With Saturated 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom; Or With Solid Copolymer Derived From At Least One Unsaturated 1,2-epoxy Reactant Wherein The Epoxy Reactant Contains More Than One 1,2-epoxy Group Per Mole And At Least One Saturated Reactant Patents (Class 525/65)
  • Patent number: 10882947
    Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: January 5, 2021
    Assignee: 3M Innovative Properties Company
    Inventor: Sohaib Elgimiabi
  • Patent number: 10829588
    Abstract: A curable composition comprises a) at least one epoxide compound E having at least two epoxide groups; b) at least one amine A having at least two amine hydrogens; and c) at least one acrylic ester U; wherein the epoxide compound E comprises at least one epoxide compound E?, the amine A comprises at least one amine A?, and the acrylic ester U comprises at least one acrylic ester U? whose Hansen solubility parameters for the dipole forces ?p and for the specific interactions ?h satisfy the following conditions: ( ? p ? ( U ? ) - ? p ? ( E ? ) ) 2 + ( ? h ? ( U ? ) - ? h ? ( E ? ) ) 2 ? 1.5 ? ? and ( ? p ? ( U ? ) 2 + ? h ? ( U ? ) 2 ) - ( ? p ? ( A ? ) 2 + ? h ? ( A ? ) 2 ) ? 0 . A suitable choice of the Hansen solubility parameters of the constituents ensures that the acrylic ester is incorporated covalently into the curing material, preventing subsequent evaporation of the diluent.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: November 10, 2020
    Assignee: BASF SE
    Inventors: Friederike Fleischhaker, Andrea Misske, Christoph Fleckenstein, Miran Yu, Martin Kaller, Uwe Meisenburg
  • Patent number: 10738226
    Abstract: A one-component heat-curing epoxy resin adhesive has at least one epoxy resin having an average of more than one epoxy group per molecule; at least one latent hardener for epoxy resins; and at least one carboxylic acid selected from substituted or unsubstituted adipic acid, substituted or unsubstituted succinic acid, substituted or unsubstituted phthalic acid, substituted or unsubstituted terephthalic acid, substituted or unsubstituted isophthalic acid, substituted or unsubstituted benzenetricarboxylic acid and substituted or unsubstituted nitrobenzoic acid, excluding 2-hydroxysuccinic acid and 2,3-dihydroxysuccinic acid as carboxylic acid, and wherein the epoxy resin adhesive contains 0.0015 to 0.04 mol of the at least one carboxylic acid per 100 g of the epoxy resin adhesive and the epoxy resin adhesive has a viscosity of 500-5000 Pas at 25° C. The epoxy resin adhesive is notable for a very heat-resistant bond on particular metal substrates such as steel having a zinc-magnesium coating.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 11, 2020
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Michael Gutgsell, John Hanley, IV
  • Patent number: 10669420
    Abstract: A polymer blend comprising polyamide, polypropylene (PP) and at least one of poly (lactic acid) (PLA) and a multi-phase compatibilizer comprising PA11-co-PP-maleic anhydride (MA). The polymer blend can be reinforced with hybrid fillers including biocarbon, glass fiber, carbon fiber and nano-clay to create composites useful in the creation of products of manufacture such as auto parts.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: June 2, 2020
    Assignee: UNIVERSITY OF GUELPH
    Inventors: Amar Mohanty, Manjusri Misra, Emmanuel Olusegun Ogunsona, Andrew James Anstey, Simonet Evelyn Torres Galvez, Amandine Marie Floriane Magali-Sophie Codou, Dylan Fernand Jubinville
  • Patent number: 10597499
    Abstract: The present invention relates to a polymer composition comprising an epoxy resin and a multistage polymer. In particular the present invention it relates to polymer composition comprising an epoxy resin and a multistage polymer that can be used as a masterbatch. More particularly the present invention relates also to a process for preparing a polymer composition comprising an epoxy resin and a multistage polymer by spray drying or coagulation.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: March 24, 2020
    Assignee: Arkema France
    Inventors: Raber Inoubli, Rosangela Pirri, Philippe Hajji
  • Patent number: 10442914
    Abstract: A nanocomposite is provided including silica nanoparticles and a dispersant dispersed in a curable resin or a curing agent, where the nanocomposite contains less than 2% by weight solvent. The silica nanoparticles include nonspherical silica nanoparticles and/or spherical pyrogenic silica nanoparticles. A composite is also provided including from about 4 to 70 weight percent of silica nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated silica nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: October 15, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Peter D. Condo, Jeremy O. Swanson, James E. Thorson, Kristin L. Thunhorst
