With Nitrogen-containing Reactant, Or Wherein The Poly 1,2-epoxy Reactant Contains A Nitrogen Atom Patents (Class 525/113)
  • Patent number: 10899926
    Abstract: A composition including at least one polymer containing silane groups, at least one epoxy resin, and at least one amine of the formula (I). The composition is low in odor, low in toxicity, and highly workable. It enables low-emission products which cure rapidly at ambient temperature to form macroscopically homogeneous films or bodies having good mechanical properties, high thermal stability and good adhesion properties, the mechanical properties being able to be adjusted from very elastic through to tough elastic. The composition is especially suitable as adhesive and/or sealant or coating.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 26, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt, Hans Häberle, Steffen Kelch
  • Patent number: 10881682
    Abstract: The disclosure describes methods and therapeutic compositions comprising polymers modified with N-alkyl-hydroxy groups comprising one or more carbon atoms. The compositions are useful for gene delivery, and exhibit broad-spectrum antiviral activity and low toxicity in vitro.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: January 5, 2021
    Assignee: International Business Machines Corporation
    Inventors: James Hedrick, Dylan Boday, Jeannette Garcia, Rudy Wojtecki, Yi Yan Yang, Chuan Yang
  • Patent number: 10874458
    Abstract: The present invention relates to a method for manufacturing a nonmagnetic water-cooled microwave ablation needle. The manufacturing method is designed for a microwave ablation needle of a nonmagnetic material and has a proper process procedure, favorable assembly quality, and high production efficiency. The produced nonmagnetic water-cooled microwave ablation needle is applicable to microwave tumor ablation surgery in a nuclear magnetic resonance imaging environment, and helps a doctor in charge to clearly determine a position of a tumor, improve piercing precision, have preferable control on a whole surgery process, improve a success rate of the surgery, reduce damage on surrounding normal tissues as much as possible on the premise of effectively inactivating the tumor, alleviate pain of a patient, and shorten a recovery cycle.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: December 29, 2020
    Assignee: NANJING VISON-CHINA MEDICAL DEVICES R & D CENTER
    Inventor: Ting Yang
  • Patent number: 10340055
    Abstract: Disclosed are methods of lowering application viscosities of or of reducing or eliminating monomer content in electrical impregnating materials comprising or consisting of an emulsion of an unsaturated polyester or a mixture of unsaturated polyesters, water, at least one radical polymerization initiator or radical polymerization initiator/promoter mixture, at least one surfactant having an HLB-value of greater than 15, optionally at least one reactive diluent, and optionally further additives, a process for preparing zero or low VOC electrical impregnation materials, a method of impregnating electrical or electromechanical devices and a method of increasing the stability of aqueous emulsions of unsaturated polyesters.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 2, 2019
    Assignee: ELANTAS PDG, INC.
    Inventors: Thomas J. Murray, Bharathi Balagam
  • Patent number: 10308757
    Abstract: A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 4, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Nebojsa Jelic, Rolf Hueppi, Zeljko Sikman
  • Patent number: 10259917
    Abstract: A prepreg having at least one layer of carbon fibers and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibers, wherein the curable thermosetting resin system includes: a curable thermosetting resin including at least one epoxide group, the curable thermosetting resin having an epoxy equivalent weight of from 140 to 180 g/eq; a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; and a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier includes at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: April 16, 2019
    Assignee: Gurit (UK) Ltd.
