Abstract: An object of the present invention is to provide a resin composition which is capable of manufacturing a high dielectric resin film having high dielectric constant and small dielectric loss tangent. And the present invention provides high dielectric resin composition comprising: a high dielectric filler; and resin; wherein a relative dielectric constant of the high dielectric filler satisfies the following formulae (1) and (2). [(?T??25)/?25]MAX?0.

Abstract: PHA pellet compositions are provided which are processible into blown and cast free-standing films. The Mw of the PHA in the pellets used to produce the films is at least 470,000, at least 435,000 if PHA thermal stabilizers of the invention are used. In order to achieve a stable, unsupported film having desirable elongational and tensile properties, the Mw of PHA in the film is greater than about 420,000.

Abstract: A hot melt adhesive composition that includes thermoplastic polymer, a source of zinc, at least one of aluminum trihydrate and magnesium hydroxide, and no greater than 70% by weight of a source of halogen. Articles that include a porous substrate and the hot melt adhesive composition.

Abstract: A flame-retardant resin composition comprises a thermoplastic resin; a flame retardant comprising a phosphorus-containing compound (A), a aromatic resin (B), and at least one flame-retardant auxiliary (C) selected from a nitrogen-containing compound and a metal salt of an inorganic acid; and at least one stabilizer auxiliary (D) selected from a compound having a functional group reactive to an active hydrogen atom and a water-repellent compound. The phosphorus-containing compound may be a phosphoric ester. The aromatic resin may be a polyphenylene sulfide-series resin or a polyphenylene oxide-series resin. The nitrogen-containing compound is a salt of an amino group-containing triazine compound with an oxygen acid, a salt of an amino group-containing triazine compound with a hydroxyl group-containing triazine compound, a polyphosphoric acid amide, a cyclic urea compound, or others.

Abstract: Laser-markable pigments which are distinguished by the fact that an absorber is coated with a marker and optionally with a diffusion barrier are described. Further, processes for the preparation of the laser-markable pigments and methods for using them are described. The absorber is preferably an inorganic pigment or a filler. The marker is preferably an intrinsically laser-markable polymer, particularly a polyethylene terephthalate, acrylonitrile-butadiene-styrene, polystyrene, polyphenylene ether, liquid-crystal polymer or polyphenylene sulfide.

Abstract: Coating materials comprising at least one electrically conductive pigment (A1) having an at least bimodal particle size distribution and at least one binder, the pigment/binder ratio being >1.5:1, can be used as coil coating materials.

Abstract: The present invention relates to a method for making boron nitride powder having a thermal diffusivity of from about 0.14 cm2/s to about 0.20 cm2/s. This method involves pressing high purity, hexagonal boron nitride having an average platelet size of at least 2 microns into a compacted form, sintering the compacted form of boron nitride to form a sintered body, and crushing the sintered body under conditions effective to produce boron nitride powder having a thermal diffusivity of from about 0.14 cm2/s to about 0.20 cm2/s. Another aspect of the present invention relates to boron nitride powder having a thermal diffusivity of from about 0.14 cm2/s to about 0.20 cm2/s.

Abstract: About 0.001 to 5 parts by weight of an antioxidant and about 0.001 to 10 parts by weight of a guanamine compound having at least one unit represented by the following formula (1) or a salt thereof relative to 100 parts by weight of a polyacetal resin are mixed and constitute a resin composition. The resin composition may further comprise a processing stabilizer, a heat stabilizer, a weather-resistant stabilizer, a coloring agent, a gloss control agent, an impact resistance improver, a slide improver, a filler, and/or the like. Wherein R1 and R2 are the same or different and each represents a hydrogen atom or an alkyl group, and “m” denotes an integer of not less than 2.

Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.

Abstract: A material composition made of a matrix material, a nano-sized particulate fraction and a micron-sized particulate fraction. A process of making a nano-structured composition. A nano-structured material is provided to initiate a mixture. A micron-sized particulate material is added to the mixture. A matrix material is added to the mixture. Finally, the mixture is utilized to fabricate a nano-structured structure.

Abstract: An object of the present invention is to improve a drying property of paint in application of alkyd paint to the surface of a cured material resulting from the curable composition containing an oxyalkylene polymer having at least one silicon-containing functional group capable of cross-linking by formation of at least one siloxane bond, and to provide a composition that contains an oxyalkylene polymer (A) having at least one silicon-containing functional group capable of cross-linking by formation of at least one siloxane bond and 2,6-di-t-butylhydroxytoluene wherein the content of the above-described 2,6-di-t-butylhydroxytoluene is 350 ppm or less relative to the above-described polymer (A).

