Abstract: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2 W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.

Abstract: The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition.

Abstract: A polysiloxane compound for LED device includes (A) cage-shaped, mesh-shaped or chain-shaped polysiloxane containing alkenyl groups, (B) polysiloxane containing Si—H bonds, (C) a filler composition with a protective function, and (D) a catalyst with ene hydrogen silylation reaction. The filler composition with a protective function is selected from the group of high thermal conductivity material, flame retardant, anti-aging material, UV-resistant material, gas-barrier material, thermal expansion suppression material and/or high temperature-resistant material that are suitable for use in the base, lamp cup and/or encapsulation body of the LED device to effectively improves the lifespan and operational stability of the LED device.

Abstract: The present invention relates to a composition containing a polyamide matrix having high thermal conductivity, and including a nitride and a metal oxide, as well as, optionally, a flame-retardant system. Said composition can be used in particular for producing components for lighting apparatuses including light-emitting diodes.

Abstract: A thermally conductive polymer composite material and an article including the same. The thermally conductive polymer composite material includes 15 to 20 parts by weight of a wholly aromatic liquid crystalline polyester resin; and 80 to 85 parts by weight of a thermally conductive additive.

Abstract: A stabilized composition containing a metal hydride of boron, including complex metal hydrides of boron, in a polyalkylsiloxane amorphous fumed silica mixture is provided. In a preferred embodiment the composition is a stabilized mixture of aluminum borohydride, polydimethylsiloxane and amorphous fumed silica. A method to prepare the stabilized mixture is also provided.

Abstract: Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film forming polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof.

Abstract: Exemplary embodiments provide materials and methods for a nanocomposite material and a fuser member containing the nanocomposite material in a fusing system, wherein the nanocomposite material can contain a plurality of carbon nanotubes (CNTs) and a plurality of inorganic nano-fillers (INFs) disposed in a polymer matrix to provide the nanocomposite material with desirable properties.

Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.

Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Abstract: Described herein are novel metal salts capable as nucleating agents for polyolefins. The present invention relates to such salts synthesized by reacting potassium hydroxide with carboxylic acids and further, to the achievement of high crystallization temperatures in polypropylene compositions upon dispersal therein of formulations containing one or more of the said metal salts.

Abstract: Provided are a heat-curable resin composition that yields a molded article having excellent dimensional accuracy and mechanical property even when high-temperature molding is carried out, a production method of article and a molded article thereof, a cured article, a molded article, and a separator for a fuel cell. A heat-curable resin composition in an embodiment of the present invention comprises: (A) a binder in an amount of 100 parts by mass comprising 50 mass % or more of a polymer comprising 60 mol % or more monomer units having a carbon-carbon double bond in a side chain; (B) a carbon material in an amount of 150 to 1,000 parts by mass; (C) a curing initiator in an amount of 1 to 10 parts by mass; and (D) a curing retarder in an amount of 0.1 to 2 parts by mass.

Abstract: A melt-molded article containing an EVOH resin composition of low acetic acid odor and good long run workability is provided.

Abstract: An ethylene-vinyl alcohol copolymer resin having low odor of acetic acid and good long-run workability is provided. The ethylene-vinyl alcohol copolymer resin which contains an alkali metal salt (A) and has a very low extractable carboxylate content is obtained by a method including contacting the ethylene-vinyl alcohol copolymer resin with an aqueous solution containing carbon dioxide gas.

Abstract: A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm·cm. Also disclosed are articles and methods of use therefor.

Abstract: A method of making a composite sheet, a method of making composite component and a composite component are provided. The method of making a composite sheet includes providing a container, adding a binder to the container, adding a plurality of randomly oriented fibers to the binder in the container, and subjecting the container to motion to coat the plurality of randomly oriented fibers with the binder. The method includes curing the binder and coated plurality of randomly oriented fibers to form a composite sheet. The plurality of randomly oriented fibers of the composite sheet are interlocked within the binder. The composite has uniform strength in all planar directions.

Abstract: A tire comprising at least one cured rubber component having boron nitride dispersed within a cured rubber matrix.

