Mixed With 1,2-epoxy Containing Reactant Or Polymer Therefrom, Or Wherein Polymer Contains At Least One 1,2-epoxy Group Patents (Class 525/396)
-
Publication number: 20100324228Abstract: An insulating polymer material composition is obtained by adding curing agent (amine, acid anhydride, or phenol, preferably imidazole), curing accelerator, etc. (curing accelerator such as organic peroxide, amine, imidazole, or the like, and reaction aid such as peroxide), kneading under conditions according to the amounts of addition, and subjecting the kneaded substance to heat treatment, thereby conducting a peroxide vulcanization and achieving a three-dimensional crosslinking. This insulating polymer material composition is applied to polymer products such as high-voltage devices, etc.Type: ApplicationFiled: January 17, 2008Publication date: December 23, 2010Inventor: Yasuyuki Kurata
-
Publication number: 20100298491Abstract: Disclosed is an adamantane derivative which provides a cured product excellent in optical characteristics such as transparency and light resistance, long-term heat resistance, electrical characteristics such as and dielectric constant, and low water absorption. Also disclosed are a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent.Type: ApplicationFiled: January 19, 2007Publication date: November 25, 2010Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Yasunari Okada, Hajime Ito, Hideki Yamane, Nobuaki Matsumoto
-
Patent number: 7816430Abstract: The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.Type: GrantFiled: September 29, 2003Date of Patent: October 19, 2010Assignee: Hitachi Chemical Company, Ltd.Inventors: Yasuyuki Mizuno, Daisuke Fujimoto, Hiroshi Shimizu, Kazuhito Kobayashi, Takayuki Sueyoshi
-
Patent number: 7786219Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: GrantFiled: October 30, 2009Date of Patent: August 31, 2010Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Katsutoshi Yamazaki
-
Publication number: 20100197859Abstract: The present invention provides polymer blends comprising the components (a) from 40% to 95% by weight of at least one polyaryl ether copolymer constructed of (a1) from 50% to 99.9% by weight of building units of the general formula I and from 0% to 40% by weight of further building units II selected from segments of one or more thermoplastic polymers, and (a2) from 0.Type: ApplicationFiled: August 27, 2008Publication date: August 5, 2010Applicant: BASF SEInventors: Martin Weber, Christian Maletzko, Qian Yang, Tai-Shung Chung
-
Publication number: 20100160572Abstract: Disclosed are a branched polycarbonate resin composition that includes: (A) a polycarbonate resin; (B) a polymer including a reactive group being capable of reacting with a hydroxyl group; and (C) an ionic compound including an alkali metal ion, organic cation, or a combination thereof, and a branched polycarbonate resin and a molded product using the same.Type: ApplicationFiled: December 21, 2009Publication date: June 24, 2010Applicant: CHEIL INDUSTRIES INC.Inventors: Chan-Gyun SHIN, Sung-Hun KIM, Tae-Uk KIM, Jong-Cheol LIM, Young-Jun LEE
-
Publication number: 20100084170Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.Type: ApplicationFiled: November 12, 2009Publication date: April 8, 2010Inventors: Christina Louise Braidwood, Hua Guo, Edward Norman Peters
-
Patent number: 7683138Abstract: A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. and about 190° C. The polyphenylene oxide compound may be provided as a melt blended mixture of two polyphenylene oxide compounds having distinct glass transition temperatures. The curable compositions may further include a bulk filler, and are therefore particularly useful as molding compounds encapsulation of electrical and/or electronic parts in transfer molding operations.Type: GrantFiled: May 16, 2005Date of Patent: March 23, 2010Assignee: Henkel CorporationInventor: Charles S. Bischof
-
Publication number: 20100063181Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a hybrid hardener, whereby said hardener is a blend of b1) an aminic compound selected from aliphatic, cycloaliphatic, araliphatic amines, imidazoline group-containing amidoamines based on mono- or polybasic acids, adducts of said amines or amidoamines made from glycidyl compounds, adducts of said amines or amidoamines made from cyclic carbonates, whereby said aminic compound contains, on average per molecule, at least two reactive hydrogen atoms bound to nitrogen atoms, and b2) a DCPD-phenol based novolac, and wherein the DCPD-phenol novolac is used in an amount from 1 to 65 wt %, based on the total weight of the hardener blend b1) and b2), especially useful as protective coatings for metallic and mineral substrates.Type: ApplicationFiled: June 14, 2007Publication date: March 11, 2010Applicant: Huntsman International LLCInventor: Isabelle Marie Muller-Frischinger
-
