Boron Atom Dnrm Patents (Class 524/404)
  • Patent number: 9828479
    Abstract: A porous polybenzimidazole (PBI) particulate resin is disclosed. This resin is easily dissolved at ambient temperatures and pressures. The resin is made by: dissolving a virgin PBI resin in a highly polar solvent; precipitating the dissolved PBI in a bath; and drying the precipitated PBI, the dried precipitated PBI being porous. The porous PBI resin may be dissolved by: mixing a porous PBI resin with a highly polar solvent at ambient temperatures and pressures to form a solution.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: November 28, 2017
    Assignee: PBI Performance Products, Inc.
    Inventors: John B. Hopkins, Jr., Karin M. Hudson, Gregory S. Copeland, Michael Gruender
  • Patent number: 9738771
    Abstract: An organic-inorganic composite including: a plurality of anisotropic ceramic particles having different aspect ratios; a resin that is combined with the ceramic particles; and a plurality of projections projecting out from the surface of the ceramic particles, thereby increasing the shear resistance of the interface between the ceramic particles and the resin. At least some of the ceramic particles neighboring each other are closely arranged such that the projections partially contact each other, thereby increasing the shear resistance between the ceramic particles due to the contacting ceramic particles.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: August 22, 2017
    Assignee: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY
    Inventors: Younghee Kim, Sooryong Kim, Wootack Kwon, Hyungmi Lim, Yoonjoo Lee, Kyoungmok Nam, Boyeon Kim
  • Patent number: 9725581
    Abstract: The present invention relates to a polycyclohexylenedimethylene terephthalate resin composition having improved reflectivity, heat resistance, and yellowing resistance. The resin composition according to one embodiment of the present invention includes 40 to 95 wt % of polycyclohexylenedimethylene terephthalate resin; 1 to 50 wt % of a white pigment; and 1 to 50 wt % of a filler, and the amount of germanium (Ge) atoms remaining in the resin is 30 to 1,000 ppm based on the weight of the resin.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: August 8, 2017
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Kyu-Tae Park, Min-Goo Kang, Tae-Woong Lee, Jong-Wook Shin
  • Patent number: 9631128
    Abstract: The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, “M”) represented by R3SiO1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, “Q”) represented by SiO4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: April 25, 2017
    Assignees: NGK Insulators, Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoyuki Fujii, Akio Suzuki
  • Patent number: 9624416
    Abstract: A polyamide resin composition containing a polyamide resin (A) and a property imparting component. The composition comprises relative to 100 parts by volume of the polyamide resin (A), as the property imparting component, 50 to less than 100 parts by volume of flake graphite (B), 5 to 40 parts by volume of carbon fibers (C), and 0.1 to 5 parts by volume of a polyhydric alcohol (D).
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: April 18, 2017
    Assignee: UBE INDUSTRIES, LTD.
    Inventors: Akio Miyamoto, Masuaki Ichikawa, Tetsuya Yasui
  • Patent number: 9611377
    Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: April 4, 2017
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Jiang You, Tianhui Huang, Zhongqiang Yang
  • Patent number: 9567222
    Abstract: Provided area carbon nanotube composite material obtained by treating a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium under a sub-critical or super-critical condition of 50-400 atm, and a method for producing the same. More particularly, the method for producing a carbon nanotube composite material, includes: introducing a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium into a preheating unit under a pressure of 1-400 atm to preheat the mixture; treating the preheated mixture under a sub-critical or super-critical condition of 50-400 atm; cooling and depressurizing the resultant product to 0-1000 C and 1-10 atm; and recovering the cooled and depressurized product. Provided also is an apparatus for producing a carbon nanotube composite material in a continuous manner.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: February 14, 2017
    Assignee: Hanwha Chemical Corporation
    Inventors: Man Woo Jung, Seong Yun Jeon, Seong Cheol Hong, Joo Hee Han, Joo Seok Oh, Jin Seo Lee, Seung Hoe Do
  • Patent number: 9556072
    Abstract: The invention relates to a process for the continuous thermal removal of binder from a metallic and/or ceramic shaped body which has been produced by injection molding, extrusion or pressing using a thermoplastic composition and comprises at least one polyoxymethylene homopolymer or copolymer as binder in a binder removal oven, which comprises the steps (a) removal of binder from the shaped body in a binder removal oven at a temperature which is from 5 to 20° C. below, preferably from 10 to 15° C. below, the temperature of a second temperature stage over a period of from 4 to 12 hours in a first temperature stage in an oxygen-comprising atmosphere, (b) removal of binder from the shaped body at a temperature in the range >160 to 200° C. over a period of from 4 to 12 hours in an oxygen-comprising atmosphere in a second temperature stage and (c) removal of binder from the shaped body at a temperature in the range from 200 to 600° C.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: January 31, 2017
