Abstract: A composition includes an elastomeric composition. The elastomeric composition can include an epichlorohydrin composition, and the elastomeric composition can be substantially free of a fluoroelastomer composition. The composition can further include a filler material which includes a reinforcement-grade carbon black. The composition can further include a peroxide curative.

Abstract: A rubber composition for adhering a steel cord that improves wet heat-resistant adhesioness, particularly heat-resistant adhesioness, by preventing adhesion deterioration due to heat, as well as initial adhesioness between a steel cord and a rubber, is disclosed. The rubber composition comprising 100 parts by weight of a diene rubber component and from 0.1 to 30 parts by weight of composite graphite particles containing boron, obtained by heating and graphitizing carbon black together with boron or a compound containing boron.

Abstract: A method of activating boron nitride comprises exposing the boron nitride to a fluid enabling —OH hydroxyl radicals and/or H3O+ to be delivered and creating B—OH bonds and/or NH2 bonds in the boron nitride, and eliminating the fluid and recovering the activated boron nitride.

Abstract: A composition including a high temperature thermoplastic polymer and a filler material is disclosed. A method for forming a coating upon a wellbore tool includes forming a powder composition comprising a thermoplastic polymer and a filler material and applying the composition on the body surface. Wellbore tools having components coated with such compositions are also disclosed.

Abstract: Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K.

Abstract: The object of the present invention is to provide a polyarylene sulfide composition having excellent thermal conductivity, dimensional stability, heat resistance and low gas property, which is particularly useful to applications of electric parts such as electric and/or electronic parts or automobile electric parts. The present invention relates to a polyarylene sulfide composition comprising a polyarylene sulfide (a), a metal silicon powder (b), a fibrous filler (c), and preferably a release agent (d) and at least one thermally conductive filler (e) selected from the group consisting of a scale-like boron nitride powder (e1) having a hexagonal structure, a coated magnesium oxide powder (e2) coated with a complex oxide of silicon and magnesium and/or a complex oxide of aluminum and magnesium, a high purity magnesite powder (e3) which is a magnesite comprising magnesium carbonate as a main component and has a magnesium carbonate content of from 98 to 99.999% by weight, and graphite (e4).

Abstract: The present invention relates to a clear coat enamel composition comprising: a) at least one film-forming resin with at least two functional groups, b) at least one colorless particulate inorganic material having an average particle size of 1-500 nm before being introduced into the coating composition, c) at least one polysiloxane having at least one functional group, d) at least one colorless particulate inorganic material having an average particle size of 1-10 ?m which is preferably not surface-modified, before being introduced into the coating composition, e) at least one crosslinking agent with at least two functional groups, which are reactive with the functional groups of the film-forming resin (a) and/or with the functional groups of the polysiloxane (c), f) optionally a component based on polyurea, wherein the components (a), (c), (e) and (f) are each different, composite coatings comprising a base coat enamel containing colored pigments and/or effect pigments and a clear coat enamel which is app

Abstract: The present invention discloses a foamable composition. The foamable composition includes a partially-crystalline melt processible perfluoropolymer and a foam nucleating package. The foamable composition has a uniform foam cell size where the foam cell size of at least 90% of the foamed cells is 50 micrometers or less. The foam nucleating package ranges from 0.1 to 10 wt % of the combined weight of the perfluoropolymer and the foam nucleating package.

Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.

Abstract: Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.

Abstract: There is provided a polymer ceramic composite which includes one or more particulate ceramics and a mixture of polymers. There is further provided methods of manufacture and application of the polymer ceramic composition. The composition finds use as a mouldable armour strike face, particularly in personal protective equipment and in vehicle or aircraft armour.

Abstract: The invention relates to aqueous formulations comprising silane-modified polymeric binders having a siloxane content and inorganic nanoparticles, a process for the preparation thereof and the use thereof for the preparation of aqueous coating compositions.

Abstract: Provided is a method for producing a thermally-conductive adhesive sheet including a thermally-conductive adhesive agent layer by performing: a composition preparation step of preparing a thermally-conductive adhesive agent composition including a thermally-conductive particle and an acrylic polymer component; and an adhesive agent layer formation step of forming a sheet-shaped thermally-conductive adhesive agent layer with the thermally-conductive adhesive agent composition, wherein in the composition preparation step, a cyclic organic compound of 8 or less carbon atoms, or an organic compound of 3 or less carbon atoms having a hydroxy, ketone, aldehyde, carboxyl or nitrile group is mixed as a constitutional component of the thermally-conductive adhesive agent composition.