  • Patent number: 10385163
    Abstract: The present invention relates to a polycarbonate resin composition for a light guide plate and an optical molded article using the same. The polycarbonate resin composition according to the present invention is excellent in transmittance and color tone uniformity required as the light guide plate, and also is excellent in processability and thus can be usefully used as a material of the light guide plate.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: August 20, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Byoungkue Chun, Moo Ho Hong, Hyong Min Bahn, Un Ko
  • Patent number: 10301444
    Abstract: The invention relates to a method for producing a fibrous composite material using at least one epoxy resin and at least one initiator comprising one or more cationic metal olefin complexes. The invention further relates to a fiber-containing agent and to a fiber-containing composite material as such.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 28, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Felipe Wolff Fabris, Andreas Ferencz, Katja Klophaus, Volker Altstadt
  • Patent number: 9982074
    Abstract: Disclosed is a method of making packaging material for polymers susceptible to oxidation. The packaging material utilizes a composite foil. The composite foil has at least three layers and have barrier layers based on polyvinyl alcohols. The composite foil may be used to package polymers susceptible to oxidation. Also disclosed is a process for packaging the polymers and the packaging composed of the composite foil.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: May 29, 2018
    Assignee: BASF SE
    Inventors: Bernhard Fussnegger, Karl-Hermann Strube, Reinhold Dieing
  • Patent number: 9725596
    Abstract: Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: August 8, 2017
    Assignee: DIC Corporation
    Inventors: Masanori Uchigata, Takayuki Okada, Taku Shimaya
  • Patent number: 9688801
    Abstract: Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: June 27, 2017
    Assignee: MITSUBISHI RAYON CO., LTD.
    Inventors: Kaori Fukutani, Toshihiro Kasai
  • Patent number: 9550915
    Abstract: A thermosetting powder coating material contains powder particles having a core that has a sea-island structure composed of an island portion containing a surface adjusting agent and a sea portion containing a thermosetting resin and a thermosetting agent, and a resin coating portion that coats a surface of the core.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: January 24, 2017
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Takeshi Agata, Susumu Yoshino, Takahiro Ishizuka
  • Patent number: 9290625
    Abstract: An aqueous resin composition that can provide excellent properties using a high molecular weight resin and less amount of surfactant, and also that does not require a complicated production procedure, is provided. The aqueous resin composition is obtained by heating and dissolving 100 parts by mass of acid-modified chlorinated polyolefin with an average molecular weight of 37,000 to 150,000 in the presence of 2 to 30 parts by weight of a surfactant, 10 to 50 parts by mass of a glycol ether-based compound that satisfies general formula (1) shown below, and 150 to 425 parts by mass of water, and then dispersing this with a basic compound that has been added at a ratio of 1 to 4 chemical equivalents per carboxyl group of the acid-modified chlorinated polyolefin. General Formula (1) C4H9—(OCH2CH2)n—OH n: an integer from 1 to 4.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: March 22, 2016
    Assignee: TOYO BOSEKI KABUSHIKI KAISHA
    Inventors: Kenji Kashihara, Hideo Matsuoka
  • Patent number: 9199128
    Abstract: The invention is directed to a method of making a neutralized non-ionomeric polymer composition (NNIPC) suitable for use in a golf ball component comprising the steps of: providing a non-acid copolymer composition (NACC); soaking the NACC in an organic acid to form a soaked non-acid copolymer composition (SNACC); providing a cation source in an amount sufficient to neutralize at least a portion of the organic acid; and melt processing the SNACC and cation source to form the NNIPC. The invention also relates to a method of making a golf ball incorporating the NNIPC made according to the inventive method and to the resulting golf ball.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 1, 2015