    Assignee: BASF SE
    Inventors: Johan ter Maat, Hans Wohlfromm, Martin Bloemacher, Arnd Thom, Andreas Kern
  • Patent number: 9469735
    Abstract: Disclosed is a method of manufacturing a colorless transparent polyimide film having impregnated glass fabric, wherein the surface of the polyimide film substrate having impregnated glass fabric is flattened by two flattening steps using a roll-to-roll process, thereby solving problems with an increase in surface roughness of the polyimide substrate when manufacturing the polyimide film having impregnated glass fabric in order to enhance thermal and mechanical properties of a film for use in flexible display substrates and in cover windows for flat panel displays and mobile phones.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: October 18, 2016
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Choon Sup Yoon, Seung Hyun Oh
  • Patent number: 9416275
    Abstract: The present invention is related to the elaboration of flexible films from cassava starch for the manufacture of biodegradable packaging useful in the packing and packaging of dry foods and other products. The novel films of the invention are produced by extrusion of a mixture of cassava starch and plasticizer.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: August 16, 2016
    Assignee: Universidad Del Cauca
    Inventors: Hector Samuel Villada Castillo, Diana Paola Navia Porras, Juan Pablo Castaneda Nino
  • Patent number: 9394470
    Abstract: Provided is a silicone composition exhibiting a favorable adhesiveness even when containing a large amount of a thermal conductive filler. The silicone composition contains specific amounts of (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and exhibiting a kinetic viscosity of 60 to 100,000 mm2/s at 25° C.; (B) a silicone resin having at least one aliphatic unsaturated hydrocarbon group in one molecule; (C) a filler including an aluminum powder and a zinc oxide powder; (D) a organohydrogenpolysiloxane represented by the following general formula (1); (E) a organohydrogenpolysiloxane represented by the following general formula (2); (F) a hydrolyzable organopolysiloxane represented by the following general formula (3); (G) a platinum group metal catalyst: effective amount; and (H) a reaction control agent.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: July 19, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita Kitazawa
  • Patent number: 9393674
    Abstract: A carbide composite for a downhole tool may be formed by depositing a first layer on a substrate, and a second layer at least partially adjacent to the first layer. The first and second layers may each include carbides, metal binders, organic binders, or a combination thereof. The first and second carbide layers may have a different particle size, particle shape, carbide concentration, metal binder concentration, or organic binder concentration from one another.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: July 19, 2016
    Assignee: SMITH INTERNATIONAL, INC.
    Inventor: Madapusi K. Keshavan
  • Patent number: 9340656
    Abstract: A shaped part that is formed from a polymer composition that contains a liquid crystalline polymer and a black pigment is provided. By selectively controlling the type and relative concentration of these components, the polymer composition and shaped parts formed therefrom can have a dark black appearance, and yet still exhibit good thermal and mechanical properties at high temperatures.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: May 17, 2016
    Assignee: Ticona LLC
    Inventor: Bruce Mulholland
  • Patent number: 9321918
    Abstract: The present invention relates to stain- or dye-resistant articles comprising a polymer composition comprising at least one semi-aromatic polyamide comprising recurring units resulting from the condensation of terephthalic acid and at least one aliphatic diamine comprising more than 8 carbon atoms, at least one filler and from 0.1 to 35 wt. % of at least one white pigment, based on the total weight of the composition.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: April 26, 2016
    Assignee: SOLVAY SPECIALTY POLYMERS USA, LLC
    Inventors: Glenn P. Desio, Amy Marie Cuevas, Linda M. Norfolk, Geert J. Verfaillie, Nancy J. Singletary
  • Patent number: 9233879
