With Saturated 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom; Or With Solid Copolymer Derived From At Least One Unsaturated 1,2-epoxy Reactant Wherein The Epoxy Reactant Contains More Than One 1,2-epoxy Group Per Mole And At Least One Saturated Reactant Patents (Class 525/65)
  • Publication number: 20040234774
    Abstract: Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 25, 2004
    Applicant: 3M Innovative Properties Company
    Inventors: Ming Cheng, Ying-Yuh Lu
  • Patent number: 6809147
    Abstract: The present invention provides a thermosetting composition which is excellent especially in storage stability and solid physical properties and can be used as automotive body sealers or undercoats. The thermosetting composition according to the present invention comprises an acrylic plastisol consisting of a plasticizer having acrylic resin particles having a gradient-type structure in which the monomer unit proportion changes from the core to the shell multistep-wise or continuously and a filler dispersed therein and therewith formulated, as a thermosetting material, a blocked urethane prepolymer or blocked polyisocyanate compound and a latent curing agent therefor.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: October 26, 2004
    Assignees: Sunstar Giken Kabushiki Kaisha, Sunstar Suisse SA
    Inventors: Hitoshi Ohno, Kenta Nakayama, Takashi Minamihori
  • Patent number: 6809160
    Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: October 26, 2004
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Noriyuki Tsuboniwa, Motoki Fujii, Ichiro Kawakami, Takayuki Kokubun, Hiroyuki Sakamoto
  • Patent number: 6800157
    Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: October 5, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Kent S. Tarbutton, Janis Robins
  • Patent number: 6787605
    Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: September 7, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Robert Steven Clough, Mario Alberto Perez
  • Patent number: 6787117
    Abstract: There are provided a porous hollow fiber membrane capable of economically and efficiently recovering germanium which has heretofore been entirely disposed as a waste, and a method for recovery of germanium oxide using such a porous hollow fiber membrane.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: September 7, 2004
    Assignee: Asai Germanium Research Institute Co., Ltd.
    Inventors: Kyoichi Saito, Katuyuki Sato, Mitsuo Akiba
  • Patent number: 6787606
    Abstract: A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novolac epoxy resin; (b) a toughening agent; and (c) a latent curative.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: September 7, 2004
    Assignee: Henkel Corporation
    Inventor: Chunfu Chen
  • Publication number: 20040152836
    Abstract: Polymers grafted with a compound of formula I, formula (I) wherein the general symbols are as defined in claim 1, have outstanding stability against oxidative, thermal, dynamic, light-induced and/or ozone-induced degradation.
    Type: Application
    Filed: October 2, 2003
    Publication date: August 5, 2004
    Inventors: Hans-Rudolf Meier, Gerrit Knobloch, Pierre Rota-graziosi, Samuel Evans, Paul Dubs, Michele Gerster
  • Publication number: 20040110900
    Abstract: A method of forming a toughened article from a blend of a thermoplastic polymer and a comb copolymer is disclosed, along with the toughened article produced thereby. Compositions such as solids blends and melt blends, including a thermoplastic polymer and a comb copolymer, are also disclosed.
    Type: Application
    Filed: November 19, 2003
    Publication date: June 10, 2004
    Inventors: Willie Lau, Paul Ralph Van Rheenen
  • Patent number: 6740708
    Abstract: An impact-resistant polymer composition exhibiting improved impact resistance at no loss in creep is obtained by melt-mixing a solid matrix polymer A with a solid composition containing the rubber composition dispersed in a matrix polymer B. The dispersion of rubber composition in matrix polymer B is obtained by melt mixing the matrix polymer B with a rubber composition which includes a functionality rubber and a non-functionality rubber. The amounts of the components are such that the impact-resistant polymer composition contains 0.5 to 75 parts by weight of the rubber composition per 100 parts by weight of the matrix polymers A and B. The composition may be used in various applications, including plugs, heat bridges for aluminum windows, hammer heads and the like.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: May 25, 2004
    Assignee: DSM IP Assets B.V.