Patent number: 7671147Abstract: Disclosed is a flame-retardant epoxy resin composition characterized by containing (A) an epoxy resin containing 0.5-10 equivalent/kg of oxazolidone rings, (B) an epoxy group-containing phosphazene compound, (C) at least one compound selected from the group consisting of phosphates, condensed phosphates, quinone derivatives of phosphine compounds, and polyphenylene ethers, and (D) at least one curing agent selected from the group consisting of guanidine derivatives, phenol novolacs, bisphenol A novolacs, cresol novolacs and naphthol novolacs.Type: GrantFiled: June 28, 2005Date of Patent: March 2, 2010Assignee: Asahi Kasei Chemicals CorporationInventors: Masaaki Urakawa, Takeshi Arai
-
Publication number: 20100048826Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.Type: ApplicationFiled: October 30, 2009Publication date: February 25, 2010Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
-
Publication number: 20100036032Abstract: A vanish, a heat-dissipation prepreg, and the manufacturing method thereof are disclosed. The vanish has a curing agent with structure as indicated in formula (1). The vanish based on this curing agent will improve thermal stability and peel strength. Glass fabric cloth is dipped into the vanish having the curing agent to form a heat-dissipation prepreg with better thermal stability and peel strength. Furthermore, the curing agent has polarity so that inorganic powders are uniformly distributed in the prepreg. Therefore, the dissipation efficiency of the heat-dissipation prepreg is improved.Type: ApplicationFiled: August 7, 2008Publication date: February 11, 2010Inventors: Uen-Ren Chen, Jeng-I Chen
-
Publication number: 20100025094Abstract: An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).Type: ApplicationFiled: September 14, 2006Publication date: February 4, 2010Applicant: Panasonic Electric Works Co., Ltd.Inventors: Hiroki Tamiya, Yoshihiko Nakamura, Shunji Araki, Eiji Imaizumi, Kentarou Fujino, Tomoaki Sawada, Takashi Shinpo
-
Publication number: 20100006998Abstract: A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.Type: ApplicationFiled: October 30, 2007Publication date: January 14, 2010Inventors: Takeshi Masuda, Hikaru Okubo
-
Patent number: 7632896Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.Type: GrantFiled: April 7, 2008Date of Patent: December 15, 2009Assignee: Dupont Electronic Polymers L.P.Inventors: Michael T. Sheehan, Edward G. Zey
-
Patent number: 7585603Abstract: A curable resin composition for use as a constituting material of an electrophotographic photoreceptor, comprises: a phenolic resin; a charge transportable material having a reactive functional group; and at least one of an organic sulfonic acid and its derivative.Type: GrantFiled: June 1, 2006Date of Patent: September 8, 2009Assignee: Fuji Xerox Co., Ltd.Inventors: Wataru Yamada, Katsumi Nukada, Masahiro Iwasaki, Kenji Yao
-
Patent number: 7560501Abstract: An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.Type: GrantFiled: May 29, 2008Date of Patent: July 14, 2009Assignee: International Business Machines CorporationInventor: Konstantinos I. Papathomas
-
Patent number: 7547749Abstract: In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a polymer or monomer, or reactive with a nucleophilic group on a polymer or monomer at a slower rate than any leaving group. The invention also comprises polymers or monomers with nucleophilic groups capped with a triazine moiety. Still other embodiments of the invention comprise processes for capping nucleophilic groups in a polymer or monomer which comprises combining and reacting the polymer or monomer with a triazine-comprising capping agent.Type: GrantFiled: June 21, 2007Date of Patent: June 16, 2009Assignee: SABIC Innovative Platics IP B.V.Inventors: Sterling Bruce Brown, Hans-Peter Brack, James Anthony Cella, Dennis Karlik
-
Patent number: 7544741Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.Type: GrantFiled: November 28, 2002Date of Patent: June 9, 2009Assignee: Asahi Kasei Chemicals CorporationInventors: Akira Mitsui, Mutsumi Maeda
-
Publication number: 20090133833Abstract: A composition comprising (A) an epoxy resin, (B) an epoxy resin curing agent in such an amount that an equivalent ratio of a functional group of the epoxy resin curing agent (B) to the epoxy group of the epoxy resin (A) ranges from 0.8 to 1.25, (C) thermoplastic resin particles which are solid at 25° C. in an amount of from 3 to 60 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B), and (D) an epoxy resin curing promoter in an amount of from 0.1 to 10 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B). The composition is stable in B-stage and forms a curing product with no void.Type: ApplicationFiled: August 23, 2006Publication date: May 28, 2009Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Tsuyoshi Honda, Hiroyuki Takenaka
-
