With Saturated 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom; Or With Solid Copolymer Derived From At Least One Unsaturated 1,2-epoxy Reactant Wherein The Epoxy Reactant Contains More Than One 1,2-epoxy Group Per Mole And At Least One Saturated Reactant Patents (Class 525/65)
  • Publication number: 20020010263
    Abstract: Herein are disclosed a curable resin composition for overcoat of flexible circuit which comprises a hydrogenated polybutadiene polyol with a number-average molecular weight of 1,000-8000 and having 2-10 hydroxyl groups per molecule (Polyol A), and a polybutadiene polyblock isocyanate (Isocyanate X), and other similar curable resin compositions, which can be an overcaoting agent which can give a coat film involving no such trouble that the coat film gets overhardened and the curling is increased.
    Type: Application
    Filed: October 15, 1999
    Publication date: January 24, 2002
    Inventor: HIROSHI ORIKABE
  • Patent number: 6333367
    Abstract: A cationic electrodeposition coating composition containing (A) an acrylic resin obtained by subjecting a mixture of 10 to 60% by weight of a hydroxyl group-containing acrylic monomer (a), 5 to 35% by weight of an amino group-containing acrylic monomer (b), 5 to 55% by weight of an aromatic vinyl monomer (c) and optionally another acrylic monomer (d) to a radical copolymerization reaction; (B) a hydroxyl group-containing acrylic resin-modified epoxy resin obtained by reacting 65 to 95% by weight of a resin composition consisting of 10 to 90% by weight of an epoxy resin (e) and 90 to 10% by weight of a hydroxyl group-containing acrylic resin (f) with 5 to 35% by weight of an amine compound (g); (C) a aliphatic and/or alicyclic blocked polyisocyanate compound, and (D) a bismuth compound component, a mixing ratio of the components (A), (B) and (C) being such that the component (A) is in the range of 40 to 90% by weight, the component (B) is in the range of 5 to 55% by weight and the component (C) is in the range
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: December 25, 2001
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Akiko Kato, Shigeo Nishiguchi, Reijiro Nishida, Shinji Miyatake, Hidehiko Haneishi
  • Patent number: 6326435
    Abstract: The polyester resin composition of the present invention comprises (A) a thermoplastic polyester resin, (B) an olefinic polymer modified with at least one member selected from the group consisting of an unsaturated carboxylic acid and its derivative, and (C) an aliphatic ester having a molecular weight of 400 to 1,000. The polyester resin of the present invention may comprises: (D) a flame retardant, (E) an inorganic flame retardant auxiliary, and others. The thermoplastic polyester resin composition is useful for the fabrication of sliding members (particularly, gears). Polyester resin compositions with improved dimensional accuracy and sliding properties and shaped articles formed therefrom can be obtained from the resin composition of the present invention.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: December 4, 2001
    Assignee: Polyplastics Co., Ltd.
    Inventors: Katsunori Takayama, Kazuhito Kobayashi
  • Patent number: 6288169
    Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: September 11, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Hideyuki Usui, Satoshi Okuda, Minoru Nakao
  • Patent number: 6277912
    Abstract: An aqueous, chlorinated modified polyolefin-based resin composition and its manufacture, which resin composition provides, as an adhesive, a paint for ink, a coating material, etc., moldings and films consisting mainly of polyolefin-based resins with a coating film excellent at the properties such as adhesiveness, gasohol resistance, moisture resistance, impact resistance, flexibility, etc. and which resin composition is particularly good at environmental conservation, safety, and health and hygiene because the resin composition doesn't contain organic solvents including aromatic solvents such as xylene, toluene, etc.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: August 21, 2001
    Assignee: Toyo Kasei Kogyo Company Limited
    Inventors: Teruaki Ashihara, Tadanori Funasaka, Shoji Maekawa, Ryozo Orita
  • Patent number: 6265489
    Abstract: A thermosetting composition comprising a co-reactable solid, particulate mixture of (a) polycarboxylic acid functional polymer, and (b) epoxide functional crosslinking agent having at least two epoxide groups, e.g., triglycidyl isocyanurate (TGIC), is described. The polycarboxylic acid functional polymer is prepared by atom transfer radical polymerization and has well defined polymer chain architecture and polydispersity index of less than 2.0. The thermosetting compositions of the present invention have utility as powder coatings compositions.