Abstract: A bearing having a surface and a self-lubricating surface coating composition deposited on the surface, wherein the self-lubricating surface coating composition includes a curable acrylate composition having a metallic composition. The metallic composition having a metallic acrylate compound according to Formula I: and about 30 mass % to about 45 mass % PTFE fiber.

Abstract: A flame retardant composition is produced by mixing a flammable organic material with an inorganic phosphorus-inorganic phosphoric oxyacid compound or its salts. The inorganic phosphorus-inorganic phosphoric oxyacid compounds are produced by reacting an inorganic phosphorus compound having a valence of 3-4 with an inorganic phosphorus oxyacid with a valence of 5. Carbonization auxiliaries, metal-containing compound having a carbonization acceleration effect, a comb-like polymer and a filler may be added with the flame retardant composition.

Abstract: The present disclosure relates to a film or a composite that provides excellent heat removal capabilities and improved chemical stability and methods of forming the film and the composite. The film can be a layer of a nanomaterial. The composite can include a nanomaterial and a thermal interface material (TIM). The methods generally involve dispersing the nanomaterial in a carrier when forming the film or the composite.

Abstract: A boron nitride composition comprising at least two different boron nitride powder materials having different properties, e.g., surface areas, particle size, tap density, etc.

Abstract: A thermally conductive composition and a system and method for forming such compositions. The thermally conductive composition comprises a polymer material and a thermally conductive filler, such as boron nitride. In one embodiment, a method of forming a composition having high through-plane conductivity comprises mixing an isotropic boron nitride material, such as boron nitride agglomerates, and a polymer resin material under conditions such that the peak stress during mixing does not exceed 80 kPa.

Abstract: A thermally conductive plastic composition and a system and method for forming such compositions. The thermally conductive composition comprises a polymer material and a thermally conductive filler, such as boron nitride, and exhibits good in-plane thermal conductivity, through-plane conductivity, or both. The system for forming thermally conductive plastic compositions comprises an extruder and an extruder screw comprising fractional mixing elements. The extruder can also comprise a screw with shovel elements located in a region of the system for introducing a thermally conductive filler into the extruder. The system and method allow for the processing of thermally conductive plastic compositions comprising boron nitride and can allow for the processing of boron nitride agglomerates such that the agglomerates remain sufficiently in tact to provide a composition exhibiting both excellent in-plane and through-plane conductivity.

Abstract: An object of the present invention is to provide a flame retardant resin composition including magnesium hydroxide particles and a cellulose resin and having excellent flame retardance, mechanical characteristics, and moldability. The flame retardant resin composition includes a thermoplastic resin including a cellulose resin and a flame retardant. The flame retardant includes, at 40% by weight to 60% by weight of the total flame retardant, a first type of magnesium hydroxide particles with a particle diameter of 10 nm to 50 nm, having a particulate surface modified by an epoxy silane coupling agent, and, at 60% by weight to 40% by weight of the total flame retardant, a second type of magnesium hydroxide particles with a particle diameter of 100 nm to 1,000 nm, having a particulate surface modified by an amino silane coupling agent.

Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Abstract: A shape memory structure includes, an elastic material, and a viscoelastic material commingled with the elastic material. The shape memory structure is reformable from a first shape to a second shape upon exposure to a change in environment that softens the viscoelastic material thereby allowing the shape memory structure to creep under stress stored in the elastic material.

Abstract: Some implementations provide a composite material that includes a first material and a second material. In some implementations, the composite material is a metamaterial. The first material includes a chiral polymer (e.g., crystalline chiral helical polymer, poly-?-benzyl-L-glutamate (PBLG), poly-L-lactic acid (PLA), polypeptide, and/or polyacetylene). The second material is within the chiral polymer. The first material and the second material are configured to provide an effective index of refraction value for the composite material of 1 or less. In some implementations, the effective index of refraction value for the composite material is negative. In some implementations, the effective index of refraction value for the composite material of 1 or less is at least in a wavelength of one of at least a visible spectrum, an infrared spectrum, a microwave spectrum, and/or an ultraviolet spectrum.

