Abstract: The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity.

Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Abstract: A poly(ester)carbonate compositions characterized by its flame resistance and high impact strength is disclosed. The composition that contains branched aromatic poly(ester)carbonate, a graft polymer wherein the graft base is silicone rubber or silicone-acrylate rubber, talc, phosphorus-containing flameproofing agent, and an inorganic boron compound, and an optional anti-dripping agent satisfies enhanced fire-protection requirements.

Abstract: A thermoplastic composition comprises poly(arylene ether) having an initial intrinsic viscosity greater than 0.25 dl/g as measured in chloroform at 25° C.; a polyolefin having a melt temperature greater than or equal to 120° C. and a melt flow rate of 0.3 to 15; a first block copolymer having a aryl alkylene content greater than or equal to 50 weight percent based on the total weight of the first block copolymer; a second block copolymer having an aryl alkylene content less than 50 weight percent based on the total weight of the second block copolymer; and a flame retardant, wherein the poly(arylene ether) is present in an amount greater than the amount of polyolefin. The composition is useful in the production of covered wire.

Abstract: A method of activating boron nitride comprises exposing the boron nitride to a fluid enabling —OH hydroxyl radicals and/or H3O+ to be delivered and creating B—OH bonds and/or NH2 bonds in the boron nitride, and eliminating the fluid and recovering the activated boron nitride.

Abstract: The invention relates to a plastic component for use in a lighting system, the plastic component comprising a semi-aromatic polyamide (X) comprising repeat units derived from aliphatic diamines and dicarboxylic acids wherein: (a) the aliphatic diamines consist a mixture of 10-70 mole % of a short chain aliphatic diamine with 2-5 C atoms and 30-90 mole % of a long chain aliphatic diamine with at least 6 C atoms; (b) the dicarboxylic acids consist of a mixture of 5-65 mole % aliphatic dicarboxylic acid and optionally aromatic dicarboxylic acid other than terephthalic acid, and 35-95 mole % terephthalic acid; and (c) the combined molar amount of terephthalic acid and the long chain aliphatic diamine is at least 60 mole %, relative to the total molar amount of the dicarboxylic acids and diamines. The invention also relates to a polymer composition that can be used for making the said plastic component comprising 100 pbw of a semi-aromatic polyamide (X) and 1-250 pbw of an inorganic material.

Abstract: A superconducting coil for a magnetic resonance apparatus is formed by one or more wound superconducting conductors that are embedded in a cured sealing compound, with nanoparticles added to the sealing compound.

Abstract: A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.

Abstract: The present invention aims to provide an interlayer film for a laminated glass, which has excellent heat shielding property and allows infrared communication waves to sufficiently pass therethrough. The present invention is an interlayer film for a laminated glass, which includes an infrared communication wave-transmitting region and a transparent region in a plane of the interlayer film, the infrared communication wave-transmitting region containing a binder resin and zinc oxide particles doped with a trivalent or tetravalent metal, the transparent region containing a binder resin and metal hexaboride particles.

Abstract: Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.

Abstract: A method of forming a resin and filler composite system generally includes softening a polymer formed by a moisture sensitive chemical reaction of one or more monomers, and adding at least one or more fillers to the softened polymer to form a resin and filler composite system. Formation of foam is substantially inhibited when adding at least one or more fillers to the softened polymer.

Abstract: A polyamide resin composition comprising a polyamide (X) having a diamine constituent unit which is mainly composed of a m-xylylenediamine unit and a dicarboxylic acid constituent unit which is mainly composed of an adipic acid unit; and specific amounts of a phosphorus acid antioxidant and alkaline component. The polyamide (X) is characterized by a specific range of terminal-group concentration balance and a specific amino-group reaction rate. This composition can simultaneously achieve inhabitation of yellow discoloration and reduction of number of gels or fish eyes.

Abstract: A hydrophobic surface coating, in particular for electronic and electrotechnical components, can be produced easily and inexpensively. For this purpose, particles and micro powders, hydrophobic particles in particular, are incorporated into the protective lacquer.

Abstract: A neutron shield material that exhibits high heat resistance and ensures neutron shielding capacity. A composition for neutron shield material excelling in heat resistance and ensuring neutron shielding capacity is provided by comprising a hydrogenated bisphenol type epoxy of the formula: (1) (wherein each of R1 to R4 is independently selected from the group consisting of CH3, H, F, Cl and Br, and n=0 to 2), a hardening agent component having at least one cyclic structure and two or more amino groups, a density increasing agent and a boron compound.

