Abstract: A multi-layer composition to be located onto a substrate. The composition comprises a bi-layer construction, including a first layer and a second layer, the first layer having a high elastic modulus and tensile strength in comparison to the second layer. The second layer includes a blowing agent such that, when cured, the first layer is spaced away from the substrate. The compositions of the first layer and second layer are similar, thus enabling the reconstitution of scrap into usable material for forming another multi-layer reinforcement.

Abstract: A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.

Abstract: Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

Abstract: The present disclosure relates to a composition for a rack housing member of a vehicle having excellent dimensional stability, and a rack housing member of a vehicle formed therefrom. In an embodiment, the composition for a rack housing member of a vehicle comprises 100 parts by weight of a base resin containing polybutylene terephthalate, an acrylonitrile-styrene-acrylate copolymer, and polyethylene terephthalate, and 40 to 75 parts by weight of an inorganic filler, wherein the inorganic filler includes a glass fiber and a plate-shaped mineral filler.

Abstract: An object is to provide a resin composition having excellent performance as a binder such as adhesiveness and, at the same time, retaining solution properties favorably even after a solution is stored for a long period of time. A modified polyolefin resin composition includes a modified polyolefin resin (C), in which the modified polyolefin resin (C) is a resin made by modifying a polymer (A) that is a polymer (a) of a polyolefin resin or a chlorinated polyolefin resin and an ?,?-unsaturated carboxylic acid derivative having a structure derived from at least one carboxy group or a chlorinated product (b) thereof with a modification component including an alcohol (B); and a residual ratio of the structure derived from at least one carboxy group in the modified polyolefin resin (C) is 50% or more and 80% or less.

Abstract: The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.

Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Abstract: The present invention relates to a polycarbonate resin composition for a light guide plate and an optical molded article using the same. The polycarbonate resin composition according to the present invention is excellent in transmittance and color tone uniformity required as the light guide plate, and also is excellent in processability and thus can be usefully used as a material of the light guide plate.

Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.

Abstract: A curable composition comprises a) at least one epoxide compound E having at least two epoxide groups; b) at least one amine A having at least two amine hydrogens; and c) at least one acrylic ester U; wherein the epoxide compound E comprises at least one epoxide compound E?, the amine A comprises at least one amine A?, and the acrylic ester U comprises at least one acrylic ester U? whose Hansen solubility parameters for the dipole forces ?p and for the specific interactions ?h satisfy the following conditions: ( ? p ? ( U ? ) - ? p ? ( E ? ) ) 2 + ( ? h ? ( U ? ) - ? h ? ( E ? ) ) 2 ? 1.5 ? ? and ( ? p ? ( U ? ) 2 + ? h ? ( U ? ) 2 ) - ( ? p ? ( A ? ) 2 + ? h ? ( A ? ) 2 ) ? 0 . A suitable choice of the Hansen solubility parameters of the constituents ensures that the acrylic ester is incorporated covalently into the curing material, preventing subsequent evaporation of the diluent.

Abstract: A one-component heat-curing epoxy resin adhesive has at least one epoxy resin having an average of more than one epoxy group per molecule; at least one latent hardener for epoxy resins; and at least one carboxylic acid selected from substituted or unsubstituted adipic acid, substituted or unsubstituted succinic acid, substituted or unsubstituted phthalic acid, substituted or unsubstituted terephthalic acid, substituted or unsubstituted isophthalic acid, substituted or unsubstituted benzenetricarboxylic acid and substituted or unsubstituted nitrobenzoic acid, excluding 2-hydroxysuccinic acid and 2,3-dihydroxysuccinic acid as carboxylic acid, and wherein the epoxy resin adhesive contains 0.0015 to 0.04 mol of the at least one carboxylic acid per 100 g of the epoxy resin adhesive and the epoxy resin adhesive has a viscosity of 500-5000 Pas at 25° C. The epoxy resin adhesive is notable for a very heat-resistant bond on particular metal substrates such as steel having a zinc-magnesium coating.

Abstract: A polymer blend comprising polyamide, polypropylene (PP) and at least one of poly (lactic acid) (PLA) and a multi-phase compatibilizer comprising PA11-co-PP-maleic anhydride (MA). The polymer blend can be reinforced with hybrid fillers including biocarbon, glass fiber, carbon fiber and nano-clay to create composites useful in the creation of products of manufacture such as auto parts.

