducing material into a polymeric film. The conductivity inducing material is a non-volatile metal salt. The polymeric film is selected from polyurethane, polyolefins, polyvinyl chloride, nitrile rubber, polyisoprene, hydrogenated block copolymers, styrene-isoprene-styrene/styrene-butadiene-styrene block copolymers, styrene butadiene latexes, and natural rubber latex. Anti-static films and gloves prepared from such process are also disclosed.

Abstract: The plastic ski coating contains a filling material addition improving the sliding properties, which contains at least one of the following materials: boron, at least one boron compound, at least one nitride. With this the filling material addition quantity may be smaller than with a filling material addition of soot or graphite, and a black coloration of the ski coating may be avoided.

Abstract: The combination of fluoropolymer processing aid with foam cell nucleating agent gives a combined processing aid that is far superior to either individually when used in the extrusion of melt processible polymers.

Abstract: A reinforced polyolefin article is provided which includes a sized reinforcement material incorporated in the article. The article may be prepared by polymerizing a cyclic olefin monomer in the presence of the sizing agent and a metathesis polymerization catalyst which includes ruthenium or osmium.

Abstract: Solvent-free applicable curable coating material containing as binder inorganic polymers and/or organic polymers, cross-linkers and sliding aids.

Abstract: Disclosed is a select class of liquid crystalline polyesters and molding compositions comprising the polyesters and glass fiber. The liquid crystalline polyesters consist essentially of (1) diacid residues consisting essentially of (i) cyclohexanedicarboxylic acid residues and (ii) other diacid residues selected from terephthalic acid residues, 2,6-naphthalenedicarboxylic acid residues, or a mixture thereof; (2) diol residues consisting essentially of hydroquinone residues, 4,4′-biphenol residues or a mixture thereof; and, optionally, (3) p-hydroxybenzoic acid residues. In the above definition, the moles of diol residues are equal to the moles of diacid residues and the total of the (1), (2) and (3) mole percentages is equal to 100. The liquid crystalline polyesters have melting points determined by differential scanning calorimetry equal to or less than 360° C.

Abstract: A composition for substrate materials according to the present invention includes 70 - 95 wt. % of inorganic powder and 5 - 30 wt. % of thermosetting resin composition and is in a finely crushed condition. The composition for substrate materials is prepared, for example, by crushing into fine pieces and mixing the inorganic powder and the thermosetting resin composition. A heat conductive substrate is provided with an insulator body formed by heating and pressurizing said composition for substrate materials and a wiring pattern is provided in such a condition that it is exposed on the surface of the insulator body. A process for manufacturing the heat conductive substrate comprises forming said composition for substrate materials into the insulator body by casting the above mentioned composition for substrate materials into a metal mold to be heated and pressurized so that said thermosetting resin is cured.

Abstract: A UV-stabilizer comprising a mixture of hydroxybenzotriazole and a hydrolyzable silane containing at least one epoxy group is disclosed. The stabilizer is especially suitable as a component of a Siloxane system for coating substrates, especially thermoplastic substrates and most especially polycarbonate substrates.

Abstract: A thermally conductive compound which comprises 15 to 60 volume % of thermoplastic carrier resin consisting of a copolymer of a plasticizer with ethylene or of a polymer of the plasticizer, polyethylene and the copolymer, 40 to 85 volume % of thermally conductive filler particles dispersed in the carrier resin, and 0.5 to 5 weight % (for the filler particles) of a dispersing agent having (a) hydrophilic group(s) and (a) hydrophobic group(s). The thermally conductive compound has a high thermal conductivity and a plasticity in the range of temperatures of −40 to 50° C.

Abstract: A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/m°K and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ/mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.

Abstract: Polymer compositions comprising polysiloxanes and metal coated boron phosphates are described and they unexpectedly display flame retardant properties and hydrolytic stability without creating environmental hazards.

Abstract: A conductive paste comprising conductive powder and low-melting glass frit, wherein the low-melting glass frit constituting the conductive paste crystallizes crystals during firing to increase the resistivity of the conductive paste.

Abstract: A polyoxymethylene resin composition which comprises (A) 70-99.89% by weight of a polyoxymethylene resin, (B) 0.1-20% by weight of at least one ethylene-substituted vinyl copolymer having a melting point of 40-80° C. and prepared by polymerization using a radical polymerization catalyst, a chromium-containing catalyst or a Ziegler catalyst, and (C) 0.01-10% by weight of at least one liquid ethylene-&agr;-olefin random copolymer. The resin composition of the present invention is small in friction coefficient and excellent in abrasion resistance under high load and high temperature against noncrystalline resins.