    Type: Grant
    Filed: August 16, 1999
    Date of Patent: July 24, 2001
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Karen A. Barkac, Simion Coca, James R. Franks, Kurt A. Humbert, Paul H. Lamers, Roxalana L. Martin, James B. O'Dwyer, Kurt G. Olson, Daniela White
  • Patent number: 6239215
    Abstract: A powder coating composition comprising a multilayer polymer particle, in which at least one inner layer is a polymer layer having a glass transition temperature (Tg) of not over 20° C. and the outermost layer is a polymer layer having a Tg of not less than 60° C. and, the monomer components forming the polymer layer having a Tg of not over 20° C. are those having an unsaturated double bond in the molecule, and among the monomer components, a crosslinking monomer and a grafting monomer are used, respectively, within the ranges of 0.3 to 5 weight % and of 1 to 10 weight %, is dispersed in an amount of 1 to 30 parts by weight per 100 parts by weight of the total components other than the multilayer polymer particle can show excellent dispersibility to various powder coatings and can improve workability and impact resistance of a coat film while maintaining inherent characteristics of a powder coating such as appearance of a coat film and an anti-blocking property.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: May 29, 2001
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Hirokazu Morita, Tatsuo Fujii, Hiroyuki Shiraki
  • Patent number: 6221961
    Abstract: A composition prepared by adding as the sliding properties improving agent a small amount of ethylene-&agr;-olefin random copolymer having polar groups to engineering plastics including polyacetal, ABS, and polyamide is suitable for the manufacture of gears, rotary shafts and bearings by way of exploiting its molding processibility including excellent mold release properties, and at the same time is capable of enhancing its friction/wear resistance. As the sliding properties improving agent, an oxidation-modified material produced from ethylene-&agr;-olefin random copolymer or a graft-modified material prepared by graft-copolymerizing an ethylenic unsaturated monomer having carboxylic acid group, hydroxyl group or the like with ethylene-&agr;-olefin random copolymer is particularly preferable.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: April 24, 2001
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hideki Hirano, Ryosuke Kaneshige, Masahide Tanaka
  • Patent number: 6184289
    Abstract: A rubber-modified styrene resin composition which can provide a molding having a good balance between surface gloss and impact resistance and a styrene resin composition and a molding thereof having good toughness and excellent adhesion, transparency, and moldability is formed from a styrene resin composition comprising (A) an epoxidized block copolymer of a styrene monomer with a conjugated diene compound, (B) a non-modified synthetic rubber and (C) a styrene polymer and a molded article thereof.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: February 6, 2001
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Tadashi Teranishi, Haruo Ichikawa
  • Patent number: 6180251
    Abstract: A thermoplastic resin having such a sufficient heat shock resistance that it is unbroken by common temperature changes and also exhibiting an excellent flame resistance when applied to an insert molded article, which is obtained by blending a thermoplastic polyester resin (A) with 1-25% by weight to the total amount of the composition of an impact resistance giving agent (B), 1-50% by weight to the total amount of the composition of an inorganic filler (C), 1-25% by weight to the total amount of the composition of a flame retardant (D) and 0.1-10% by weight to the total amount of the composition of an aromatic polyvalent carboxylate (E).
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: January 30, 2001
    Assignee: Polyplastics Co. Ltd.
