Abstract: Toughened thermosetting resins are disclosed comprising a thermosetting resin having a Tg of at least 150.degree. C., preferably 180.degree. C., and having dispersed substantially uniformly therethrough microspheres of a thermoplastic resin having a Tg of at least 150.degree. C., preferably 180.degree. C. It is preferred to use thermoplastic resins with functional groups on the surface thereof capable of bonding to an available group on the thermosetting resin. High performance structural composites made from such toughened resins are disclosed as well as the process of making such composites.

Abstract: A waterborne structural adhesive bonding primer composition (a) that can be effectively applied to an adherend for structural adhesive applications, (b) that emits a VOC content of less than about 250 grams per liter, (c) is thermally stable, and (d) may be employed with 350.degree. F. (176.7.degree. C.) cure epoxy resin systems, which contains the combination of (i) a dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane dissolved in a water vehicle, and (ii) a rigid ring substituted polyethylenically unsaturated carboxylate, carboxamide or carboximide intimately dispersed in the water vehicle and the dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane. Formulations are described that contain chromate-free corrosion inhibitors.

Abstract: A emulsifiable, phenolic-resole-resin-based composition comprising a low salt, urea-extended phenol aldehyde resin and an emulsifying agent, wherein the resin has a water dilutability ranging from about 2:1 to about 10:1 v/v water to resin prior to neutralization and aldehyde scavenger addition, and the method for making the same.

Abstract: The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin;(B) an epoxide-group-containing phosphorous compound;(c) an aromatic polyamine as a curing agent; and(D) filler material.

Abstract: Copolycondensation of a hydroxyl group-containing naphthalene and xylene with an aldehyde compound gives a polyhydroxy aromatic compound. The hydroxyl group-containing naphthalene comprises at least one of naphthols and dihydroxynaphthalenes. In the polyhydroxy aromatic compound, the proportions of the naphthalene unit and xylene unit are 95 to 50:5 to 50 (mole percent), and each molecule contains 2 to 20 naphthalene units. The polyhydroxy aromatic compound is useful as an epoxy resin curing agent. Reaction of the polyhydroxy aromatic compound with an epihalohydrin gives an epoxy resin. An epoxy resin composition can be prepared from the epoxy resin and a curing agent.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.

Abstract: Urethane-modified polyoxyalkylene epoxy resins useful in aqueous dispersions having the general formula ##STR1## where R and R.sup.1 are, independently of one another, ##STR2## wherein R.sup.3 is a C.sub.1-3 alkyl group,R.sup.4 is a C.sub.1-4 alkylenemoiety, ##STR3## each b is, independently of one another, an integer from 0 to 4, and c is 1 to 10;a is 1 to 20, andR.sub.2 is H and at least once the group ##STR4## R.sup.6 is a C.sub.1-5 alkyl group, R.sup.7 is H or CH.sub.3 --,d is 1 to 100,e is 0 or 1,f is 0 or 1, andR.sup.8 is an aliphatic, cyclic, alicyclic, aromatic or araliphatic hydrocarbon group.

Abstract: Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.

Abstract: A 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane as an epoxy resin; a 1,1-bis(2,7-dihydroxy-1-naphthyl)alkane as an intermediate for said epoxy resin; a process for producing said intermediate comprising reacting 2,7-dihydroxy-1-naphthalene and an aldehyde; a process for producing said epoxy resin comprising reacting said intermediate and an epihalohydrin; and an epoxy resin composition comprising said epoxy resin and a curing agent. The epoxy resin has a low melt viscosity while exhibiting excellent heat resistance.

Abstract: Copolycondensation of .alpha.-naphthol and .beta.-naphthol with an aldehyde compound gives a poly-hydroxynaphthalene compound having an average molecular weight of 300 to 2,000. This compound is useful as a curing agent for epoxy resins and as a precursor of epoxy resins. Epoxy resin compositions include (1) compositions comprising an epoxy resin and the poly-hydroxynaphthalene compound as a curing agent and (2) compositions comprising an epoxy resin obtained by reacting the poly-hydroxynaphthalene compound with an epihalohydrin and a curing agent. The epoxy resin compositions of the invention are characterized in that the cured resins have a high glass transition temperature and high heat stability and high moisture resistance, scarcely allowing package cracking even in soldering treatment. Therefore the compositions are suited for use in encapsulating semiconductors.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.

Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

Abstract: There are disclosed methods and compositions for retarding the ambient temperature hardening of a phenolic resole resin alone or with an aggregate when such resin is contacted with a nitroalkane and a hardening agent such as lightburned magnesium oxide, an organic ester functional hardening agent, and mixtures of lightburned magnesium oxide and an organic ester functional hardening agent in an alkaline medium. There is also disclosed a hardener composition for phenolic resole resins wherein the hardener composition consists essentially of a solution of a nitroalkane in an organic ester functional hardening agent.

Abstract: A two-part, thermally curable epoxy composition comprising an epoxy resin; a curing agent prepared from a substituted pentafluoroantimonic acid and a substituted benzene having an amino substituent and an electron-withdrawing substituent on the benzene ring; a polyol; and a toughening agent. The compositions exhibit desirable green strength and pot life.

Abstract: An epoxy resin composition comprising:(A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), ##STR1## wherein n is 0 to 10, R.sup.1 and R.sup.2 each represents a glycidyl group, and A.sup.1 to A.sup.8 each represents a hydrogen atom or a bromine atom;(B) as an epoxy resin curing agent,(b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), or(b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A.sup.1 to A.sup.

Abstract: The invention relates to modified polyoxyalkylene epoxy resins based on polyhydric phenols prepared by the addition of polyethers and/or polyether monourethanes containing isocyanate groups to higher-molecular-weight hydroxyl group-containing polyglycidyl compounds, and to the use of these reaction products in the preparation of stable aqueous dispersions.

Abstract: An epoxy resin composition useful as a molded article is curable with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agents can contain rodlike mesogenic moieties.

Abstract: A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: An epoxy resin composition useful as a molded article is cured with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agent can contain rodlike mesogenic moieties.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin and when cured with a curing agent is useable in molding applications.

Abstract: A resin composition for a cationically electrodepositable paint comprising(A) a resin having hydroxyl groups and cationic groups such as tertiary amino groups prepared from the reaction product of a polyepoxide compound and an secondary amine having hydroxyl group(s), and(B) an epoxy resin having at least 2 epoxy functional groups each of which comprises an epoxy group directly bound to an alicyclic ring and/or bridged alicyclic ring on average per molecule.

Abstract: A hardening agent composition for epoxy resins and a method for forming the composition is disclosed, which comprises a low-reactive hardening agent, an imidazole compound and a zeolite, wherein the imidazole compound is substituted on the imidazole nucleus by at least one of (a) and (b): (a) an alkyl group having 2 or more carbon atoms and a polar group and (b) an alkenyl group. The hardening agent composition combined with an epoxy resin to form a thermosetting epoxy resin composition, capable of hardening under heat to give a hardened product, has a remarkably elevated adhesion strength.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.

Abstract: A composition useful as a molded article when cured is obtained from a polyepoxy compound and a catalyst comprising a phosphonium compound having an amino group in the cationic portion of the compound such as 2-dimethylaminoethyl triphenylphosphonium bromide.

Abstract: A lightly-crosslinked thermosettable formulation comprises (a) a diepoxy resin, (b) an aromatic diamine of the structural formula ##STR1## in which each R is a divalent linking moiety selected from C.sub.1-6 alkylene, --S-- and --O--, and R' is ethyl, (c) an amine or phenolic crosslinking agent, and (d) 2,6-dialkyl aniline. The formulation exhibits relatively long outlife and can be used as the matrix resin in aerospace composites applications.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin, is curable with a curing agent and can be employed in molding applications.

Abstract: Disclosed is a curable epoxy resin composition which is effectively cured at ambient temperature and when cured has excellent adhesive strength and good water resistance. The epoxy resin composition comprises:(a) an epoxy resin having at least two epoxy groups in one molecule,(b) a monofunctional (meth)acrylate represented by ##STR1## wherein R.sub.1 represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, R.sub.2 and R.sub.3 respectively represent a hydrogen atom or a methyl group, and n is an integer of 1 to 4, and(c) An amine curing agent selected from the group consisting of an aromatic polyamine, a modified aromatic polyamine, a polyamideamine and a mixture thereof. The present invention also provides an adhesive composition prepared from the above mentioned curable epoxy resin composition.

Abstract: A resin composition comprising(a) a glycidyl ether of phenol novolak and/or cresol novolak,(b) a phenol novolak and/or cresol novolak,(c) an organic solvent, and(d) a silane coupling agent having an aromatic ring and an amino group having active hydrogen in the same molecule;a process for forming a transparent thin film by using a glycidyl ether of phenol novolak and/or cresol novolak and a phenol novolak and/or cresol novolak, which comprises dissolving said materials in an organic solvent, forming a coat and heat curing it to obtain a transparent thin film, wherein the improvement comprises the use of a silane coupling agent having an aromatic ring and an amino group having active hydrogen in the same molecule as additive; andtransparent thin films formed from the above process.