Abstract: A resin composition having laser marking properties from a NdYAG radiation laser wherein said composition comprises a polyester thermoplastic resin, a sufficient amount of light pigment for forming a light background coloration, and an effective amount of marking agent wherein said polyester thermoplastic resin decomposes in laser struck areas to form dark colored markings in laser struck areas on the light background coloration wherein the marking agent is selected from the group consisting of boron phosphate, zinc oxide, zinc stannate, zinc hydroxy stannate, tin (II) oxalate and mixtures thereof.

Abstract: The present invention provides a novel screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Abstract: The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Abstract: The present invention relates to mixtures of conducting organic polymers and reaction products of polyfunctional organosilanes, conducting organic-inorganic hybrid materials obtained therefrom, and their use for coating surfaces.

Abstract: Filler-containing polytetrafluoroethylene granular powder, which has a large apparent density, a small average particle size and a sharp particle size distribution and a superior powder flowability, and gives a molded product having a superior tensile strength, elongation and surface roughness, and a process for preparing the same. The granular powder is prepared by granulation of a mixture of a PTFE powder and a filler in water with stirring in the presence of an organic liquid forming liquid-liquid interface with water and a nonionic surfactant.

Abstract: A resin composition is provided which comprises (A) a saponified ethylene-vinyl acetate copolymer (referred to as EVOH for short) with an ethylene content of 20 to 60 mole percent and a saponification degree of not less than 90 mole percent, and contains therein (B) a boron compound as an essential component, (C) acetic acid as an optional component, and at least one compound selected from among (D) an acetic acid salt and (E) a phosphoric acid compound as an essential component, the contents of the respective additive components per 100 parts by weight of EVOH (A) being as follows: boron compound (B): 0.001 to 1 part by weight on the boron basis; acetic acid (C): 0 to 0.05 part by weight; acetic acid salt (D): 0.001 to 0.05 part by weight on the metal basis; and phosphoric acid compound (E): 0.0005 to 0.05 part by weight on the phosphate radical basis.

Abstract: This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m.degree. K and it is capable of being molded using high speed molding techniques such as injection molding.

Abstract: A low viscosity high thermal conductivity polymer-based boron nitride composition and a surface-treated boron nitride material for use as a filler in this composition, and methods of preparation is described.

Abstract: A flexible self-supporting fire barrier material comprising about 0.5 to about 25 weight % of a structural phase and greater than or equal to about 75 weight % to about 99.5 of inorganic heat absorbing compounds dispersed throughout the structural phase, based on a total weight % of the fire barrier material; the structural phase comprising 0.5 to about 10 weight % binder and 0.01 to about 15 weight % fibers, based on the total weight % of the fire barrier material; the inorganic heat absorbing compounds comprising an intumescent compound and an endothermic compound; the material having a density of at least about 0.5 g/cc.

Abstract: A thermostable polymer electrolyte gel containing an acrylonitrile polymer, an electrolyte and a solvent, the acrylonitrile polymer having an acrylonitrile content of from 89 wt % to 98 wt % and meeting the following relationship:1,040,000-(A.times.10,000).ltoreq.B.ltoreq.1,490,000-(A.times.10,000)where A is the acrylonitrile content in wt % and B is the weight average molecular weight of the acrylonitrile polymer, the polymer electrolyte gel having an ion conductivity of 10.sup.-3 S/cm or higher at 20.degree. C., exhibiting the "retention of shape" in a thermostability test, and containing the acrylonitrile polymer in a proportion of from 3 wt % to 9 wt %. The thermostable polymer electrolyte gel can be produced by dissolving an acrylonitrile polymer and an electrolyte in a solvent to prepare a solution of the polymer, and cooling the polymer solution to a temperature of 0.degree. C. or lower.

Abstract: A low molecular weight polyether oligomer is modified with a salt during chain extending reaction of the polyether oligomer to form electrostatic dissipative polymer products such as polyurethanes, polyether amide block copolymers and polyether-ester block copolymers. The reaction product polymers exhibit relatively low surface and volume resistivities, and static decay times which are not too fast or too slow, yet are free of excessive amounts of extractable anions, particularly chlorine, nitrate, phosphate and sulfate. The electrostatic dissipative polymers can be blended with a variety of base polymers to form plastic alloys, which in turn can be utilized to form articles useful in the manufacture of electrostatic sensitive electronic devices.

Abstract: Vinyl halide resin compositions containing a metal compound stabilizer and coated acid absorber particles, where the coating consists of a tin-based coating or a complex calcium/zinc/strontium phosphate-based coating, are used to confer heat stability to such compositions. Use of the costabilizers of this invention results in economic advantages and material cost savings.

