Specified Material Contains Nitrogen Patents (Class 525/486)
  • Patent number: 10918912
    Abstract: Golf balls having covers made of thermoplastic polyurethane compositions are provided. Multi-piece golf balls can be made. In one embodiment, the outer cover layer is formed from a composition comprising a thermoplastic polyurethane and epoxy compound. Mixtures of multi-functional amines and imines, and multi-functional isocyanates, and epoxy curing agents; and solvent, can be applied to the outer cover. The resulting coating may contain polyurethanes, polyureas, and hybrids, copolymers, and blends thereof. The cover composition and surface coatings can further include catalysts, ultraviolet (UV)-light stabilizers, and other additives. The coating methods have many benefits and the finished balls have good physical properties.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: February 16, 2021
    Assignee: Acushnet Company
    Inventors: Michael J. Sullivan, Michael Michalewich, Mark L. Binette, Brian Comeau
  • Patent number: 9562175
    Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: February 7, 2017
    Assignee: PPG Industries Ohio, Inc.
    Inventors: David B. Asay, Tien-Chieh Chao, Umesh C. Desai, Cheng-Hung Hung, Masayuki Nakajima, Noel R. Vanier
  • Patent number: 9056786
    Abstract: The present invention relates to fabrics, composites, prepregs, laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be adapted for use in high energy impact applications such as ballistic or blast resistance applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: June 16, 2015
    Assignee: PPG Industries Ohio, Inc.
    Inventors: James Carl Peters, Juan Camilo Serrano, Hong Li, Cheryl A. Richards
  • Publication number: 20150126690
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventor: Joseph Gan
  • Patent number: 9000120
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: April 7, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Andreas Lutz, Robert D. Froese, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Publication number: 20150065608
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.
    Type: Application
    Filed: April 9, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Jin Seok Moon, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim
  • Publication number: 20150025201
    Abstract: The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins.
    Type: Application
    Filed: July 17, 2013
    Publication date: January 22, 2015
    Inventors: Gamini Ananda VEDAGE, Gauri Sankar LAL, Stephen Michael BOYCE, Atteye Houssein ABDOURAZAK, Dilipkumar Nandlal SHAH
  • Patent number: 8921497
    Abstract: An adhesive for anchoring materials in or to concrete or masonry exhibits a shorter cure time than previous adhesives and comprises an epoxy compound and a curing agent of at least one aliphatic amine and at least one tertiary amine, optionally with a reactive dilent, which possesses sufficent strength to pass ICBO Heat Creep Test at 110 degrees F. and the ICBO Damp Hole Test at 75 degrees F.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: December 30, 2014
    Assignee: Illinois Tool Works Inc.
    Inventor: Jim Surjan
  • Publication number: 20140342161
    Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
    Type: Application
    Filed: October 18, 2011
    Publication date: November 20, 2014
    Applicant: Shengyi Technology Co. Ltd.
    Inventor: Xianping Zeng
  • Patent number: 8742018
    Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffery L. Reynolds, Rajesh H. Turakhia, George Jacob, Marty J. Null
  • Patent number: 8729197
    Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: May 20, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Michael A. Kropp
  • Patent number: 8729213
    Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 20, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Williams Rene Edouard Raymond, Gamini Ananda Vedage
  • Patent number: 8729196
    Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: May 20, 2014
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Akihiko Shimasaki
  • Publication number: 20140010979
    Abstract: To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), “R” is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).
    Type: Application
    Filed: March 22, 2012
    Publication date: January 9, 2014
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Masao Tomioka, Manabu Kaneko, Miyuki Hagiwara
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Publication number: 20130090431
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Application
    Filed: June 27, 2011
    Publication date: April 11, 2013
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Andreas Lutz, Robert D. Froese, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Patent number: 8404339
    Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: March 26, 2013
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 8362116
    Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming Jen Tzou, June Che Lu, Yi Cheng Lin
  • Patent number: 8247517
    Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: August 21, 2012
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Michael Henningsen, Georg Degen, Matthias Maase, Manfred Doering, Ulrich Arnold
  • Patent number: 8198381
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 12, 2012
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Patent number: 8114954
    Abstract: The invention is directed to polyester processes that utilizes a pipe reactor in the esterification, polycondensation, or both esterification and polycondensation processes. Pipe reactor processes of the present invention have a multitude of advantages over prior art processes including improved heat transfer, volume control, agitation and disengagement functions.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: February 14, 2012
    Assignee: Grupo Petrotemex, S.A. de C.V.