    Inventors: Wilhelmus G. M. Bruls, Johannes F. Repin, Jan De Kroon
  • Publication number: 20040077784
    Abstract: The present invention, a powder composition for making powder coatings comprising one or more than one curable polymer or resin and an agglomerate of a core-shell polymer, wherein the agglomerate of a core-shell polymer has an average particle size of from 5 to 190 microns, preferably from 10 to 127 microns. The powders in accordance with the present invention provide a cured powder coating that is flexible, smooth, and which may be applied in a thickness of only from 0.3 to 8 mils. In a preferred embodiment of making a powder in accordance with the present invention, the agglomerate is cryoground to form a reduced agglomerate prior to adding it into a powder as a post-blend or a powder-forming mixture as a preblend. The preferred core-shell polymer for use in accordance with the present invention comprises an acrylic impact modifier having a poly(methyl methacrylate) shell and a poly(butyl acrylate) core.
    Type: Application
    Filed: December 18, 2002
    Publication date: April 22, 2004
    Inventors: Casmir Stanislaus Ilenda, Michael Louis Spera, Gordon Tullos, Andrew T. Daly
  • Patent number: 6723803
    Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: April 20, 2004
    Assignee: Raytheon Company
    Inventors: Ralph D. Hermansen, Steven E. Lau
  • Patent number: 6720370
    Abstract: A thermoplastic resin composition having 100 parts by weight of a resin mixture of (A) from 20 to 98% by weight of a polycarbonate resin and (B) from 2 to 80% by weight of a styrenic resin; from 0.1 to 20 parts by weight of (C) an epoxy-modified block copolymer; and from 0.5 to 20 parts by weight of (D) a grafted core/shell rubber elastomer, can be used in moldings which have a good surface layer peeling resistance and a good impact resistance. Further, a flame-retardant polycarbonate resin composition having 100 parts by weight of a resin or resin mixture of (A) from 20 to 100% by weight of a polycarbonate resin and (B) from 0 to 80% by weight of a styrenic resin; from 1 to 30 parts by weight of (E) a flame retardant of an organic phosphorus compound; and from 0.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: April 13, 2004
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Akio Nodera, Naoki Mitsuta
  • Patent number: 6716915
    Abstract: A method of forming a toughened article from a blend of a thermosetting polymer and a comb copolymer is disclosed, along with the toughened thermoset article produced thereby. Compositions including a thermosetting polymer and a comb copolymer are also disclosed.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: April 6, 2004
    Assignee: Rohm and Haas Company
    Inventors: Willie Lau, Paul Ralph Van Rheenen
  • Patent number: 6713535
    Abstract: The present invention is directed to a low-friction coating composition, comprising: about 10 to about 30 wt % of an epoxy resin composition consisting essentially of 4-glycidyloxy-N,N′-diglycidylaniline; about 30 to about 60 wt % of an epoxide resin composition consisting essentially of bisphenol A diglycidyl ether polymer; and about 20 to about 40 wt % of an aromatic amine composition consisting essentially of 4,4′-sulfonyldianiline; wherein all weight percents are based on the total weight of the low-friction coating composition, and wherein the low-friction coating composition is substantially free of chromate. The invention is also directed to a substrate coated with the above low-friction coating composition, and methods of coating a substrate with the low-friction coating composition.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: March 30, 2004
    Assignee: Turbine Controls, Inc.
    Inventors: Stanley Orkin, Glenn Greenberg
  • Publication number: 20040024122
    Abstract: A thermoplastic molding composition comprising a grafted acrylate rubber (ASA) and a gloss reducing agent and a process for making the same are disclosed. The gloss reducing agent is the reaction product of (i) an epoxidized grafted rubber having two or more epoxy groups in its graft phase and (ii) a compound having two or more terminal primary amine groups per molecule The gloss reducing agent may be either incorporated in ASA as the reaction product of (i) and (ii) or, in the alternative, formed upon the reaction of (i) with (ii) in the course of the thermal processing of the a blend containing ASA, (i) and (ii).