Abstract: A method for producing a composite material containing nanotubes and an interfacial polymer, and a composite material made by the method. The method involves contacting two mutually insoluble monomer solutions, at least one of which contains nanotubes, to provide an insoluble polymer containing entrained nanotubes.

Abstract: The present invention provides a thermal conductive composition formed by blending a thermal conductive filler of not less than 600 mass parts to 100 mass parts of a liquid silicone having a viscosity in a range of 20 to 2000 mPa·s. Since the thermal conductive composition is not crosslinked further or cured at a normal temperature of 25° C., it keeps a putty state, and the thermal conductivity is not less than 3 W/m·K. A heat-dissipating putty sheet according to the present invention is formed by applying the thus obtained thermal conductive composition onto a release sheet. The heat-dissipating putty sheet having a thickness ranging from 0.5 mm to 3 mm can be released manually from a release base, or it can be transferred from a release sheet to a heat-generating part or a dissipator so as to be attached to a desired position easily.

Abstract: The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract: Thermoplastic polyurethanes having an alternating sequence of hard and soft segments in which a nanostructured polyhedral oligomeric silsesquioxane diol is used as a chain extender to form a crystalline hard segment constituting SMPs. The polyurethanes are formed by reacting a polyol, a chain extender dihydroxyl-terminated POSS and a diisocyanate. The polyurethanes have multiple applications including for example, implants for human health care, drug delivery matrices, superabsorbant hydrogels, coatings, adhesives, temperature and moisture sensors, etc.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: Disclosed herein is a barrier coating that shows decreased moisture sensitivity compared to conventional coatings, and provides high barrier properties, as well as a rapid method for producing the coating. These improvements are generated through use of a boric acid chelating agent in the composition and curing the composition with UV/NIR radiation.

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G? of the cured thermal interface material.

Abstract: A molded article produced by injection-molding a molten form of a flame-retardant aromatic polycarbonate resin composition comprising: 100 parts by weight of an aromatic polycarbonate (A) (Mw: 17,000 to 35,000), 0.01 to 3 parts by weight of inorganic compound particles (B) (average diameter: 10 nm to 10 ?m), 0.001 to 0.5 part by weight of an alkali metal salt (C) of an organic sulfonic acid, and 0.01 to 0.

Abstract: A heat radiation blocking fluororesin film comprising a fluororesin containing a hexaboride.

Abstract: The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract: A composition and a process for producing the composition are disclosed. The composition comprises (1) repeat units derived from a carbonyl compound and a glycol and (2) one or more ultrafine metal oxides. The process can comprise (1) contacting, in the presence of a catalyst and optionally one or more ultrafine metal oxides, a carbonyl compound such as dicarboxylic acid with a glycol under a condition sufficient to produce polyester wherein the glycol can be pretreated with a metal oxide or (2) incorporating an ultrafine metal oxide into or onto polyester. Also disclosed is a process for substantially removing, or reducing the content of, an aldehyde in a glycol which comprises contacting the glycol with at least one metal oxide.

Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Abstract: A method for increasing the crystallization rate of a polyethylene terepthalate (PET) prepared based on terepthalic acid (TPA) and ethylene glycol monomers, by adding into said TPA-based PET an effective amount of a polyethylene terepthalate prepared based on dimethyl terephthalate (DMT), in an amount sufficient for said thermally formable composition to have an increase in crystallization temperature as required for the final end-use application.

Abstract: Articles and processes are provided whereby flame-retardant SAP particles are incorporated into synthetic resins, especially curable thermosettable resins. The SAP particles are most preferably hydrated with an aqueous flame-retardant solution. In this regard, the flame-retardant solution may consist essentially of water alone or a water solution containing one or more water soluble inorganic flame retardants. When SAP particles are hydrated with an aqueous inorganic flame retardant solution, the SAP particles may thereafter be dried to remove substantially the water component. In such a manner, the inorganic flame retardant will remain as a dried residue physically entrained within the SAP particles. As such, the SAP particles serve as a physical matrix in which the inorganic flame retardant is homogenously dispersed.

Abstract: Polyolefin-based pallets capable of passing standard pallet flammability tests are prepared by molding the pallet or one or more subassemblies thereof, of a polyolefin molding resin containing a flame retardant package containing magnesium hydroxide, and optionally alumina trihydrate, and zinc borate. The flame retardants may be supplied as a master batch at a concentration higher than that desired in the pallet or subassembly, in a polyolefin-compatible polymer, and result in pallets having a significantly lower heat release rate.

Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).