    Assignee: Acushnet Company
    Inventors: Mark L. Binette, Robert Blink, David A. Bulpett, Rick Kuhner
  • Patent number: 9119992
    Abstract: Multi-piece golf balls having at least one layer made from a polyamide non-ionomeric composition are provided. The polyamide composition consist essentially of about 40 to about 99% by weight polyamide; about 1 to about 60% by weight of an acid anhydride-modified polyolefin; and about 1 to about 60% of a fatty acid additive selected from the group consisting of fatty acid salts, fatty acid amides, and mixtures thereof. The ball includes a core, preferably a dual core construction; and a cover of at least one layer. A rubber composition is preferably used to form the inner core and the polyamide composition is preferably used to form the outer core layer. The resulting ball has high resiliency along with a soft feel.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: September 1, 2015
    Assignee: Acushnet Company
    Inventors: Michael J. Sullivan, Mark L. Binette, Brian Comeau, David A. Bulpett, Robert Blink
  • Patent number: 9082709
    Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 14, 2015
    Assignee: DENSO CORPORATION
    Inventors: Hiroyuki Okuhira, Akira Takakura, Hiroshi Katou
  • Patent number: 8952097
    Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 10, 2015
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Matthias Gössi
  • Publication number: 20150025197
    Abstract: A process for preparing a reinforced and reactive thermoplastic composition having a continuous phase based on a thermoplastic polymer and dispersed therein is a discontinuous phase based on a reactive reinforcing agent that may be immiscible with the thermoplastic polymer is provided. A composition obtained by this process is also provided. The reinforcing agent is selected from the group consisting of epoxy resins, polyorganosiloxanes having SiH functional group(s), diisocyanates or polyisocyanates and mixtures thereof, comprises a grafting, a branching and/or a crosslinking, that are carried out in situ, by reactive compounding of these phases with a shear rate greater than 102 s?1, of the reinforcing agent onto the chain of the thermoplastic polymer, so that the discontinuous phase is dispersed homogeneously in the continuous phase in the form of nodules having a number-average size of less than 5 ?m.
    Type: Application
    Filed: April 4, 2014
    Publication date: January 22, 2015
    Applicant: Hutchinson
    Inventors: Nicolas Garois, Philippe Sonntag, Gregory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8859695
    Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: October 14, 2014
    Assignee: Sika Technology AG
    Inventors: Karsten Frick, Ulrich Gerber, Juergen Finter, Andreas Kramer
  • Publication number: 20140296437
    Abstract: A vinyl polymer powder, a curable resin composition containing the vinyl polymer powder and a curable resin, and a cured product obtained by curing the curable resin composition are provided. The vinyl polymer powder contains a vinyl polymer of which the glass transition temperature is 120° C. or higher and the mass average molecular weight is 100,000 or more, has excellent dispersibility in the curable resin composition, and rapidly turns the curable resin composition into a gel state by heating at a predetermined temperature in a short time. Further, the vinyl polymer powder decreases the linear expansion coefficient of the obtained cured product, and improves the crack resistance.
    Type: Application
    Filed: October 29, 2012
    Publication date: October 2, 2014
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Youko Hatae, Toshihiro Kasai
  • Patent number: 8809455
    Abstract: A dynamically vulcanized alloy contains at least one isobutylene-containing elastomer and at least one thermoplastic resin, wherein the elastomer is present as a dispersed phase of small vulcanized or partially vulcanized particles in a continuous phase of the thermoplastic resin. The dynamically vulcanized alloy also contains an anhydride functionalized oligomer. The alloy maintains a high Shore A hardness value while obtaining improved flowability for processing.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: August 19, 2014
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Maria D. Ellul, Anthony Jay Dias, Rodney May
  • Patent number: 8808862
    Abstract: A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: August 19, 2014
    Assignee: Elite Material Co., Ltd.