    Type: Application
    Filed: August 1, 2002
    Publication date: February 5, 2004
    Inventors: Moh-Ching Oliver Chang, Allen R. Padwa, Norma I. Santiago
  • Patent number: 6667367
    Abstract: A directly paintable polyolefin composition contains (1) a graft copolymer, composition containing (a) a graft copolymer having a backbone of propylene polymer material having graft polymerized thereto at least one vinyl monomer capable of being polymerized by free radicals, (b) a rubber component, and, optionally, (c) a broad molecular weight distribution propylene polymer material, (2) an oxidized polyethylene wax, (3) a propylene-homopolymer or copolymer grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid, (4) a functionalized polymer that is reactive with the anhydride groups of the grafted polymers, (5) optionally, a polyolefin rubber grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid, and (6) optionally, an ethylene polymer grafted with an anhydride of an aliphatic &agr;,&bgr;-unsaturated dicarboxylic acid.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: December 23, 2003
    Assignee: Basell Poliolefine Italia S.p.A.
    Inventor: Dominic A. Berta
  • Patent number: 6660805
    Abstract: Epoxy-modified, two-part acrylic structural adhesives are disclosed. These adhesives are not inhibited by oxygen. Representative embodiments include 2-part acrylic structural adhesives comprising, in a first package from about 10 to about 90 percent by weight of at least one methacrylate selected from C3-C10 alkyl monosubstituted-, C1-C6 alkyl disubstituted-, C1-C4 alkyl tri-substituted, and F1-C4 alkyl tetra-substituted cyclohexyl methacrylate. The ring substituents are prefereably in the 3, 4, and/or 5 ring position, and linear or branched C4-C10 branched alkyl methacrylates; from about 10 to about 80 percent by weight of a toughener, and an adhesion promotor; and in a second package, a bonding activator, and optional epoxy resin.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: December 9, 2003
    Assignee: Lord Corporation
    Inventors: Robin F. Righettini, Jeffrey A. Hatcher
  • Patent number: 6656601
    Abstract: The adhesive ethylene copolymer composition of the invention comprises a specific long-chain branched ethylene/&agr;-olefin copolymer (or this copolymer and its graft-modified product) and a tackifier (or a specific ethylene/vinyl acetate copolymer), and has specific density, MFR, crystallinity and graft quantity. The composition containing the tackifier can form a layer having good adhesive force to polystyrene resins, ABS resin, polyacrylonitrile resins and ethylene/vinyl acetate copolymer saponified resins even in an atmosphere of high temperatures. The composition containing the ethylene/vinyl acetate copolymer can form a layer having good adhesive force to polyester resins, polycarbonate resins, polyvinylidene chloride resins and ethylene/vinyl acetate saponified resins even in an atmosphere of high temperatures. The other adhesive ethylene copolymer composition of the invention comprises a blend of a graft-modified linear ethylene/&agr;-olefin copolymer and an olefin elastomer.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: December 2, 2003
    Assignee: Mitsui Chemicals Inc.