Abstract: A hot melt adhesive composition that includes thermoplastic polymer, a source of zinc, at least one of aluminum trihydrate and magnesium hydroxide, and no greater than 70% by weight of a source of halogen. Articles that include a porous substrate and the hot melt adhesive composition.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: A high temperature resistive coating composition includes a pigmenting component, a binder component, and a hardening agent. The pigmenting component includes a spinel of the formula AB2O4, in which A is selected from the group consisting of Mg, Fe, Zn, Mn, Cu and Ni, or a combination thereof, and B is selected from the group consisting of Al, Fe and Cr, or a combination thereof. The binder component of the high temperature resistive coating is preferably a polysiloxane material, such as a silicon resin. Moreover, the hardening agent of the high temperature resistive coating includes a finely powdered material selected from the group consisting of diamond powder, BN, WC, SiC, Al2O3, AlN and SiO2. The resistive coating may be advantageously used for coating the interior of a self-cleaning oven, an oven rack, burner grates, and the like, particularly due to its ability to withstand high temperatures.

Abstract: Nanocomposites from nanofillers with preferred form of whiskers, rods, plates and fibers are disclosed. The matrix composition described includes polymers, ceramics and metals. The composition disclosed include inorganic, organic and metallic. These nanocomposites are useful in wide range of applications given their unusual properties such as refractive index, transparency to light, reflection characteristics, resistivity, permittivity, permeability, coercivity, B-H product, magnetic hysteresis, breakdown voltage, skin depth, curie temperature, dissipation factor, work function, band gap, electromagnetic shielding effectiveness, radiation hardness, chemical reactivity, thermal conductivity, temperature coefficient of an electrical property, voltage coefficient of an electrical property, thermal shock resistance, biocompatibility, and wear rate.

Abstract: Laminates are disclosed having interlayers containing an infrared absorbing amount of lanthanum hexaboride (LaB6) coated on or dispersed in a thermoplastic polymeric matrix. Preferably, the LaB6 is combined with other materials, such as indium tin oxide, antimony tin oxide, organic dyes or pigments in a polymeric matrix of polyvinyl butyral (PVB). Alternatively, LaB6 is coated on a sheet of polyethylene terephthalate and encapsulated with one or more sheets of PVB. The interlayers having LaB6 dispersed therein or coated thereon are advantageously combined with encapsulation layers, reflective layers, dyed layers and/or pigmented layers.

Abstract: A thermal conductive material is obtained by kneading an organic material, having the melting transition in the range of 30-70° C. and the viscosity at 100° C. equal to or above 70,000 cP, and a filler at the ratio of 100:40-900. It has a property of flexibly changing its form by being plasticized due to liquidation of the composing organic material upon receipt of heat from an electronic component. Accordingly, adhesion of the thermal conductive material toward the electronic component and a heat sink is increased and thermal conductivity is improved. Additionally, since the thermal conductive material changes its form according to the outer shape of the electronic component, load is evenly applied to the whole electronic component and does not concentrate on part of the electronic component.

Abstract: A low softening temperature thermal conductive adhesive composition is made from a blend of liquid NBR in molecular weight of 300˜100,000 and ethylene vinyl acetate (EVA) to have a softening point of 38˜65° C. With proper addition of sub-micron or nano powder thermal conductive agents like aluminum oxide, zinc oxide, aluminum nitride, boron nitride, graphite, metal powder or nano clay, the adhesive can be made into a membrane with thickness of 0.01˜5 mm and thermal conductivity of 0.5˜5 W/m-K, and thermal conductive plate with thermal resistance of 0.005˜0.2° C.in2/W. The thermal conductive plate has softening point of 38˜65° C., preferably 45° C. to avoid liquidation during storage and transportation. Further application includes use as the sealant or thermal conductive interface in electronic components and heat dissipaters to reduce heat resistance and improve thermal conductive efficiency.

Abstract: An abradable dry powder coating (22) composition for coating onto a surface (12) for subsequent curing to form into an abradable coating, including a powder (16) formed of uncured thermoset resin with at least 15 volume percent filler, wherein the filler does not substantially melt below the cure temperature of the resin. Method for making the coating composition includes melt-mixing the thermoset resin with at least 15 volume percent of filler, cooling the resulting mass composite, and then breaking the cooled mass composite into powder particles (16). Method of coating an article with an abradable coating includes applying the dry composite powder with the filler therein onto a substrate and curing the dry powder composition, preferably by electrostatic coating. An article is also disclosed which is coated with the abradable coating.

Abstract: Biodegradable polymer blend compositions are provided which contain oligomeric esters. The oligoester compound can compatibilize blends of two or more biodegradable polymers resulting in excellent ductility and reduced tendency to embrittlement of products produced from therefrom. In a preferred embodiment of the invention, the blend composition comprises a PHA, polycaprolactone (PCL) and one or more oligomeric esters. In another preferred embodiment of the invention, the blend composition comprises a PHA, polybutylenesuccinate-adipate (PBSUA), and one or more oligomeric esters.