Abstract: A silicone resin composition contains a borosiloxane resin containing a B—O—Si bond and boron nitride. A silicone resin composition contains an aluminosiloxane resin containing an Al—O—Si bond and aluminum nitride.

Abstract: Disclosed is a radiation shielding member having improved radiation absorption performance, including 80.0˜99.0 wt % of a polymer matrix or metal matrix and 1.0˜20.0 wt % of a radiation shielding material in the form of nano-particles having a size of 10˜900 nm as a result of pulverization, wherein the radiation shielding material is homogeneously dispersed in the matrix through powder mixing or melt mixing after treatment with a surfactant which is the same material as the matrix or which has high affinity for the matrix. A preparation method thereof is also provided. This radiation shielding member including the nano-particles as the shielding material further increases the collision probability of the shielding material with radiation, compared to conventional shielding members including micro-particles, thus reducing the mean free path of radiation in the shielding member, thereby exhibiting superior radiation shielding effects.

Abstract: The present invention provides a light-absorbent resin composition for laser welding whereby transparency can be maintained and stable laser welding is possible. The light-absorbent resin composition for laser welding includes a resin and laser-light-absorbent nanoparticles, wherein the laser-light-absorbent nanoparticles are nanoparticles of tungsten oxide indicated by the general formula WyOz, and/or nanoparticles of composite tungsten oxide indicated by the general formula MxWyOz.

Abstract: High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

Abstract: A new method is disclosed for the exfoliation of hexagonal boron nitride into mono- and few-layered nanosheets (or nanoplatelets, nanomesh, nanoribbons). The method does not necessarily require high temperature or vacuum, but uses commercially available h-BN powders (or those derived from these materials, bulk crystals) and only requires wet chemical processing. The method is facile, cost efficient, and scalable. The resultant exfoliated h-BN is dispersible in an organic solvent or water thus amenable for solution processing for unique microelectronic or composite applications.

Abstract: A highly heat-conductive epoxy resin composition, which comprises epoxy resin in a liquid state at room temperature, a latent curing agent, a highly heat-conductive filler, and a non-ionic surfactant, where preferably the latent curing agent is mixed with a portion of the epoxy resin in a liquid state at room temperature to form a master batch, can keep a relatively low viscosity, even if a large amount of the filler is contained, and can be cured at a relatively low temperature for a short time, and has a distinguished storage stability as one-component composition.

Abstract: The use of nucleating agents to manufacture polymeric stents is disclosed. The resulting stents may have increased crystallinity, decreased crystal size, increased mechanical properties, and faster degradation times.

Abstract: Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications.

Abstract: This invention relates to composites for use in high temperature elastic composite applications. Most particularly, this invention relates to elastic composites formed with a silanol-silanol condensation reaction mixture of silsesquioxane silicone resins thermally stabilized by boron nitride, silica and boron oxide additives as their matrix. The polymer matrix composite comprise a matrix of cured high, intermediate and optionally low molecular weight silicone resins including boron nitride and silica additives and reinforcing material.

Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.

Abstract: A white polyimide film comprises a polyimide base polymer and a coloration filler homogeneously distributed in the white polyimide film by reacting a diamine component with a dianhydride component and a coloration filter. The diamine component can include 2,2?-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay. The white polyimide film has a coefficient of thermal expansion (CTE) less than about 60 ppm/° C. in a temperature range between about 100° C. and about 200° C. , an elongation rate between about 5% and about 60%, and a b*-value between about 0 and about 15. In some embodiments, a method of manufacturing the white polyimide film is also described.

Abstract: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.

Abstract: The present invention relates to a hexagonal boron nitride platelet particle having a layer of a ferromagnetic metal between the layers of hexagonal boron nitride thereof, and a process for preparing the composition thereof. The present invention further relates to polymeric composites formed therefrom. The present invention describes improvements in thermal conductivity of said composites when subject to an orienting magnetic field.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polymer blend polyimide polymer and amino silicone.

Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Abstract: Methods for synthesizing macroscale 3D heteroatom-doped carbon nanotube materials (such as boron doped carbon nanotube materials) and compositions thereof. Macroscopic quantities of three-dimensionally networked heteroatom-doped carbon nanotube materials are directly grown using an aerosol-assisted chemical vapor deposition method. The porous heteroatom-doped carbon nanotube material is created by doping of heteroatoms (such as boron) in the nanotube lattice during growth, which influences the creation of elbow joints and branching of nanotubes leading to the three dimensional super-structure. The super-hydrophobic heteroatom-doped carbon nanotube sponge is strongly oleophilic and an soak up large quantities of organic solvents and oil. The trapped oil can be burnt off and the heteroatom-doped carbon nanotube material can be used repeatedly as an oil removal scaffold.