    Inventor: Bruce Roger DeBruin
  • Patent number: 8097664
    Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), phenol resin (C), metal compound (D), and nitrogen oxide ion (E), wherein the metal compound (D) is contained in an amount of 10 to 10,000 ppm calculated as metal and the nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm, relative to the mass of the cationic electrodeposition coating composition. The cationic electrodeposition coating composition exhibits excellent anti-corrosion properties when coated onto untreated steel sheets.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: January 17, 2012
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Akihiko Shimasaki
  • Patent number: 8044154
    Abstract: Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: October 25, 2011
    Assignee: Trillion Science, Inc.
    Inventors: John J. McNamara, Yurong Ying, Rong-Chang Liang
  • Patent number: 7994263
    Abstract: This invention discloses a cationic electrodeposition paint composition containing an amino group-containing modified epoxy resin which is obtained through reaction of specific modified epoxy resin with xylene formaldehyde resin having phenolic hydroxyl groups and amino group-containing compound. The cationic electrodeposition paint composition excels in film thickness retention, finished appearance of coating film and electrocoatability of galvanized alloy steel sheet and can form coating film having good corrosion resistance, even when its content of volatile organic compound (VOC) is reduced.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: August 9, 2011
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Akihiko Shimasaki
  • Patent number: 7989561
    Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: August 2, 2011
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Makoto Hayashi, Koshin Nakai, Katsuto Murata
  • Publication number: 20110120761
    Abstract: Epoxy resin compositions which comprise an epoxy resin (A), an active ester compound (B), and a triazine-containing cresol novolac resin (C), when cured and roughened, exhibit a roughed surface which has a high adhesion strength to a metal plated conductor, even though the roughness of the roughed surface is small, and provide an insulating layer which has a low coefficient of linear expansion and a low dielectric loss tangent.
    Type: Application
    Filed: November 22, 2010
    Publication date: May 26, 2011
    Applicant: AJINOMOTO CO. INC.
    Inventor: Kenji KAWAI
  • Patent number: 7928170
    Abstract: The present invention is one liquid type cyanate-epoxy composite resin composition comprised of cyanate ester resin (A), epoxy resin (B), and potential curing agent (C), characterized in that the above potential curing agent is the potential curing agent containing phenol resin (b) as well as modified amine (a) which has one or more amino groups having an active hydrogen within a molecule obtained by reacting polyamine compound (a-1) with epoxy compound (a-2). The one liquid type cyanate-epoxy composite resin composition having storage stability, curing properties and high heat resistance properties at the same time can be realized by this composition.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: April 19, 2011
    Assignee: Adeka Corporation
    Inventors: Ryo Ogawa, Yoko Masamune, Shinsuke Yamada
  • Patent number: 7923516
    Abstract: The present invention is a cyanate-epoxy composite resin composition comprised of a cyanate ester resin (A), an epoxy resin (B), and a latent curing agent (C), characterized in that the latent curing agent (C) is composed of a modified polyamine (c1), a phenol resin (c2) and one or more kind of polycarboxylic acid (c3). The above modified polyamine (c1) is a modified polyamine, which is obtained by the reaction of polyamine compound (c1-1) with epoxy compound (c1-2), containing one or more amino group having an active hydrogen within a molecule.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: April 12, 2011
    Assignee: Adeka Corporation
    Inventors: Ryo Ogawa, Mitsunori Ide, Shinsuke Yamada
  • Patent number: 7897703
    Abstract: Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: March 1, 2011
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20100310849
    Abstract: The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards.
    Type: Application
    Filed: December 10, 2008
    Publication date: December 9, 2010
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Jürgen Kress, Stephan Tusl, Sandro Cicchetti, Thierry Bécret
  • Patent number: 7842778
    Abstract: The invention is directed to polyester processes where the esterification process at utilizes a vapor removing device, wherein the vapor removing device is substantially horizontally oriented, wherein the esterification effluent forms a two-phase laminar, stratified, non-circular vapor/liquid flow in at least a portion of said vapor removing device.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: November 30, 2010
    Assignee: Eastman Chemical Company
    Inventor: Bruce Roger DeBruin
  • Patent number: 7829638
    Abstract: Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: November 9, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Dong Seon Uh, Chang Il Oh, Do Hyeon Kim, Jin Kuk Lee, Irina Nam
  • Publication number: 20100267887
    Abstract: An organic solvent free process to make an aqueous co-dispersion of epoxy resins and at least phenolic novolac resins is reported. The compositions of such co-dispersions are based on blends of epoxy resins and at least a phenolic novolac resin within the profile viscosity versus temperature in the ranges from 1 500 000 to 300 mPas at 80° C. and 10 000 to 20 mPas at 120° C.