Abstract: A resin composition useful for wire and cable covering material is formed by compounding a phosphate ester retardant, boron phosphate, and zinc borate hydrate with a polyphenylene ether group resin or a combination of a polyphenylene ether group resin and an aromatic vinyl group resin, in a specific ratio.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: The present invention relates to polycarbonate blends containing phosphonate amine and inorganic nanoparticles, which have improved flame proofing and improved mechanical properties such as low-temperature impact strength, elongation at break, weld line strength and stress cracking resistance as well as an improved yellowness index.

Abstract: The purpose of the invention is a coating precursor comprising a silicone resin, a mineral filler and an organic solvent capable of dissolving the said resin and putting the said mineral filler into suspension, the said silicone resin and the said mineral filler being capable of chemically reacting so as to produce a solid layer on a substrate after the organic solvent has evaporated and a cohesive refractory layer after a calcination operation. Another purpose of the invention is a method for coating a given surface of a substrate with at least one refractory layer containing silicon in which the substrate is coated with a coating precursor according to the invention so as to form a green layer and a heat treatment is carried out to calcine the said green layer and to form a cohesive refractory layer. The invention is a means of obtaining a protective coating capable of resisting oxidising environments, liquid metal and solid or molten salt.

Abstract: The purpose of the invention is a coating precursor comprising a silicone resin and a mineral filler capable of chemically reacting so as to produce a solid layer on a substrate and a cohesive refractory layer after a calcination operation. The precursor may also include an additive capable of reducing its viscosity. Another purpose of the invention is a method for coating a given surface of a substrate with at least one refractory layer containing silicon in which the substrate is coated with a coating precursor according to the invention so as to form a green layer and a heat treatment is carried out to calcine the said green layer and to form a cohesive refractory layer. The invention is a means of obtaining a protective coating capable of resisting oxidising environments, liquid metal and a solid or molten salt.

Abstract: A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m° K and preferably greater than 22 W/m° K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.

Abstract: A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical shaped alumina grains which have an average grain diameter in a range between 50 &mgr;m and 80 &mgr;m. The heat conductive filler includes micro grains having a grain diameter of 30 &mgr;m or less at a proportion of 5 volume % or less with respect to the total amount of the spherical shaped alumina grains.

Abstract: The resin-coated scale-like inorganic particles have soft feel, adhesivity to human skin and effective in suppressing excessive luster. The scale-like inorganic particles are those with the surface coated with resin, and are characterized in that the 100% modulus of the resin in the tensile test is in a rage from 50 to 3000 N/cm2. The resin is preferably one or more selected from the group consisting of polyurethane, a styrene-butadiene copolymer, an acrylonitrile-butadiene copolymer, a silicone-based elastomer, and a polyolefin-based elastomer. The resin-coated scale-like inorganic particles are blended in the cosmetics according to the present invention.

Abstract: An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: Electrically conductive, thermoset molding compositions are disclosed which comprise an unsaturated thermosetting resin, an olefinically unsaturated monomer which is copolymerizable with the thermosetting resin, a thermoplastic additive and carbon black. The carbon black is incorporated in a conductive additive which comprises the thermoplastic additive, the carbon black and, preferably, a lubricant. The electrical resistance of articles molded from the disclosed molding compositions is typically less than about 108 ohms/cm2.

Abstract: A thermoplastic resin composition which has an excellent fluidity and is able to give a molded product having an excellent mechanical strength contains 90-30% by weight of (A) a thermoplastic resin, 5-60% by weight of (B) a fibrous filler and 5-60% by weight of (C) a whisker.

Abstract: Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.

Abstract: A low softening temperature thermal conductive adhesive composition is made from a blend of liquid NBR in molecular weight of 300˜100,000 and ethylene vinyl acetate (EVA) to have a softening point of 38˜65° C. With proper addition of sub-micron or nano powder thermal conductive agents like aluminum oxide, zinc oxide, aluminum nitride, boron nitride, graphite, metal powder or nano clay, the adhesive can be made into a membrane with thickness of 0.01˜5 mm and thermal conductivity of 0.5˜5 W/m-K, and thermal conductive plate with thermal resistance of 0.005˜0.2° C.in2/W. The thermal conductive plate has softening point of 38˜65° C., preferably 45° C. to avoid liquidation during storage and transportation. Further application includes use as the sealant or thermal conductive interface in electronic components and heat dissipaters to reduce heat resistance and improve thermal conductive efficiency.