Abstract: Polyimide resin compositions that contain an end-capped rigid aromatic polyimide, graphite and carbon filaments are found to exhibit low wear at high temperatures. Such compositions are especially useful in molded articles that are exposed to wear conditions at high temperatures such as aircraft engine parts.

Abstract: A suspension for protecting a semiconductor material includes a polymeric matrix as carrier medium, inorganic particles, and at least one of an absorber dye or a plasticizer.

Abstract: A polymer additive for improving the reheat characteristics of a polymer or polymeric composition comprises an inorganic material which is such that a 2.5 mm thick polyethylene terephthalate plaque incorporating the inorganic material has, when tested, an absorption ratio of less than 0.9, wherein the absorption ratio is either the ratio of A1/A2 or the ratio A1/A3, wherein: A1 is the maximum absorption between 400 nm and 550 nm; A2 is the maximum absorption between 700 to 1100 nm; A3 is the maximum absorption between 700 to 1600 nm. Preferred inorganic materials are titanium nitride, indium tin oxide and lanthanum hexaboride.

Abstract: Disclosed is a coating formed from a composition containing a film-forming resin and a plurality of particles dispersed in the resin. The average particle size of the particles is 0.1 to 50 microns, and the particles have a hardness sufficient to impart greater mar and/or scratch resistance to the coating as compared to a coating where no particles are present. Also, the difference between the refractive ranges from 1 to 1.5. A method for preparing a powder coating including the particles also is provided.

Abstract: A shape memory structure includes, an elastic material, and a viscoelastic material commingled with the elastic material. The shape memory structure is reformable from a first shape to a second shape upon exposure to a change in environment that softens the viscoelastic material thereby allowing the shape memory structure to creep under stress stored in the elastic material.

Abstract: The present invention relates to a process for the continuous production of polymer mixtures comprising: a) from 10 to 80% by weight of a biodegradable polyester (Q) composed of aliphatic or aliphatic and aromatic dicarboxylic acids and of aliphatic dihydroxy compounds, and b) from 20 to 90% by weight of one or more polymers (T) selected from the group consisting of: polylactic acid, polycaprolactone, polypropylene carbonate, polyglycolide, aliphatic polyester, cellulose acetate, and polyhydroxyalkanoate, where i) a mixture composed of the aliphatic dihydroxy compounds, of the aliphatic and aromatic dicarboxylic acids and, if appropriate, of further comonomers (component C) is mixed, without addition of any catalyst, to give a paste or, as an alternative, the liquid esters of the dicarboxylic acids are fed into the system, as also are the dihydroxy compound and, if appropriate, further comonomers, without addition of any catalyst, and in a first stage this mixture, together with the entire amount or with a

Abstract: A composition that contains from 30 to 95 wt. %, based on the total weight of the composition, of a thermoplastic component and an effective amount of a flow-enhancing component. The effective amount of the flow-enhancing component reduces the viscosity of the composition by at least 10% compared to the viscosity of a composition comprising the thermoplastic component, but not an effective amount of the flow-enhancing component. The thermoplastic component is selected from the group consisting of polycarbonates, polyesters, and combinations thereof. The flow-enhancing component comprises b1) a component selected from the group consisting of metal oxides, metalloid oxides, metal alkoxides, metalloid alkoxides, and combinations thereof and b2) a mineral filler component. The weight ratio of component b1) to component b2) ranges from 1:25 to 25:1. A method for enhancing the flow of compositions comprising thermoplastic components is also disclosed.

Abstract: Boron nitride nanotubes (BNNTs), boron nitride nanoparticles (BNNPs), carbon nanotubes (CNTs), graphites, or combinations, are incorporated into matrices of polymer, ceramic or metals. Fibers, yarns, and woven or nonwoven mats of BNNTs are used as toughening layers in penetration resistant materials to maximize energy absorption and/or high hardness layers to rebound or deform penetrators. They can be also used as reinforcing inclusions combining with other polymer matrices to create composite layers like typical reinforcing fibers such as Kevlar®, Spectra®, ceramics and metals. Enhanced wear resistance and usage time are achieved by adding boron nitride nanomaterials, increasing hardness and toughness. Such materials can be used in high temperature environments since the oxidation temperature of BNNTs exceeds 800° C. in air.

Abstract: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2 W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.

Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).

Abstract: A thermoplastic molding composition characterized by its flame retardance is disclosed. The composition contains A) aromatic poly(ester) carbonate having a weight-average molecular weight of at least 25,000, B) (co)polyester and C) graft (co)polymer having a core-shell morphology, comprising a grafted shell that contains polymerized alkyl(meth)acrylate and a composite rubber core that contains interpenetrated and inseparable polyorganosiloxane and poly(meth)alkyl acrylate where the weight ratio of polyorganosiloxane/poly(meth)alkylacrylate/grafted shell is 70-90/5-15/5-15, D) phosphorus-containing compound, E) fluorinated polyolefin and F) boron compound having average particle diameter of 2 to 10 microns.

Abstract: The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.

Abstract: A plastic molding material contains at least one filler and a polymer resin, selected from the group made up of cyanate ester resins, epoxy novolac resins, multifunctional epoxy resins, bismaleimide resins and their mixtures. The proportion of filler in the plastic molding material is in the range of 65 to 92 wt. %, with reference to the overall mass of the plastic molding material.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyamideimide/polybenzimidazole polymer blend. A method of manufacturing the fuser member is described.

Abstract: Disclosed is a resin composition which has high heat dissipation properties and high electrical insulation properties at the same time, while having low-temperature bondability to a conductor circuit or the like. The resin composition contains (A) a thermoplastic polyimide resin having a glass transition temperature of 160 DEG C or less and (B) an inorganic filler. The aspect ratio, that is the value of length/thickness, of the inorganic filler (B) is 9 or more, and the content of the inorganic filler (B) is 40-70 weight % relative to the total weight of the resin composition. The resin composition has a melt viscoelasticity of 10-300 MPa (inclusive) at 170 DEG C.

Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.

Abstract: The disclosure provides methods and materials for imparting corrosion resistance to a substrate, as well as the corrosion-resistant substrates prepared accordingly. Compositions and methods include nonpyrolyzed, silicon-based polymer coatings prepared on substrates. The prepared coatings are highly stable and resistant to corrosion. The invention finds utility, for example, in the fields of surface and coating chemistry.

Abstract: A white polyimide film comprises a polyimide base polymer and a coloration filler homogeneously distributed in the white polyimide film by reacting a diamine component with a dianhydride component and a coloration filter. The diamine component can include 2,2?-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay. The white polyimide film has a coefficient of thermal expansion (CTE) less than about 60 ppm/° C. in a temperature range between about 100° C. and about 200° C. , an elongation rate between about 5% and about 60%, and a b*-value between about 0 and about 15. In some embodiments, a method of manufacturing the white polyimide film is also described.

Abstract: Composite nanogranules from polymer/inorganic nanoparticle, especially first composite nanogranules which are formed from first polymer and inorganic nanoparticles, second composite nanogranules which are obtained by forming second polymer on the first composite nanogranules, third composite nanogranules which is obtained by forming third polymer on the second composite nanogranules, and Nth composite nanogranules which is obtained by forming Nth polymer on the (N?1)th composite nanogranules with the similar method, are disclosed. A composition comprising anyone of the composite nanogranules described above is disclosed. The preparation method thereof and use of the same are also disclosed.

Abstract: The invention relates to a ceramic product, manufactured from a mixture made of natural and/or synthetic inorganic non-metal raw materials, at least one binder and optionally further additives. In order to provide ceramic products allowing for disadvantages known from the prior art to be eliminated, at least with respect to corrosion and erosion, it is proposed that the ceramic products are manufactured from a mixture comprising a) at least 10% by weight (based on the weight of all solids of the mixture) oxidic components, b) 0.05 to 2.7% by weight (based on the weight of all solids of the mixture) at least one organic-based binder, acting as a solubilizer in the mixture, and c) 3 to 10% by weight (based on the weight of all solids of the mixtures) hydrous dispersing agent, and that the ceramic product contains less than 0.1% by weight (based on the total weight of the ceramic product) of carbon after the use thereof at temperatures above 600° C.

Abstract: A monolithic refractory castable material comprises from about 25 to about 80 weight percent of graphite, from about 1 to about 15 weight percent of a water dispersible, curable phenolic novolac resin, and from about 70 to about 15 weight percent of one or more refractory aggregates, based on the weight of the monolithic refractory castable material. The monolithic refractory castable material is water dispersible and may be delivered to a structure surface by casting, pumping, shotcreting or gunning processes. In one embodiment, the monolithic refractory castable material may be employed to install or replace a blast furnace lining.