    Inventors: Hiroyuki Kanai, Kei Aoki, Toru Katsumata
  • Patent number: 6166143
    Abstract: A thermoplastic elastomer composition containing a component (A) (thermoplastic polyolefin resin), component (B) (epoxy-group-containing ethylene acrylic ester copolymer rubber), and component (C) (acid-modified polyolefin resin) comprising a continuous phase of the component (A) in which the component (B) is dispersed as a dispersed phase and is cross-linked by a peroxide; a thermoplastic elastomer composition comprising a continuous phase of a thermoplastic polyolefin resin (A) and a dispersed phase of an epoxy-group-containing ethylene-acrylic ester copolymer rubber component (B) and acrylonitrile butadiene rubber component (C), which is dynamically cross-linked; and a hose having an inner tube, at least one reinforcing layer, and an outer cover, wherein the inner tube and the outer cover contain a thermoplastic elastomer composition comprised of a thermoplastic resin in which is blended an at least partially cross-linked elastomer component, the reinforcing layer is a brass-plated wire, and the reinforcin
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: December 26, 2000
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Jiro Watanabe, Yuichi Hara, Daisuke Irii, Takashi Satoh, Gou Kawaguchi, Shigeru Yamauchi, Susumu Hatanaka, Noriaki Kuroda
  • Patent number: 6133374
    Abstract: A polypropylene resin composition comprises (1) 40 to 99% by weight of a polypropylene resin; (2) 1 to 60% by weight of an ethylene/alpha-olefin copolymer elastomer; (3) 20 to 50 parts by weight of a low molecular weight polypropylene resin modified with unsaturated carboxylic acid or its anhydride, and (4) 0.1 to 20 parts by weight of an epoxy resin represented by the following chemical formula I: ##STR1## wherein n is an integer of 1 to 4 and A is a multivalent group having a bond number of n and is selected from bisphenol A-type ethers, propylene oxide-type ethers and ethylene oxide-type ethers, the components (3) and (4) being based on 100 parts by weight of the components (1) and (2) in total. The composition is suited for polypropylene materials to be painted, such as automobile bumpers, by virtue of its superior paint adhesion even under the condition of no pretreatments.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: October 17, 2000
    Assignee: SK Corporation
    Inventors: Byeong-Uk Nam, Young-Keun Lee, Tae-Hee Lee, Kyu-Jong Lee
  • Patent number: 6133377
    Abstract: The present invention provides an epoxy resin composition comprising: (a) an epoxy resin having two or more epoxy groups in each molecule; (b) a phenolic resin composition comprising a condensation product of: (i) a phenol; (ii) a compound having a triazine ring; and (iii) an aldehyde, the mixture or condensation product being substantially free from any unreacted aldehydes, or methylol groups; (c) a rubber component; and (d) a curing accelerator. The epoxy resin composition has minute protrusions having a maximum height (Ry) .ltoreq.1.0 .mu.m, formed on its surface by thermosetting at or above 80.degree. C. The invention also provides a process for manufacturing a multilayer printed-wiring board of the build-up type which has a formed copper plating layer.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: October 17, 2000
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Yuki Miyazawa, Tadahiko Yokota
  • Patent number: 6111016
    Abstract: A thermoplastic resin composition can be obtained by adding about 0.1 to 20 parts by weight of a diene-series block copolymer (2) to 100 parts by weight of a resin composition containing a polycarbonate-series resin (1) as a basic component of which the proportion of terminal hydroxy groups relative to the whole of the terminals is 1 mole % or above (about 5 to 40 mole %). The polycarbonate-series resin base may further comprise a thermoplastic resin composition (3) such as a rubber-modified styrenic resin. The block copolymer component (2) includes an epoxy-modified block copolymer, etc. When added an organophosphorus compound as a flame retardant (4), or a fluorine-containing resin as a flame-retartant auxiliary (5), a halogen-free flame-retardant thermoplastic resin composition can be obtained. A thermoplastic resin with an improved flowability and impact strength can be obtained by modifying a polymer blend of the polycarbonate-series resin and the styrenic-series resin in quality.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: August 29, 2000
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Masahiro Katayama, Masaaki Ito, Yoshihiro Otsuka
  • Patent number: 6111015
    Abstract: Curable suspensions of an epoxy resin formulation comprisinga) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system,b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components,c) a curing catalyst, conventional fillers or reinforcing materials,are particularly suitable for use as casting resins, laminating resins or adhesives.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: August 29, 2000
    Assignee: Ciba Specialty Chemicals Corp.
    Inventors: Sameer H. Eldin, Robert Peter Peyer, Frans Setiabudi, Urs Gruber
  • Patent number: 6099685
    Abstract: An adhesive resin composition comprising:(A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and(B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: August 8, 2000
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6075093
    Abstract: A laundry detergent composition comprising a surfactant, builder and from about 0.1 to about 25 weight percent, based on the total weight of the laundry detergent composition, of a styrene-anhydride copolymer grafted with polyethylene glycol which is prepared by reacting in a solvent styrene monomer selected from styrene and substituted styrene, with an anhydride monomer selected from maleic anhydride and itaconic anhydride, to form a styrene-anhydride copolymer which is reacted with polyethylene glycol, to form a styrene-anhydride copolymer grafted with polyethylene glycol. The styrene-anhydride copolymers grafted with polyethylene glycol when used in a laundering process, remove soil from fabrics, inhibit soil deposition on fabrics, and provide soil resistance to fabrics.
