Abstract: Improved compositions are provided which comprise a poly(phenylene ether) resin, a poly(arylene sulfide) resin, a polyester resin, and a compatibilizer compound. The compositions can further comprise functionalizing agents, impact modifiers, flame retardants, and reinforcing fillers to provide compositions that exhibit improved tensile strength and elongation characteristics. Articles molded from these compositions are useful in the electrical connector industry.

Abstract: An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.

Abstract: Compatible blends of poly(phenylene ether) resins and polyester resins are provided comprising electrophile-containing poly(phenylene ether) resins, polyester resins and an impact modifier mixture comprising a functionalized polyolefin-based resin and an elastomeric block copolymer to afford articles having good impact, ductility and tensile properties. The compositions may further comprise reinforcing agents, flame retardants, and flow promoters. Articles made from the compositions are useful for automotive components.

Abstract: Compositions are provided for comprising a compatibilizing PPE and a naphthalate-type polyester resin wherein the compositions have a drop in the elastic modulus occurring at least about 15.degree. C. higher than the corresponding blend wherein the polyester does not contain a substantial portion of naphthalate moieties. The compositions can further comprise impact modifiers, reinforcing agents, fillers, stabilizers, antistatic agents, plasticizers, lubricants, and other additives to provide compositions with enhanced physical properties. Articles molded from these compositions are useful in the automotive industry.

Abstract: The present invention relates to a readily molded engineering plastic composition comprising:polyphenylene ether polymer; optionallya second polymer chosen from polyesters, polyamides and polycarbonates; andabout 0.05 to about 5 weight percent hydrogenated poly (alpha-olefin) fluid.

Abstract: A hydroxyl functional acrylic addition polymer, useful in producing refinish compositions having a good balance of solids at a given viscosity and final film hardness, which comprises units derived from isobornyl methacrylate and units derived from 4-hydroxybutyl acrylate.

Abstract: A curable resin composition, which is not thickened nor gels during storage, can be high solids, cures even at low temperatures and is excellent in electrostatic coating properties, and which contains as main components, a polymer having in one molecule epoxy group(s), and functional group(s) in each of which a carbonate ester group (--O--CO--O--) is directly bound to an aromatic ring; or a mixture of a compound having in one molecule at least two epoxy groups and a compound having in one molecule at least two functional groups in each of which a carbonate ester group (--O--CO--O--) is directly bound to an aromatic ring, and a curing reaction catalyst.

Abstract: The invention describes a thermoplastic composition made of a continuous phase made of crystalline thermoplastic resin A, a dispersed phase made of polyphenylene ether resin B, and an amide compound C represented by formula 1,R.sub.4 --CONH--R.sub.2 --HNOC--R.sub.1 --CONH--R.sub.3 --HNOC--R.sub.5( 1)wherein R.sub.1, R.sub.2, and R.sub.3 represent divalent hydrocarbon groups, which may be identical or different, and R.sub.4 and R.sub.5 represent monovalent hydrocarbon groups, which may be identical or different. The amide compound is present in an amount between about 0.1 and about 30 parts by weight per 100 parts by weight of the resins A and B mixed together.

Abstract: A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.

Abstract: Thermosetting resin systems exhibiting improved performance characteristics when utilized in composite product applications, said resin systems being modified with a polyarylsulfidesulfone dispersed therein and with a polyethersulfone dissolved therein.

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B) , an average particle diameter in said dispersing phase having of 0.01-10 .mu..

Abstract: The present invention relates to a readily molded engineering plastic composition comprising:polyphenylene ether polymer; optionallya second polymer chosen from polyesters, polyamides and polycarbonates; andabout 0.05 to about 5 weight percent hydrogenated poly (alpha-olefin) fluid.

Abstract: The present inventions provides polyphenylene ether (PPE)/polyamide (PA) resin compositions having excellent dimensional stability when they absorb moisture, and good mechanical and other properties. Resin compositions of (A) 10-80 wt. parts PPE resins and (B) 90-20 wt. parts PA resins, in which the PA resins (a) are polymers formed by condensation of linear aliphatic diamines with linear aliphatic dicarboxylic acids and aromatic dicarboxylic acids, and (b) have terminal amino group contents of at least 0.4 mequiv/g.