    Inventors: Hideshi Kawachi, Yuji Sawada, Haruhiko Tanaka
  • Patent number: 6656595
    Abstract: This invention relates to use of copolymers which are obtained through copolymerization, in the presence of a radical-polymerization initiator, of monomeric mixtures comprising: macromonomers obtained by (co)polymerizing, in the presence of a metal complex which is a catalytic chain transfer agent or an addition-cleavage-type chain transfer agent, and optionally a radical-polymerization initiator, at least one polymerizable monomer selected from methacrylic acid esters and styrene and if necessary methacrylic acid, or the macromonomers into which polymerizable unsaturated groups are further introduced; polymerizable unsaturated monomers containing at least one ionic functional group selected from amino, quaternary ammonium salt and sulfonic acid groups; polyoxyalkylene chain-containing nonionic polymerizable unsaturated monomers; and other ethylenically unsaturated monomers (D); and also such copolymers into which long chain alkyl groups are further introduced, as pigment-dispersing resins to be used in w
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: December 2, 2003
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Yoshio Nakajima, Yoshiyuki Yukawa, Isao Kamimori
  • Publication number: 20030212204
    Abstract: Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 13, 2003
    Applicant: DAINIPPON INK AND CHEMICALS, INC., Tokyo, Japan
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Patent number: 6645341
    Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: November 11, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Terry Gordon
  • Patent number: 6632881
    Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: October 14, 2003
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Satoru Tsuchida, Masahiko Osaka, Masatsugu Ogata
  • Patent number: 6632913
    Abstract: A method for producing an isocyanate group-blocked liquid urethane prepolymer which comprises: reacting a lactone-modified diol (3) with a polyfunctional isocyanate (4) to form an isocyanate group-having urethane prepolymer (5), wherein said lactone-modified diol (3) is obtainable by ring-opening addition polymerization of a lactone monomer (2) with a diol (1) selected from the group consisting of a polyalkylene ether diol, a polyester diol and a polycarbonate diol; and then reacting said urethane prepolymer with a blocking agent (6).
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: October 14, 2003
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Yasuhiro Matsumoto, Hideyuki Takeuchi, Hiroki Tanaka
  • Patent number: 6613869
    Abstract: A branched polycarbonate resin suitable for making containers is disclosed. The polycarbonate is characterized in that at 260° C. and shear rate of 10 s−1 it has a melt viscosity of 5500 to 900 Pas, and in that at 260° C. and shear rate of 1000 s−1 it has a melt viscosity of 880 tom 1500 Pas, and in that it has a melt flow index (MFR) of 0.1 to 3.0 g/10 min. A container made of the polycarbonate exhibits great breaking strength.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: September 2, 2003
    Assignee: Bayer Aktiengesellschaft
    Inventors: Klaus Horn, Ralf Hufen, Wolfgang Alewelt, Peter Gebauer, Franky Bruynseels
  • Publication number: 20030144416
    Abstract: An epoxy composition effective for forming a thermally curable structural adhesive, and in particular, a two part epoxy resin composition that when cured can obtain preferred and improved physical and chemical characteristics useful in structural assembly applications.
    Type: Application
    Filed: September 16, 2002
    Publication date: July 31, 2003
    Applicant: 3M Innovative Properties Company
    Inventors: Kent S. Tarbutton, Janis Robins
  • Patent number: 6596813
    Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: July 22, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Hideyuki Usui, Satoshi Okuda, Minoru Nakao
  • Patent number: 6593423
    Abstract: The present invention provides an adhesion promoting agent which includes a graft copolymer formed by a halogenated polyolefin polymer with at least one reactive functionality and a substantially saturated hydrocarbon polymer having more than one reactive functionality. At least one reactive functionality of the saturated hydrocarbon polymer is reactive with the reactive functionality of the halogenated polyolefin to form the graft copolymer of the invention.
    Type: Grant
    Filed: May 3, 2000
    Date of Patent: July 15, 2003
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Constantine A. Kondos, Jonathan T. Martz, Masayuki Nakajima
  • Patent number: 6586525
    Abstract: The invention provides a binder resin and a primer composition, paint composition, ink composition an adhesive composition with excellent gasohol resistance, adherence, weather resistance, etc. to polyolefinic resins and relates to a binder resin for polyolefinic resins comprising carboxyl group-containing chlorinated polyolefin (II), which contains not more than 2% of a component with molecular weight of 2,000 or lower and which has a ratio of weight average molecular weight (Mw) to number average molecular weight (Mn), that is the value Mw/Mn of not more than 4.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: July 1, 2003
    Assignee: Nippon Paper Industries Co., Ltd.