Abstract: To provide a polyacetal resin composition having an excellent corrosion inhibiting effect on metals, particularly reduced in the adverse effect on magnetic tapes or the like, and suitable for use in producing component parts of a magnetic tape cassette such as a reel hub or tape guide, 100 parts by weight of a polyacetal resin (A) is blended with 0.05 to 5 parts by weight of an antioxidant (B), 0.001 to 5 parts by weight of a specified nitrogen-containing compound (C), and 0.001 to 3 parts by weight of a boric acid compound.

Abstract: An oxymethylene polymer resin shaped article having high flexural modulus, which is produced by molding an oxymethylene polymer resin, wherein the oxymethylene polymer resin is selected from the group consisting of an oxymethylene homopolymer resin, an oxymethylene copolymer resin and a mixture thereof. The oxymethylene copolymer resin comprises a copolymer of an oxymethylene monomer and a comonomer copolymerizable therewith, wherein the amount of the comonomer is extremely limited. The shaped article has the following characteristics: (1) a crystallinity of 72% or more; (2) an average crystallite size of 150 .ANG. or more; (3) 70% by volume or more of the whole volume of the shaped article being comprised of spherulites each having a diameter of 60 .mu.m or less; and (4) a thickness of 1 mm or more.

Abstract: A composition suitable as a buoyant putty is disclosed, which is a mixture of a discontinuous solid phase of microballoons, and a viscous liquid continuous phase comprising a polydimethylsiloxane; the polydimethylsiloxane of the continuous phase has a viscosity between 100,000 cs and 2,000,000 cs; the viscosity of the polydimethylsiloxane of the continuous phase is achieved by incorporating polydimethylsiloxane molecules of sufficiently high molecular weight; containment within other materials is optional; additional dyes, pigments, particles, fibers, felts or fabrics can confer additional visibility, strength, stiffness, dryness or friction; accompanying properties of malleability, and thermal, electrical, vibratory, shock and acoustical insulation, also make this composition useful for other applications that require such qualities.

Abstract: In order to provide a heat-conductive pressure-sensitive adhesive which is excellent in heat conductivity and adhesive property, in particular, shows a large adhesive force in a high temperature (heat resisting shear retention force), does not show an extreme viscosity increase during or after the preparation thereof, and is excellent in the stability, the present invention provides a heat-conductive pressure-sensitive adhesive comprising a) 100 parts by weight of a copolymer of a monomer mixture comprising from 70 to 99% by weight of a monomer made up of a (meth) acrylic acid alkyl ester having an alkyl group having from 2 to 14 carbon atoms on an average as the main constituent and from 30 to 1% by weight of a copolymerizable monomer having an acidic or basic polar group in the molecule and b) from 10 to 300 parts by weight of a heat-conductive filler having the same polarity as the polar group of the above-described copolymerizable monomer and having a purity of at least 95% by weight, an adhesive sheet co

Abstract: A silicone composition comprising (A) 100 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 parts by weight of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and consisting essentially of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, R.sup.4 is selected from the group consisting of R.sup.3 and alkenyl, the mole ratio of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.

Abstract: Described is a resin mixture for an organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature. The composition comprises about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride, silica or silver. The organic compound component comprises the reaction product of about 40 to 90 wt. %, of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form. The resin mixture includes unsaturated liquid rubber having an attached functional group, and an average molecular weight of about 2,000 to 10,000.

Abstract: A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.

Abstract: Extrusion films and coatings are prepared by applying a polyhydroxyalkanoate (PHA) to a surface which is in the range from 20.degree. C. above to 20.degree. C. below the optimum crystallisation temperature of the PHA. A PHA of high melt flow index is preferred.

Abstract: A filled polymer composition which comprisesA) from about 5 to about 90 percent of one or more thermoplastic substantially random interpolymers prepared by polymerizing one or more a-olefin monomers with one or more vinylidene aromatic monomers and/or one or more hindered aliphatic or cycloaliphatic vinylidene monomers, and optionally with other polymerizable ethylenically unsaturated monomer(s), and(B) from about 10 to about 95 percent of one or more inorganic fillers,the amounts of (A) and (B) being based on the total weight of (A) and (B).Fabricated articles made from the filled polymer compositions are useful as sound insulating or energy absorbing films or sheets or as floor, wall or ceiling coverings.

Abstract: A flame retardant composition is provided which is less expensive to produce than prior compositions and yet which exhibits desirable insulation properties, flame and fire resistance, and which, when ignited, does not emit noxious smoke or corrosive gases. The crosslinkable flame retardant composition includes a crosslinkable polymer, a hydrated inorganic filler, and a coupling agent which is an acid having at least two active carboxylic acid groups.

Abstract: A high temperature silicon sealant comprising a combination of high molecular weight, high viscosity silicon oil; a low molecular weight, low viscosity silicon oil; a liquid organo-metallic catalyst; and a submicron boron nitride powder.