Abstract: The present invention relates to a polymer composition comprising an epoxy resin and a multistage polymer. In particular the present invention it relates to polymer composition comprising an epoxy resin and a multistage polymer that can be used as a masterbatch. More particularly the present invention relates also to a process for preparing a polymer composition comprising an epoxy resin and a multistage polymer by spray drying or coagulation.

Abstract: A nanocomposite is provided including silica nanoparticles and a dispersant dispersed in a curable resin or a curing agent, where the nanocomposite contains less than 2% by weight solvent. The silica nanoparticles include nonspherical silica nanoparticles and/or spherical pyrogenic silica nanoparticles. A composite is also provided including from about 4 to 70 weight percent of silica nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated silica nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.

Abstract: The present invention relates to a polycarbonate resin composition for a light guide plate and an optical molded article using the same. The polycarbonate resin composition according to the present invention is excellent in transmittance and color tone uniformity required as the light guide plate, and also is excellent in processability and thus can be usefully used as a material of the light guide plate.

Abstract: The invention relates to a method for producing a fibrous composite material using at least one epoxy resin and at least one initiator comprising one or more cationic metal olefin complexes. The invention further relates to a fiber-containing agent and to a fiber-containing composite material as such.

Abstract: Disclosed is a method of making packaging material for polymers susceptible to oxidation. The packaging material utilizes a composite foil. The composite foil has at least three layers and have barrier layers based on polyvinyl alcohols. The composite foil may be used to package polymers susceptible to oxidation. Also disclosed is a process for packaging the polymers and the packaging composed of the composite foil.

Abstract: Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.

Abstract: Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

Abstract: A thermosetting powder coating material contains powder particles having a core that has a sea-island structure composed of an island portion containing a surface adjusting agent and a sea portion containing a thermosetting resin and a thermosetting agent, and a resin coating portion that coats a surface of the core.

Abstract: An aqueous resin composition that can provide excellent properties using a high molecular weight resin and less amount of surfactant, and also that does not require a complicated production procedure, is provided. The aqueous resin composition is obtained by heating and dissolving 100 parts by mass of acid-modified chlorinated polyolefin with an average molecular weight of 37,000 to 150,000 in the presence of 2 to 30 parts by weight of a surfactant, 10 to 50 parts by mass of a glycol ether-based compound that satisfies general formula (1) shown below, and 150 to 425 parts by mass of water, and then dispersing this with a basic compound that has been added at a ratio of 1 to 4 chemical equivalents per carboxyl group of the acid-modified chlorinated polyolefin. General Formula (1) C4H9—(OCH2CH2)n—OH n: an integer from 1 to 4.

Abstract: The invention is directed to a method of making a neutralized non-ionomeric polymer composition (NNIPC) suitable for use in a golf ball component comprising the steps of: providing a non-acid copolymer composition (NACC); soaking the NACC in an organic acid to form a soaked non-acid copolymer composition (SNACC); providing a cation source in an amount sufficient to neutralize at least a portion of the organic acid; and melt processing the SNACC and cation source to form the NNIPC. The invention also relates to a method of making a golf ball incorporating the NNIPC made according to the inventive method and to the resulting golf ball.

Abstract: Multi-piece golf balls having at least one layer made from a polyamide non-ionomeric composition are provided. The polyamide composition consist essentially of about 40 to about 99% by weight polyamide; about 1 to about 60% by weight of an acid anhydride-modified polyolefin; and about 1 to about 60% of a fatty acid additive selected from the group consisting of fatty acid salts, fatty acid amides, and mixtures thereof. The ball includes a core, preferably a dual core construction; and a cover of at least one layer. A rubber composition is preferably used to form the inner core and the polyamide composition is preferably used to form the outer core layer. The resulting ball has high resiliency along with a soft feel.

Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: A process for preparing a reinforced and reactive thermoplastic composition having a continuous phase based on a thermoplastic polymer and dispersed therein is a discontinuous phase based on a reactive reinforcing agent that may be immiscible with the thermoplastic polymer is provided. A composition obtained by this process is also provided. The reinforcing agent is selected from the group consisting of epoxy resins, polyorganosiloxanes having SiH functional group(s), diisocyanates or polyisocyanates and mixtures thereof, comprises a grafting, a branching and/or a crosslinking, that are carried out in situ, by reactive compounding of these phases with a shear rate greater than 102 s?1, of the reinforcing agent onto the chain of the thermoplastic polymer, so that the discontinuous phase is dispersed homogeneously in the continuous phase in the form of nodules having a number-average size of less than 5 ?m.

