Abstract: The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions.

Abstract: A thermoconductive composition is described comprising: (a) 100 parts by weight of wax, (b) 10 to 1,000 parts by weight of the compound of formula (I) below: where, R1 and R2independently represent an alkyl group having 1 to 3 carbons, and n represents a value of 100 to 100,000, (c) 10 to 2,000 parts by weight of a thermoconductive filler and (d) 0 to 1,000 parts by weight of a softener. An article is also described comprising: (a) an exothermic component; (b) a heat radiator; and (c) the thermoconductive composition of claim 1 disposed between the exothermic component and the heat radiator.

Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.

Abstract: A perfluoropolyether, a composition comprising the perfluoropolyether, a process for producing the perfluoropolyether, and a process for improving the thermostability of grease or lubricant are provided. The perfluoropolyether comprises perfluoroalkyl radical end groups in which the radical has at least 3 carbon atoms per radical and is substantially free of perfluoromethyl and perfluoroethyl end groups.

Abstract: The present invention relates to a powder including agglomerates of hexagonal boron nitride platelets, wherein the agglomerates have an agglomerate size distribution of from about 10 to about 125 microns and the powder is substantially free of non-agglomerated platelets of boron nitride and its use in a polymer blend. The present invention also relates to a method of making a powder including agglomerates of hexagonal boron nitride platelets. This method involves providing a briquette formed from agglomerated hexagonal boron nitride platelets, crushing the briquette to produce a powder including hexagonal boron nitride agglomerates and non-agglomerated boron nitride platelets, and removing the non-agglomerated boron nitride platelets from the powder under conditions effective to produce a powder including agglomerates of hexagonal boron nitride platelets having an agglomerate size distribution of from about 10 to about 125 microns.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A water- and oil-repellent, antistatic composition comprises (a) at least one nonpolymeric ionic salt consisting of (i) at least one cation selected from the group consisting of monovalent metal cations, divalent metal cations, and organic onium cations, and (ii) at least one weakly coordinating anion, the conjugate acid of the anion having an acidity greater than or equal to that of a hydrocarbon sulfonic acid, and with the proviso that the anion is organic or fluoroorganic when the cation is a metal; (b) at least one fluorochemical repellency-imparting additive or repellent; and (c) at least one insulating material.

Abstract: Disclosed is an ink composition comprising water, a colorant, and sodium tetraphenylboride. Another embodiment of the present invention is directed to a set of inks for printing multicolor images in an ink jet printer, the ink set comprising (1) a first ink having a first color and comprising water, a first colorant, and at least one of (a) a cationic polymer, (b) a cationic surfactant, or (c) an inorganic salt the cation of which has a tetraphenylboride salt that is substantially insoluble in water, and (2) a second ink having a second color different from the first color and comprising water, a second colorant, and sodium tetraphenylboride, wherein intercolor bleed between the first ink and the second ink is reduced when the second ink is printed adjacent to, on top of, or underneath the first ink on a print substrate.

Abstract: This invention deals with the development of improved SMT performance flame retardant polyamide compositions. The compositions include replacing the poly bromostyrene or brominated polystyrene with a copolymer of a halostyrene and glycidyl(meth)acrylate. The resulting composition results in greatly improved blistering performance in Surface Mounting Technology Applications.

Abstract: A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally conductive filler are oriented in a predetermined direction by a magnetic field. The thermally conductive composition contains 100 parts by weight of the liquid crystalline polymer and 5 to 800 parts by weight of the thermally conductive filler having magnetic anisotropy. The thermally conductive filler has a thermal conductivity in at least one direction higher than the thermal conductivity of the liquid crystalline polymer.

Abstract: Disclosed is a thermally conductive silicone gel is produced by reacting a stoichiometric excess of a multifunctional vinyl-substituted silicone with a multifunctional hydride-substituted silicone. The thermal conductive components comprise at least three conductive solid fillers, aluminum oxide, zinc oxide and boron nitride. The invention is adaptable to spin casting for encapsulating electronic circuitry, among other uses.

Abstract: A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.

Abstract: A method for increasing the crystallization rate of a polyethylene terepthalate (PET) prepared based on terepthalic acid (TPA) and ethylene glycol monomers, by adding into said TPA-based PET an effective amount of a polyethylene terepthalate prepared based on dimethyl terephthalate (DMT), in an amount sufficient for said thermally formable composition to have an increase in crystallization temperature as required for the final end-use application.