Abstract: A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards.

Abstract: The present invention is directed to compositions, baths, and methods for composite plating including polytetrafluoroethylene (PTFE), and more particularly, to compositions, baths, and methods of composite plating with PTFE in a metal or alloy matrix where the materials used in the process contain no or essentially no PFOS (perfluorooctane sulfonate) and/or no PFOA (perfluorooctanoic acid).

Abstract: The thermoplastic resin in accordance with the present invention includes a unit (A) by 25 mol % to 60 mol %, the unit (A) having a biphenyl group, a linear unit (e.g., a linear aliphatic hydrocarbon chain) (B) by 25 mol % to 60 mol %, and a unit (C) by 1 mol % to 25 mol %, the unit (C) having a substituent selected from the group consisting of non-fused aromatic groups, fused aromatic groups, heterocyclic groups, alicyclic groups, and alicyclic heterocyclic groups, each of which has an effect of folding a main chain.

Abstract: A resin composition includes solid brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0.01-20 wt %, high thermal conductivity powder of 5-85 wt % closest packed by Horsfield packing model and a processing aid of 0-10 wt %; the resin composition possesses high glass transition temperature ranged from 169° C. to 235° C. measured by DSC, high thermal conductivity ranged from 5.7 W/m·K to 14.2 W/m·K, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract: The invention relates to a heat curable composition for fire-resistant or intumescent composite parts, which is free of any halogen additive or halogen structure in the components thereof, and which comprises: a) 100 parts by weight of a dry resin, including a1) an unsaturated polyester having an acid index lower than 10 and/or a2) a vinyl ester; b) 40 to 200 parts by weight of a reactive thinner among ethylenically unsaturated monomers; c) 20 to 110 parts by weight of a thermal expansion agent selected from melamine and derivatives thereof, guanidine, glycine, urea, triisiocynurates, and azodicarbinamide; d) 0 to 250 parts by weight of aluminium trihydrate; e) 10 to 80 parts by weight of a carbonisation precursor agent selected from multifunctional polyols; f) 50 to 200 parts by weight of a compound selected from a phosphorus derivative and/or a boric acid derivative; g) optionally at least one metal oxide; h) optionally other additives and fillers; i) optionally reinforcements containing natural or syntheti

Abstract: Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.

Abstract: A retarder aid increases the applicable temperature range of phosphonate/borate cement-retarder systems to at least 302° C. (575° F.), and 207 MPa (30,000 psi). The retarder aid comprises a terpolymer of styrene sulfonate, maleic anhydride and acrylate of ethylene oxide. Cement slurries containing the retarder and retarder aid may be used for both primary-cementing and remedial-cementing applications.

Abstract: Methods for preparing nanocomposites with electrical properties modified by powder size below 100 nanometers. Both low-loaded and highly-loaded nanocomposites are included. Nanoscale coated, un-coated, whisker type fillers are taught. Electrical nanocomposite layers may be prepared on substrates.

Abstract: Provided herein are nucleating agent compositions for use in nucleating polymers during processing. Methods for making and using the nucleating agent compositions are also provided. The nucleating agent in dry powder form is wet milled in a liquid carrier, such as a plasticizer, surfactant, or lubricant.

Abstract: A resin composition including the following components (A) to (C): (A) polyarylene sulfide resin: 20 wt %<component (A)?60 wt %; (B) hexagonal boron nitride: 8 wt %?component (B)?55 wt %; and (C) flat glass fiber: 15 wt % ?component (C)?55 wt % wherein the amount ratio of each component is a weight percentage relative to the total amount of the components (A) to (C).

Abstract: A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

Abstract: A method for injection molding a thermoplastic composition that contains a polyarylene sulfide and a boron-containing nucleating agent is provided. By selectively controlling certain aspects of the polyarylene sulfide and nucleating agent, as well as the particular manner in which they are combined, the crystallization properties of the resulting thermoplastic composition can be significantly improved. This allows the “cooling time” during a molding cycle to be substantially reduced while still achieving the same degree of crystallization. The cooling time can be represented by the “normalized cooling ratio”, which is determined by dividing the total cooling time by the average thickness of the molded part.