    Inventors: Paul John Spencer, Benjamin Edward Creaser
  • Patent number: 10179832
    Abstract: The present invention relates to a catalyst composition for curing epoxy group containing compounds comprising a base and a quaternary ammonium salt, of Formula (I): with R1, R2, R3, R4, R5, Y, A and X being as defined herein. Also encompassed are adhesive compositions containing said catalyst composition and the use of the catalyst composition.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 15, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christian Holtgrewe, Pablo Walter, Thomas Bachon, Rainer Schoenfeld
  • Patent number: 9994706
    Abstract: An acrylic ester containing resin mixture for production of reinforced composite, and the process of making and using the same.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: June 12, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Toni Ristoski, David H. Bank, Gary L. Jialanella
  • Patent number: 9845386
    Abstract: The present invention provides the following multilayer heat-shrinkable styrene-based film having an appropriate surface shape, together with excellent lubricity and blocking resistance, and resistance to ink skipping and like problems during the printing process: a multilayer heat-shrinkable styrene-based film having: layers (A) each containing 0.8 to 2.5 parts by weight of high impact polystyrene resin and 0.02 to 0.15 parts by weight of organic fine particles having a mean particle diameter of 0.5 to 5 ?m per 100 parts by weight of a block copolymer of 75 to 90 wt % vinyl aromatic hydrocarbon and 10 to 25 wt % conjugated diene hydrocarbon; and a layer (B1) containing a block copolymer of 70 to 85 wt % vinyl aromatic hydrocarbon and 15 to 30 wt % conjugated diene hydrocarbon; or a layer (B2) containing a resin composition containing a copolymer of 98 to 40 wt % vinyl aromatic hydrocarbon and 2 to 60 wt % aliphatic unsaturated carboxylic acid ester.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: December 19, 2017
    Assignee: GUNZE LIMITED
    Inventors: Masaharu Maruo, Naoki Ohno, Tadayoshi Tanaka, Hiroyuki Furukawa
  • Patent number: 9631047
    Abstract: The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under damp, cold conditions, to form films of high hardness and low brittleness. It is particularly well suited for low-emission coatings that cure at room temperature.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 25, 2017
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
  • Patent number: 9562154
    Abstract: A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 ?m to 10 ?m in a matrix of the thermoplastic resin.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: February 7, 2017
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Masayuki Okoshi, Daisuke Nakayama, Tsuyoshi Miyamoto, Hiroyuki Moriya, Yuko Iwadate
  • Patent number: 9353251
    Abstract: The purpose of the present invention is to provide a thermoplastic resin composition having excellent rigidity and impact strength and a method for producing the same. The thermoplastic resin composition is obtained by mixing a polyolefin resin (such as a polypropylene resin), a polyamide resin (such as nylon 11 resin), and a compatibilizer (such as maleic anhydride-modified EPR, maleic anhydride-modified EBR). The thermoplastic resin composition is characterized in having a resin phase separate structure as observed under an electron microscope, wherein the resin phase separate structure consists of a continuous phase and a disperse phase which is dispersed in the continuous phase, there is a microdisperse phase in the disperse phase, and the average diameter of the microdisperse phase is 5 to 1,200 nm.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 31, 2016
    Assignees: TOYOTA BOSHOKU KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Masayuki Kito, Jumpei Kawada, Makoto Mouri, Osamu Watanabe, Makoto Kato
  • Patent number: 9169403
    Abstract: A powder coating composition for PC strand coating which, when used for the coating of a PC strand, can advantageously form a coating film having an even thickness at low cost without causing uneven thickness or stringness is disclosed. The powder coating composition of this invention for PC strand coating is characterized by having a melt viscosity of 3,000-15,000 poise.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: October 27, 2015
    Assignees: NIPPON PAINT CO., LTD., SUMITOMO (SEI) STEEL WIRE CORP.
    Inventors: Tomoyuki Hirai, Yoshitaka Ishihara, Koichiro Natori, Toshihiko Niki, Yoshihiko Touda, Takayuki Yamagiwa
  • Patent number: 9102816
    Abstract: Provided are: a tire rubber composition improving fuel economy and abrasion resistance while maintaining good wet-grip performance or improving it; and a pneumatic tire including the same.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: August 11, 2015
    Assignee: SUMITOMO RUBBER INDUSTRIES, LTD.
    Inventor: Soh Ishino
  • Publication number: 20150141576
    Abstract: Coalesced rubber particles having an average particle size of 5-50 microns are produced by: (1) adding simultaneously to a latex of pre-crosslinked rubber particles a solvent and an electrolyte solution to form swollen rubber aggregation particles, wherein the solvent has a lower boiling point than water and a capacity of swelling the rubber by at least 10 wt %, and the electrolyte is a solution of at least one metal salt; (2) removing the solvent under atmospheric pressure or low vacuum and at temperature greater than 80° C. to coalesce the rubber into particles having an average particle size of 5-50 50 microns; (3) filtering and washing with methanol; and (4) filtering the washed particles to remove methanol. An epoxy resin is blended with the particles and residual methanol removed, to obtain a blend containing coalesced rubber particles having an average particle size of 5-50 microns in the blended state.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Applicant: ZEON CHEMICALS L.P.
    Inventors: Soobum Choi, Lawrence Justice, James Eckler
  • Publication number: 20150114693
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.
    Type: Application
    Filed: March 3, 2014
    Publication date: April 30, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Geum Hee Yun, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim, Keung Jin Sohn
  • Patent number: 8969503
    Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: March 3, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Fabio Aguirre Vargas, Raymond J. Thibault, John Beckerdite
  • Patent number: 8952097
    Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 10, 2015
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Matthias Gössi
  • Publication number: 20140364568
    Abstract: Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Yi WEI, Alexandre BAIDAK, James Senger
  • Publication number: 20140357784
    Abstract: A modified conjugated diene polymer, which can be used as a raw material of a cross-linked polymer for automobile tires, is prepared by a method including a step of polymerizing a monomer having a conjugated diene compound etc. in the presence of a compound of formula (1) or (2) and an alkali metal compound to obtain a conjugated diene polymer, and a step of reacting the polymer and a compound of formula (3). In formulae (1) and (2), R1 is hydrocarbylene; Q is —N(-A1)- etc.; A1 is hydrocarbyl without active hydrogen atom and may have substituent(s). In formula (3), E is a functional group etc. which has no active hydrogen atom and is bound to R4 by an atom of N; R2 and R3 are hydrocarbyl groups; R4 is a hydrocarbylene group; and n is an integer of 0 to 2.