Abstract: A fiber size composition contains a modified polyolefin, a hydrophilic coupling agent, a boron-containing, fluorine-containing compound, a blend of at least two fatty acids and a compound selected from phosphorus(V) compounds and sulfur(VI) compounds, the fiber size composition being substantially free of conventional lower oxidation state antioxidants and optical brighteners. Composite materials produced from reinforcing fiber materials sized with a fiber size composition according to the invention exhibit improved properties such as, for example, increased strength and/or improved color stability.

Abstract: Disclosed is a thermally conductive adhesive comprising an adhesive polymer resin, a thermally conductive filler and a microhollow filler. The adhesive comprising a microhollow filler that can form a porous structure, in addition to a thermally conductive filler, can provide an adhesive tape having excellent thermal conductivity and adhesive properties.

Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

Abstract: Silicone compositions particularly useful for the production of anti-fouling varnishes for application to support substrates, these providing an anti-fouling varnish for textiles covered with silicone elastomers which is economical, adhesive, non-slip and glossy; the subject varnishes comprise a crosslinkable silicone composition containing, per 100 parts by weight: 1, at least 80 parts by weight of: (1.1), 2., 0.1 to 10 parts of weight of: (1.2), 3., 0 to 10 parts by weight of at least one polydimethylisiloxane (PDMS) acrylate or epoxide, 4., 0 to 10 parts by weight of at least one silylated compound which includes at least one ultrafine filler, 7., 0 to 10 parts by weight of at least one thickener, and 8., 0 to 10 parts by weigh of at least one additional functional additive.

Abstract: Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film fowling polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof.

Abstract: The present invention relates to thermoplastic moulding compositions based on thermoplastics with an electrically insulating, thermally conductive filler and with a further thermally and electrically conductive filler, and to production of these and to their uses.

Abstract: The incorporation of a synergistic combination of a boron-containing fungicide and an anhydride-functional polyolefin coupling agent during the manufacture of lignocellulosic based thermoplastic materials significantly increases their resistance to surface impairment caused by mold. The preferred amount is about 0.5 to 3 percent by weight of the coupling agent and about 0.5 to 3 percent by weight of the boron containing fungicide.

Abstract: The present invention relates generally to sizing compositions for fibers used in composite materials. More specifically, this invention relates to siloxane fiber sizing solutions comprising rubbery-polymers and their use in preparing composite materials. Using the sizings of the present invention not only improves the energy absorption of the composite materials made thereof, but also maintains the interfacial strength of composite materials. Particularly, the rubbery-polymers of the present invention are functionalized with chemical groups that react to the fiber surface and/or to the polymeric resin. In addition, because the rubbery-polymer is incorporated as one block of a block copolymer, it advantageously improves both, the interfacial strength and energy absorption.

Abstract: A composition is provided that is applicable for providing a non-stick abrasion-resistant coating on a surface, but not as a primer layer, said composition comprising fluoropolymer and an effective amount of ceramic particles having an average size of at least about 10 micrometers to improve the abrasion resistance of said coating on said surface by at least 10% as determined by the dry SBAR method, said composition optionally containing adhesion promoter in an amount up to about 10 wt % of the wt. of said fluoropolymer.

Abstract: A thermoplastic compound is disclosed, comprising polyhydroxyalkanoate and macrocyclic poly(alkylene dicarboxylate) oligomer. Optionally the compound also includes additional polymers and functional additives to modify physical properties of the compound. Molded or extruded plastic articles can be made from the compound. The compound is ductile, in comparison to the polyhydroxyalkanoate without the macrocyclic poly(alkylene dicarboxylate) oligomer.

Abstract: The invention relates to a composite material including nanotubes of a chemical element selected from the compounds of the elements of columns IIIa, IVa and Va of the periodic table, dispersed in a polymer matrix including (a) at least one fluorinated homo- or copolymer and (b) at least one fluorinated homo- or copolymer grafted with at least one carboxylic polar function. The invention also relates to the use of the composite material and to the use of at least one fluorinated homo- or copolymer grafted with at least one carboxylic polar function for increasing the tensile strength of a composite material containing the above nanotubes dispersed in a fluorinated polymer matrix.

Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition, and more particularly, to an acrylic pressure-sensitive adhesive composition, which comprises (a) 100 weight parts of an acrylic copolymer, (b) 0.001 to 30 weight parts of an antistatic agent; and (c) 0.01 to 10 weight parts of a corrosion inhibitor, thereby being optically transparent, causing durability and reliability not to change, and simultaneously improving antistatic performance and preventing generation of corrosion although the adhesive composition comes into contact with a metal surface.

Abstract: A silicone emulsion composition for wood treatment is prepared by emulsifying and dispersing (A) an organopolysiloxane having at least two SiH groups, (B) a surfactant, and (C) a curing catalyst in water to form a silicone emulsion, and adding (D) a boron compound to the silicone emulsion.