Abstract: A heat transfer material includes thermoplastic elastomer such as styrenic block copolymer, oil and fillers, and has a composite heat transfer coefficient greater than 0.8 watts/m-K. The material is easily conformable to irregularly shaped surfaces and has low thermal impedance values less than 0.1K-in2/W at 0.5 MPa mounting pressure. The material has a good dry-out performance of less than 0.15% at 70° C., 240 hours, which are better than the existing thermal conductive grease. More particularly, the material has excellent re-usability.

Abstract: An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

Abstract: The present invention is envisioned to improve sliding characteristics of polyether aromatic ketone resins and to provide their molded articles which are themselves resistant to damage and abrasion, cause no such damage or abrasion to their partner parts and can be easily molded. Thus, the present invention pertains to a polyether aromatic ketone resin composition comprising a polyether aromatic ketone resin and a high-hardness filler having a Mohs hardness of 6 or higher, the content of said filler being 1 to 100 parts by weight per 100 parts by weight of said ketone resin, and furthermore to a film or sheet made of the resin composition. The high-hardness filler having a Mohs hardness of 6 or higher is preferably particulate or spherical in particle shape. Also, the maximal particle size of said high-hardness filler is preferably not larger than 100 &mgr;m.

Abstract: A thermoplastic polymer composition is provided. The thermoplastic polymer composition comprising: a metal hydroxide containing at least one metal selected from the group consisting of magnesium, aluminum and calcium, at least one transition metal selected from the group consisting of manganese, nickel and zinc, and hydroxyl; a borate; and a thermoplastic polymer.

Abstract: A thermoplastic compound is disclosed comprising a macrocyclic poly(alkylene dicarboxylate) oligomer and an effective amount of a property-modifying additive selected from the group consisting of a thermal conductivity additive, an electrical conductivity additive, a sound dampening additive, an ionizing-radiation-opacity additive, an atomic-particle-moderating additive, and combinations thereof. Preferred macrocyclic poly(alkylene dicarboxylate) oligomers are cyclic polybutylene terephthalate and cyclic polyethylene terephthalate. The property-modifying additives enhance the existing manufacturing and use performance of the macrocyclic poly(alkylene dicarboxylate) oligomers.

Abstract: There is provided a paste coating composition for reinforcing wood or wood joint comprising: (A) an epoxy resin containing a curing agent, (B) a first fiber composed of a ceramic fiber, and (C) a second fiber composed of an aramid fiber or a polyketone fiber, wherein contents of components (B) and (C) are 1.5 to 5% by weight and 1 to 7% by weight based on a weight of component (A), respectively; and a wood structure reinforced by the composition. The composition can be easily applied for wood structures thereby imparting a remarkable improvement in strength to the structures.

Abstract: A corrugating adhesive that improves the bonding of coated papers, including latex coated medium and linerboards. The corrugating adhesive may comprise a hydrocolloid portion of the adhesive that improves tack and bonding and buffers and absorbs caustic in the adhesive allowing higher caustic in the adhesive formula without premature gelling of the secondary starch portion. Also, methods for making waterproof or water resistant corrugated board from corrugated media and paper liner.

Abstract: The present invention provides cement compositions comprising an improved fluid loss control additive, and methods for cementing in a subterranean formation using such cement compositions. The cement compositions comprise a hydraulic cement, water, and a fluid loss control additive comprising at least two polymers connected by a pH-sensitive crosslink. Optionally, other ingredients may be included in the compositions.

Abstract: A magnetic compound is formed comprising: (1) 25% to 50% by volume of polyphenylene sulfide (PPS); (2) 50% to 70% by volume of coated samarium cobalt (the coating comprising 1 to 30% Kaolin by weight of the coating and 70 to 99% potassium silicate by volume of the coating); and (3) 0% to 5% by volume of an internal lubricant. The PPS polymer component of the compound renders the compound amenable to be injection molded to precise tolerances and also has a low coefficient of linear thermal expansion. The samarium cobalt constituent of the compound provides thermal stability. The potassium silicate/kaolin coating separates the PPS from the samarium cobalt, thus preventing degradation (i.e, PPS viscosity reduction) during manufacture.

Abstract: Coated nanoparticles are used for composites and media. Exemplary applications include magnetic applications involving a solid matrix material and a nanostructured magnetic material.

Abstract: Polyamide compositions containing non-melt-processible fluoropolymers as additives, and processes for making such additives. The fluoropolymer particles have a standard specific gravity (SSG) of less than 2.225 and comprise a core of high molecular weight polytetrafluoroethylene and a shell of lower molecular weight polytetrafluoroethylene or modified polytetrafluoroethylene.

Abstract: Disclosed herein is a barrier coating that shows decreased moisture sensitivity compared to conventional coatings, and provides high barrier properties, as well as a rapid method for producing the coating. These improvements are generated through use of a boric acid chelating agent in the composition and curing the composition with UV/NIR radiation.

Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: The invention relates to a method for coating a metallic surface with a composition. This method is characterised in that the composition contains the following in addition to water: a) at least one organic film former containing at least one polymer which is soluble in water or is dispersed in water; b) a quantity of cations and/or hexafluoro complexes of cations selected from the group comprising titanium, zirconium, hafnium, silicon, aluminium and boron; and c) at least one inorganic compound in particle form with an average particle diameter of 0.005 to 0.2 &mgr;m, measured with a scanning electron microscope. The clean metallic surface is brought into contact with the aqueous composition and a film containing particles is formed on the metallic surface. This film is then dried, the dry film having a layer thickness of 0.01 to 10 &mgr;m. The invention also relates to a corresponding aqueous composition.

Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.

Abstract: A polymer composition formed by: I) fluoropolymers selected from one or more of the following: copolymers based on ethylene, TFE and/or CTFE modified with hydrogenated monomers, or blends of these fluoropolymers with PCTFE; said fluoropolymers and/or the corresponding blends optionally mixed with hydrogenated plasticizers; II) one or more inorganic fire-retardants, treated and not with dispersing agents; III) one or more crosslinking agents; IV) optional additives.

Abstract: A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.

Abstract: The invention provides an organic/inorganic hybrid material with a high refractive index at telecommunications wavelengths. Energy curable compositions of the present invention include condensed metal oxide nanoparticles, a high refractive index organometallic coupling agent, an energy curable organometallic coupling agent, and a high refractive index monomer or oligomer. Polymeric materials of the present invention include condensed metal oxide nanoparticles having a mixture of organometallic coupling agents covalently bound to the exterior surface of the nanoparticles and a high refractive index solid polymer matrix, wherein the mixture of organometallic coupling agents includes a high refractive index coupling agent, and a coupling agent covalently bound to the polymer matrix. The materials of the present invention are useful in making optical devices for telecommunications applications.

Abstract: A gas barrier coating composition which undergoes no decrease in barrier properties to gases such as oxygen and water vapor even under high-humidity conditions, contains no compounds thought to be harmful to the human body, and is harmless to the human body; and a gas barrier coating film with excellent gas barrier properties comprising the composition. The gas barrier coating composition comprises (a) a polyvinyl alcohol resin and (b) at least one member selected from the group consisting of a specific metal alcoholate, a hydrolysate of the metal alcoholate, a condensate of the metal alcoholate, a chelate compound of the metal alcoholate, a hydrolysate of the chelate compound and an acylated metal compound. The coating film obtained from the composition has excellent gas barrier properties.

Abstract: A thermoplastic, thermally-conductive composition is provided. The composition comprises a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The composition can be used to make shaped, thermally-conductive articles. The articles can be used as thermal interfaces for dissipating heat from heat-generating devices such as electronic parts. The articles can have good electrical conductivity.

Abstract: A paint system and process are disclosed for hardfacing metal surfaces. In one embodiment of the process, a paint including a dispersion of hard particles is first applied as a coating to a surface. Next, a paint including a dispersion of a braze alloy is applied over the layer of hard particles. The surface is then heated to cause the braze alloy to melt and infiltrate into the hard particles thereby bonding them to the metallic surface. In another embodiment, a first layer of adhesive is applied, and a hardfacing powder is applied onto the adhesive. Then a second layer of adhesive is applied, and a braze alloy powder is applied onto the second adhesive. Then the material is heated as in the first embodiment. In another embodiment, paint containing hard particles is coated onto the substrate, and an acid-containing cross-linked copolymer in the paint is then neutralized to increase the viscosity of the paint to prevent running.

Abstract: The present invention provides a flame retardant resin composition having a good fluidity and excellent recycling property, can yield a molded article having excellent rigidity and flame retardancy, and is particularly applicable for a molded article having a small thickness. Specifically, the flame retardant resin composition contains: 100 parts by weight of a thermoplastic resin (A); 0.5 to 100 parts by weight of a liquid crystal polymer (B); and 0.1 to 30 parts by weight of a silicone compound (C) as a flame retardant.

Abstract: The present invention relates to a method for making a hexagonal boron nitride slurry and the resulting slurry. The method involves mixing from about 0.5 wt. % to about 5 wt. % surfactant with about 30 wt. % to about 50 wt. % hexagonal boron nitride powder in a medium under conditions effective to produce a hexagonal boron nitride slurry. The present invention also relates to a method for making a spherical boron nitride powder and a method for making a hexagonal boron nitride paste using a hexagonal boron nitride slurry. Another aspect of the present invention relates to a hexagonal boron nitride paste including from about 60 wt. % to about 80 wt. % solid hexagonal boron nitride. Yet another aspect of the present invention relates to a spherical boron nitride powder, a polymer blend including a polymer and the spherical hexagonal boron nitride powder, and a system including such a polymer blend.

