Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.

Abstract: A method for the manufacture of a one-component epoxy resin system comprises mixing at 15-30° C. and reacting at room temperature over 2-14 days (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation to yield a product with a Kofler Heat Bank melting point of less than 55° C. and a melting point stability of at least six months at normal workshop temperatures in the presence of (C) a hardener for (A) and the reaction product of (A) and (B) which is different from (B) and remains unreacted with (A) and (B) during the their reaction, (E) an expanding agent and (D) additives other than the expanding agent, provided that the reaction between (A) and (B) does not generate enough heat to activate a reaction between the remaining epoxy groups and hardener (C) or expanding agent (E).

Abstract: Thermosettable adhesive compositions that include a polyepoxide resin, a curing agent, and a plurality of microspheres. The microspheres, polyepoxide resin, and curing agent and the relative amounts thereof, are selected such that upon cure the composition is capable of forming a semi-structural bond to a substrate and is cleanly thermally removable from the substrate.

Abstract: A flexible encapsulating material resulting from a mixture that includes at least one epoxy novolak resin and at least two other epoxy compounds wherein the material has a percent hardness change of less than 20% after thermal aging of 504 hours at 140° C. The epoxy novolak resin preferably has less than 3 epoxy groups per molecule. A further embodiment is an electronic component encapsulated with a flexible material resulting from combining a two part system wherein a first part includes an epoxy novolak resin and at least two other epoxy resins and the second part includes at least one amine. An additional embodiment is a method for flexibly encapsulating an electronic component comprising applying to the component a mixture comprising an epoxy novolak resin having less than 3 epoxy groups per molecule and at least one other epoxy compound.

Abstract: Curable coating compositions comprising either a liquid or particulate curable film-forming resinous material, a flow control agent which is a copolymer and optionally a carrier for the liquid resinous material. The copolymer is from at least one non-amino, non-hydroxyl and non-acid functional alkyl acrylate or methacrylate containing from 1 to 20 carbon atoms in the alkyl group, and functional monomer of either (i) amino functional acrylates and methacrylates in an effective amount to give the copolymer an amine value in the range from 2 to 70, or (ii) acid functional acrylate and methacrylate in an effective amount to give the copolymer an acid value in the range of from 10 to 30. Additionally, with either functional monomer (i) or (ii) another functional comonomer (iii) can be present in the copolymer which is hydroxyalkyl acrylate and/or hydroxyalkyl methacrylate and/or caprolactone polyol monomer.

Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Abstract: A resin composition for powder coating, which comprises the following components (A), (B) and (C): (A) a carboxyl group-containing resin having a number average molecular weight of from 1,000 to 20,000, an acid value of from 5 to 200 and a glass transition temperature of from 30 to 120° C.; (B) tris(&bgr;-methylglycidyl) isocyanurate of the formula (1): (C) as a ring opening polymerization inhibitor, at least one compound selected from the group consisting of amines having in their molecules a bond of the formula (2): and onium salts.

Abstract: A paint protecting and reactivating composition comprising a main ingredient selected from: a dicyclopentadiene polymer, soy oil, sunflower oil or corn oil; an organic solvent; alkanoates of cobalt, magnesium, and zirconium; a chelating agent; an epoxy resin; a hindered amine; and a nitrogen heterocyclic compound.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and which comprises: (i) an acrylic polymer having acetoacetoxy functionality; and (ii) an acetoacetoxy functional derivative of a low molecular weight polyol; and (iii) a crosslinking component comprising at least one imine functional compound having an average of at least two imine groups per molecule which are reactive with acetoacetoxy functionality.

Abstract: A thermosetting adhesive comprising a polyepoxide resin, a curing agent such as an imidazole and polymeric or elastomeric microspheres is removable when heated to a temperature greater than the use temperature of from about room temperature to about 185° C.

Abstract: Reaction products of a microgel that contains carboxylic acid groups with a nitrogen-containing base have a high latency and high stability towards mechanical influences and are suitable as hardeners for one-component epoxy resin systems.

Abstract: A shaped article optionally containing a prepreg, or a composite derived from the shaped article with the prepreg, is prepared from a curable composition derived from the reaction in the presence of a catalyst of epoxy resin having at least 0.05% by weight of an epoxy resin oligomer with a solid rubber possessing at least 1% by weight of reactive groups and which is swellable or soluble in the reaction mixture, in a rubber epoxy resin weight ratio between 1:1 to 1:20, wherein said epoxy resin comprises (a) at least one first epoxy resin having an epoxy functionality of greater than three and (b) at least one second epoxy resin having a functionality of greater than one to three.

