Mixed With 1,2-epoxy Containing Reactant Or Polymer Therefrom, Or Wherein Polymer Contains At Least One 1,2-epoxy Group Patents (Class 525/396)
  • Patent number: 11111382
    Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: September 7, 2021
    Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Noriaki Fukuda, Ryota Harisaki, Katsumasa Yamamoto
  • Patent number: 10919271
    Abstract: A composite molded article has (A) a fiber-reinforced resin molded article (A) including a fiber-reinforced resin having a polyamide-based resin as a matrix resin, a molded article (B) including a modified vinyl-based copolymer, and a molded article (C) including a styrene-based resin layered in this order. A layer (B) including a modified vinyl-based copolymer is interposed as a joining layer between a layer (A) of a fiber-reinforced resin having a polyamide-based resin as a matrix resin and a layer (C) including a styrene-based resin, whereby a composite molded article can be obtained in which the layers (A), (B) and (C) are strongly joined and integrated, and a composite molded article can be obtained which has excellent characteristics not realizable by a single layer of the layer (A) or the layer (C).
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: February 16, 2021
    Assignee: Toray Industries, Inc.
    Inventors: Kimihiko Hattori, Shinsuke Hidaka, Hideo Matsuoka
  • Patent number: 10647877
    Abstract: A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: May 12, 2020
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Eylem Tarkin-Tas, Edward Norman Peters
  • Patent number: 10240033
    Abstract: The optical film of the present invention is an optical film including a thermoplastic resin, in which the optical film has a moisture permeability of 70 g/m2/day or less (in terms of a film thickness of 40 ?m), and contains a moisture permeability-reducing compound having a molecular weight of 200 or more and satisfying Formula (1) described below. Formula (1) A/B?0.9 (A represents a moisture permeability of an optical film in a case in which 10 mass % of the moisture permeability-reducing compound is added to the mass of the thermoplastic resin, and B represents a moisture permeability of an optical film in a case in which the thermoplastic resin is included and the moisture permeability-reducing compound is not added.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 26, 2019
    Assignee: FUJIFILM CORPORATION
    Inventors: Shigeaki Nimura, Makoto Kamo, Shusuke Arita, Yutaka Nozoe, Katsumi Sasata
  • Patent number: 9617413
    Abstract: A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: April 11, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Angela I. Padilla-Acevedo, Theofanis Theofanous, Nikhil E. Verghese, Fabio Aguirre Vargas
  • Patent number: 9051465
    Abstract: A resin composition for use in making pre-pregs and structural laminates contains a curable composition comprising: a functionalized poly(phenylene ether) having the structure: a radical initiator; an unsaturated monomer; and a flame retardant comprising the compound 1,1?(ethane-1,2-diyl)bis[pentabromobenzene], wherein Y, m and n are defined herein.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: June 9, 2015
    Assignee: Park Electrochemical Corporation
    Inventor: Gregory Roy Almen
  • Patent number: 9045585
    Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: June 2, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Stephanie L. Potisek, Mark B. Wilson
  • Patent number: 9012572
    Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is ?R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 21, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: I-Hong Lin, Chung-Cheng Lin, Wei-Ta Yang, Chih-Hsiang Lin
  • Publication number: 20140323666
    Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.
    Type: Application
    Filed: December 26, 2013
    Publication date: October 30, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: I-Hong LIN, Chung-Cheng LIN, Wei-Ta YANG, Chih-Hsiang LIN
  • Patent number: 8815401
    Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: August 26, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshihiro Kato, Takeshi Nobukuni, Masayoshi Ueno
  • Patent number: 8748541
    Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: June 10, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenichi Mori, Syouichi Itoh
  • Patent number: 8729192
    Abstract: The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: May 20, 2014
    Assignee: DIC Corporation
    Inventors: Kazuo Arita, Ichirou Ogura, Kunihiro Morinaga
  • Publication number: 20140058014
    Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.
    Type: Application
    Filed: November 5, 2013
    Publication date: February 27, 2014
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventor: Edward Norman Peters
  • Patent number: 8642709
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 4, 2014
    Assignees: Henkel AG & Co. KGaA, Henkel US IP LLC
    Inventors: Pablo Walter, Mustapha Benomar, Stefen Kreiling, Angelika Troll, Rainer Schoenfeld, Timothy Walsh
  • Publication number: 20140018471
    Abstract: Disclosed are oligomeric phosphonates including oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications.