Abstract: A zinc oxide-filled addition-curable silicone rubber composition comprises (A) a diorganopolysiloxane containing at least two alkenyl groups in its molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in its molecule, (C) a platinum family metal catalyst, and (D) a zinc oxide powder surface treated with a tetraalkoxy silane and/or a partial hydrolysis-condensation product thereof. The composition can further comprise (E) a high thermal-conductive filler. The composition scarcely generates hydrogen gas during storage so as to have an excellent storage stability and provides a cured product excellent in heat resistance, electrical insulating properties, and adhesion to various metals, semiconductors, etc. while keeping good physical properties as a rubber.

Abstract: A non-chromate, corrosion-inhibiting coating composition for metal surfaces includes at least one inhibitor selected from the group consisting of phosphates, phosphosilicates, silicates, and mixtures thereof, at least one inhibitor selected from the group consisting of titanates, zinc salts, and mixtures thereof, and a carrier for these inhibitors, the carrier capable of placing the inhibitors in proximity with the metal surface. In a preferred embodiment, the coating composition further includes a borate such as boric acid, and a succinate. A preferred phosphate includes calcium dihydrogen phosphate, and sodium titanium oxide is a preferred titanate. The zinc salt can include zinc phosphate or zinc cyanamide.

Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

Abstract: A heat conductive BN filler having a cohesive factor of 3-50% is provided. An electrically insulating/heat dissipating sheet is obtained by mixing the BN filler with an organopolysiloxane and a crosslinking agent, shaping the resulting silicone rubber composition into a sheet form, followed by vulcanization. Without special orienting means, the BN particles are oriented in the sheeting step such that their a-axis is perpendicular to the sheet surface.

Abstract: A conductive molding composition, with a thermal conductivity above 22 W/m.degree. K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: A rubber molded product containing an inorganic filler, in which the relation of an inorganic filler content and a thermal resistance is within the range enclosed by lines connecting points A (20,1.5), B (20,0.1) and C (50,0.1) in the X-Y coordinates wherein the X coordinate expresses the inorganic filler content (vol %) and the Y coordinate expresses the thermal resistance per 1 mm thickness (.degree. C./W).

Abstract: The present invention provides a method of preparing semi-wet pressed green bodies having improved wet strength. The wet strength of the semi-wet pressed green bodies is increased by the addition of at least one polymeric binder having a molecular weight greater than 50,000 comprising, as polymerized units, at least 10 percent of one or more monoethylenically unsaturated acids, salts, or anhydrides, and further comprising at least one hydrophobe per polymeric chain on average. The present invention further provides semi-wet pressed green bodies, having improved wet strength, made from the above method.In one embodiment, the polymeric binder increases the wet strength of ceramic green bodies. In another embodiment, the polymeric binder increases the wet strength of metallurgic green bodies. In another embodiment, the polymeric binder increases the wet strength of cermet green bodies.

Abstract: The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

Abstract: Aqueous multiphase dispersions for multicolor coatings are produced by a process essentially comprising the steps of:providing one or more emulsion paints;adding at least one linear colloid capable of being insolubilised by borate ions and at least one hydrophilic inorganic clay to said paints to form base paints;providing an aqueous medium containing at least one hydrophilic inorganic clay;adding said base paints into said aqueous medium;adding borate ions to said aqueous medium;adding at least one emulsified binder to said medium;each of the emulsion paints having a different color.It is preferred to use galactomannoglycans as colloid (most preferably guar gum) and synthetic clays (most preferably of the smectite or hectorite types).

Abstract: High performance silicone rubber windshield wiper blades are provided as a result of molding a tintable platinum group metal catalyzed silicone compositions having an intrinsic viscosity of less than 1.3. Improved lubricity with respect to windshield wiper glass is achieved by a molding procedure which effects a transfer such as a migration, or diffusion of release agent, for example polytetrafluoroethylene, into the surface of the silicone rubber windshield wiper blade.

Abstract: A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.

Abstract: A formaldehyde-free curable aqueous composition comprising:(a) a polyacid comprising at least two carboxylic acid groups, anhydride groups, or salts of the polyacid thereof;(b) an active hydrogen compound containing at least two active hydrogen groups selected from the group consisting of hydroxyl, primary amino, secondary amino, and mixtures thereof; and(c) a fluoroborate accelerator; wherein the ratio of the number of equivalents of said carboxylic acid groups, anhydride groups, or salts thereof to the number of equivalents of said hydroxyl groups is from 1/0.01 to about 1/3, and wherein said carboxylic acid groups, anhydride groups, or salts thereof are neutralized to an extent of less than 35% with a fixed base is disclosed. A method for curing formaldehyde-free polyacids and a method for bonding glass fiber heat-resistant nonwovens with a formaldehyde-free binder are further disclosed.