    Inventors: Chen-Yu Hsieh, Yi-Fei Yu
  • Publication number: 20140227516
    Abstract: A carbon fiber sizing agent imparts good bonding performance to carbon fiber, is used to reinforce a thermoplastic matrix resin, and provides a carbon fiber strand applied with the sizing agent and a fiber-reinforced composite reinforced with the carbon fiber strand. The sizing agent for carbon fiber is used to reinforce thermoplastic matrix resin. The sizing agent essentially contains a polymer component having a glass transition temperature of at least 20 deg.C. and exhibits no endothermic peaks indicating an endothermic heat of fusion due to crystalline melting of at least 3 J/g in a determination with a DSC. The weight ratio of the polymer component is 10 to 100 wt % of the nonvolatile components of the sizing agent. The polymer component is at least one component selected from the group consisting of an aromatic polyester resin, aromatic polyester-polyurethane resin and amine-modified aromatic epoxy resin.
    Type: Application
    Filed: October 15, 2012
    Publication date: August 14, 2014
    Inventors: Yoshio Hashimoto, Yusuke Shimizu, Mikio Nakagawa
  • Publication number: 20140206817
    Abstract: A modifier for resin has an average particle size of 20 ?m or more, wherein particles having an average particle size of 10 ?m or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 ?m or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Tsuneki WAKITA, Keiji Nakamura, Hideaki Makino, Masahiro Osuka, Yohei Miwa, Yasutaka Doi
  • Patent number: 8779059
    Abstract: An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: July 15, 2014
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Atsushi Sato, Hiroyuki Hirakawa
  • Patent number: 8742014
    Abstract: An object of the invention is to provide a liquid resin composition with low viscosity while containing polymer particles. Further, another object of the invention is to provide a liquid resin composition containing a large quantity of polymer particles without increasing the viscosity of the liquid resin composition. A liquid resin composition of the invention is comprising a liquid resin component and polymer particles each having an elastic core layer, an intermediate layer formed with a monomer having two or more double bonds and coated on the core layer, and a shell layer coated on the intermediate layer; wherein the polymer particles are dispersed at a ratio of their volume average particle diameter (Mv) to their number average particle diameter (Mn) of 3 or lower.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: June 3, 2014
    Assignee: Kaneka Corporation
    Inventor: Shinya Hongo
  • Patent number: 8729197
    Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: May 20, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Michael A. Kropp
  • Patent number: 8691913
    Abstract: A polylactic acid composition is provided having a polymer matrix and a compatibilizer. The polymer matrix includes polylactic acids and acrylonitrile-butadiene-styrene[s]. The compatibilizer is at least one compound selected from the group consisting of: a poly (styrene-ethylene-butadiene-styrene) copolymer grafted with maleic anhydrides, an acrylonitrile-butadiene-styrene copolymer grafted with maleic anhydrides, a polystyrene grafted with maleic anhydrides, and an ethylene-ethyl acrylate-glycidyl methacrylate.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: April 8, 2014
    Assignee: BYD Company Limited
    Inventors: Xueyuan Zhu, Jianghong Dou, Xiaobin He, Jianghui Li
  • Publication number: 20140073712
    Abstract: The present invention relates to polyurethanes obtainable via mixing of (a) polyisocyanate, (b) polymeric compounds having groups reactive toward isocyanates, (c) catalyst, (d) aliphatic hydrocarbon having from 2 to 15 carbon atoms and comprising at least one heteroatom selected from the group consisting of oxygen, nitrogen, and sulfur, and comprising at least one bromine and/or chlorine atom, (e) optionally blowing agent, (f) optionally chain extender and or crosslinking agent, and (g) optionally auxiliary and/or additives to give a reaction mixture and allowing the reaction mixture to complete its reaction to give the polyurethane, where the aliphatic hydrocarbon (d) comprises no phosphoric ester, polyphosphate, phosphonic ester, or phosphorous ester. The present invention further relates to a process for producing such polyurethanes, and to their use in the interior of conveyances.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 13, 2014