Abstract: Provided are compositions comprising infrared absorptive inorganic nanoparticles and an ethylene copolymer, and methods to produce the compositions. The infrared absorptive inorganic nanoparticles preferably include antimony tin oxide (ATO), indium tin oxide (ITO), lanthanum hexaboride (LaB6), or mixtures thereof. Also provided are polymer blends, polymeric films and sheets, solar control laminates, and processes to produce the polymer blends, polymeric films and sheets and solar control laminates.

Abstract: The invention relates to a resin polymer blend comprising at least two dry blended, non-melt processible resin polyimide particulates, wherein the non-melt processible resin polyimide articulates are molded by compression molding.

Abstract: A polysaccharide-based solid material including, in its mass, at least one active agent having bactericidal, fungal, insecticidal and/or flame-retardant properties, and at least one complexing agent and/or at least one polymeric matrix having a complexing agent. The active agent includes at least one compound selected from the group including boron, silica, aluminum, phosphorus, iodine, derivatives thereof, aluminosilicate derivatives, and mixtures thereof. The solid material is characterized by an improved stability and by reduced environmental impact, and makes it possible to prepare materials based on wood particles and woods having a particular resistance against environmental attacks such as moisture.

Abstract: A halogen-free, fire-resistant rubber composition comprising: 100 parts by weight of elastomer comprising 50-100 parts of at least one olefin-type elastomer; at least one fire-retardant boron source; at least one phosphorous source; at least 75 parts of at least one fire-retardant metal-hydrate; and at least one selected from the group consisting of a fire-retardant nitrogen compound and a nitrile-containing elastomer. The composition is suitable for use in fire-resistant, low-smoke hose. The hose may be used in fluid-handling systems requiring flame resistance and/or low smoke generation in fire.

Abstract: Provided are a polymer resin composition and a method of preparing the same. The polymer resin composition includes: a polymer resin; 0.01-10.0 parts by weight of flaky pigment particles having an inverse aspect ratio of 0.01-0.1 based on 100 parts by weight of the polymer resin; and 0.01-10.0 parts by weight of polyhedral pigment particles having an inverse aspect ratio of 0.300-0.999 based on 100 parts by weight of the polymer resin. Using the polymer resin composition, a polymer resin molded product having excellent appearance, i.e., having a uniform color even in resin flow lines or resin weld lines, and in which there is no degradation in the physical properties of the polymer resin contained therein can be manufactured at a low cost.

Abstract: A method for processing polyester wastes, especially used polyester bottles, which comprises shredding, washing, drying and melting the waste mixture to obtain a starting raw material wherein a modifying agent selected from the group comprising a combination of polysiloxane and a plasticizer selected from the group of phthalates, or a combination of silazanes and silanes is added to the shredded and dried waste mixture, the amount of the modifying agent being 4 to 6% by weight, based on the waste mixture.

Abstract: Chemically crosslinked polycyclooctene having excellent shape recovery properties is prepared by ring-opening metathesis polymerization of cis-cyclooctene followed by chemical crosslinking. The crosslinked polycyclooctene can be shaped, the shape memorized, a new shape imparted with the original shape being recoverable by suitable temperature adjustment. The dependence of shape memory characteristics on degree of crosslinking was established. In addition to polycyclooctene, blends thereof with other materials such as SBR, EVA, polyurethane rubbers, and inorganic fillers can be utilized to provide chemically crosslinked products having excellent and tailored shape memory properties.

Abstract: Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.

Abstract: This specification discloses a conductive composition relying upon spherical boron nitride particles and thermally expanded graphite to impart high through-plane thermal conductivity in thermoplastics for use in hot environments, including the electronics industry.

Abstract: The present techniques provide a method for making wear surfaces comprising a thermoplastic matrix blended with ceramic particles. The wear surfaces may optionally contain other materials, such as friction modifying additives. Wear surfaces formed according to these techniques may be used to protect such surfaces as the side rails of conveyor belts, the teeth of buckets used on front end loaders, rock or debris chutes, and self dumping hoppers, among others.

Abstract: Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C., at least one hyperbranched aromatic polyamide having terminal alkylcarboxamide groups, and, optionally a thermally conductive filler; and molded articles made therefrom.

Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Abstract: Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF2 powder; and at least one hyperbranched polyesteramide having terminal hydroxy groups; and molded articles made therefrom.

Abstract: The invention relates to a method for preparing a powdered polymer selected from a polyamide, a copolyamide or a copolyesteramide by anionic polymerization in a solvent solution, characterized in that the polymerization of the monomers) generating said polymer is made in the presence of a catalyst, an activator, at least one amide one of which is always a N,N?-alkylene bisamide, and an organic or inorganic filler, the amount of N,N?-alkylene bisamide added in the medium being determined based on the specific surface are desired for the powder particles, said powder particles having an essentially constant diameter or one depending on the desired mean diameter of the powder particles, said powder particles having an essentially constant specific surface area.