    Abstract: The invention relates to a process for the continuous thermal removal of binder from a metallic and/or ceramic shaped body which has been produced by injection molding, extrusion or pressing using a thermoplastic composition and comprises at least one polyoxymethylene homopolymer or copolymer as binder in a binder removal oven, which comprises the steps (a) removal of binder from the shaped body in a binder removal oven at a temperature which is from 5 to 20° C. below, preferably from 10 to 15° C. below, the temperature of a second temperature stage over a period of from 4 to 12 hours in a first temperature stage in an oxygen-comprising atmosphere, (b) removal of binder from the shaped body at a temperature in the range >160 to 200° C. over a period of from 4 to 12 hours in an oxygen-comprising atmosphere in a second temperature stage and (c) removal of binder from the shaped body at a temperature in the range from 200 to 600° C.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: January 12, 2016
    Assignee: BASF SE
    Inventors: Johan ter Maat, Hans Wohlfromm, Martin Bloemacher, Arnd Thom, Andreas Kern
  • Patent number: 9228092
    Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: January 5, 2016
    Inventors: Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Michael P. Toben, Martin W. Bayes
  • Patent number: 9178120
    Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: November 3, 2015
    Assignee: KANEKA CORPORATION
    Inventors: Tadashi Kokubo, Katsuya Ouchi, Takahisa Iwahara, Kazuhiko Hirabayashi, Hiroshi Okoshi, Tomokazu Tozawa, Shuhei Ozaki
  • Patent number: 9171656
    Abstract: A cellulose material contains cellulose fibers having an impregnation. Accordingly, the impregnation is made of nanoparticles, in particular BNNT, containing a shell of polymers, in particular PEDOT:PSS. The impregnation forms a type of network that can reduce the specific resistance of the cellulose material due to the electrical conductivity of the network. The cellulose material can thereby be advantageously adapted to corresponding applications with respect to the electrical properties thereof. The cellulose material can thus also be used to electrically insulate transformers, wherein the cellulose material is thereby saturated with transformer oil and an adaptation of the specific resistance of the cellulose material to the specific resistance of the oil leads to improved dielectric strength of the transformer insulation. A method for producing the cellulose material described above contains a suitable impregnation step for the cellulose material.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: October 27, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Volkmar Luethen, Gabriele Winkler
  • Patent number: 9101062
    Abstract: A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 ?m and a spherical filler with an average particle diameter DR of 0.05-10 ?m, DL and DR satisfy the relationship DL>DR/2, no heat conductive filler of 30 ?m or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.
    Type: Grant
    Filed: September 7, 2009
    Date of Patent: August 4, 2015
    Assignee: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
    Inventors: Eijiro Aoyagi, Hongyuan Wang, Noriyuki Kirikae, Katsufumi Hiraishi
  • Publication number: 20150132512
    Abstract: Compositions of biobased polymer blends of polymers and a polyhydroxyalkanoate copolymer are described. In certain embodiments, the copolymer is a multiphase copolymer blend having one phase a glass transition temperature of about ?5° C. to about ?50° C. Methods of making the compositions of the invention are also described. Also articles, films and laminates made from the compositions are described.
    Type: Application
    Filed: June 5, 2013
    Publication date: May 14, 2015
    Inventors: Rajendra K. Krishnaswamy, Johan van Walsem, Oliver P. Peoples, Yossef Shabtai, Allen R. Padwa
  • Patent number: 9029440
    Abstract: The present invention relates to a polymer composition including a transparent thermoplastic plastic, an inorganic infrared absorber, also referred to as IR absorber hereinbelow, optionally an inorganic nano-scale pigment, and the combination of at least one organic coloring agent of a specific structure, and to the preparation and use of the polymer compositions according to the invention and to products produced therefrom.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: May 12, 2015
    Assignee: Bayer MaterialScience AG
    Inventors: Alexander Meyer, Joerg Reichenauer, Andrea Scagnelli, Vincenzo Taravella
  • Patent number: 9023920
    Abstract: The present invention relates to a high-strength inflammable blend resin composition including a polyphenylene sulfide resin and a polyethylene terephthalate resin. More specifically, the resin composition of the present invention includes: a basic blend resin containing 10 to 80 wt. % of a polyphenylene sulfide resin, and 20 to 90 wt. % of a polyethylene terephthalate resin; and 0.1 to 20 parts by weight of a modified polystyrene or a styrene-based elastomer with respect to 100 parts by weight of the basic blend resin.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: May 5, 2015
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Sung-Gi Kim, Jae-Bong Lim, Jong-In Lee, Chang-Hyun Lee, Sung-Su Bae, Sang-Mook Lee
  • Publication number: 20150086776
    Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.
