Abstract: A polymer composition comprising chains of at least one aromatic polymer or a mixture thereof together with at least one chain linking component wherein the at least one aromatic polymer comprises polymer chains of number average molecular weight (Mn) in a first range and characterised by a polymer flow temperature, and having at least one reactive end group, and wherein the at least one chain linking component comprises at least two linking sites, characterised in that a plurality of the polymer chain end groups are adapted to react with the linking sites at chain linking temperature in excess of the polymer flow temperature to form linked polymer chains of number average molecular weight (Mn) in a second range which is in excess of the first range, substantially thermoplastic in nature; process for the preparation thereof; prepreg, composite or shaped product obtained therewith and the use thereof.

Abstract: A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.

Abstract: A phenolic resin obtainable by reacting a dihydroxy compound of the following formula (1) with a phenolic compound, wherein the dihydroxy compound is partially dehydrated.

Abstract: The invention relates to novel liquid epoxy resin emulsions which contain the following components, dissolved and/or dispersed in water: (A) at least one binding agent selected from the group made of epoxy resins and modified epoxy resins, (B) at least one non ionic thickener and (C) at least one catalyst for hardening, produced by reacting at least one boron trifluoride complex with at least one compound containing at least one epoxy group. The invention also relates to a method for the production and use thereof as an impregnating varnish for electrotechnical components, particularly for electrical winding items.

Abstract: An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

Abstract: The present invention provides a crosslinkable polymer composition in the form of its aqueous polymer dispersion or polymer powder, including A) a copolymer having a glass transition temperature Tg or a melting temperature of ?30° C. and containing units derived from one or more comonomers selected from the group consisting of vinyl esters of branched or unbranched alkylcarboxylic acids of 1 to 18 carbon atoms, acrylic esters or methacrylic esters of branched or unbranched alcohols of 1 to 15 carbon atoms, dienes, olefins, vinyl aromatics and vinyl halides and from 0.

Abstract: An object of the present invention is to provide an agent serving both as a compatibilizer and an impact strength-imparting agent, which is freed from layer separation phenomenon and capable of improving compatibility to a polyphenylene ether and/or a polyolefin without detriment to weld tensile strength and low temperature impact strength. Another object is to provide a resin composition, which is obtained by blending the agent serving both as a compatibilizer and an impact strength-imparting agent with other thermoplastic resin, and which is superior in its impact resistance, particularly impact strength at low temperature, heat resistance and processability.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.

Abstract: An object of the invention is to provide a resin composition with which color tone, moldability, heat resistance, flame retardancy and mechanical properties are simultaneously attained each in a sufficient level and which is particularly excellent in color tone and less generation of foreign matter. Specifically, the present invention provides a resin composition obtained by melt-kneading: (A) 99 to 1 wt. % of a functionalized polyphenylene ether resin obtained by reacting a mixture of: (a) 100 parts by weight of a polyphenylene ether, and (b) 0.01 to 10.0 parts by weight of a modifier selected from non-aromatic conjugated diene compounds, dienophile compounds having one dienophile group and precursors for these diene or dienophile compounds at a reaction temperature of from room temperature to the melting point of (a); and (B) 1 to 99 wt. % of a liquid-crystal polyester.

Abstract: A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (Å) of an epoxy group-containing monomer and an &agr;-olefin, a powder of the resin composition, a laminate having a layer containing the resin composition, and producing method of the laminate.

Abstract: A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.

Abstract: Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): and (B) 0.1 to 60 parts by weight of a copolymer having a functional group reactive with the above-mentioned polyphenylene oxide.

Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.

Abstract: An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.

Abstract: Phenolic resin polyols are disclosed. The polyols, which contain aliphatic or mixed phenolic and aliphatic hydroxyl groups, are the reaction products of aralkylated phenols or phenol aralkylation polymers with an oxyalkylating agent selected from alkylene oxides and alkylene carbonates. The phenolic resin polyols are versatile intermediates for many polymer systems, including urethanes, epoxies, alkyds, acrylates, and polyesters.

Abstract: The present invention provides a partial condensate of glycidyl ether group-containing alkoxysilane which is obtainable by dealcoholization reaction between glycidol and a partial condensate of alkoxysilane, compositions comprising the same and preparation methods thereof. Further, the present invention provides an alkoxy-containing silane-modified polyimide resin, alkoxy-containing silane-modified polyamide-imide resin and alkoxy-containing silane-modified phenol resin which are modified with the partial condensate of glycidyl ether group-containing alkoxysilane, and preparation methods thereof.

Abstract: A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (A) of an epoxy group-containing monomer and an &agr;-olefin, a powder of the resin composition, a laminate having a layer containing the resin composition, and producing method of the laminate.

Abstract: A catayltic process for the hydrogenation of aromatic polymers is disclosed. The catalyst used in the process is a metal or mixture of metals of sub-group VIII of the periodic table together with a support of silicon dioxide, aluminum oxide or a mixture thereof. The catalyst, having pores is characaterized in that the pores having diameters of 100 to 1,000 Å constitute less than 15 percent of the total volume of pores. The hydrogenation, that is carried out in the presence of at least one oxygen-containing hydrocarbon is characterized in that it is essentially complete and without significant degradation of molecular weights.