    Type: Application
    Filed: December 19, 2012
    Publication date: December 4, 2014
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki Morita, Takeshi Yuasa, Koichiro Tani, Naoya Nosaka, Ryoji Tanaka, Koji Okada
  • Patent number: 8815401
    Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: August 26, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshihiro Kato, Takeshi Nobukuni, Masayoshi Ueno
  • Patent number: 8784711
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: July 22, 2014
    Assignee: Hutchinson
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Publication number: 20140178656
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 26, 2014
    Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
    Inventor: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD
  • Publication number: 20140170326
    Abstract: Crosslinker-accelerator system for the thermal crosslinking of polyacrylates with functional groups suitable for entering into linking reactions with cyclic ethers, more particularly epoxide groups or oxetane groups, comprising at least one substance containing epoxide or oxetane groups (crosslinker) and at least one substance with an accelerating action for the linking reaction at a temperature below the melting temperature of the polyacrylate (accelerator).
    Type: Application
    Filed: December 23, 2013
    Publication date: June 19, 2014
    Applicant: tesa SE
    Inventors: Norbert Grittner, Sven Hansen, Alexander Prenzel, Stephan Zöllner
  • Patent number: 8742018
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Jacob, Marty J. Null
  • Patent number: 8729197
    Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: May 20, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Michael A. Kropp
  • Patent number: 8716401
    Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 6, 2014
    Assignee: Lintec Corporation
    Inventors: Yasunori Karasawa, Isao Ichikawa
  • Publication number: 20140114022
    Abstract: Embodiments of the present disclosure provide a curable composition having an epoxy resin component having an epoxide equivalent weight of 75 grams/equivalent to 210 grams/equivalent, an amine component having a hydrogen equivalent weight of 18 grams/equivalent to 70 grants/equivalent, and an acrylate component having an acrylate equivalent weight of 85 grams/equivalent to 160 grams/equivalent, wherein the acrylate component is 1 part per hundred parts epoxy resin to less than 5 parts per hundred parts epoxy resin.
    Type: Application
    Filed: April 20, 2012
    Publication date: April 24, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventor: Marvin L. Dettloff
  • Patent number: 8674039
    Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: March 18, 2014
    Assignee: Wacker Chemie AG
    Inventors: Michael Faatz, Reinhard Haerzschel
  • Patent number: 8653202
    Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 18, 2014
    Assignee: TORAY Industries, Inc.
    Inventors: Koichi Fujimaru, Toshihisa Nonaka
  • Publication number: 20140023839
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 23, 2014
    Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD
    Inventor: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD
  • Patent number: 8614266
    Abstract: A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: December 24, 2013
    Assignee: Tyco Electronics Services GmbH
    Inventors: Haiying Li, William Lee Harrison
  • Patent number: 8608899
    Abstract: A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: December 17, 2013
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Karsten Frick
  • Publication number: 20130289209
    Abstract: Disclosed is an interfacial polymer for a network used as a coupling agent in mixing of rubber-silica. More particularly, the interfacial polymer for a rubber-silica network is a block copolymer containing a copolymer of conjugated diene and vinyl aromatic monomers, in which when used as a coupling agent in the mixing of synthetic rubber and silica (an inorganic material), the polymer enhances silica dispersibility within the rubber, and improves compatibility and processability, resulting in considerable improvement in the dynamic property as well as the mechanical property of the rubber, and when used in a tire, etc., it enhances automobile braking performance and reduces rolling resistance.
    Type: Application
    Filed: September 20, 2012
    Publication date: October 31, 2013
    Applicants: Institute for Research & Industry Cooperation, PNU, Korea Kumho Petrochemical Co., Ltd.
    Inventors: Gwang Hoon Kwag, Jong Yeop Lee, Jae Yun Kim, Han Baek Lee, Sang Chul Ji, Hyun Jong Paik, Won Ho Kim, Hee Jeong Kim, Ki Hyun Kim
  • Publication number: 20130281573
    Abstract: Provided are: a fiber-reinforced composite material which has mode I interlaminar fracture toughness, mode II interlaminar fracture toughness and compressive strength under heat and humidity conditions at the same time; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements (A), (B), (C) and (D). (A) An epoxy resin (B) Resin particles that satisfy the following conditions (b1)-(b3) and are insoluble in an epoxy resin (b1) The particle size distribution index is 1.0-1.8. (b2) The particle sphericity is 90 or more. (b3) The glass transition temperature of the particles is 80-180° C. (C) At least one elastomer component that is selected from among block copolymers containing a block having a glass transition temperature of 20° C.