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract: A vinyl polymer powder, a curable resin composition containing the vinyl polymer powder and a curable resin, and a cured product obtained by curing the curable resin composition are provided. The vinyl polymer powder contains a vinyl polymer of which the glass transition temperature is 120° C. or higher and the mass average molecular weight is 100,000 or more, has excellent dispersibility in the curable resin composition, and rapidly turns the curable resin composition into a gel state by heating at a predetermined temperature in a short time. Further, the vinyl polymer powder decreases the linear expansion coefficient of the obtained cured product, and improves the crack resistance.

Abstract: A dynamically vulcanized alloy contains at least one isobutylene-containing elastomer and at least one thermoplastic resin, wherein the elastomer is present as a dispersed phase of small vulcanized or partially vulcanized particles in a continuous phase of the thermoplastic resin. The dynamically vulcanized alloy also contains an anhydride functionalized oligomer. The alloy maintains a high Shore A hardness value while obtaining improved flowability for processing.

Abstract: A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.

Abstract: A carbon fiber sizing agent imparts good bonding performance to carbon fiber, is used to reinforce a thermoplastic matrix resin, and provides a carbon fiber strand applied with the sizing agent and a fiber-reinforced composite reinforced with the carbon fiber strand. The sizing agent for carbon fiber is used to reinforce thermoplastic matrix resin. The sizing agent essentially contains a polymer component having a glass transition temperature of at least 20 deg.C. and exhibits no endothermic peaks indicating an endothermic heat of fusion due to crystalline melting of at least 3 J/g in a determination with a DSC. The weight ratio of the polymer component is 10 to 100 wt % of the nonvolatile components of the sizing agent. The polymer component is at least one component selected from the group consisting of an aromatic polyester resin, aromatic polyester-polyurethane resin and amine-modified aromatic epoxy resin.

Abstract: A modifier for resin has an average particle size of 20 ?m or more, wherein particles having an average particle size of 10 ?m or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 ?m or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.

Abstract: An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.

Abstract: An object of the invention is to provide a liquid resin composition with low viscosity while containing polymer particles. Further, another object of the invention is to provide a liquid resin composition containing a large quantity of polymer particles without increasing the viscosity of the liquid resin composition. A liquid resin composition of the invention is comprising a liquid resin component and polymer particles each having an elastic core layer, an intermediate layer formed with a monomer having two or more double bonds and coated on the core layer, and a shell layer coated on the intermediate layer; wherein the polymer particles are dispersed at a ratio of their volume average particle diameter (Mv) to their number average particle diameter (Mn) of 3 or lower.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: A polylactic acid composition is provided having a polymer matrix and a compatibilizer. The polymer matrix includes polylactic acids and acrylonitrile-butadiene-styrene[s]. The compatibilizer is at least one compound selected from the group consisting of: a poly (styrene-ethylene-butadiene-styrene) copolymer grafted with maleic anhydrides, an acrylonitrile-butadiene-styrene copolymer grafted with maleic anhydrides, a polystyrene grafted with maleic anhydrides, and an ethylene-ethyl acrylate-glycidyl methacrylate.

Abstract: The present invention relates to polyurethanes obtainable via mixing of (a) polyisocyanate, (b) polymeric compounds having groups reactive toward isocyanates, (c) catalyst, (d) aliphatic hydrocarbon having from 2 to 15 carbon atoms and comprising at least one heteroatom selected from the group consisting of oxygen, nitrogen, and sulfur, and comprising at least one bromine and/or chlorine atom, (e) optionally blowing agent, (f) optionally chain extender and or crosslinking agent, and (g) optionally auxiliary and/or additives to give a reaction mixture and allowing the reaction mixture to complete its reaction to give the polyurethane, where the aliphatic hydrocarbon (d) comprises no phosphoric ester, polyphosphate, phosphonic ester, or phosphorous ester. The present invention further relates to a process for producing such polyurethanes, and to their use in the interior of conveyances.

Abstract: The invention relates to a method for increasing the compatibility between at least two polymers, which comprises: (a) selecting at least two immiscible polymers (A) and (B), at least one of which does not bear a nitrogenous heterocycle-based associative group, and (b) modifying the polymer (A) and/or the polymer (B) so as to obtain a blend of polymers (Pi) which are derived from the polymers (A) and (B) and which each bear nitrogenous heterocycle-based associative groups, said associative groups being present in sufficient amount for the polymers (Pi) to be more compatible with one another than the polymers (A) and (B). It also relates to the polymer composition that can be obtained according to this method.