    Type: Application
    Filed: March 27, 2013
    Publication date: March 26, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Patent number: 8985818
    Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: March 24, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
  • Publication number: 20150080502
    Abstract: The present disclosure relates to a polymer composition comprising a polymer blend of Polyaryl Ether Ketone (PAEK) and Poly(2,5-benzimidazole) characterized with enhanced mechanical and wear resistance properties as compared to commercial polymer blends of Polyaryl Ether Ketone and Polybenzimidazole. The present disclosure also relates to shaped articles derived from the polymer composition of the present disclosure.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventor: Keki Hormusji GHARDA
  • Patent number: 8980974
    Abstract: A low copper-containing friction material composition used for brake pad is provided, which consists of 4-6 parts of aramid fiber, 2-2.5 parts of tire powder, 5-6 parts of magnesia, 5-6 parts of red vermiculite, 8-10 parts of ceramic fiber, 3.5-5 parts of magnetite, 7-8 parts of boron-containing phenolic resin, 15-17 parts of calcium sulfate crystal whisker, 16-18 parts of potassium titanate, 15-17 parts of barite, 5.5-7 parts of flake graphite, 6-8 parts of friction powder of cashew nut oil, 6-8 parts of calcined petroleum coke, 1.5-2 parts of boron nitride, 5-7 parts of flake aluminum powder, 0.4-0.5 parts of pure copper fiber, and 0.4-0.6 parts of black silicon carbide. The friction material composition has low content of heavy metal, wherein the content of copper is lower than 0.5%, has a satisfactory high temperature and thermal decay resistant performance, long service life, good abrasion resistance and stable friction coefficient.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: March 17, 2015
    Assignee: Ruiyang Automotive Materials (Xiantao) Co., Ltd.
    Inventor: Jim Zewei Zhang
  • Publication number: 20150057401
    Abstract: A die release agent composition is provided that is used by being applied to a die used for the squeeze casting, low-pressure casting, or the like of a metal or a die used for die forging. The die release agent composition includes a mineral oil or a synthetic oil, a solid lubricant, a thermosetting resin, and a polymer compound. The die release agent composition is used by being applied to the inner surface of a die for casting or forging.
    Type: Application
    Filed: January 21, 2013
    Publication date: February 26, 2015
    Inventors: Mikinori Suzuki, Yasunari Oshimoto, Tamotsu Matsuki, Shigeru Sakou, Masaaki Ishiguro, Masashi Mori, Naoto Uesaka, Kazumasa Yasuda, Masayoshi Morooka
  • Publication number: 20150038628
    Abstract: A method for dispersing an alkali or alkaline earth metal borohydride having median particle size less than 30 microns in an organic solvent. The method comprises combining the alkali or alkaline earth metal borohydride, the organic solvent and a surfactant.
    Type: Application
    Filed: January 31, 2013
    Publication date: February 5, 2015
    Applicant: Rohm and Haas Company
    Inventors: Michael Bender, Robert Butterick, III, Edward C. Kostansek, Samuel November, John Yamamoto
  • Patent number: 8946333
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 3, 2015
    Assignee: Momentive Performance Materials Inc.
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Patent number: 8946332
    Abstract: A composition that contains from 30 to 95 wt. %, based on the total weight of the composition, of a thermoplastic component and an effective amount of a flow-enhancing component. The effective amount of the flow-enhancing component reduces the viscosity of the composition by at least 10% compared to the viscosity of a composition comprising the thermoplastic component, but not an effective amount of the flow-enhancing component. The thermoplastic component is selected from the group consisting of polycarbonates, polyesters, and combinations thereof. The flow-enhancing component comprises b1) a component selected from the group consisting of metal oxides, metalloid oxides, metal alkoxides, metalloid alkoxides, and combinations thereof and b2) a mineral filler component. The weight ratio of component b1) to component b2) ranges from 1:25 to 25:1. A method for enhancing the flow of compositions comprising thermoplastic components is also disclosed.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 3, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Josephus Gerardus van Gisbergen, Chris van der Weele, Sreepadaraj Karanam, Mark van der Mee
  • Publication number: 20150030837
    Abstract: The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040° C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.
    Type: Application
    Filed: March 27, 2013
    Publication date: January 29, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20150025188
    Abstract: A resin composition includes (A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp-??(1) where M represents a mesogenic group and Sp represents a spacer, (B) a thermosetting resin; and (C) an inorganic filler.