Abstract: The present invention provides a polyarylene sulfide resin composition which shows high dielectric constant and low dielectric dissipation factor, has excellent moldability, and has improved corrosive property to metal parts. More specifically, to 100 parts by weight of (A) polyarylene sulfide resin, compounded are 10 to 400 parts by weight of (B) an alkaline earth metal titanate showing 50 or higher relative dielectric constant and 0.05 or lower dielectric dissipation factor at 1 MHz, and containing less than 500 ppm of metal ion which is extracted by hot water; and 0.01 to 15 parts by weight of (C) one or more compound selected from hydroxides and oxides of alkaline earth metals.

Abstract: An article with an abradable dry powder coating thereon comprises an abradably coated article with a substrate surface and having at least one coating of a liquid primer on the substrate surface and then coating with at least one abradable dry powder coating on the surface of the liquid primer. The sequence of layers may also be reversed, or additional layers may be useful. The abradable dry powder coating is formed of a dry powder coating composition including a thermoset resin having a cure temperature combined with at least one filler material, wherein the filler is formed of a material which does not melt substantially at or below the cure temperature of the resin, whereby an abradable coating results employing a filler to make the coating.

Abstract: An improved friction material includes inorganic fibers formed from a melt of volcanic black rock and additives. The black rock comprises silica oxide, magnesium oxide, potassium permanganate, aluminum oxide, iron oxide, silicon dioxide, titanium dioxide, sodium oxide, and boron. The additives include potassium permanganate and boron. As a result of their composition, the fibers are temperature resistant and lightweight, yet strong. The fibers exhibit a melting point between 1500 degrees centigrade and 1650 degrees centigrade, a working range of ?130 degrees centigrade to 700 degrees centigrade, a density of 1.8 g/cc, a surface density between 160 g/m2 and 350 g/m2, and a tensile strength between 500 lbf/in2 and 1800 lbf/in2. The friction material is made from layers of the inorganic fibers and a bonding material and has a working temperature between 250 degrees centigrade and 650 degrees centigrade, with a melting point of approximately 1200 degrees centigrade.

Abstract: In order to provide a non-stick coating which permits a very high coat thickness even under load, a polymeric matrix with embedded non-stick particles is used.

Abstract: A resin composition including the following components (A) to (C): (A) polyarylene sulfide resin: 20 wt %<component (A)?60 wt %; (B) hexagonal boron nitride: 8 wt %?component (B)?55 wt %; and (C) flat glass fiber: 15 wt % component?(C)?55 wt % wherein the amount ratio of each component is a weight percentage relative to the total amount of the components (A) to (C).

Abstract: An object of the present invention is to provide a resin composition excellent in retort resistance at high temperature, gas barrier property, and anti-pinhole property as well as a multi-layer structure using the same. The invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (A) and a polyamide-based resin (B), wherein the ethylene-vinyl alcohol copolymer (A) is an ethylene-vinyl alcohol copolymer comprising the following structural unit (1), preferably obtained by saponifying a copolymer of 3,4-diacetoxy-1-butene, a vinyl ester-based monomer, and ethylene: wherein X is a bonding chain which is an arbitrary bonding chain excluding an ether bond, R1 to R4 each independently represents an arbitrary substituent, and n represents 0 or 1.

Abstract: Flame retardant compositions are disclosed which comprise (a) at least one particulate material which expands on the application of heat and (b) at least one particulate nano-filler, together with at least one polymer and/or at least one curable monomer or oligomer. The compositions may also contain certain silicon-based materials. Flame-retardant compositions comprising polyorganosiloxanes containing one or more functional groups selected from amino, hydroxyl, methacrylic, acrylic and epoxy groups, are also disclosed.

Abstract: A resin composition includes brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0-20 wt %, high thermal conductivity powder of 5-85 wt % and a processing aid of 0-10 wt %. The resin composition possesses high glass transition temperature, high thermal conductivity, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract: In a master batch containing a heat radiation shielding component, which is used to produce heat radiation shielding transparent resin forms, the master batch has as chief components a thermoplastic resin and a hexaboride represented by XB6, wherein X is at least one selected from La, Ce, Pr, Nd, Gd, Tb, Dy, Ho, Y, Sm, Eu, Er, Tm, Yb, Lu, Sr and Ca. The hexaboride, which is a heat radiation shielding component, is contained in an amount of from 0.01 part by weight or more to less than 20 parts by weight based on 100 parts by weight of said thermoplastic resin. The use of this master batch enables simple production of heat radiation shielding transparent resin forms having a high visible-light transmission power and a high heat radiation shielding performance, without relying on any high-cost physical film formation methods.