    Type: Grant
    Filed: June 9, 1998
    Date of Patent: June 13, 2000
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Klein A. Rodrigues
  • Patent number: 6066699
    Abstract: This invention comprises a two-part epoxy adhesive composition. The composition comprises an epoxy resin having an average epoxide functionality of greater than one and an oligomeric polyester which is on average, terminated by at least two hydroxyl groups.
    Type: Grant
    Filed: November 23, 1994
    Date of Patent: May 23, 2000
    Assignee: 3M Innovative Properties Company
    Inventor: Virginia C. Marhevka
  • Patent number: 6063839
    Abstract: Disclosed are epoxy resin compositions for fiber-reinforced composite materials, comprising an epoxy resin containing 70 parts by weight or more, per 100 parts by weight of the epoxy resin, of a bi-functional epoxy resin, fine particles comprising a rubber phase and substantially insoluble in epoxy resins and a curing agent. Also disclosed are prepregs and fiber-reinforced composite materials comprising the composition.
    Type: Grant
    Filed: May 9, 1996
    Date of Patent: May 16, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Oosedo, Shunsaku Noda
  • Patent number: 6054531
    Abstract: Weatherable thermoplastic compositions, such as a copolymer of styrene and acrylonitrile (SAN) are provided having improved impact strength. Improvements in thermoplastic composition properties are the result of the incorporation of the graft of an emulsion polymerized cross-linked poly(acrylate) rubber. The emulsion polymerized cross-linked poly(acrylate) rubber is synthesized in the presence of an effective amount of an alpha-alkylstyrenic monomer, such as alpha-methylstyrene dimer; the emulsion polymerized cross-linked poly(acrylate) rubber can be monomodal or bimodal.
    Type: Grant
    Filed: November 23, 1998
    Date of Patent: April 25, 2000
    Assignee: General Electric Company
    Inventor: Daniel Horace Craig
  • Patent number: 6025420
    Abstract: A polymer blend composition with a good balance of high impact resistance and moldablity with reduced tendencies of delamination in molded articles is prepared by admixing with polycarbonate a substantially linear ethylene polymer or linear ethylene polymer, and a compatibilizing graft copolymer of a styrene and acrylonitrile copolymer grafted to an ethylene, propylene, and optional diene copolymer.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: February 15, 2000
    Assignee: The Dow Chemical Company
    Inventors: Hoang T. Pham, Sarada P. Namhata, Clive P. Bosnyak
  • Patent number: 6015845
    Abstract: The present invention relates to a binder for a building structure comprising a main ingredient, a curing agent and an accelerator for the main ingredient; the main ingredient being an epoxy acrylate resin diluted with a reactive monomer comprising a multifunctional ester of carboxylic acid and alcohol, at least one of which contains a reactive double bond; the curing agent being an organic peroxide; and the accelerator of the main ingredient being tertiary aromatic amines containing a hydroxyl group in a nitrogen substituent.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: January 18, 2000
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Masayuki Yonetani, Seiji Nishida
  • Patent number: 6015859
    Abstract: A thermoplastic polymer composition contains at least two distinct polymers, characterized in that it comprises at least one polymer P1 containing at least one reactive function and at least one modified polyolefin P2 containing at least one succinimide ring substituted on the nitrogen by a reactive group, the ring being carried either by the main chain or by a side chain, and optionally at least one third polymer P3 selected from the group formed by polymers and copolymers obtained by polymerisation of one or more olefinic compounds. A mixture of polymers comprises at least one composition as defined above and at least one other polymer P5 which is identical to or different from polymer P3 and optionally at least one other polymer P6 which is identical to or different from polymer P1.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: January 18, 2000
    Assignee: Institut Francais du Petrole
    Inventors: Yves Camberlin, Serge Gonzalez, Frederique Hauviller
  • Patent number: 6008286
    Abstract: The present invention provides a primer composition comprising an aliphatic isocyanate-containing compound, a nonhalogenated hydrocarbon polymer containing organic functional groups, a halogenated hydrocarbon polymer optionally containing organic functional groups, and an organic solvent.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: December 28, 1999