    Inventors: Keiji Urata, Takaaki Ueda
  • Patent number: 6579936
    Abstract: A resin composition applicable to semiconductor or electric devices comprises (A) a polyarylenesulfide resin, (B) a bisphenol epoxy resin, (C) an oxazoline group-containing amorphous polymer, and (D) an impact resistance-improving resin which is either (d1) an acid or epoxy groups-containing vinyl polymer, or (d2) an acid or epoxy groups-containing gum polymer.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: June 17, 2003
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Publication number: 20030060530
    Abstract: The present invention relates to shape deformable materials, which are capable of (1) being deformed, (2) storing an amount of shape deformation, and (3) recovering at least a portion of the shape deformation when exposed to a humid environment. The shape deformable materials can advantageously be in the form of films, fibers, filaments, strands, nonwovens, and pre-molded elements. The shape deformable materials of the present invention may be used to form products, which are both disposable and reusable. More specifically, the shape deformable materials of the present invention may be used to produce products such as disposable diapers, training pants, incontinence products, and feminine care products.
    Type: Application
    Filed: July 24, 2001
    Publication date: March 27, 2003
    Inventors: Vasily A. Topolkaraev, Dave A. Soerens
  • Publication number: 20030059398
    Abstract: The present invention is directed toward water-soluble supramolecular self-assemblies and a process for their preparation via micellization of polyelectrolytes through the use of hydrophobic monomeric units. In this invention the polyelectrolyte segment ultimately forms the core of the supramolecular assembly whereas the shell consists of uncharged hydrophilic polymers or oligomers. It has been determined that the inclusion of the hydrophobic co-monomers to the polyelectrolyte segment forming the micelle core leads to a structure of enhanced stability.
    Type: Application
    Filed: June 8, 2001
    Publication date: March 27, 2003
    Inventors: Maxime Ranger, Jean-Christophe Leroux
  • Publication number: 20030060564
    Abstract: The present invention relates to shape deformable materials, which are capable of (1) being deformed, (2) storing an amount of shape deformation, and (3) recovering at least a portion of the shape deformation when exposed to a humid environment. The shape deformable materials can advantageously be in the form of films, fibers, filaments, strands, nonwovens, and pre-molded elements. The shape deformable materials of the present invention may be used to form products, which are both disposable and reusable. More specifically, the shape deformable materials of the present invention may be used to produce products such as disposable diapers, training pants, incontinence products, and feminine care products.
    Type: Application
    Filed: July 24, 2001
    Publication date: March 27, 2003
    Inventors: Vasily A. Topolkaraev, Dave A. Soerens
  • Patent number: 6521704
    Abstract: The present invention relates to methods to improve the dampening characteristics of compositions and the improved compositions. The compositions made by the method comprises (a) a polymer system selected from the group consisting of immiscible polymer blends, miscible polymer blends, copolymers, thermoplastic polymers and thermosetting polymers, and (b) a block copolymer comprising: (i) at least one block derived from aromatic vinyl units and (ii) at least one block derived from at least isoprene and a vinyl aromatic monomer and optionally butadiene, and having a glass transition temperature of at least 10° C. In a preferred embodiment, the block copolymer comprises at least one block of polystyrene and at least one block derived from isoprene, styrene and butadiene, and the polymer system comprises at least one polyamide resin.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: February 18, 2003
    Assignee: General Electric Company
    Inventors: Steven F. Hubbard, Sai-Pei Ting
  • Patent number: 6518362
    Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: February 11, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Robert Steven Clough, Mario Alberto Perez
  • Publication number: 20030013807
    Abstract: This composition includes:
    Type: Application
    Filed: March 7, 1995
    Publication date: January 16, 2003
    Inventors: CATHERINE BEUZELIN, ALAIN BOUILLOUX, JEAN-CLAUDE JAMMET, YVES TROLEZ
  • Patent number: 6497337
    Abstract: Adhesion of shaped thermoplastic elastomer articles is promoted without the need for special primers or other supplemental resin additives by incorporating in an enamel coating composition, an adhesion promoting amount of a carboxyl-modified poly (alpha-olefin) polymer resin. In accordance with a preferred embodiment, the enamel coating composition is a corrosion-resistant cresol-formaldehyde/epoxy resin coating containing from about 0.1% to about 3% by weight of a maleic anhydride-modified polypropylene resin adhesion promoter. The compositions and bonding methods described are useful to provide bonded structures of shaped thermoplastic elastomers, such as SEBS, PBR and EPDM copolymers, heat sealed to metallic substrates, especially metal closures for food containers destined for exposure to high temperature filling, sterilization and retort processing conditions.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: December 24, 2002
    Assignee: White Cap, Inc.