    Type: Application
    Filed: October 6, 2014
    Publication date: January 22, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Shusuke Yoshihara, Kazuaki Matsumoto
  • Publication number: 20150013477
    Abstract: The composition for coating of a surface intended to be exposed to a metal melt is disclosed. The composition essentially consists of: 8-18 wt-% of a refractory component; 50-75 wt-% of solvent, preferably water; 10-20 wt-% of an inorganic binder; 0-10 wt-%, preferably 2-10 wt-%, of an organic binder; 0.3-7 wt-%, preferably 2-6 wt-%, more preferably, 3-5 wt-% of pyrite; and optionally up to 10 wt-%, preferably up to 5 wt-%, of additional additive or additives. The composition results in a coating on a surface, which coating is able to reduce the dissolved elemental magnesium content in a metal melt to which the surface is exposed.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 15, 2015
    Applicant: SinterCast AB
    Inventors: Patrik POPELAR, Tobias BJÖRKLIND
  • Patent number: 8933157
    Abstract: A boron nitride composition comprising at least two different boron nitride powder materials having different properties, e.g., surface areas, particle size, tap density, etc.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: January 13, 2015
    Assignee: Momentive Performance Materials Inc.
    Inventors: Paulo Meneghetti, Chandrashekar Raman
  • Publication number: 20150003996
    Abstract: Coatings includes about 60 weight percent to about 90 weight percent of one or more fluorinated polymers, about 1 weight percent to about 7 weight percent of one or more erosion resistant fillers about 3 weight percent to about 9 weight percent of one or more anticorrosive pigments, about 1 weight percent to about 4 weight percent of one or more thixotropic agents, and about 1 weight percent to about 4 weight percent of one or more porosity reducing filler materials.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 1, 2015
    Inventors: Kalaga Murali Krishna, Padmaja Parakala, Surinder Singh Pabla, Krishnamurthy Anand
  • Patent number: 8921470
    Abstract: A rubber composition for adhering a steel cord that improves wet heat-resistant adhesioness, particularly heat-resistant adhesioness, by preventing adhesion deterioration due to heat, as well as initial adhesioness between a steel cord and a rubber, is disclosed. The rubber composition comprising 100 parts by weight of a diene rubber component and from 0.1 to 30 parts by weight of composite graphite particles containing boron, obtained by heating and graphitizing carbon black together with boron or a compound containing boron.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: December 30, 2014
    Assignees: Toyo Tire & Rubber Co., Ltd., Nippon Steel Chemical Carbon Co., Ltd.
    Inventors: Takashi Miyasaka, Takashi Yuri, Hiroaki Narita, Hirofumi Hayashi, Yoichi Kawano
  • Patent number: 8921458
    Abstract: To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: December 30, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Kenji Miyata, Toshitaka Yamagata
  • Patent number: 8911642
    Abstract: A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: December 16, 2014
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Anja Staiger, Florian Meyer
  • Patent number: 8910684
    Abstract: A tire comprising an innerliner, where the innerliner includes a rubber and boron nitride dispersed within the rubber.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: December 16, 2014
    Assignee: Bridgestone Corporation
    Inventors: Mary M. Matthiesen, Amy Randall, Mindaugas Rackaitis
  • Publication number: 20140357770
    Abstract: The invention relates to silicone resins comprising metallosiloxane which contains Si—O-Metal bonds and borosiloxane containing Si—O—B bonds and potentially Si—O—Si and/or M-O-M and/or B—O—B bonds. It also relates to the preparation of such silicone resins and to their use in thermoplastic or thermosetting organic polymer or rubber or thermoplastic/rubber blends compositions to reduce the flammability or enhance scratch and/or abrasion resistance of the organic polymer compositions. It further relates to coatings made of such silicone resins for scratch resistance enhancement or flame retardant properties.
    Type: Application
    Filed: November 14, 2012
    Publication date: December 4, 2014
    Applicant: Dow Corning Corporation
    Inventors: Michael Depierro, David Pierre, Vincent Rerat
  • Patent number: 8883898
    Abstract: The invention relates to a method for the impregnation of continuous fibers that comprises coating said fibers with a polymer matrix containing: (a) at least one fluorinated polymer grafted with at least one carboxylic polar function and (b) optionally at least one fluorinated nongrafted polymer. The invention also relates to the composite fibers that can be obtained by said method and to the use thereof.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: November 11, 2014
    Assignee: Arkema France
    Inventors: Gilles Hochstetter, Michael Werth
  • Patent number: 8883890
    Abstract: A crepe agent composition that forms a layer having excellent durability and a method for producing a crepe paper using the same. The crepe agent composition is to be applied to a surface of a cylindrical dryer, and contains an inorganic solid lubricant, a dispersant for dispersing the inorganic solid lubricant, a thermosetting polymer for fixing the inorganic solid lubricant to the surface of the cylindrical dryer, and water as a solvent, the inorganic solid lubricant having a particle diameter of 0.5 to 20 ?m.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: November 11, 2014
    Assignee: Maintech Co., Ltd.