Abstract: The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Abstract: Coating compositions which comprise: (i) a hydroxy-functional compound containing in the molecule an average of at least two hydroxyl groups; (ii) an anhydride-functional compound containing in the molecule an average of at least two cyclic carboxylic acid anhydride groups; and (iii) an epoxy-functional compound containing in the molecule an average of at least two cycloaliphatic epoxy groups, provide low temperature cure response and excellent durability.

Abstract: An adhesive composition including as principal components: (a) about 10-90% by weight of at least one free radical-polymerizable monomer, (b) about 0-20% by weight of an adhesion promoter, (c) about 10-80% by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000 and; (d) about 1-15% by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).

Abstract: Heat sensitive substrates, as well as others such as metal or glass, are electrostatically coated with a thermosetting coating powder comprising a melt-mixed, chilled, chipped, and powdered blend of an epoxy resin and a catalyst therefore, and a polyamine as a powdered low temperature curing agent along with a scavenger which will react secondarily with residual polyamine domains that do not contact the base epoxy resin during curing. The coating powder is deposited on the substrate and heated to fuse, flow and cure. The mixture of resin and catalyst does not cure within the extruder but it is made to cure at low temperatures on the desired substrate by the separate addition of the curing agent to the powdered melt-mixed blend.

Abstract: An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: A process for the preparation of hydrocarbon solutions of monofunctional ether initiators of the following general structure: M—Qn—Z—O—[A(R1R2R3)] wherein M is an alkali metal selected from the group consisting of lithium, sodium and potassium; Q is a saturated or unsaturated hydrocarbyl group derived by incorporation of a compound selected from the group consisting of conjugated diene hydrocarbons, alkenylsubstituted aromatic hydrocarbons, and mixtures thereof into the M—Z linkage; Z is a branched or straight chain hydrocarbon group which contains 3-25 carbon atoms, optionally containing aryl or substituted aryl groups; A is an element selected from carbon and silicon; R1, R2, and R3 are independently selected from hydrogen, alkyl, substituted alkyl groups containing lower alkyl, lower alkylthio, and lower dialkylamino groups, aryl or substituted aryl groups containing lower alkyl, lower alkylthio, and lower dialkylamino groups, and n is an integer from 1 to 5, monof

Abstract: Hetero-telechelic polymers having the formula:FG--(Q).sub.d --Z--J--[A(R.sup.1 R.sup.2 R.sup.3)].sub.x (I)wherein FG is a protected or non-protected functional group; Q is a saturated or unsaturated hydrocarbyl group derived by incorporation of a compound selected from the group consisting of conjugated diene hydrocarbons, alkenylsubstituted aromatic hydrocarbons, and mixtures thereof; d is an integer from 10 to 200; Z is a branched or straight chain hydrocarbon group which contains 3-25 carbon atoms, optionally containing aryl or substituted aryl groups; J is oxygen, sulfur, or nitrogen; [A(R.sup.1 R.sup.2 R.sup.3)].sub.x is a protecting group, wherein A is an element selected from Group IVa of the Periodic Table of Elements; R.sup.1, R.sup.2, and R.sup.

Abstract: A composition comprising a water-soluble cationic group-containing high-molecular compound (P1) derived from the reaction of (A) epichlorohydrin and a dialkyl or dialkanol amine, or (B) a glycidyl group-terminated hydrophilic oligomer and a diamine, dialkylamine or dialkanolamine; optionally, a high-molecular compound (P2) having a condensable functional group in a side chain such as alkylolacrylamide-bearing high-molecular compound (E) or hydrolyzable trialkylsilyl group-containing acrylic ester high-molecular compound (F); and a poly(meth)acrylate (P3) is coated onto a substrate and cured by ultraviolet radiation to form a printing medium.

Abstract: The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising:(a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule;(b) a liquid amine terminated polyamide prepared by reacting at least one C.sub.18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1;(c) one or more optional polyamine(s); and(d) one or more optional filler(s);wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%.

Abstract: A curable composition formed by mixing components comprising 10 to 70 weight percent of a curable epoxy resin; an effective amount of a curative for the epoxy resin; 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and 5 to 60 weight percent of a thermoplastic polyester resin, the parts by weight being based on the total weight of the resin in the composition.