    Inventor: Alfred William Kehe
  • Patent number: 6492462
    Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: December 10, 2002
    Assignee: Landec Corporation
    Inventors: Steven P. Bitler, David D. Taft, Ray F. Stewart
  • Patent number: 6486241
    Abstract: A polycarbonate resin composition with improved moisture resistance maintains outstanding physical properties even in high-temperature, high-humidity aging and comprises a polycarbonate resin composition containing (B) (B-1) 1 to 99 parts by weight of a copolymer having as its component parts (a) an aromatic vinyl monomer component, (b) a cyanide vinyl monomer component, and (c) a rubber-like polymer, and/or (B-2) a copolymer having as its component parts (a) an aromatic vinyl monomer component and (b) a cyanide vinyl monomer component, with respect to (A) 1 to 99 parts by weight of polycarbonate resin having a viscosity average molecular weight within a specified range, said copolymer containing an amount of various alkali metals of 1 ppm or less, and (C) 0 to 40 parts by weight of a phosphoric ester compound blended in with respect to a total of 100 parts by weight of the aforementioned components (A) and (B).
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: November 26, 2002
    Assignee: General Electric Company
    Inventor: Yuzuru Sawano
  • Patent number: 6486256
    Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: November 26, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kent S. Tarbutton, Janis Robins
  • Patent number: 6482530
    Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: November 19, 2002
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6476145
    Abstract: Polyester injection-moulded parts based on a polyester (A) and on a copolymer (B) of ethylene and of an unsaturated epoxy, such that weight % (B)×MFI (A+B)/MFI(A) is greater than 3 and in this expression: MFI (A+B) denotes the melt flow index of the modified polyester, that is to say the blend of (A) and (B) and of any fillers; MFI (A) denotes the melt flow index of the polyester (A) and of any fillers (without (B)); and weight % (B) denotes the percentage by weight of (B) in the blend of (A) and (B) and of any fillers.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: November 5, 2002
    Assignee: Atofina
    Inventors: Patrice Perret, Jacques Komornicki, Yoshiyuki Miyaki
  • Patent number: 6447913
    Abstract: To provide a thermoplastic polyester resin composition which has a very good durability to alkaline solutions for a long period of time. That is, a thermoplastic polyester resin composition, wherein a thermoplastic polyester resin (A) is compounded with 1-25% by weight (in the total composition) of impact resistance rendering materials (B), 0.1-15% by weight (in the total composition) of a silicone compound and/or a fluorine compound (C), 1-50% by weight (in the total composition) of an inorganic filler (D), and 0.1-10% by weight of at least one polyfunctional compound (E) selected from the group consisting of an epoxy compound, an isocyanate compound and a carboxylic acid dianhydride. A molded article of the present invention has anti-stress properties even in a weld part thereof.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: September 10, 2002
    Assignees: Polyplastics Co., LTD, Denso Corporation
    Inventors: Kazufumi Watanabe, Takayuki Ishikawa, Toru Katsumata, Tetsuya Hirose, Hiroyuki Wakabayashi
  • Publication number: 20020103294
    Abstract: A thermoplastic resin composition with enhanced elongation and good appearance comprising a compatible resin blend of a polyester sulfonate salt ionomer and a polyamide and an effective amount of at least one difunctional epoxy compound wherein the difunctional epoxy compound has at least one cyclohexane ring moiety and having two terminal epoxy functional groups, wherein at least one of the two terminal epoxy functional groups is a substituent on the at least one cyclohexane ring moiety; and optionally an effective amount of a catalyst compound or rubbery impact modifier.