Abstract: Improved thermoplastic compositions are disclosed, comprising a polyphenylene ether resin capped with an epoxytriazine compound; a thermoplastic polyester; and a radial block copolymer which itself comprises at least about 60% by weight of a polymerized vinyl aromatic material, and about 5%-40% of a polymerized conjugated diene monomer.

Abstract: Resin compositions comprising (A) polyethylene ether resins, (B) polyamide resins, (C) elastomeric substances, and (D) needle-shaped titanium oxide are disclosed. The disclosed resins exhibit an excellent balance of stiffness and impact resistance, low linear coefficient of expansion, and good heat resistance, oil resistance, forming processability and molding surface appearance.

Abstract: Polyarylene ether-organopolysiloxane copolymers are provided having amine, or ester connecting linkages between blocks resulting from the melt extrusion of epoxy, carboxy or amine functionalized polyarylene ether with epoxy, carboxy or amine functionalized organopolysiloxane.

Abstract: Compositions containing a thermoplastic polyester resin, a polyphenylene ether resin capped with an epoxytriazine compound, linear, tapered, block copolymers and an elastomeric material.

Abstract: Disclosed herein is a flame-retardant resin composition comprising 100 parts by weight of a styrene based polymer, 10 to 40 parts by weight of a brominated bisphenol epoxy resin or a resin in which at least one of the epoxy terminals of the brominated bisphenol epoxy resin is blocked with a brominated phenol, 1 to 10 parts by weight of antimony trioxide, and 0.3 to 5 parts by weight of a methacrylate polymer with a methacrylate unit content of not less than 25 wt %.

Abstract: The resin composition comprises, as essential components, (A) an epoxy resin, (B) a thermoplastic resin and (C) particles of a diaminodiphenylsulfone compound whose cross linking reactivity with the epoxy resin is prevented until the resin composition is subjected to molding or curing by a resin coating which is formed (i) by forming or adhering resin particles onto the surface of the diaminodiphenylsulfone particles or (ii) by forming a resin film on the diaminodiphenylsulfone particles, the coating resin used for forming the resin coating is not compatible with components included in the resin composition at the temperature up to the curing temperature of the resin composition.

Abstract: A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60.degree. C., flowable under shear and self-adhesive at temperatures in the range 60.degree.-150.degree. C. and hardenable at temperature over 150.degree. C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO.sub.2 Ph).sub.n and Ph.sup.1.sub.a linked through ether and/or thioether, where Ph is paraphenylene, Ph.sup.1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph.sup.1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO.sub.2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula --D--Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.

Abstract: A thermoplastic resin composition comprising (A) from about 10 to about 90% by weight of a hydroxyalkylated polyphenylene ether represented by formula (I): ##STR1## wherein A represents a residue of a polyphenylene ether from which a hydroxyl group is removed; and n represents an integer of from 1 to 10, and (B) from about 10 to about 90% by weight of a resin selected from a carboxyl-containing olefin resin, an epoxy-containing olefin resin, a hydroxyl-containing olefin resin, a polyamide resin, and a saturated polyester resin, provided that when (B) is the olefin resin, the hydroxyalkylated polyphenylene ether also can be represented by formula (II): ##STR2## wherein A is defined as above; X represents an oxygen atom or a nitrogen atom; R.sup.1 represents an alkylene group having from 1 to 12 carbon atoms; R.sup.2 and R.sup.3 each represents a hydrocarbon group having from 1 to 6 carbon atoms; s represents 1 when X is an oxygen atom, or 2 when X is a nitrogen atom; and t represents an integer of from 1 to 3.