Abstract: A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an alkyd resin, or mixtures thereof. The coating solution, in the liquid state, contains water. The binder contains 50-100% phenolic resin, preferably based on phenol and/or resorcinol.

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Abstract: Disclosed is a composition comprising a blend of (a) a thermally reactive polymer selected from the group consisting of resoles, novolacs, thermally reactive polyarylene ethers, and mixtures thereof; and (b) a photoreactive epoxy resin that is photoreactive in the absence of a photocationic initiator.

Abstract: A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

Abstract: A resin composition comprising (A) an aromatic polycarbonate resin or aromatic epoxy resin and (B) a minor amount of an organosiloxane containing phenyl and alkoxy radicals is flame retardant and does not emit harmful gases when burned. It can be molded into parts having optical transparency.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: Disclosed is a composition comprising a blend of (a) a thermally reactive polymer selected from the group consisting of resoles, novolacs, thermally reactive polyarylene ethers, and mixtures thereof; and (b) a photoreactive epoxy resin that is photoreactive in the absence of a photocationic initiator.

Abstract: This invention relates to an epoxy resin composition which comprises polyalkyl phenol resins or polyalkyl phenol epoxy resins or both, wherein the polyalkyl phenol resins are represented by formula (I): ##STR1## wherein Ra, Rb and Rc may be the same or different from each other and stand for C.sub.1-5 alkyl styryl or halogen respectively;n is an integer of 0 to 4;k is an integer of 0 to 3;l is an integer of 0 to 4; andm is an integer of 1 to 10;and the polyalkyl phenol epoxy resins, which are obtained by reacting polyalkyl phenol resins of formula (I) with epihalohydrins, are represented by formula (II): ##STR2## wherein G stands for ##STR3## while the other symbols are the same as those defined above. The epoxy resin composition of this invention is able to provide a reactivity at lower temperatures and provide lower viscosity when used as hardener resins, as compared with traditional phenolic novolacs.

Abstract: Novel polymeric compounds having pendent fluoroaliphatic groups, pendent organic-solubilizing groups, and pendent groups capable of reacting with an epoxy silane; which have been reacted with an epoxy silane have been discovered. These compounds are easy to apply, abrasion and impact resistant, and provide durable, low surface energy, streak reducing surfaces on coating dies, edge guides, and other coating and fluid contacting surfaces.

Abstract: The invention provides a powdered crosslinkable textile binder composition for producing polymer bonded textile moldings or sheet materials, comprisinga) a powdered copolymer obtainable by emulsion polymerization and subsequent drying of one or more monomers selected from the group consisting of vinyl esters, acrylic esters, methacrylic esters, vinylaromatics and vinyl chloride and of 0.01 to 25% by weight, based on the total weight of the copolymer, of one or more ethylenically unsaturated carboxyl-containing monomers, the copolymer having a glass transition temperature Tg or a melting point of greater than 40.degree. C. and a molecular weight Mw of 60,000 to 300,000, andb) at least one powdered compound having two or more epoxide or isocyanate groups and a melting point of 40.degree. C. to 150.degree. C.

Abstract: The present invention relates to binder compositions containingA) 40 to 95 parts by weight of OH-functional graft copolymer resins prepared by copolymerizinga) 0.1 to 10 parts by weight of polybutadienes containing at least 20% of 1,2-vinyl groups,b) 5 to 30 parts by weight of aliphatic .alpha.-olefins,c) 0.1 to 35 parts by weight of glycidyl esters of .alpha.-alkylalkane-monocarboxylic acids,d) 10 to 70 parts by weight of unsaturated, aromatic monomers,e) 5 to 60 parts by weight of hydroxyalkyl esters of acrylic and/or methacrylic acid having primary hydroxyl groups,f) 0 to 50 parts by weight of (cyclo)aliphatic esters of acrylic and/or methacrylic acid,g) 0.1 to 20 parts by weight of .alpha.,.beta.

Abstract: The invention provides a composition for a platable resinous substrate having enhanced heat performance comprising: a thermoplastic mixture of at least one polyphenylene ether and at least one poly(alkenylaromatic) compound, at least one rubber compound, and at least one inorganic filler material.

Abstract: A composite material for a lateral rigid member of a track belt for use in a snowmobile. A glycidylamine epoxy resin that is a polyfunctional epoxy thermosetting resin and has a molecular weight of about 250 to 1000 is included in an amount of 100 parts by weight. A 2-functional epoxy resin having a molecular weight of about 100 to 600 is included in an amount of 12 to 14.5 parts by weight. An aromatic polycarbonate thermoplastic resin having a molecular weight of about 12000 to 80000, a glass transition point of 130.degree. C. or more, a melting point of 220.degree. C. to 240.degree. C. is included in an amount of 5 to 45 parts by weight. An acid anhydride curing agent is included in an amount of 90 to 130 parts by weight. The composite material also includes reinforcing fiber.