    Type: Application
    Filed: January 20, 2012
    Publication date: October 24, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuko Goto, Nobuyuki Tomioka, Yuji Echigo, Hiroaki Sakata, Shiro Honda, Hiroshi Taiko
  • Patent number: 8536273
    Abstract: The instant invention relates to epoxy resin compositions comprising an epoxy resin, a block copolymer having at least one block predominantly composed of methyl methacrylate units or a core shell component and a hardener of the polyoxyalkyleneamine type. The epoxy materials cured from these compositions have high impact resistance.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: September 17, 2013
    Assignee: Huntsman International LLC
    Inventors: Chantal Hubschmid, Celine Meunier, Ulrich Weidmann
  • Publication number: 20130190452
    Abstract: The present invention relates to a multicomponent resin system comprising a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof b. an epoxide functional resin as compound capable of reacting with a primary and/or secondary aliphatic amine, c. a transition metal compound, d. a primary and/or secondary aliphatic amine characterized in that the transition metal is selected from the group consisting of Cu, Mn, Fe and mixtures thereof.
    Type: Application
    Filed: February 11, 2011
    Publication date: July 25, 2013
    Inventors: Arie Boer Den, Johan Franz Gradus Antonius Jansen, Daniel Raimann
  • Patent number: 8481612
    Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: July 9, 2013
    Assignee: Trillion Science, Inc
    Inventors: Yurong Ying, John J. McNamara, Jing Liang, Rong-Chang Liang
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Patent number: 8436095
    Abstract: Disclosed are curable powder coating compositions that include a film-forming resin composition that includes (a) a first film-forming resin, (b) a second film-forming resin that is different from and incompatible with the first film-forming resin, and (c) a compatibilizing agent that includes a first portion that is compatible with the first film-forming resin and a second portion that is compatible with the second film-forming resin. The compatibilizing agent is present in such compositions in an amount sufficient to result in a coating composition that, when deposited onto at least a portion of a substrate and cured, produces a mid-gloss coating.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: May 7, 2013
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Anthony M. Chasser, Michael P. Makowski, Brian E. Woodworth
  • Publication number: 20130053497
    Abstract: Two part cyanoacrylate/cationically curable adhesive systems are provided, which contain vinyl ethers.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 28, 2013
    Applicant: Henkel Ireland Ltd.
    Inventors: Raymond P. TULLY, Barry N. BURNS, Emer WARD, Mark LOANE, Rachel M. HERSEE
  • Publication number: 20130030124
    Abstract: A thermoplastic elastomer composition having a continuous phase and a dispersed phase, wherein the continuous phase comprising (A) an epoxy-modified polyamide resin, and the dispersed phase comprising (B) a halogenated isoolefin-paraalkylstyrene copolymer rubber, wherein the thermoplastic elastomer composition is obtained by melt-kneading (B) halogenated isoolefin-paraalkylstyrene copolymer rubber, (C) a polyamide resin, and (D) a polyfunctional epoxy compound having two or more epoxy groups per molecule in an amount of 0.05 parts by weight or more and less than 3 parts by weight with respect to 100 parts by weight of polyamide resin (C), at a temperature which is equal to or more than the melting point of polyamide resin (C), and epoxy-modified polyamide resin (A) is produced by the reaction of polyamide resin (C) with polyfunctional epoxy compound (D) during the melt-kneading.
    Type: Application
    Filed: February 10, 2011
    Publication date: January 31, 2013
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventor: Shusaku Tomoi
  • Patent number: 8206808
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: June 26, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • Patent number: 8198369
    Abstract: One exemplary embodiment of the invention includes grafting a thermoplastic hot melt adhesive material to a shape memory polymer surface.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: June 12, 2012
    Assignee: GM Global Technology Operations LLC
    Inventor: Tao Xie
  • Patent number: 8198381
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 12, 2012
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Patent number: 8192840
    Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: June 5, 2012
    Assignees: Chuo Hatsujo Kabushiki Kaisha, Rock Paint Co., Ltd.
    Inventors: Yasuhiko Kunita, Takayuki Sakakibara, Masami Wakita, Yuichi Kondo, Norio Sawatari
  • Patent number: 8173726
    Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: May 8, 2012
    Assignee: Valspar Sourcing, Inc.
    Inventors: Martin Peter Joseph Heuts, Lonnie Jones
  • Publication number: 20120048598
    Abstract: Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
    Type: Application
    Filed: March 26, 2010
    Publication date: March 1, 2012
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi
  • Publication number: 20120035324
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 9, 2012
    Applicant: HUTCHINSON
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8101689
    Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: January 24, 2012
    Assignee: Cornerstone Research Group, Inc.
    Inventors: Tat Hung Tong, Benjamin J. Vining, Richard D. Hreha, Thomas J. Barnell