Publication number: 20090111948Abstract: Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking agents, adhesion promoters, and other inorganic fillers. The composition of the present disclosure can have a glass transition temperature greater than 250° C. and a water absorption factor of less than 2%, and a positive solubility measurement.Type: ApplicationFiled: October 25, 2007Publication date: April 30, 2009Inventors: Thomas Eugene Dueber, Nyrissa S. Rogado
-
Patent number: 7521100Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.Type: GrantFiled: April 6, 2004Date of Patent: April 21, 2009Assignee: Nippon Kayaku Kabushiki KaishaInventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiko Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai
-
Patent number: 7521511Abstract: Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group.Type: GrantFiled: April 12, 2004Date of Patent: April 21, 2009Assignee: Kaneka CorporationInventors: Shigeru Tanaka, Kanji Shimoohsako, Takashi Itoh, Koji Okada, Mutsuaki Murakami
-
Publication number: 20090088497Abstract: The purposes of the present invention are to provide a paving material which is easy to be handled, has less restriction on the conditions of execution of work, decomposes fast, and is superior in durability, and a method for construction of paved body using the paving material. The purposes are attained by providing a paving material and a method for construction of paved body using the same, said paving material comprises at least binder emulsion for pavement, non-water soluble epoxy resin, and amine compound(s) a hardener thereof, and is prepared by mixing these three ingredients at the time of the execution of work, at the scene of the execution of work. The purposes are also attained by providing binder emulsion for pavement comprising an amine compound(s) that is a hardener of epoxy resin and the amine compound comprises at least polyaminoamido.Type: ApplicationFiled: August 23, 2006Publication date: April 2, 2009Applicants: PETRO CHEMICALS CO., LTD., NICHIREKI CO. LTD.Inventors: Yoshihito Sasada, Akito Hagiwara, Masahiko Fujii, Kazuma Takeuchi, Sadaharu Ueno, Takashi Kanazawa, Tada-aki Ikeda
-
Patent number: 7491789Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.Type: GrantFiled: July 17, 2007Date of Patent: February 17, 2009Assignee: Hitachi Chemical Company, LtdInventors: Haruaki Sue, Takashi Kumaki, Hideyasu Tsuiki, Hiroshi Matsutani, Toshihiko Takasaki, Iwao Fukuchi
-
Publication number: 20090042036Abstract: [Problems] To provide a high solid type anticorrosive coating composition excellent in drying properties during coating, and capable of forming a coating film having excellent oil resistance, solvent resistance, chemical resistance and anticorrosive properties. [Solving Means] A high solid type paint composition comprising (A) a main component containing a semi-solid state bisphenol type epoxy resin (a1) wherein the epoxy equivalent weight of the epoxy resin is 250 to 300, and (B) a curing component containing an epoxy adduct of xylylenediamine (b1) and an epoxy adduct of polyamide (b2), wherein the epoxy adduct of polyamide (b2) is contained at 50 to 200 parts by weight per 100 parts by weight of the epoxy adduct of xylylenediamine (b1).Type: ApplicationFiled: March 8, 2007Publication date: February 12, 2009Applicant: CHUGOKU MARINE PAINTS, LTD.Inventor: Osamu Kato
-
Publication number: 20090036582Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.Type: ApplicationFiled: January 23, 2008Publication date: February 5, 2009Applicant: Huntsman International L.L.CInventor: Isabelle Marie Marguerite Muller-Frischinger
-
Publication number: 20090004484Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a dicyclopentadiene epoxy resin represented by Formula 1; and (c) an alkylphenol aldehyde novolak curing agent represented by Formula 2, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a brominated epoxy resin. Also, a composite substrate and a copper laminate using the same are disclosed.Type: ApplicationFiled: June 26, 2008Publication date: January 1, 2009Applicant: Doosan CorporationInventors: In Wook KIM, Duk Sang Han, Kwang Suk Park, Soo Im Jung, Dong Ki Nam
-
Publication number: 20090000736Abstract: An object of the present invention is to provide an easily disassemblable adhesive that is an adhesive for forming a structure by adhering members and enables easy disassembly of the adhered structure owing to possessing disassemblability. The invention provides a disassemblable adhesive containing an organic adhesive component and an oxidant.Type: ApplicationFiled: January 11, 2007Publication date: January 1, 2009Applicant: Asahi Kasei Chemicals CorporationInventor: Yoshiaki Mitarai
-
Patent number: 7446154Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: February 13, 2008Date of Patent: November 4, 2008Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
-