    Type: Application
    Filed: September 12, 2013
    Publication date: January 16, 2014
    Applicant: FRX POLYMERS, INC.
    Inventors: Lawino KAGUMBA, Jan-Pleun LENS, Dieter FREITAG
  • Patent number: 8629200
    Abstract: The present invention provides an organic/inorganic compositive dispersant and a method for producing the same. The compositive dispersant comprises a complex of inorganic clay and an organic surfactant. The compositive dispersant is produced by reacting inorganic clay with the organic surfactant in a solvent to generate a complex. The inorganic clay is layered or platelet. The organic surfactant is an anionic surfactant such as alkyl sulfates, or a nonionic surfactant such as octylphenol polyethoxylate and polyoxyethylene alkyl ether. The compositive dispersant may be used to produce electrolytes of a solar cell or to increase the hardness of an epoxy resin.
    Type: Grant
    Filed: December 23, 2012
    Date of Patent: January 14, 2014
    Assignee: National Taiwan University
    Inventors: Jiang-Jen Lin, Wei-Ting Chen, Yen-Chi Hsu, Chih-Wei Chiu
  • Patent number: 8629219
    Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: January 14, 2014
    Assignee: Guangdong Shengyi Sci. Tech Co., Ltd.
    Inventors: Dong Wei, Ke Hong Fang
  • Publication number: 20140005340
    Abstract: Disclosed are compositions comprising: (a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 60 to 90 percent by weight of an epoxy resin; wherein the weight percents are based on the total weight of the composition. Also disclosed are processes for preparing such compositions as well as articles derived therefrom.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Inventors: Edward Norman Peters, Scott Michael Fisher
  • Patent number: 8617930
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 8598281
    Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: December 3, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: Edward N. Peters
  • Patent number: 8597749
    Abstract: A high solid type paint composition comprising (A) a main component containing a semi-solid state bisphenol type epoxy resin (a1) wherein the epoxy equivalent weight of the epoxy resin is 250 to 300, and (B) a curing component containing an epoxy adduct of xylylenediamine (b1) and an epoxy adduct of polyamide (b2), wherein the epoxy adduct of polyamide (b2) is contained at 50 to 200 parts by weight per 100 parts by weight of the epoxy adduct of xyleylenediamine (b1 ). The anticorrosive coating composition is excellent in drying properties during coating, and capable of forming a coating film having excellent oil resistance, solvent resistance, chemical resistance and anticorrosive properties.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: December 3, 2013
    Assignee: Chugoku Marine Paints, Ltd.
    Inventor: Osamu Kato
  • Publication number: 20130267136
    Abstract: Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.
    Type: Application
    Filed: December 28, 2011
    Publication date: October 10, 2013
    Applicant: 3M Innovative Properties Company
    Inventors: Dmitriy Salnikov, Michael A. Kropp, Ilya Gorodisher
  • Publication number: 20130261229
    Abstract: A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: wherein, Ar represents an aryl; and X represents at least one selected from the group consisting of ethers, ketones, sulfides, sulfones, amides, carbonates and esters.
    Type: Application
    Filed: December 7, 2011
    Publication date: October 3, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Sano, Yuki Mitsutsuji, Masato Honma
  • Patent number: 8545971
    Abstract: A multi-component article comprising a first component comprising a biodegradable polymer, and a second component comprising a polyolefin and a reactive modifier. A method of preparing a multi-layer film comprising coextruding first and second film layers, wherein the first layer comprises a polylactic acid and the second layer comprises a polyolefin and an epoxy-functionalized polyolefin. A method of preparing a multi-component fiber comprising coextruding a core component and a sheath component, wherein the core component comprises a polyolefin and an epoxy-functionalized polyolefin and the sheath component comprises a polylactic acid.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 1, 2013
    Assignee: Fina Technology, Inc.