Abstract: An hydrolytically stable, heat-curable composition useful as an hermetic varnish for electrical conductors comprising an aqueous solution with or without organic co-solvents of:1) an adduct of an epoxide of a phenol-formaldehyde condensate and a dialkanolamine, and2) a water-soluble curing agent comprising both a phenoplast alcohol and an aminoplast such as a melamine for example, hexamethoxymethylmelamine;the cured products thereof which are useful as hermetic varnishes for electrical conductors. i.e. varnishes exposed to refrigerants such as fluorocarbons.

Abstract: A composition comprising a curable epoxy resin, a reactive diluent, a curing agent for the epoxy resin, and an isocyanate compound is stable at room temperature for extended periods of time and cures to form a part which has good high-temperature properties.

Abstract: An epoxy resin powder coating composition having excellent thermal resistance, mechanical strength, hardening speed and storage stability which comprises an epoxy resin mixture comprising a bisphenol type epoxy resin and a polyfunctional epoxy resin having at least three epoxy groups in the molecule; a hardener comprising a mixture of dicyandiamide and a compound represented by formula (I) below, and a filler: ##STR1## wherein, R.sup.1 represents an alkyl group or an aryl group, and preferably represents a phenyl group from the view of storage stability; and R.sup.2 represents a cyanoethyl group, a vinyl group, or a phenyl group.The powder coating composition is suitably used in fixing stator coils or armature coils in motors or generators.

Abstract: An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

Abstract: An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Abstract: A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.

Abstract: A resin composition comprising an epoxy resin and an isocyanate group-containing fluorine compound is particularly suitable for covering a magnetic recording medium comprising a non-magnetic substrate and formed thereon a thin magnetic film so as to give excellent sliding durability.

Abstract: The process of reacting an epoxy resin with a reactive hydrogen-containing compound or a carboxylic acid anhydride in the presence of a phosphonium catalyst is improved by employing a phosphonium compound having an amino substituent on the cation portion of the phosphonium compound as the catalyst. The invention also concerns precatalyzed epoxy resin compositions, curable compositions and cured compositions.

Abstract: Cationic modification products of novolaks which contain bridging bonds, originating from at least bifunctional epoxide compounds, between the phenolic hydroxyl groups of the starting novolak and the nitrogen atoms of an originally secondary or primary amine and if appropriate additional bridging bonds between phenolic hydroxyl groups and/or between the nitrogen atoms of the amine, it being possible for the amine additionally to carry tertiary amino groups, the nitrogen content in the cationic modification product being between 0.02 and 6% by weight and the weight content of bridging bonds of epoxide compounds being between 1 and 70% by weight, in each case based on the cationically modified novolak.Process for the preparation of the cationically modified novolaks from the starting novolak, epoxide compound and amine, which are reacted with one another at temperatures between 60.degree. and 200.degree. C., if appropriate in the presence of solvents.

Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.

Abstract: Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100.degree. C. is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.

Abstract: The process of reacting an epoxy resin with a reactive hydrogen-containing compound or a carboxylic acid anhydride in the presence of a phosphonium catalyst is improved by employing a phosphonium compound having an amino substituent on the cation portion of the phosphonium compound as the catalyst. The invention also concerns precatalyzed epoxy resin compositions, curable compositions and cured compositions.

Abstract: A non-fluorinated epoxy prepolymer of known type is mixed with a fluorinated epoxy prepolymer containing perfluoropolyether blocks or perfluoroalkylene blocks of type --(CF.sub.2 CF.sub.2).sub.n -- and/or of type ##STR1## and the two prepolymers are co-cured by treating the mixture with cross-linking agents of known type suitable for epoxy resins, thereby obtaining a cross-linked epoxy resin having a fluorine content.ltoreq.30% by weight, preferably.ltoreq.25% by weight.

Abstract: Curable compositions comprise:(A) an epoxide resin(B) as latent curing agent for (A), dicyandiamide or a polycarboxylic acid hydrazide, and(C) as cure accelerator dispersed as a powder in the composition, a Mannich base of a polymeric phenol.The compositions are particularly useful as adhesives and sealants.

Abstract: Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium salt, amine, or amine salt with an acid or a salt of an acid having a weak nucleophilic anion.