    Inventors: Hiroshi Sekiya, Daisuke Kurihara, Hiraku Sawada, Masayuki Serizawa
  • Patent number: 8871848
    Abstract: A coating composition for a golf ball and a coated golf ball are disclosed. The coating composition comprises a polyurethane and a boron-containing compound that improves the adhesion of the coating to a printed image.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: October 28, 2014
    Assignee: PPG Industries Ohio, Inc.
    Inventor: Kelly J. Gasper
  • Publication number: 20140316045
    Abstract: The invention relates to silicone resins. It also relates to the preparation of organopolysiloxanes and to their use in a thermoplastic or thermosetting organic polymer or thermoplastic blends or thermosetting organic polymer blends or rubbers or thermoplastic/rubbers blends composition to reduce the flammability or enhance scratch and/or abrasion resistance of the organic polymer composition. It further relates to coatings made of such silicone resins for scratch resistance enhancement or flame retardant properties.
    Type: Application
    Filed: November 14, 2012
    Publication date: October 23, 2014
    Applicant: Dow Corning Corporation
    Inventors: Mert Kilinc, David Pierre, Vincent Rerat
  • Publication number: 20140309352
    Abstract: A curable polymer composition comprising: (A) a thermoset maleimide resin precursor component; and further comprising one or both of: (B) an arylsulphone-containing maleimide component; and (C) a polyarylpolymer thermoplastic toughening agent component, wherein in the absence of component (B), said component (C) comprises one or more maleimide pendant and/or end groups, and thermoset resins and composites derived therefrom.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 16, 2014
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Steven Richard Ward, Paul Mark Cross, Robin Maskell
  • Patent number: 8852487
    Abstract: A method for injection molding a thermoplastic composition that contains a polyarylene sulfide and a boron-containing nucleating agent is provided. By selectively controlling certain aspects of the polyarylene sulfide and nucleating agent, as well as the particular manner in which they are combined, the crystallization properties of the resulting thermoplastic composition can be significantly improved. This allows the “cooling time” during a molding cycle to be substantially reduced while still achieving the same degree of crystallization. The cooling time can be represented by the “normalized cooling ratio”, which is determined by dividing the total cooling time by the average thickness of the molded part.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: October 7, 2014
    Assignee: Ticona LLC
    Inventors: Ke Feng, Peter Radden, Michael Schafer
  • Patent number: 8853313
    Abstract: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2 W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: October 7, 2014
    Assignee: Cool Options, Inc.
    Inventor: James D Miller
  • Publication number: 20140248504
    Abstract: The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition.
    Type: Application
    Filed: February 17, 2012
    Publication date: September 4, 2014
    Inventors: Shihui Song, Yukihiko Yamashita, Yoshitaka Takezawa, Hideyuki Katagi
  • Publication number: 20140235773
    Abstract: A polysiloxane compound for LED device includes (A) cage-shaped, mesh-shaped or chain-shaped polysiloxane containing alkenyl groups, (B) polysiloxane containing Si—H bonds, (C) a filler composition with a protective function, and (D) a catalyst with ene hydrogen silylation reaction. The filler composition with a protective function is selected from the group of high thermal conductivity material, flame retardant, anti-aging material, UV-resistant material, gas-barrier material, thermal expansion suppression material and/or high temperature-resistant material that are suitable for use in the base, lamp cup and/or encapsulation body of the LED device to effectively improves the lifespan and operational stability of the LED device.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicant: CSI CHEMICAL COMPANY LIMITED
    Inventors: SONG KE, CHIH WEI HUANG
  • Publication number: 20140235770
    Abstract: The present invention relates to a composition containing a polyamide matrix having high thermal conductivity, and including a nitride and a metal oxide, as well as, optionally, a flame-retardant system. Said composition can be used in particular for producing components for lighting apparatuses including light-emitting diodes.
    Type: Application
    Filed: September 25, 2012
    Publication date: August 21, 2014
    Applicant: RHODIA OPERATIONS
    Inventors: Yeong-Chool Yu, Tae-Kyun Kim