    Inventors: Fengkui Li, Tim J. Coffy, Michel Daumerie
  • Patent number: 8529928
    Abstract: Biodegradable polymers incorporating biomolecules and methods of their use are provided. Certain aspects provide biomolecules crosslinked with diglycidyl esters. The disclosed compositions have numerous applications including cellular regeneration, wound healing, and cellular differentiation.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: September 10, 2013
    Assignee: Georgia Tech Research Corporation
    Inventors: Yadong Wang, Blaine Zern, Christiane Gumera
  • Publication number: 20130225723
    Abstract: A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.
    Type: Application
    Filed: November 10, 2011
    Publication date: August 29, 2013
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Juergen Finter, Ulrich Gerber, Edis Kasemi, Andreas Kramer
  • Publication number: 20130225725
    Abstract: Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured compositions can be used as structural adhesives. The reactive liquid modifier is an acetoacetate ester of a dimer alcohol. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.
    Type: Application
    Filed: November 8, 2011
    Publication date: August 29, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Christopher J. Campbell, Kevin M. Lewandowski, Kwame Owusu-Adom
  • Publication number: 20130206333
    Abstract: A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.
    Type: Application
    Filed: July 26, 2011
    Publication date: August 15, 2013
    Applicant: ZEPHYROS, INC.
    Inventor: Michael Czaplicki
  • Patent number: 8507602
    Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: August 13, 2013
    Assignee: Whitford Worldwide Company
    Inventors: Thomas J. Bate, Arthur Wachowski, Jan Wilhelm Ernst Moos
  • Patent number: 8501874
    Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: August 6, 2013
    Assignee: Kaneka Corporation
    Inventors: Shigeru Tanaka, Kanji Shimoohsako, Takashi Itoh, Koji Okada, Mutsuaki Murakami
  • Patent number: 8487050
    Abstract: A composition comprises a fluorine-containing aromatic polymer, an epoxy compound and an initiator. Its use as film, laminate with polyimide or copper foils, copper-clad laminated board and adhesive film. The fluorine-containing aromatic polymer is preferably a fluorine-containing aryl ether polymer. The initiator is preferably a cationic initiator.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: July 16, 2013
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kazushi Omote, Ai Nishichi, Shimpei Sato
  • Publication number: 20130158147
    Abstract: Disclosed are random copoly(phosphonate carbonate)s with the high molecular weight and narrow molecular weight distribution exhibiting a superior combination of properties compared to prior art.
    Type: Application
    Filed: February 11, 2013
    Publication date: June 20, 2013
    Applicants: BAYER MATERIAL SCIENCE AG, FRX POLYMERS, INC.
    Inventors: FRX Polymers, Inc., Bayer Material Science AG
  • Patent number: 8461275
    Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: June 11, 2013
    Assignee: Hexcal Composites Limited
    Inventor: John Cawse
  • Patent number: 8461281
    Abstract: An insulating polymer material composition is obtained by adding curing agent (amine, acid anhydride, or phenol, preferably imidazole), curing accelerator, etc. (curing accelerator such as organic peroxide, amine, imidazole, or the like, and reaction aid such as peroxide), kneading under conditions according to the amounts of addition, and subjecting the kneaded substance to heat treatment, thereby conducting a peroxide vulcanization and achieving a three-dimensional crosslinking. This insulating polymer material composition is applied to polymer products such as high-voltage devices, etc.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: June 11, 2013
    Assignee: Meidensha Corporation
    Inventor: Yasuyuki Kurata
  • Publication number: 20130101857
    Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).
    Type: Application
    Filed: June 8, 2011
    Publication date: April 25, 2013
    Applicant: DIC CORPORATION
    Inventors: Kazuo Arita, Etsuko Suzuki
  • Patent number: 8354475
    Abstract: An organic solvent free process to make an aqueous co-dispersion of epoxy resins and at least phenolic novolac resins is reported. The compositions of such co-dispersions are based on blends of epoxy resins and at least a phenolic novolac resin within the profile viscosity versus temperature in the ranges from 1 500 000 to 300 mPas at 80° C. and 10 000 to 20 mPas at 120° C.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: January 15, 2013
    Assignee: Momentive Specialty Chemicals Inc.