    Assignee: 3M Innovative Properties Company
    Inventor: James D. Groves
  • Patent number: 5994462
    Abstract: A solid coating composition for use in powder coating and extrusion coating applications is disclosed. The coating composition contains about 70 to about 95% of a base resin, such as a polyester, and about 1 to about 50% of a low-to-medium molecular weight end-capped epoxy resin, and is essentially free of a bisphenol-A diglycidyl ether monomer. The solid coating composition is applied to a metal substrate in a powder coating or an extrusion process to provide a metal article having a composition film having a thickness of about 1 to about 200 microns. The metal articles can be used to package food and beverages.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: November 30, 1999
    Assignee: The Dexter Corporation
    Inventors: K. G. Srinivasan, Stephen Postle, Hans Widmer
  • Patent number: 5965665
    Abstract: A low gloss thermoplastic resin composition containing a rubber modified thermoplastic resin, a gel polymer and a low molecular weight polyolefin polymer provides low surface gloss properties and improved impact properties.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: October 12, 1999
    Assignee: General Electric Company
    Inventors: James M. Fukuyama, Satish Kumar Gaggar
  • Patent number: 5962586
    Abstract: Improved toughened epoxy resin systems having glass transition temperatures of 250.degree. C. to 350.degree. C. are prepared by carefully curing a blend of epoxy resin or resins, all of which have an epoxy functionality of at least 2 with the mixture having an epoxy functionality greater than 2, an anhydride hardener mixture comprising a bicycloalkenedicarboxylic acid anhydride, a polybutadiene-maleic anhydride adduct, and optionally, a polybutadiene, a bismaleimide, or benzophenone tetracarboxylic acid dianhydride, preferably using a dialkyl imidazole-2-thione accelerator.
    Type: Grant
    Filed: September 27, 1994
    Date of Patent: October 5, 1999
    Inventor: John D. Harper
  • Patent number: 5955149
    Abstract: A release coating composition and a method of forming a release coating on a bakeware substrate using the coating composition is provided. The release coating composition includes (i) an acrylic resin, (ii) an epoxy resin, and (iii) a silicone release agent. The release coating composition can be formed in two parts, a base coat composition and a top coat composition. The base coat composition may include an epoxy resin, an acrylic resin, a color additive and appropriate solvents. The top coat composition may include an acrylic resin, an epoxy resin, a silicone release agent, a silicone resin and appropriate solvents. Each of the parts can be separately applied to the bakeware substrate and heated to form a release coating. In some cases, the top coat composition alone may only be applied if fabrication of the coated substrate will not be severe.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: September 21, 1999
    Assignee: Material Sciences Corporation
    Inventor: Edmund J. Kuziemka
  • Patent number: 5939490
    Abstract: Compositions are provided for compatibilized blends comprising compatibilizing poly(phenylene ether) resins and epoxy-functional polyolefins that exhibit improved resistance to delamination while providing high impact strength and other improved physical properties. Articles made from the compositions are useful for automotive lighting and under hood components.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: August 17, 1999
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, John Robert Campbell, Chorng-Fure Robin Hwang, Steven Thomas Rice, Patric A. Rodgers, James Joseph Scobbo, Jr., John Bennie Yates
  • Patent number: 5830946
    Abstract: A rubber composition comprises a hydrogenated NBR, zinc dimethacrylate, zinc diacrylate, or an admixture thereof, an epoxy compound and an organic peroxide vulcanizer. A hose is also provided, comprising an inner tube, a reinforcement layer and an outer tube, at least the inner tube being formed from the above rubber composition.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: November 3, 1998
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Ozamu Ozawa, Katsuki Hayashida, Tomoji Saitoh
  • Patent number: 5789482
    Abstract: Epoxy resin compositions which containa) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule,b) an anhydride hardener for the epoxy resin a),c) a toughener, andd) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electrical and electronic components.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: August 4, 1998