Abstract: A composition for providing protection against electrical overstress (EOS) comprising an insulating binder, doped semiconductive particles, and semiconductive particles. The composite materials exhibit a high electrical resistance to normal operating voltage values, but in response to an EOS transient switch to a low electrical resistance and clamp the EOS transient voltage to a low level for the duration of the EOS transient.

Abstract: A mixture Ia comprises a mix IIa composed of a) from 1 to 95% by weight of a solid III, preferably a basic solid III, with a primary particle size of from 5 nm to 20 &mgr;m and b) from 5 to 99% by weight of a polymeric composition IV, obtainable by polymerizing b1) from 5 to 100% by weight, based on the composition IV, of a condensation product V of &agr;) at least one compound VI which is capable of reacting with a carboxylic acid or with a sulfonic acid or with a derivative or a iixture of two or more of these, and &bgr;) at least 1 mol per mole of the compound VI of a carboxylic acid or sulfonic acid VII which has at least one functional group capable of free-radical polymerization, or of a derivative thereof or of a mixture of two or more thereof and b2) from 0 to 95% by weight, based on the composition IV, of another compound VIII with an average molecular weight (number average) of at least 5000 having polyether segments in its main or side chain and at least one ester of the formula (E1) to (E5)

Abstract: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.

Abstract: A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.

Abstract: An electroconductive curable resin composition comprising (A) a graphite powder containing boron in the graphite crystal and (B) a curable resin and/or a curable resin composition, at a ratio of 20 to 99.9:80 to 0.1 in terms of the mass ratio of the component (A) to component (B); and a cured product thereof and a formed product obtained by using the curable resin composition. The cured product exhibits excellent electroconductivity even with a relatively small amount of electroconductive filler charged, and also exhibits a high heat resistance, a good heat-radiating property and superior formability or workability.

Abstract: A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin consisting of a blend of silicone oil and octyl-ethoxysilane to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin blend.

Abstract: The invention provides compositions and methods for imparting a translucent optical effect to transparent thermoplastic polymers. The compositions comprise the thermoplastic polymer and 0.01 to 15 parts per hundred by weight (preferably 0.1 to 6, more preferably 0.2 to 5 parts by weight, even more preferably 0.5 to 2 parts by weight, and most preferably 0.5 to 1.5 parts by weight) of at least one particulate, light diffusing material in the form of powders, fibers, whiskers, platelets, flakes, aggregates, agglomerates, and mixtures of these, comprising a average maximum particle size of from about 0.1 microns to about 200 microns (preferably from about 1 to about 100 microns). A first embodiment of the invention comprises a one step method for imparting the translucent optical effect. A second embodiment comprises a two step method, including the use of a concentrate composition.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: A polyvinyl butyral composition is disclosed which is comprised of polyvinyl butyral resin containing an IR absorbing effective amount of lanthanum hexaboride or a mixture of lanthanum hexaboride and at least one of tin oxide and antimony tin oxide. Also disclosed are a sheet of the IR absorbing polyvinyl butyral and a glass laminate having the IR absorbing polyvinyl butyral sheet disposed between two sheets of glass.

Abstract: PHA pellet compositions are provided which are processible into blown and cast free-standing films. The Mw of the PHA in the pellets used to produce the films is at least 470,000, at least 435,000 if PHA thermal stabilizers of the invention are used. In order to achieve a stable, unsupported film having desirable elongational and tensile properties, the Mw of PHA in the film is greater than about 420,000.

Abstract: An antistatic additive includes a tetrahalogenated ionic compound. An antistatic additive composition for organic polymer compositions includes an antistatically-effective amount of the tetrahalogenated ionic compound, a solvent for the tetrahalogenated ionic compound, and a diluent compatible with the tetrahalogenated ionic compound, the solvent and the organic polymer composition. The tetrahalogenated ionic compound preferably is a tetrahalogenated borate, and more specifically lithium or sodium tetrafluoroborate. Organic polymer compositions containing the additive also are provided, as are methods incorporating the additive into the polymer compositions.

Abstract: A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.

Abstract: Inorganic particle/polymer composites are described that involve chemical bonding between the elements of the composite. In some embodiments, the composite composition includes a polymer having side groups chemically bonded to inorganic particles. Furthermore, the composite composition can include chemically bonded inorganic particles and ordered copolymers. Various electrical, optical and electro-optical devices can be formed from the composites.