    Applicant: BASF SE
    Inventors: Iran OTERO MARTINEZ, Udo HADICK, Christian HAGEN
  • Patent number: 8586672
    Abstract: The invention relates to a method for increasing the compatibility between at least two polymers, which comprises: (a) selecting at least two immiscible polymers (A) and (B), at least one of which does not bear a nitrogenous heterocycle-based associative group, and (b) modifying the polymer (A) and/or the polymer (B) so as to obtain a blend of polymers (Pi) which are derived from the polymers (A) and (B) and which each bear nitrogenous heterocycle-based associative groups, said associative groups being present in sufficient amount for the polymers (Pi) to be more compatible with one another than the polymers (A) and (B). It also relates to the polymer composition that can be obtained according to this method.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: November 19, 2013
    Assignees: Arkema France, CNRS
    Inventors: Nicolas Dufaure, Francois Genes Tournilhac, Manuel Hidalgo, Ludwik Leibler
  • Patent number: 8415428
    Abstract: The present invention provides a thermoplastic elastomer composition obtained by dynamically crosslinking, under a melting condition, 100 parts by mass of a block copolymer (I), 1 to 1,000 parts by mass of a polar resin (II), 1 to 500 parts by mass of a modified polymer (III), and 0.01 to 50 parts by mass of a crosslinking agent (IV), wherein the block copolymer (I) comprises at least one polymer block (A) comprising as a main component an alkylene unit, and/or at least one copolymer block (B) comprising as main components an alkylene unit (b-1) and a vinyl aromatic monomer unit (b-2), and comprises at least one unsaturated block (C) comprising as a main component a conjugated diene monomer unit having 5 or more carbon atoms at an end.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: April 9, 2013
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Daisuke Shimizu, Yasuhiro Kusanose, Yoshifumi Araki, Masahiro Fujiwara
  • Patent number: 8399101
    Abstract: Disclosed is a toughened poly(hydroxyalkanoic acid) resin composition comprising poly(hydroxyalkanoic acid) and an impact modifier comprising a core/shell polymer that does not comprise a vinyl aromatic comonomer, having a refractive index not greater than 1.5; wherein the core comprises elastomer and the shell comprises non-elastomeric polymer. Also disclosed are packaging materials and packaged products comprising the composition.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 19, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: Benjamin Andrew Smillie, Julius Uradnisheck
  • Patent number: 8318870
    Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: November 27, 2012
    Assignee: Sika Technology AG
    Inventors: Markus Haufe, Andreas Kramer
  • Patent number: 8314181
    Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: November 20, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Ye-Gang Lin, Donghai Sun, David Xiangping Zou
  • Publication number: 20120277378
    Abstract: Electrical insulation comprising a polymeric matrix having compounded therein, a functionalized dielectric nanoparticle filler comprising a self-healing moiety, dispersible in the polymeric matrix, wherein the electrical insulation is capable of self-healing upon exposure to corona discharge.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Inventors: John Keith Nelson, Brian Benicewicz, Atri Rungta, Linda S. Schadler
  • Patent number: 8293839
    Abstract: Disclosed herein is a polycarbonate-polysiloxane copolymer resin composition comprising: (A) about 100 parts by weight of a thermoplastic polycarbonate resin; and (B) about 0.1 to about 30 parts by weight of an organo-siloxane polymer having an epoxy group. The polycarbonate-polysiloxane copolymer resin composition has high impact strength at low temperature and high mechanical strength.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: October 23, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Bo Young Kim, Jong Cheol Lim, Tae Gon Kang
  • Patent number: 8278388