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Sameer H. Eldin, Jurg Maurer, Robert Peter Peyer, Peter Grieshaber, Fran.cedilla.ois Rime
  • Patent number: 5770652
    Abstract: There is provided a process for making a gel-containing additive concentrate by mixing a reactive polymer such as SAN and a substantially immiscible carrier polymer such as polycarbonate or polystyrene and reactively extruding the reactive polymer and carrier polymer in the presence of a multi-functional crosslinking agent and catalyst
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: June 23, 1998
    Inventors: William David Richards, Greg R. Bradtke, Robert Howard Wildi, Linda McAdam Gemmell, Jack Alvon Hill, Vinod Kumar Berry, Catherine Marie Monique Pottier-Metz, John Robert Campbell, Jack Lew Little, Kenneth Gordon Powell
  • Patent number: 5750619
    Abstract: A curable coating composition comprises an organic solvent, a binder obtained from (a) an anhydride resin with a molecular weight of less than about 3000 containing a central organic moiety having bonded thereto non-cyclic anhydride moieties and (b) an oligomer possessing an epoxy functionality of at least 2 and a molecular weight of less than about 1500, from about 3-40% by weight of the binder of (c) a stabilized acrylic resin prepared from an acrylic polymer core having grafted thereto linear stabilizer components of an acrylic backbone with at least about 3% of epoxy-functional ethylenically unsaturated monomers, and (d) an active catalyst.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: May 12, 1998
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Robert John Barsotti, Christopher Scopazzi
  • Patent number: 5747557
    Abstract: A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: May 5, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koshi Hanyu, Akira Yoshizumi
  • Patent number: 5739214
    Abstract: The present invention relates to radiation-curable coating compositions comprising(A) from 20 to 50% by weight of at least one prepolymer containing at least two ethylenically unsaturated double bonds,(B) from 20 to 60% by weight of at least one cationically curing epoxy resin,(C) from 10 to 30% by weight of at least one ketonic and/or ketone-formaldehyde resin,(D) from 5 to 40% by weight of at least one reactive diluent, and(E) from 5 to 10% by weight of a mixture of at least one cationic polymerization initiator and at least one free-radical polymerization initiator,the sum of the proportions by weight of components A to E being in each case 100% by weight.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: April 14, 1998
    Assignee: BASF Lacke + Farben, AG
    Inventor: Stephan Schunck
  • Patent number: 5712333
    Abstract: A blend of polycarbonate and a homogeneously branched, linear ethylene polymer, which blend has a desirable balance of impact resistance and toughness properties.
    Type: Grant
    Filed: August 12, 1996
    Date of Patent: January 27, 1998
    Assignee: The Dow Chemical Company
    Inventors: Frank M. Hofmeister, Hani Farah, Morgan M. Hughes, Steve R. Ellebracht
  • Patent number: 5705565
    Abstract: Substantially linear ethylene polymers, e.g., polyethylenes prepared by constrained geometry catalysis (substantially linear ethylene), which are grafted with one or more unsaturated organic compounds containing both ethylenic unsaturation and a carbonyl group, e.g., maleic anhydride, exhibit desirable adhesive properties. These graft-modified substantially linear ethylene polymers also impart desirable compatibility and impact properties to various thermoplastic polymer blends.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: January 6, 1998
    Assignee: The Dow Chemical Company
    Inventors: Morgan M. Hughes, Kyle G. Kummer, Stephen R. Betso, Michael E. Rowland, Morris S. Edmondson
  • Patent number: 5691416
    Abstract: An epoxy resin composition which is tough and has excellent heat resistance and adhesion is obtained by dispersing, in an epoxy resin, polymer particles with a glass transition temperature of lower than 20.degree. C. obtained by emulsion polymerization of a (meth)acrylic acid ester monomer by using, as an emulsifier, an end alkyl group-containing polymer with an acid value of greater than 200 or a salt thereof obtained by polymerization of a polymerizable monomer containing an unsaturated carboxylic acid in the presence of an alkyl mercaptan. The epoxy resin composition is useful, for example, as adhesives, molding materials, paints, sealants.