    Inventors: Helga De Velder, Alain Leroy
  • Patent number: 8263714
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 11, 2012
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Patent number: 8198369
    Abstract: One exemplary embodiment of the invention includes grafting a thermoplastic hot melt adhesive material to a shape memory polymer surface.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: June 12, 2012
    Assignee: GM Global Technology Operations LLC
    Inventor: Tao Xie
  • Patent number: 8101689
    Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: January 24, 2012
    Assignee: Cornerstone Research Group, Inc.
    Inventors: Tat Hung Tong, Benjamin J. Vining, Richard D. Hreha, Thomas J. Barnell
  • Patent number: 8092717
    Abstract: Disclosed herein is a polymer composition comprising: a poly(arylene ether); a polyester; electrically conductive filler, and an impact modifier. The composition has a continuous phase comprising polyester and a disperse phase comprising poly(arylene ether). The amount of the disperse phase is less than 35 weight percent, based on the total weight of the composition.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: January 10, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Pravin Borade, Donna Starrup Bossman, Shreyas Chakravarti, Robert R Gallucci, Roshan Kumar Jha, Ganesh Kannan, Nitin Moghe, Przemyslaw Olszynski
  • Publication number: 20110282010
    Abstract: An epoxy resin composition having low moisture permeability, transparency and a high refractive index. The epoxy resin composition includes an epoxy compound, and a compound having two or more crosslinking groups that are reactive with the epoxy compound. The weight ratio of (a) to (b) is from 0.3 to 3, and the epoxy resin composition has a refractive index of 1.6 or higher.
    Type: Application
    Filed: January 13, 2010
    Publication date: November 17, 2011
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Jun Fujita
  • Publication number: 20110275739
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Application
    Filed: June 10, 2011
    Publication date: November 10, 2011
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Patent number: 8034962
    Abstract: The present invention provides an acid anhydride ester obtained by esterifying cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and a composition of the ester, and a heat-curable resin composition and a cured product of the composition. _Provided is an epoxy resin composition using the acid anhydride ester as a curing agent for an epoxy resin, the epoxy resin composition having, for example, the following properties (1), (2), and (3): (1) the epoxy resin composition has a low viscosity at room temperature, so the components of the composition can be favorably blended with each other, (2) the acid anhydride ester has a low vapor pressure at curing temperature, so no evaporation loss occurs after curing, and the intended design of blend is capable, and (3) a cured product to be made from the composition is colorless and transparent, and changes its color to a small extent even when the product is irradiated with light or heated for a long time period.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: October 11, 2011
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tomohiro Sugawara, Takeshi Koyama, Atsushi Okoshi, Takashi Sato, Shuichi Ueno
  • Patent number: 7968194
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Patent number: 7968195
    Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teiichi Inada, Michio Mashino, Michio Uruno
  • Publication number: 20110139496
    Abstract: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.
    Type: Application
    Filed: December 14, 2010
    Publication date: June 16, 2011
    Applicant: AJINOMOTO CO., INC.
    Inventor: Shigeo NAKAMURA
  • Publication number: 20110132646
    Abstract: There is provided herein a curable epoxy resin composition comprising at least one brominated epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.
    Type: Application
    Filed: June 3, 2010
    Publication date: June 9, 2011
    Applicant: ICL-IP America Inc.
    Inventors: Sergei V. Levchik, Fabienne Samyn
  • Publication number: 20110112222
    Abstract: A composition including an epoxy resin having at least a difunctional epoxy resin and at least one cross-linking agent for epoxy resin. The difunctional epoxy resin has a viscosity of from 1000 to 5000 mPa·s. The composition may include a low viscosity diluent for modulating the composition viscosity in an amount not higher than 10% by weight.
    Type: Application
    Filed: November 10, 2010
    Publication date: May 12, 2011
    Inventors: Giuseppina Barra, Marino Lavorgna, Giuseppe Mensitieri, Filomena Piscitelli
  • Publication number: 20110084408
    Abstract: An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 14, 2011
    Inventors: Yuichiro Shishido, Naohide Takamoto
  • Patent number: 7897697
    Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: March 1, 2011
    Assignee: DuPont Electronic Polymers L.P.
    Inventors: Michael T. Sheehan, Edward G. Zey