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula ##STR1## wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, NR.sup.1.sub.2, C(O)NHR.sup.1, R.sup.2 NR.sup.1.sub.2, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R.sup.1, OR.sup.1 or SO.sub.2 C.sub.6 H.sub.4 --NH.sub.2 ; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates.

Abstract: A resin composition for powder coating, which comprises the following components (A), (B) and (C): (A) a carboxyl group-containing resin having a number average molecular weight of from 1,000 to 20,000, an acid value of from 5 to 200 and a glass transition temperature of from 30 to 120.degree. C.; (B) tris(.beta.-methylglycidyl) isocyanurate of formula (1); and (C) as a ring opening polymerization inhibitor, at least one compound selected from the group consisting of amines having in their molecules a bond of formula (2); and onium salts.

Abstract: Disclosed are epoxy resin compositions for fiber-reinforced composite materials, comprising an epoxy resin containing 70 parts by weight or more, per 100 parts by weight of the epoxy resin, of a bi-functional epoxy resin, fine particles comprising a rubber phase and substantially insoluble in epoxy resins and a curing agent. Also disclosed are prepregs and fiber-reinforced composite materials comprising the composition.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Abstract: A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a polyvinyl formal resin.

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: A thermoplastic polymer composition contains at least two distinct polymers, characterized in that it comprises at least one polymer P1 containing at least one reactive function and at least one modified polyolefin P2 containing at least one succinimide ring substituted on the nitrogen by a reactive group, the ring being carried either by the main chain or by a side chain, and optionally at least one third polymer P3 selected from the group formed by polymers and copolymers obtained by polymerisation of one or more olefinic compounds. A mixture of polymers comprises at least one composition as defined above and at least one other polymer P5 which is identical to or different from polymer P3 and optionally at least one other polymer P6 which is identical to or different from polymer P1.

Abstract: Curable coating compositions comprising either a liquid or particulate curable film-forming resinous material, a flow control agent which is a copolymer and optionally a carrier for the liquid resinous material. The copolymer is from at least one non-amino, non-hydroxyl and non-acid functional alkyl acrylate or methacrylate containing from 1 to 20 carbon atoms in the alkyl group, and functional monomer of either (i) amino functional acrylates and methacrylates in an effective amount to give the copolymer an amine value in the range from 2 to 70, or (ii) acid functional acrylate and methacrylate in an effective amount to give the copolymer an acid value in the range of from 10 to 30. Additionally, with either functional monomer (i) or (ii) another functional comonomer (iii) can be present in the copolymer which is hydroxyalkyl acrylate and/or hydroxyalkyl methacrylate and/or caprolactone polyol monomer.

Abstract: A curable composition and a method of making it comprises reacting in the presence of a catalyst epoxy resin(s) having at least 0.05% by weight of epoxy resin oligomer with a solid rubber which is swellable or soluble in the reaction mixture and possessing at least 1% by weight of reactive groups, in a rubber:epoxy resin(s) weight ratio of between 1:1 and 1:20, wherein said epoxy resin(s) comprises (a) at least one epoxy resin having an epoxy functionality of greater than three and (b) at least one second epoxy resin having a functionality of greater than one but not more than three; heating to effect the reaction, cooling to substantially ambient temperature, and adding any remaining portion of epoxy resin and curing agent(s).

Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Abstract: A low gloss thermoplastic resin composition containing a rubber modified thermoplastic resin, a gel polymer and a low molecular weight polyolefin polymer provides low surface gloss properties and improved impact properties.

Abstract: A composite material for a lateral rigid member of a track belt for use in a snowmobile. A glycidylamine epoxy resin that is a polyfunctional epoxy thermosetting resin and has a molecular weight of about 250 to 1000 is included in an amount of 100 parts by weight. A 2-functional epoxy resin having a molecular weight of about 100 to 600 is included in an amount of 12 to 14.5 parts by weight. An aromatic polycarbonate thermoplastic resin having a molecular weight of about 12000 to 80000, a glass transition point of 130.degree. C. or more, a melting point of 220.degree. C. to 240.degree. C. is included in an amount of 5 to 45 parts by weight. An acid anhydride curing agent is included in an amount of 90 to 130 parts by weight. The composite material also includes reinforcing fiber.

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.