    Type: Grant
    Filed: November 2, 1995
    Date of Patent: November 25, 1997
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Masatoshi Yoshida, Kenji Minami, Ichiro Namura, Masuji Izubayashi
  • Patent number: 5691419
    Abstract: A coating agent comprises a binding agentcontaining at least one acrylate copolymer (A) with carboxyl groups and/or at least one acrylate copolymer (B) with epoxide groups, the acrylate copolymers (A) and (B) being obtained by solution polymerization using less than 5% by weight based on the total weight of monomers of one or more polysiloxane macromonomers a.sub.1 having a number-average molecular weight of 1000 to 40,000 and on average 0.5 to 2.5 ethylenically unsaturated double bonds per molecule; and one or more epoxy resins.
    Type: Grant
    Filed: February 1, 1994
    Date of Patent: November 25, 1997
    Assignee: BASF Lacke + Farben, AG
    Inventors: Stephan Engelke, Michael Brunnemann, Olaf Rotter, Andreas Holst
  • Patent number: 5686509
    Abstract: An adhesion-reinforcing composition for an epoxy resin adhesive which comprises a copolymer resin particle having been ion-crosslinked with a univalent or divalent metal cation, which particle is comprised of (i) a core ingredient composed of a polymer comprising diene monomer units and optional crosslinking monomer units and having a glass transition temperature not higher than -30.degree. C. and (ii) a shell ingredient composed of a copolymer having a glass transition temperature of at least 70.degree. C. and comprising acrylate or methacrylate monomer units and 0.01-20 wt. parts, per 100 wt. parts of the shell ingredient, of units of a radically polymerizable unsaturated carboxylic acid monomer having a carboxyl group and 3-8 carbon atoms; the core/shell weight ratio being 5/1-1/4. A composition comprising 100 wt. parts of an epoxy resin, 15-60 wt.
    Type: Grant
    Filed: November 22, 1995
    Date of Patent: November 11, 1997
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Akira Nakayama, Toshio Nagase, Tadashi Ashida, Masahiko Ohnishi
  • Patent number: 5686531
    Abstract: A coating agent comprises a binding agent containing at least one acrylate copolymer (A) with carboxyl groups and/or at least one acrylate copolymer (B) with epoxide groups, the acrylate copolymers (A) and (B) being obtained by solution polymerization using less than 5% by weight based on the total weight of monomers of one or more polysiloxane macromonomers a.sub.1 having a number-average molecular weight of 1000 to 40,000 and on average 0.5 to 2.5 ethylenically unsaturated double bonds per molecule; one or more addition and/or condensation resins with carboxyl groups; and one or more epoxy resins.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: November 11, 1997
    Assignee: BASF Lacke + Farben, AG
    Inventors: Stephan Engelke, Michael Brunnemann, Olaf Rotter, Andreas Holst
  • Patent number: 5668214
    Abstract: A polyarylene sulfide resin composition having improved toughness and impact resistance is formed by 100 wt. parts of polyarylene sulfide and 0.5-50 wt. parts of a graft copolymer. The graft copolymer includes an olefin copolymer segment comprising .alpha.-olefin units and .alpha.,.beta.-unsaturated acid glycidyl ester units, and a grafting polymer segment comprising .alpha.,.beta.-unsaturated acid glycidyl ester units and chemically bonded to the olefin copolymer segment. The .alpha.-olefin is preferably ethylene. The .alpha.,.beta.-unsaturated acid glycidyl ester is preferably glycidyl acrylate or glycidyl methacrylate. The grafting polymer segment is preferably in the form of a copolymer of an .alpha.,.beta.-unsaturated acid glycidyl ester and a monoethylenically unsaturated monomer.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: September 16, 1997
    Assignee: Kureha Kagaku Kogyo Kabushiki Kaisha
    Inventor: Yasuhiro Suzuki
  • Patent number: 5661200
    Abstract: Compositions of stabilized stereoregular polymers of branched higher alpha-olefins, grafting compounds, free radical generators, glass and epoxy resins and/or epoxy-functional silanes and/or hydroxy functional compounds are provided as well as methods for making these compounds and articles thereof.