    Abstract: It is an object of the invention to provide a rubbery polymer-containing resin composition useful as a raw material for a molded article and a cured product having high transparency and excellent mechanical strength: namely, an object of the invention is to provide, for example, a cycloaliphatic epoxy resin composition capable of improving the toughness thereof while maintaining the mechanical strength and transparency of the cycloaliphatic epoxy resin without lowering the heat resistance, a production method thereof and a cured product thereof. A rubbery polymer-containing resin composition of the invention, for example, a cycloaliphatic epoxy resin composition of the invention is a cycloaliphatic epoxy resin composition comprising 100 parts by weight of a cycloaliphatic epoxy resin and 1 to 60 parts by weight of polymer particles with a volume average particle diameter (Mv) of not smaller than 0.01 ?m and not larger than 0.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: October 2, 2012
    Assignee: Kaneka Corporation
    Inventors: Shinya Hongo, Kazuhiro Yoshida
  • Patent number: 8273824
    Abstract: A production process of a resin composition containing 100 parts by weight of a polyester fiber, 1 to 600 parts by weight of a copolymer of ethylene with a glycidyl group-carrying monomer, and 0.3 to 500 parts by weight of an unsaturated carboxylic acid-modified polyolefin resin, the process comprising steps of (1) melt-kneading the copolymer with the modified polyolefin resin, and (2) kneading the resultant melted resin with the polyester fiber at a temperature lower than a melting point of the polyester fiber.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: September 25, 2012
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Kenji Watanabe
  • Patent number: 8273825
    Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: September 25, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Ye-Gang Lin, Donghai Sun, David Xiangping Zou
  • Patent number: 8268425
    Abstract: The invention relates to a polyethylene molding composition which has a multimodal molar mass distribution and is particularly suitable for producing external sheathing of electric or information transmission cables. The molding composition has a density at a temperature of 23° C. in the range from 0.94 to 0.95 g/cm3 and an MFI190/5 in the range from 1.2 to 2.1 dg/min. It comprises from 45 to 55% by weight of a low molecular weight ethylene homopolymer A, from 30 to 40% by weight of a high molecular weight copolymer B of ethylene and another olefin having from 4 to 8 carbon atoms and from 10 to 20% by weight of an ultra high molecular weight ethylene copolymer C. The invention also relates to an electric or information transmission cable having an external sheath of the polyethylene molding composition which has a thickness in the range from 0.2 to 3 cm.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: September 18, 2012
    Assignee: Basell Polyolefine GmbH
    Inventors: Heinz Vogt, Joachim Berthold
  • Patent number: 8236893
    Abstract: The polylactic acid based resin molded article is a molded article formed from a polylactic acid based resin composition comprising a polylactic acid based resin (A), a polypropylene (B) having a crystallinity of 20% by weight or less and a modified ethylene-?-olefin copolymer (C1) or a modified polyolefin (C2), wherein a treatment for accelerating crystallization of the polylactic acid based resin (A) is applied thereto. In the polylactic acid based resin composition, the polypropylene (B) having a crystallinity of 20% by weight or less is blended in an amount of from 10 to 90 parts by weight based on 90 to 10 parts by weight of the polylactic acid based resin (A). In addition, the modified ethylene-?-olefin copolymer (C1) or the modified polyolefin (C2) is blended in an amount of from 1 to 20 parts by weight based on 100 parts by weight in total of the polylactic acid based resin (A) and the polypropylene (B) having a crystallinity of 20% by weight or less.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: August 7, 2012
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Hiroyuki Nakagawa, Katsushi Ito
  • Patent number: 8227084
    Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: July 24, 2012
    Assignee: Isola USA Corp.