Abstract: A boron-containing nucleating agent is provided for use with a polyarylene sulfide. The boron-containing nucleating agent can have low crystallinity, a small particle size, and a large specific surface area. By selectively controlling certain aspects of the nucleating agent, the crystallization properties of a thermoplastic composition including the nucleating agent and a polyarylene sulfide can be significantly improved. For instance, the recrystallization temperature can be increased, which can allow the “cooling time” during a molding cycle to be substantially reduced. Through use of the boron-containing nucleating agent the recrystallization temperature can be greater than about 231° C.

Abstract: A process of manufacturing a white polyimide film comprising performing condensation polymerization of monomers comprising diamine and dianhydride components to obtain a solution; adding a dehydrant, a catalyst and a coloration filler into the solution to obtain a precursor solution; coating a layer of the precursor solution on a support; and baking the coated layer of the precursor solution to form a white polyimide film. The diamine component can include 2,2?-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay.

Abstract: The present invention provides a golf ball comprising a core and a cover covering the core, wherein the cover is formed from a cover composition containing a non-petroleum based polyester resin as a resin component (A) and a needle-like and/or fibrous filler (B). The present invention further provide a golf ball comprising a core and a cover covering the core, wherein the cover is formed from a cover composition containing, a non-petroleum based polyester resin (A-1), at least one petroleum based thermoplastic resin (A-2), and a compatibilizer (C) containing at least a (meth)acrylic resin (C-1) having a polar functional group and an olefin resin (C-2) having a polar functional group. According to the present invention, durability, abrasion resistance and repulsion of a golf ball can be improved.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a thermoplastic polyimide/polybenzimidazole blend. A method of making the fuser member is provided.

Abstract: A curable composition contains (A) a polyorganosiloxane base polymer having an average per molecule of at least two aliphatically unsaturated organic groups, optionally (B) a crosslinker having an average per molecule of at least two silicon bonded hydrogen atoms, (C) a catalyst, (D) a thermally conductive filler, and (E) an organic plasticizer. The composition can cure to form a thermally conductive silicone gel or rubber. The thermally conductive silicone rubber is useful as a thermal interface material, in both TIM1 and TIM2 applications. The curable composition may be wet dispensed and then cured in situ in an (opto)electronic device, or the curable composition may be cured to form a pad with or without a support before installation in an (opto)electronic device.

Abstract: A composition of thermally conductive flame-retarded plastic comprises of: (A) 5 wt % to 45 wt % of polyolefines; (B) 3 wt % to 25 wt % of thermoplastic elastomer; (C) 35 wt % to 85 wt % of thermal conductive fillers; (D) 5 wt % to 55 wt % of flame retardant additive free of halogen, phosphorus and nitrogen; and (E) 0.5 wt % to 6 wt % of coupling agents. The composition exhibits high surface impedance and meets at least the UL94 V1 rating. The composition has a thermal conductivity greater than 1.0 Watts/m-K, a heat deflection temperature greater than 105° C. Besides, the composition is easy to mold and can be made by the method of injection, extrusion or thermoforming.

Abstract: A resin composition for giving molded articles that effectively block heat radiation from sunlight and are excellent in transparency, and molded articles thereof. The resin composition comprises an aromatic polycarbonate resin (Component A), hexaboride particles of at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sr and Ca (Component B-1) and other resin different from Component A (Component B-2), wherein the total content of Component B-1 and Component B-2 is 0.001 to 1 part by weight per 100 parts by weight of Component A, the resin composition contains particles (1) composed of Component B-1 and particles (2) composed of Component B-1 and Component B-2, both the particles (1) and (2) having a number average secondary particle diameter of 50 ?m or less and a maximum secondary particle diameter of 300 ?m or less.

Abstract: In order to provide a non-stick coating which permits a very high coat thickness even under load, a polymeric matrix with embedded non-stick particles is used.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.