    Type: Grant
    Filed: May 2, 1996
    Date of Patent: August 26, 1997
    Assignee: Phillips Petroleum Company
    Inventors: Edwin Boudreaux, Jr., Howard F. Efner, Mary Jane Hagenson
  • Patent number: 5652326
    Abstract: A polyetheresteramide having good heat resistance, permanent antistatic property and superior compatibility with thermoplastic resins and a resin composition containing of the polyetheresteramide are disclosed, wherein the polyetherester-amide consists essentially of a polyamide oligomer with carboxylic chain ends having a number average molecular weight between 200 and 5,000 and a bisphenol compound with oxyalkylene units having a number average molecular weight between 300 and 3,000. Antistatic resin compositions with good antistatic property and heat resistance are obtained from compositions comprising 3 to 40% by weight of the polyetheresteramide and 60 to 97% by weight of thermoplastic resins. The antistatic resin compositions can contain as compatibilizers vinyl polymers having functional groups such as carboxyl and epoxy groups or block polymers containing polyolefin blocks and aromatic vinyl polymer blocks.
    Type: Grant
    Filed: March 1, 1994
    Date of Patent: July 29, 1997
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Yasuhiro Ueda, Eiichi Senda, Yoshitsugu Takai, Tokiko Kokubu, Toshiaki Okamoto, Eiji Ichihara
  • Patent number: 5643975
    Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: July 1, 1997
    Assignee: Shin-Etsu Chemical Company, Limited
    Inventors: Toshio Shiobara, Hisashi Shimizu
  • Patent number: 5637179
    Abstract: A process for adhesion using an epoxy rein adhesive composition which comprises coating surfaces for adhesion with a two component epoxy resin adhesive composition prepared immediately before the coating by mixing a mixture containing (A) resin powder prepared by ionic crosslinking of resin particles by addition of a metal cation and (B) an epoxy resin with (C) a curing agent of a room temperature curing type for epoxy resins, bringing the coated surfaces for adhesion into contact with each other, and subsequently heating the surfaces for adhesion. The resin particle is constituted with (a) a core formed with a (meth)acrylate polymer and/or a diene polymer which has a glass transition temperature of -30.degree. C. or lower and (b) a shell formed with a copolymer of a (meth)acrylate monomer and a radical polymerizable unsaturated carboxylic acid monomer having carboxyl group and 3 to 8 carbon atoms which has a glass transition temperature of 70.degree. C. or higher.
    Type: Grant
    Filed: September 28, 1995
    Date of Patent: June 10, 1997
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Akira Nakayama, Toshio Nagase
  • Patent number: 5629379
    Abstract: Toughened epoxy resin systems having high temperature capabilities of from 250.degree. to 350.degree. C. prepared by carefully curing blends of epoxy resins having an average epoxy functionality greater than two with bicycloalkene dicarboxylic anhydride hardener, maleinized polybutadiene toughening agent, supplemental hardener selected from the group consisting of aromatic tetracarboxylic dianhydrides and bismaelimides of aromatic diamines, and epoxy/anhydride accelerator.
    Type: Grant
    Filed: October 6, 1995
    Date of Patent: May 13, 1997
    Inventor: John D. Harper
  • Patent number: 5629380
    Abstract: A curable, structural epoxy adhesive composition comprising two parts is provided. The first part comprises an amine curing agent and a catalyst; the second part comprises an epoxy resin having an average epoxide functionality of greater than one.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: May 13, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: John M. Baldwin, Janis Robins
  • Patent number: 5612401
    Abstract: Improved compositions are provided which comprise a poly(phenylene ether) resin, a poly(arylene sulfide) resin, a polyester resin, and a compatibilizer compound. The compositions can further comprise functionalizing agents, impact modifiers, flame retardants, and reinforcing fillers to provide compositions that exhibit improved tensile strength and elongation characteristics. Articles molded from these compositions are useful in the electrical connector industry.
    Type: Grant
    Filed: April 17, 1996
    Date of Patent: March 18, 1997
    Assignee: General Electric Company
    Inventors: Sterling B. Brown, Kevin H. Dai, Chorng-Fure R. Hwang, Steven T. Rice, James J. Scobbo, Jr., John B. Yates
  • Patent number: 5589540
    Abstract: Three new types of chelating resins containing nitrogen and sulfur or oxygen atoms as coordination atom were synthesized by the reaction of a polymer bearing amino (--NH.sub.2) or imino (.dbd.NH) groups as reaction sites with a substitutive derivative of epithiopropane or epoxypropane. These resins exhibited excellent adsorption properties for noble metals.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: December 31, 1996
    Inventor: Dong Shihua