Abstract: A water dispersible powder composition is provided. The powder composition contains at least one film-forming polymer having at least one functional group and at least one reactive component that reacts to form a non-ionic bond with the polymer functional group following dispersion of the powder composition in water. The reaction between the polymer particles in the admixture and the reactive component renders the resulting coating water-resistant. The powder composition of this invention is useful for producing water-resistant coatings.

Abstract: A method of forming a topcoat from a base coat and clear coat comprises applying to the surface of an undercoat or intercoat a base coat containing (A) a compound having at least two epoxy groups per molecule, (B) a compound having at least two carboxyl groups per molecule, wherein at least one of compounds (A) and (B) possesses hydroxyl groups, (C) a melamine resin with from 0.3-3.5 imino groups, from 2-5.5 alkyl ether groups per triazine nucleus and having a polymerization degree of from 1.6-3.5, and (D) pigment(s); then applying a clear coat prepared from (A) a compound having at least two epoxy groups per molecule and (B) a compound having at least two carboxyl groups per molecule, and curing by heating.

Abstract: The thermosetting coating composition in a powdery form, includes (a) a binder resin prepared by the steps comprising preparing a starting material monomer mixture of two different polymerization reactions, each of the polymerization reaction being carried out in an independent reaction path, and then concurrently carrying out both of the two different polymerization reactions in one reaction vessel; (b) a colorant; and (c) a crosslinking agent. The coating film is prepared by curing the above thermosetting coating composition.

Abstract: A thermosettable adhesive composition that includes a monomeric or partially polymerized composition that includes at least one polymerizable acrylic or methacrylic acid ester of a non-tertiary alcohol, a thermosettable epoxy resin, an amine curative, a silane coupling agent, and a chelating agent.

Abstract: A process for producing a printing medium is disclosed wherein a composition is applied to a substrate and cured by heat treatment, said composition comprising a water soluble cationic polymer (P1) selected from the group consisting of polymer (A) obtained by the addition polymerization of epichlorohydrin and a dialkylamine or dialkanolamine; polymer (B) derived from the addition polymerization of a glycidyl groups-terminated hydrophilic oligomer and an asymmetric diamine, dialkylamine or dialkanolamine; acrylic polymer (C) with a cationized hydroxyl group-containing molecular side chain; and polyvinyl alcohol (D) with a cationized hydroxyl group-containing molecular chain; and a condensable functional group-containing polymer (P2) selected from the group consisting of alkylolacrylamide copolymer and a hydrolyzable trialkylsilyl group-containing copolymer.

Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.

Abstract: Polyalkenylaromatic-polyethylene copolymers are prepared using protected functional organolithium initiators. Polymerization of an alkenylsubstituted aromatic monomer followed by ethylene, results in a protected functional block polystyrene-co-polyethylenyllithium. Termination with a functionalizing agent followed by deprotection produces polymeric products with high functionalization at the initiating chain-end and at least partial functionalization at the terminal chain-end.

Abstract: The present invention relates to a composition used for hydrophilization, which comprises:(A) a compound having a polyoxyalkylene chain, and(B) hydrophilic crosslinked polymer fine particles made of a copolymer composed of:2-50% by weight of (a) a hydrophilic monomer having a polymerizable double bond and a polyoxyalkylene or polyvinylpyrrolidone chain,20-97% by weight of (b) a (meth)acrylamide type monomer,1-30% by weight of (c) a crosslinkable unsaturated monomer,2-50% by weight of (d) a carboxyl group-containing polymerizable unsaturated monomer, and0-50% by weight of (e) a monomer having one polymerizable unsaturated group in the molecule, other than the monomers (a), (b), (c) and (d).Said composition can form a hydrophilic film superior in retention of hydrophilicity, stability and press formability, on, for example, the surfaces of heat exchanger fins.

Abstract: The invention relates to a process for preparing a composition contains a polymer and a crosslinking agent which comprises mixing a polymer that is solid at room temperature with a crosslinking agent, the polymer and the crosslinker having complementary reactive groups, at a temperature at which the viscosity of the polymer (measured according to Emila) is less than 5000 dpas, in a means for achieving a homogeneous composition in such a short time that less than 20% of the reactive groups of one of either the polymer or crosslinking agent has reacted, and subsequently cooling and comminuting the composition.The mixing is preferably effected in a static mixer at a temperature higher than 140.degree. C.