Publication number: 20080268239Abstract: Disclosed herein is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a low molecular weight compound that exists in the form of a second crystalline phase; wherein the second crystalline phase is dispersed within the first organic polymer phase. Disclosed herein too is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a second phase that comprises a crystalline organic polymer, wherein the crystalline organic polymer has a different molecular structure from the first organic polymer; wherein the second phase is not covalently bonded to the first organic polymer phase and wherein the second phase has an average particle size of about 1 to about 20 micrometers.Type: ApplicationFiled: March 28, 2008Publication date: October 30, 2008Applicant: THE UNIVERSITY OF MASSACHUSETTSInventors: Alan J. Lesser, Thomas J. McCarthy, Joonsung Yoon, Onur S. Yordem
-
Patent number: 7439310Abstract: The present invention can provide a resin composition comprising epoxy-modified polyphenylene ethers which show good solubility in MEK or acetone which has been conventionally used in a manufacturing process for printed boards of epoxy resins, and has high heat resistance originating from polyphenylene ethers. Specifically, the resin composition of the present invention contains (C) an epoxy-modified polyphenylene ether obtained by reacting (A) a polyphenylene ether having a content of volatile components of 0.1-5.0% by weight and a number of average molecular weight of 500 or more and less than 1.0×104 and (B) a cresol-novolac type epoxy resin at a modification ratio of component (A) of 5-95%, wherein (B?) a cresol-novolac type epoxy resin is contained in an amount of 10-900 parts by weight based on 100 parts by weight of the total of the reaction products (C), and (A?) a polyphenylene ether.Type: GrantFiled: July 6, 2006Date of Patent: October 21, 2008Assignee: Asahi Kasei Chemicals CorporationInventors: Tetsuji Tokiwa, Tomohiro Kondo
-
Publication number: 20080251757Abstract: A subject of the present invention is to provide a one-pot type epoxy resin composition having both high curability and storage stability and a latent hardener for obtaining the same, and to provide anisotropic conductive materials, conductive adhesive materials, insulating adhesive materials, sealing materials, and the like which have high storage stability, solvent resistance and humidity resistance and can provide high connection reliability, adhesive strength and high sealing properties even under curing conditions such as low temperatures or short periods of time. The present invention relates to a latent hardener for epoxy resins in which a hardener (A) for epoxy resins is covered with a film (c1) obtained by reacting an isocyanate component (b1) comprising a low molecular bifunctional aliphatic isocyanate compound in an amount of 1% by mass or more and 95% by mass or less with an active hydrogen compound (b2), and to a one-pot type epoxy resin composition using the same.Type: ApplicationFiled: February 23, 2006Publication date: October 16, 2008Inventors: Hisanao Yamamoto, Kazuhiro Daikai
-
Publication number: 20080153976Abstract: An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy resin of the present invention is represented by the following formula (1): (wherein n is 0.1 to 20 (the number is an average). The epoxy resin of the present invention can be produced by extending the chain of an epoxide of 4,4?-bisphenol F with 4,4?-biphenol.Type: ApplicationFiled: December 21, 2005Publication date: June 26, 2008Applicant: Nippon Kayaku Kabushiki KaishaInventors: Yasumasa Akatsuka, Katsuhiko Oshimi, Masataka Nakanishi, Shigeru Moteki
-
Patent number: 7388057Abstract: A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.Type: GrantFiled: June 22, 2007Date of Patent: June 17, 2008Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
-
Patent number: 7384682Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.Type: GrantFiled: September 26, 2007Date of Patent: June 10, 2008Assignee: International Business Machines CorporationInventor: Konstantinos I. Papathomas
-
Publication number: 20080131639Abstract: An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.Type: ApplicationFiled: June 23, 2004Publication date: June 5, 2008Inventors: Tetsuya Yamamoto, Tomohiro Kitamura, Sachio Suzuki
-
Patent number: 7378455Abstract: A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinationsType: GrantFiled: June 30, 2005Date of Patent: May 27, 2008Assignee: General Electric CompanyInventors: Qiwei Lu, Michael O'Brien, Michael Vallance
-
Patent number: 7371801Abstract: A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplastic particles.Type: GrantFiled: April 27, 2004Date of Patent: May 13, 2008Assignee: EADS SPACE Transportation SAInventors: Estelle Chauray, Brigitte Defoort, Frédéric Boursereau, Alain Soum
-