    Type: Application
    Filed: February 17, 1999
    Publication date: August 1, 2002
    Inventors: BRET J. CHISHOLM, ROBERT R. GALLUCCI, JOSEF H.P. BASTIAENS
  • Patent number: 6426148
    Abstract: A curable coating composition comprising, in an organic solvent, a binder of (i) a non-isocyanate oligomer or blend of oligomers containing at least two functional groups with at least one being an epoxy group, the remaining being epoxy or hydroxyl; (ii) optionally a polyester, oligoester, or acrylic polymer with at least two hydroxyl groups; and (iii) an oligomeric crosslinker or blend of crosslinkers which contain at least two isocyanate groups.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: July 30, 2002
    Assignee: E. I. du Pont de Nemours & Company
    Inventors: Robert John Barsotti, Lee R. Harper, John David Nordstrom
  • Patent number: 6395828
    Abstract: A thermoplastic molding composition comprising a grafted acrylate rubber (ASA) and a gloss reducing agent and a process for making the same are disclosed. The gloss reducing agent is the reaction product of (i) a compound having two or more epoxy groups per molecule and (ii) a compound having two or more amine groups per molecule, with the proviso that the total of epoxy groups of (i) and amine groups of (ii) per molecule is greater than 4. The gloss reducing agent may be either incorporated in ASA as the reaction product of (i) and (ii) or, in the alternative, formed upon the reaction of (i) with (ii) in the course of the thermal processing of the a blend containing ASA, (i) and (ii).
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: May 28, 2002
    Assignee: Bayer Corporation
    Inventors: Moh-Ching Oliver Chang, Allen R. Padwa
  • Publication number: 20020058753
    Abstract: A method of forming a toughened article from a blend of a thermosetting polymer and a comb copolymer is disclosed, along with the toughened thermoset article produced thereby. Compositions including a thermosetting polymer and a comb copolymer are also disclosed.
    Type: Application
    Filed: September 13, 2001
    Publication date: May 16, 2002
    Inventors: Willie Lau, Paul Ralph Van Rheenen
  • Patent number: 6384134
    Abstract: A polymer gel composition useful in the fabrication of a vibration damping material comprises a maleated polyalkylene grafted via a grafting agent such as a diamine to a poly(alkenyl-co-maleimide), an epoxy polymer and, optionally, an extender such as a phthalate oil.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: May 7, 2002
    Assignee: Bridgestone Corporation
    Inventors: James E. Hall, Xiaorong Wang
  • Patent number: 6383439
    Abstract: This invention relates to grafted ethylene-higher &agr;-olefin polymers and blends thereof. Preferred grafted ethylene-higher &agr;-olefin polymers are multimodal EPDM's having 5-40 weight % of a higher molecular weight, higher ethylene content, lower diene content fraction grafted with maleic anhydride. These polymers can then be used as modifiers for additional polymers such as polyamides, polyesters, and other EPDM's.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: May 7, 2002
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventor: Jean-Roch H. Schauder
  • Patent number: 6369142
    Abstract: A thermoplastic resin composition having 100 parts by weight of a resin mixture of (A) from 20 to 98% by weight of a polycarbonate resin and (B) from 2 to 80% by weight of a styrenic resin; from 0.1 to 20 parts by weight of (C) an epoxy-modified block copolymer; and from 0.5 to 20 parts by weight of (D) a grafted core/shell rubber elastomer, can be used in moldings which have a good surface layer peeling resistance and a good impact resistance. Further, a flame-retardant polycarbonate resin composition having 100 parts by weight of a resin or resin mixture of (A) from 20 to 100% by weight of a polycarbonate resin and (B) from 0 to 80% by weight of a styrenic resin; from 1 to 30 parts by weight of (E) a flame retardant of an organic phosphorus compound; and from 0.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: April 9, 2002
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Akio Nodera, Naoki Mitsuta