Abstract: Compositions are provided for compatibilized blends comprising compatibilizing poly(phenylene ether) resins and epoxy-functional polyolefins that exhibit improved resistance to delamination while providing high impact strength and other improved physical properties. Articles made from the compositions are useful for automotive lighting and under hood components.

Abstract: An electrodepositable coating composition is provided comprising (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a curing agent for transurethanation, transamidation or transesterification curing like at least a partially capped polyisocyanate curing agent; and (c) a catalytic mixture of bismuth and an amino acid or amino acid precursor. Optionally, an auxiliary acid may be present to increase the effectiveness of the amino acid in the mixture with bismuth.

Abstract: A fire-retardant compound including bromine indicated by general formula (1), wherein the end group X and Y are comprised by A or B shown in formula (2), and the said fire-retardant compound is a mixture of the composition including 15 to 30% of X=Y=A, the composition including 40 to 60% of X=A and Y=B and the composition including 20 to 35% of X=Y=B, and degree of polymerization n is indicated by an integral number from 0 to 30, and a flame-retarded thermoplastic resin including said fire-retardant compound.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

Abstract: A water-soluble polymer prepared by melting and reacting a mixture of an oxycarboxylic acid having a melting point of 170.degree. C. or less and maleamic acid, or a mixture of a plurality of oxycarboxylic acids including at least one oxycarboxylic acid having a melting point of 170.degree. C. or less and maleamic acid, at a temperature of 170.degree. C. or less at the start of the reaction to obtain a polymer; and then hydrolyzing the polymer.

Abstract: A binder composition for thermosetting powder paints comprising (i) a polymer that is capable of reacting with epoxy groups and (ii) a crosslinker that contains epoxy groups, wherein the crosslinker comprises at least one C.sub.5 to C.sub.26 linear or branched aliphatic chain with the proviso that epoxy groups are carried on at least one aliphatic chain. In order to function as a crosslinker the amount of oxirane-oxygen originating from the crosslinker in the binder composition is higher than 0.1 meq/gram. The crosslinker is, for example, an epoxydized oil, a modified epoxydized oil or an epoxydized alkyd resin. A powder paint comprising the binder composition can contain a suitable catalyst and, optionally, an additional curing agent.

Abstract: Compatibilized blends of poly(phenylene ether) resins and polyester resins are provided from nucleophile containing poly(phenylene ether) resins and polyester resins and compatibilizer compounds to afford articles having good impact, ductility and tensile properties. The compositions may further comprise impact modifiers, metal salts, reinforcing agents, flame retardants and flow promoters. Articles made from the compositions are useful for automotive components.

Abstract: Compatibilized blends of poly(phenylene ether) resins and polyester resins are provided from nucleophile containing poly(phenylene ether) resins and polyester resins and compatibilizer compounds to afford articles having good impact, ductility and tensile properties. The compositions may further comprise impact modifiers, metal salts, reinforcing agents, flame retardants and flow promoters. Articles made from the compositions are useful for automotive components.

Abstract: Antistatic polyethylene ether composition, containing (A) 100 parts, by weight, of a polyphenylene ether resin or such a resin and styrene resin containing at least one PPE resin in which at least 0.01 unit having at least one substituent of the following structure: ##STR1## (where R1 and R2 independently represent a hydrogen atom, alkyl group, substituted alkyl group, halogen atom, aryl group, or substituted aryl group; R3 and R3' independently represent a hydrogen atom, alkyl group, or substituted alkyl group, but R3 and R3' are not simultaneously hydrogen atoms) is present per 100 phenylene ether structural units and (B) 3-30 parts, by weight, of poly(alkylene oxide) containing at least one poly(alkylene oxide) having at least one intramolecular structure selected from among the following structures: ##STR2## (where X.sub.1 and X.sub.2 independently represent a hydrogen atom, halogen atom, or alkyl group, and n is an integer ranging from 0 to 10).

Abstract: A thermoplastic resin composition containing (A) 100 parts by weight of at least one modified polyphenylene ether selected from the group consisting of (A1) a modified polyphenylene ether having repeating units of the formula (1): ##STR1## in which R.sub.1 and R.sub.2 are, independently from each other, a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms and having a number average polymerization degree of 20 to 1200, in which 0.02/X to 1/X of methyl groups at the 2- and/or 6-positions of phenylene group are modified to an aminomethyl group in which X is a number average polymerization degree and (A2) a modified polyphenylene ether comprising polyphenylene ether to which an amino group-containing monomer is graft polymerized, and (B) 0.1 to 70 parts by weight of an epoxy group-containing ethylene copolymer comprising (a) 50 to 99% by weight of ethylene units, (b) 0.

Abstract: Compatiblized mixtures of a polyphenylene ether, a polyamide and a compatibilizer are described. The mixtures have improved physical properties as a result of using in the mixtures a polyamide having a terminal amine group to terminal carboxyl group ratio of greater than 1.