Abstract: The present invention provides a resin composition enhanced in melt tension and remarkably improved in blow moldability without a parison being drawing down during blow molding, while being freed from the tendency to gelation at high viscosity, maintaining stable flowability and capable of effectively producing a blow molded article of comparatively large size having uniform thickness and excellent appearance.A resin composition for blow molding prepared by compounding 100 parts by weight of a resin component composed of:(A) 1 to 99 parts by weight of a thermoplastic polyester resin mainly comprising an aromatic dicarboxylic acid or the ester forming derivative thereof and an aliphatic dihydroxy compound having 2 to 8 carbon atoms and(B) 99 to 1 parts by weight of a thermoplastic polyamide resin with(C) 0.2 to 10 parts by weight of a styrenic copolymer comprising 40 to 97% by weight of styrene, 60 to 3% by weight of a glycidyl ester of an .alpha.,.beta.

Abstract: A novel curable polyphenylene ether resin composition caontains (a) a curable polyphenylene ether resin containing at least a reaction product of a polyphenylene ether with an unsaturated carboxylic acid or an acid anhydride, (b) at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group and/or (e) a reinforcement material. The resin composition has excellent film-forming properties, resin flowability in pressing and storage stability. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition has excellent chemical resistance, heat resistance, dielectric properties and dimensional stability.

Abstract: A flame-retardant thermoplastic resin composition is disclosed, comprising (A) a thermoplastic resin and (B-1) a halogenated epoxy resin whose epoxy groups are blocked by a long chain aliphatic carboxylic acid or (B-2) a mixture prepared by melt mixing (b1) a halogenated epoxy resin or (b2) a halogenated epoxy resin whose epoxy groups are blocked with (b3) a long chain aliphatic carboxylic acid. The composition has easy release from mold and satisfactory thermal stability during molding.

Abstract: According to the present invention, there is provide a monofilament, based on the total weight of the monofilament composition, (a) from about 10 weight % to about 60 weight % of a functionalized polyphenylene ether, (b) from about 40 weight % to about 90 weight % of a polyamide, and (c) from about 1 weight % to about 30 weight % of a functionalized elastomeric polymer, and industrial conveyer belts fabricated therefrom.

Abstract: The present invention relates to a polymer blend composition for melt molding which is a composition obtained by adding a thickener to a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer, characterized in that the melt viscosity of the composition determined at a molding temperature at a shear rate of 1000 sec.sup.-1 is the same or higher than the melt viscosity of said non-liquid crystal polymer determined under the same conditions.According to the present invention, a polymer blend for melt molding having improved properties, whereby problems observed in prior arts upon molding a polymer blend comprising a liquid crystal polymer and a non-liquid crystal polymer (for example, insufficient alignment of the liquid crystal polymer and difficulties in extrusion, because of excessively low melt viscosity) can be solved, is obtained.

Abstract: The invention relates to a process for producing improved water absorbing resin comprising the steps of treating water absorbing resin particles (A) with an aqueous solution of a water-soluble compound (B) and a crosslinking agent (C), reacting, and obtaining resin particles crosslinked in the surface vicinity; and a water absorbing resin obtained by this process possessing the absorption characteristics of an absorbency under a pressure-free state of 50 times or more to physiological saline solution, and an absorbency under the pressurized state of 30 times or more to physiological saline solution. The water-soluble compound (B) is at least one water-soluble compound selected from the group consisting of alkylene-oxide adducts of monofunctional alcohols (1), a monofunctional salts of organic acids (2), and lactams (3), and inert to (A) and (C); and the crosslinking agent (C) has two or more functional groups capable of reacting with (A).

Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.

Abstract: Epoxy-functionalized polyphenylene ethers are prepared by melt blending a polyphenylene ether with glycidyl acrylate in the presence of a lubricant such as at least one hydrogenated poly-.alpha.-olefin. The blending reaction takes place at a temperature in the range of about 250.degree.-300.degree. C., and the amount of glycidyl acrylate employed is about 2.5-5.0% by weight based on polyphenylene ether. The products are characterized by a gel content of less than 5% by weight. They form copolymer-containing compositions having excellent properties upon melt blending with linear polyesters such as poly(butylene terephthalate).

Abstract: Resinous compositions are prepared by blending an ABS copolymer or similar addition polymer, a polyphenylene ether-polystyrene blend, and a copolymer of an olefin such as ethylene and an epoxy compound such as glycidyl methacrylate. The first two constituents may be scrap materials. The resulting compositions have high impact strength and other advantageous properties.