    Type: Application
    Filed: December 9, 2008
    Publication date: October 21, 2010
    Inventors: Helga De Velder, Alain Leroy
  • Patent number: 7786223
    Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: August 31, 2010
    Assignee: Huntsman International LLC
    Inventor: Isabelle Marie Marguerite Muller-Frischinger
  • Patent number: 7745515
    Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: June 29, 2010
    Assignee: Nan Ya Plastics Corporation
    Inventor: Ming-Jen Tzou
  • Patent number: 7671114
    Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: March 2, 2010
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk, Andrew D. Messana
  • Patent number: 7544727
    Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: June 9, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
  • Patent number: 7541423
    Abstract: The invention is directed to polyester processes that utilizes a pipe reactor in the esterification, polycondensation, or both esterification and polycondensation processes. Pipe reactor processes of the present invention have a multitude of advantages over prior art processes including improved heat transfer, volume control, agitation and disengagement functions.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: June 2, 2009
    Assignee: Eastman Chemical Company
    Inventor: Bruce Roger DeBruin
  • Publication number: 20090137702
    Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, b) as curing agent a hybrid hardener, whereby said hardener is a liquid hardener blend with a viscosity of less than 150 000 mPa·s at 25° C. comprising b1) an aminic compound selected from aliphatic, cycloaliphatic, and araliphatic amines, whereby said aminic compound contains, on average per molecule, at least two reactive hydrogen atoms bound to nitrogen atoms, and b2) a polymeric phenol novolac, and wherein said novolac is used in an amount of from 46% to 62% by weight, based on the total weight of the hardener blend b1) and b2), useful for rapid setting and protective coatings and adhesives in application fields like civil engineering, marine, architectural and maintenance.
    Type: Application
    Filed: June 15, 2007
    Publication date: May 28, 2009
    Applicant: Huntsman International LLC
    Inventor: Isabelle Marie Muller-Frischinger
  • Patent number: 7538150
    Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: May 26, 2009
    Assignee: Hitachi Chemical Company, Ltd
    Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
  • Patent number: 7501087
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 10, 2009
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Patent number: 7495060
    Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: February 24, 2009
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Hiroshi Suzuki, Satoru Abe, Midori Aoki, legal representative, Izuo Aoki
  • Patent number: 7470752
    Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a—R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: December 30, 2008
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Shawn P. Duffy, Anthony M. Chasser, Ronald R. Ambrose
  • Patent number: 7427652
    Abstract: An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxazine resin, and an optional co-curing agent.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: September 23, 2008
    Assignee: Supresta LLC
    Inventors: Sergei Levchik, Mark Buczek
  • Patent number: 7423096
    Abstract: An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: September 9, 2008
    Assignee: Intel Corporation
    Inventor: Saikumar Jayaraman
  • Patent number: 7410673
    Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: August 12, 2008
    Assignee: San-ei Kagaku Co., Ltd.
    Inventors: Kiyoshi Sato, Kazunori Kitamura
  • Patent number: 7396885
    Abstract: A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition can be easily charged and plugged into a through-hole, does not drip down, and can be effectively photo-set and thermoset. A photo-set product prepared of the resin composition can be easily polished. A plugged-through-hole printed wiring (substrate) board prepared of the resin composition does not cause defects such as hollows, cracks, blisters, peelings and so on, is excellent in solder-resistance, does not corrode a metal part, and can produce an appliance of high reliability and long life which does not occur short circuit and poor electrical connection.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: July 8, 2008
    Assignee: SAN-EI Kagaku Co., Ltd.
    Inventors: Kiyoshi Sato, Kazunori Kitamura
  • Patent number: 7381788
    Abstract: Provided is a continuous production method of a polyamide with stabilized polymerization degree and good quality, particularly an aromatic-containing polyamide.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: June 3, 2008
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Yasuhito Tsujii, Gaku Maruyama, Kaoru Ogawa, Yoshinori Takada, Kazuhisa Koishi, Kenta Susuki
  • Patent number: 7354978
    Abstract: One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler and (E) a triazole compound, preferably an epoxy resin composition for encapsulating a semiconductor wherein the triazole compound is a compound represented by general formula (1): wherein R1 represents hydrogen atom, or mercapto group, amino group, hydroxyl group or a hydrocarbon chain with 1 to 8 carbon atoms containing one or more of the functional groups as an end group.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: April 8, 2008
    Assignee: Sumitomo Bakelite Co.
    Inventor: Yoshinori Nishitani
  • Patent number: 7244793
    Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: July 17, 2007
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Bucquet, Barbara Chabut