    Inventors: Martin Choate, Jyoti Sharma, Steve Peters, Kevin Rafferty
  • Patent number: 8222350
    Abstract: A thermoplastic composition comprising in combination a polycarbonate, a polycarbonate-polysiloxane copolymer, an impact modifier composition comprising ABS or BABS, a second impact modifier different from BABS or ABS, an aromatic vinyl copolymer, and optionally a gel-type low gloss additive, wherein the 60° gloss of the thermoplastic composition is measured to be less than or equal to 14 GU on 3 millimeter chips having a textured surface when measured according to ASTM D2457, and wherein a molded sample of the thermoplastic composition has a low temperature notched Izod impact at ?40° C. of at least 65 KJ/m2 when measured according to ISO 180/1A is disclosed. The composition has low gloss, high low temperature impact, and a significantly improved balance of properties.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: July 17, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: James Louis DeRudder
  • Patent number: 8222351
    Abstract: A thermoplastic composition comprising in combination a polycarbonate, an impact modifier composition comprising ABS or BABS, a second impact modifier different from BABS or ABS, an aromatic vinyl copolymer, and a gel-type low gloss additive, wherein the 60° gloss of the thermoplastic composition is measured to be less than or equal to 11.3 GU on 3 millimeter chips having a textured surface when measured according to ASTM D2457, and wherein a molded sample of the thermoplastic composition has a low temperature notched Izod impact at ?40° C. of at least 30 KJ/m2 when measured according to ISO 180/1A is disclosed. The composition has low gloss and a significantly improved balance of properties.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: July 17, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventor: James Louis DeRudder
  • Patent number: 8217098
    Abstract: A thermosetting resin composition having rubbery polymer particles dispersed therein of the present invention, that does not precipitate the thermosetting resin rubbery polymer particles over a long period of time, has excellent fluidity, is easily cured and molded, and sufficiently exhibits original properties of the thermosetting resin, comprises 100 parts by weight of a thermosetting resin, and 1 to 80 parts by weight of rubbery polymer particles, the rubbery polymer particles being dispersed in the form of a primary particle, wherein the solid content concentration is 60% to 90% by weight, and the water concentration is 3% by weight or less, and can efficiently be produced industrially in the state that the rubbery polymer particles are maintained in a stable state.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: July 10, 2012
    Assignee: Kaneka Corporation
    Inventors: Masakuni Ueno, Ryuji Furukawa, Shinya Hongou, Kazuki Nishiyama
  • Publication number: 20120035324
    Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 9, 2012
    Applicant: HUTCHINSON
    Inventors: Nicolas Garois, Philippe Sonntag, Grégory Martin, Matthieu Vatan, Jacques Drouvroy
  • Patent number: 8092717
    Abstract: Disclosed herein is a polymer composition comprising: a poly(arylene ether); a polyester; electrically conductive filler, and an impact modifier. The composition has a continuous phase comprising polyester and a disperse phase comprising poly(arylene ether). The amount of the disperse phase is less than 35 weight percent, based on the total weight of the composition.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: January 10, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Pravin Borade, Donna Starrup Bossman, Shreyas Chakravarti, Robert R Gallucci, Roshan Kumar Jha, Ganesh Kannan, Nitin Moghe, Przemyslaw Olszynski
  • Patent number: 8080611
    Abstract: The present invention provides a chemical and impact resistant thermoplastic resin composition that can have improved extrudability. In one embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and about 1 to about 6 parts by weight of an aromatic vinyl-vinyl cyanide copolymer resin having a weight average molecular weight of about 1,000,000 to about 5,000,000, per 100 parts by weight of the base resin comprising (A)+(B)+(C). In another embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and (E) about 0.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: December 20, 2011
    Assignee: Cheil Industries Inc.
    Inventors: Jee Kwon Park, Jun Myung Kim, Jin Hwan Choi, Jae Won Lee
  • Patent number: 8058345
    Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: November 15, 2011
    Assignee: Illinois Tool Works Inc.
    Inventors: Wen-Feng Liu, Barbara Chabut
  • Patent number: 8048957
    Abstract: Disclosed is a composition comprising a blend and a modifier in which the blend comprises polycarbonate and acrylonitrile/butadiene/styrene terpolymer and 15 weight % or less of a modifier wherein the modifier comprises an ethylene ester copolymer and either an acrylonitrile butadiene styrene block copolymer or a core-shell polymer. Also disclosed are shaped articles prepared from the composition.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: November 1, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: David D. Zhang