Abstract: The present invention provides a thermoplastic elastomer composition obtained by dynamically crosslinking, under a melting condition, 100 parts by mass of a block copolymer (I), 1 to 1,000 parts by mass of a polar resin (II), 1 to 500 parts by mass of a modified polymer (III), and 0.01 to 50 parts by mass of a crosslinking agent (IV), wherein the block copolymer (I) comprises at least one polymer block (A) comprising as a main component an alkylene unit, and/or at least one copolymer block (B) comprising as main components an alkylene unit (b-1) and a vinyl aromatic monomer unit (b-2), and comprises at least one unsaturated block (C) comprising as a main component a conjugated diene monomer unit having 5 or more carbon atoms at an end.

Abstract: Disclosed is a toughened poly(hydroxyalkanoic acid) resin composition comprising poly(hydroxyalkanoic acid) and an impact modifier comprising a core/shell polymer that does not comprise a vinyl aromatic comonomer, having a refractive index not greater than 1.5; wherein the core comprises elastomer and the shell comprises non-elastomeric polymer. Also disclosed are packaging materials and packaged products comprising the composition.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: Electrical insulation comprising a polymeric matrix having compounded therein, a functionalized dielectric nanoparticle filler comprising a self-healing moiety, dispersible in the polymeric matrix, wherein the electrical insulation is capable of self-healing upon exposure to corona discharge.

Abstract: Disclosed herein is a polycarbonate-polysiloxane copolymer resin composition comprising: (A) about 100 parts by weight of a thermoplastic polycarbonate resin; and (B) about 0.1 to about 30 parts by weight of an organo-siloxane polymer having an epoxy group. The polycarbonate-polysiloxane copolymer resin composition has high impact strength at low temperature and high mechanical strength.

Abstract: It is an object of the invention to provide a rubbery polymer-containing resin composition useful as a raw material for a molded article and a cured product having high transparency and excellent mechanical strength: namely, an object of the invention is to provide, for example, a cycloaliphatic epoxy resin composition capable of improving the toughness thereof while maintaining the mechanical strength and transparency of the cycloaliphatic epoxy resin without lowering the heat resistance, a production method thereof and a cured product thereof. A rubbery polymer-containing resin composition of the invention, for example, a cycloaliphatic epoxy resin composition of the invention is a cycloaliphatic epoxy resin composition comprising 100 parts by weight of a cycloaliphatic epoxy resin and 1 to 60 parts by weight of polymer particles with a volume average particle diameter (Mv) of not smaller than 0.01 ?m and not larger than 0.

Abstract: A production process of a resin composition containing 100 parts by weight of a polyester fiber, 1 to 600 parts by weight of a copolymer of ethylene with a glycidyl group-carrying monomer, and 0.3 to 500 parts by weight of an unsaturated carboxylic acid-modified polyolefin resin, the process comprising steps of (1) melt-kneading the copolymer with the modified polyolefin resin, and (2) kneading the resultant melted resin with the polyester fiber at a temperature lower than a melting point of the polyester fiber.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: The invention relates to a polyethylene molding composition which has a multimodal molar mass distribution and is particularly suitable for producing external sheathing of electric or information transmission cables. The molding composition has a density at a temperature of 23° C. in the range from 0.94 to 0.95 g/cm3 and an MFI190/5 in the range from 1.2 to 2.1 dg/min. It comprises from 45 to 55% by weight of a low molecular weight ethylene homopolymer A, from 30 to 40% by weight of a high molecular weight copolymer B of ethylene and another olefin having from 4 to 8 carbon atoms and from 10 to 20% by weight of an ultra high molecular weight ethylene copolymer C. The invention also relates to an electric or information transmission cable having an external sheath of the polyethylene molding composition which has a thickness in the range from 0.2 to 3 cm.

Abstract: The polylactic acid based resin molded article is a molded article formed from a polylactic acid based resin composition comprising a polylactic acid based resin (A), a polypropylene (B) having a crystallinity of 20% by weight or less and a modified ethylene-?-olefin copolymer (C1) or a modified polyolefin (C2), wherein a treatment for accelerating crystallization of the polylactic acid based resin (A) is applied thereto. In the polylactic acid based resin composition, the polypropylene (B) having a crystallinity of 20% by weight or less is blended in an amount of from 10 to 90 parts by weight based on 90 to 10 parts by weight of the polylactic acid based resin (A). In addition, the modified ethylene-?-olefin copolymer (C1) or the modified polyolefin (C2) is blended in an amount of from 1 to 20 parts by weight based on 100 parts by weight in total of the polylactic acid based resin (A) and the polypropylene (B) having a crystallinity of 20% by weight or less.