Abstract: Hydroxy group-containing polymers, particularly polyphenylene ethers, are capped by reaction with a chlorotriazine in the presence of a substantially inert organic liquid such as toluene, water, a phase transfer catalyst and a tertiary amine from a specific class, preferably a trialkylamine such as triethylamine or dimethyl-n-butylamine. The reaction proceeds rapidly and in good yield.

Abstract: Phenoxy resins are disclosed which are prepared from polyglycidyl amines containing one or more mesogenic moieties. The phenoxy resins are useful in the preparation of coatings.

Abstract: Disclosed are curable compositions based on a combination of polyphenylene oxide, monomeric epoxy resin, a compatibilizing metal salt of tin, and suitable curing agents. The monomeric epoxy resin comprises a polyepoxide composition comprising at least one bisphenol polyglycidyl ether having an average of at most one aliphatic hydroxy group per molecule. The composition may be used in the preparation of laminates useful as printed circuit boards.

Abstract: Polyphenylene ether-olefin polymer compositions having improved properties are obtained by first blending an acyl group- or electrophilic group-functionalized polyphenylene ether of relatively high molecular weight with a lower molecular weight unfunctionalized polyphenylene ether to form a blend of which the lower molecular weight polymer comprises about 45-60% by weight, subsequently blending with an electrophilic group- or acyl group-functionalized olefin polymer (respectively), preferably a glycidyl methacrylate-grafted EPDM copolymer, and finally blending with a curing agent such as hexamethylenediaminemonocarbamic acid.

Abstract: A thermoplastic resin composition comprising (A) from about 10 to about 90% by weight of a hydroxyalkylated polyphenylene ether represented by formula (I): ##STR1## wherein A represents a residue of a polyphenylene ether from which a hydroxyl group is removed; and n represents an integer of from 1 to 10,and (B) from about 10 to about 90% by weight of a resin selected from a carboxyl-containing olefin resin, an epoxy-containing olefin resin, a hydroxyl-containing olefin resin, a polyamide resin, and a saturated polyester resin, provided that when (B) is the olefin resin, the hydroxyalkylated polyphenylene ether also can be represented by formula (II): ##STR2## werein A is defined as above; X represents an oxygen atom or a nitrogen atom; R.sup.1 represents an alkylene group having from 1 to 12 carbon atoms; R.sup.2 and R.sup.3 each represents a hydrocarbon group having from 1 to 6 carbon atoms; s represents 1 when X is an oxygen atom, or 2 when X is a nitrogen atom; and t represents an integer of from 1 to 3.

Abstract: A thermoplastic resin composition comprising (a) from 10 to 90% by weight of polyphenylene sulfide and (b) from 10 to 90% by weight of hydroxyalkylated polyphenylene ether which exhibits improved compatibility between components (a) and (b) and provides molded articles having characteristics inherent to polyphenylene sulfide and polyphenylene ether, i.e., excellent mechanical strength, excellent rigidity, and good appearance.

Abstract: Compositions containing thermoplastic polyester resin and polyphenylene ether resin capped with an epoxytriazine compound are described. The compositions also include linear, tapered, block copolymers.

Abstract: Improved thermoplastic compositions are disclosed, comprising a polyethylene ether resin capped with an epoxytriazine compound; a thermoplastic polyester; and a radial block copolymer which itself comprises at least about 60% by weight of a polymerized vinyl aromatic material, and about 5%-40% of a polymerized conjugated diene monomer.