Patent number: 7371800Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.Type: GrantFiled: April 22, 2005Date of Patent: May 13, 2008Assignee: DuPont Electronic Polymers L.P.Inventors: Michael T. Sheehan, Edward G. Zey
-
Publication number: 20080071036Abstract: A cured composition is prepared by curing a curable composition including an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. The cured composition exhibits markedly improved impact strength relative to a corresponding composition prepared from monofunctional poly(arylene ether).Type: ApplicationFiled: September 15, 2006Publication date: March 20, 2008Inventors: Erik R. Delsman, Hua Guo, Edward N. Peters
-
Publication number: 20080071035Abstract: A curable composition includes an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. After curing, the composition exhibits markedly improved impact strength relative to a corresponding composition prepared from monofunctional poly(arylene ether).Type: ApplicationFiled: September 15, 2006Publication date: March 20, 2008Inventors: Erik R. Delsman, Hua Guo, Edward N. Peters
-
Publication number: 20080039591Abstract: The present invention provides an acid anhydride ester obtained by esterifying cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and a composition of the ester, and a heat-curable resin composition and a cured product of the composition. _Provided is an epoxy resin composition using the acid anhydride ester as a curing agent for an epoxy resin, the epoxy resin composition having, for example, the following properties (1), (2), and (3): (1) the epoxy resin composition has a low viscosity at room temperature, so the components of the composition can be favorably blended with each other, (2) the acid anhydride ester has a low vapor pressure at curing temperature, so no evaporation loss occurs after curing, and the intended design of blend is capable, and (3) a cured product to be made from the composition is colorless and transparent, and changes its color to a small extent even when the product is irradiated with light or heated for a long time period.Type: ApplicationFiled: August 8, 2007Publication date: February 14, 2008Inventors: Tomohiro Sugawara, Takeshi Koyama, Atsushi Okoshi, Takashi Sato, Shuichi Ueno
-
Patent number: 7326755Abstract: A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additionally comprise a phenoxy resin, a phenolic resin and talc. A method for bonding an elastomer to a metal also is provided.Type: GrantFiled: August 3, 2005Date of Patent: February 5, 2008Assignee: Lord CorporationInventor: Zhiqiang M. Wang
-
Patent number: 7321005Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.Type: GrantFiled: March 19, 2007Date of Patent: January 22, 2008Assignee: International Business Machines CorporationInventor: Konstantinos I. Papathomas
-
Patent number: 7247682Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: April 21, 2005Date of Patent: July 24, 2007Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
-
Patent number: 7235611Abstract: In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a polymer or monomer, or reactive with a nucleophilic group on a polymer or monomer at a slower rate than any leaving group. The invention also comprises polymers or monomers with nucleophilic groups capped with a triazine moiety. Still other embodiments of the invention comprise processes for capping nucleophilic groups in a polymer or monomer which comprises combining and reacting the polymer or monomer with a triazine-comprising capping agent.Type: GrantFiled: September 26, 2003Date of Patent: June 26, 2007Assignee: General Electric CompanyInventors: Sterling Bruce Brown, Hans Peter Brack, James Anthony Cella, Dennis Karlik
-
Patent number: 7192997Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.Type: GrantFiled: February 7, 2001Date of Patent: March 20, 2007Assignee: International Business Machines CorporationInventor: Konstantinos I. Papathomas
-
Patent number: 7101933Abstract: A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of a catalyst in a reactor at a temperature of 90° C. to 220° C., characterized in that, in the course of the reaction, PPE needs not to be cleaved into small molecules and in stead, can mix and react directly with the epoxy resin to thereby produce a high speed transmitting dielectric material. The process of the invention can reduce greatly the synthetic reaction time, and is applicable in the production of the material useful in printed circuit board for wireless communication, base station and the like.Type: GrantFiled: December 10, 2003Date of Patent: September 5, 2006Assignee: Uniplus Electronics Co., Ltd.Inventors: Chen-Yu Hsieh, Ming-Cheng Hsiao, Tai-Wen Chien
-
Patent number: 7090895Abstract: An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.Type: GrantFiled: July 24, 2003Date of Patent: August 15, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Yoshifumi Inoue