Abstract: A thermoplastic polymer composition(a) 10 to 95 parts by weight of a block copolymer which comprises at least two polymer segments comprised primarily of a vinyl aromatic hydrocarbon and at least one polymer segment comprised primarily of a conjugated diene, in which:(i) the content of the vinyl aromatic hydrocarbon is more than 60% by weight and 95% by weight;(ii) the weight ratio of the vinyl aromatic hydrocarbon present in the copolymer as the vinyl aromatic hydrocarbon polymer block to the total vinyl aromatic hydrocarbons present in the copolymer is more than 0.75% to 0.98%; and(iii) the ratio of the weight average molecular weight to the number average molecular weight of the vinyl aromatic hydrocarbon polymer block in the copolymer is 1.2 to 2.0 and(b) 5 to 90% by weight of polyphenylene ether, and, optionally,(c) 3 to 400 parts by weight, based on 100 parts by weight of the total weight of said components (a) and (b), of polystyrene.

Abstract: This invention relates to thermoplastic molding compositions comprising the following:(a) about 5 to about 95% by weight of a polyester or a polyester, comprising: repeat units derived from terephthalic acid, ethylene glycol, and 1,4-cyclohexanedimethanol wherein the mole ratio of ethylene glycol to 1,4-cyclohexanedimethanol is from 66:34 to 98:2, said polyester having an I.V. of about 0.3 dL/g to about 1.2 dL/g, and(b) about 5 to about 95% by weight of a polyphenylene ether.The compositions are useful for producing clear articles by injection molding or extrusion.

Abstract: Derivatives of melamine are disclosed having a carboxylic acid substituent on an amine nitrogen appended to the triazine ring. The compounds can be used to cross-link polymers having epoxy groups thereon.

Abstract: Blended polymer compositions are described which comprise:(A) at least about 5% by weight of at least one polyphenylene ether;(B) up to about 95% by weight of at least one block polyetheramide; and(C) from 0 to about 3% by weight based upon the total weight of components (A), (B) and any other polymers present in the composition of at least one polyepoxide;with the proviso that when said block polyetheramide has a flex modulus greater than about 75 MPa., said composition contains at least about 0.5% by weight based upon the total weight of components (A), (B) and any other polymers present in the composition of said polyepoxide.The blends give non-delaminating molded parts with good mechanical properties. The blends can be formed from a high-nitrogen polyphenylene ether and a block polyetheramide without the need for using vacuum-vented polyphenylene ether extrudate and without the need for adding a compatibilizer.

Abstract: According to the present invention, there is provide a monofilament, based on the total weight of the monofilament composition, (a) from about 70 weight % to about 30 weight % of a polyphenylene ether, (b) from about 30 weight % to about 70 weight % of a polyamide, (c) from about 0.1 weight % to about 2.0 weight % of a compatibilizer compound for (a) and (b), and (d) from about 1 weight % to about 35 weight % of a functionalized olefinic elastomer, and industrial conveyer belts fabricated therefrom.

Abstract: Epoxy-functionalized polyphenylene ethers are prepared by melt blending a polyphenylene ether with glycidyl acrylate in the presence of a lubricant such as at least one hydrogenated poly-.alpha.-olefin. The blending reaction takes place at a temperature in the range of about 250.degree.-300.degree. C., and the amount of glycidyl acrylate employed is about 2.5-5.0% by weight based on polyphenylene ether. The products are characterized by a gel content of less than 5% by weight. They form copolymer-containing compositions having excellent properties upon melt blending with linear polyesters such as poly(butylene terephthalate).

Abstract: Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.

Abstract: Disclosed is a process for preparing a polyhydroxyphenylene ether resin which comprises copolymerizing a phenol-substituted compound having hydroxyl group as a substituent, represented by the formula (I): ##STR1## wherein m and n each represents an integer satisfying the formulae 1.ltoreq.m and m+n.ltoreq.4; J represents {(HO).sub.a --R.sup.1 --S}.sub.b --R.sup.2 -- where a and b each represents an integer of 1 to 6; and R.sup.1 and R.sup.2 each represents unsubstituted or halogen-substituted alkylene, alkenylene or arylene, or alkylene; K represents halogen, primary or secondary alkyl, alkenyl, phenyl, aminoalkyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy;with at least one phenol-substituted compound represented by the formula (II): ##STR2## wherein Qs each represents hydrogen, halogen, primary or secondary alkyl, alkenyl, aromatic, aminoalkyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy,and a resin composition containing the polyhydroxyphenylene ether resin prepared by the above method.