Abstract: A composite panel comprises first and second metallic sheets each having an inner and outer surface, a silicone-based primer coating on the inner surface of the first and second metallic sheets and an organosilicon adhesive contacting the primer coating on both the first and second metallic sheets, wherein the adhesive has a gross heat of combustion (Q-PCS) of no greater than 1.4 MJ/m2. The panel is compliant with specification EN 13501-6:2018, classification A1.

Abstract: The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

Abstract: A composition applied over a resist pattern includes a modified polysiloxane in which some of silanol groups of a polysiloxane containing a hydrolysis condensate of a hydrolyzable silane are capped, and a solvent, wherein a ratio of silanol groups to all Si atoms contained in the modified polysiloxane is 40 mol % or less. The modified polysiloxane ratio of the silanol groups is adjusted to a desired ratio by reacting the silanol groups of the polysiloxane with an alcohol. A method for producing a semiconductor device having the steps of forming a resist film on a substrate, forming a resist pattern by exposing and developing the resist film, applying the composition over the resist pattern during or after development, and reversing a pattern by removing the resist pattern by etching.

Abstract: Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1) (wherein R1 represents an alkyl group; R2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2) (wherein R2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa·s at 25° C.); and (C) a curing catalyst.

Abstract: The thermosetting composition of the present invention comprises 100 parts by mass of an organosilicon compound represented by a general formula (1) and 0.01 to 10 parts by mass of a polymerization initiator having a 10-hour half-life temperature in a range from 80° C. to 130° C. (In the formula (1), R1, R2, R3, R4 and R5 are each, independently, a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, a cycloaralkyl group having 9 to 12 carbon atoms, an aryl group having 6 to 10 carbon atoms or a group having an ethylenically unsaturated group; at least one of R1, R2, R3, R4 and R5 is a group having an ethylenically unsaturated group; R6 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; v, w, x, y and z represent number of moles and are 0 or a positive number; at least one of w and x is a positive number; 0?w/(v+x+y+z)?10 is satisfied.

Abstract: A method of forming a fin-based field-effect transistor device includes forming one or more first fins comprising silicon on a substrate, forming epitaxial layers on sides of the one or more first fins, and removing the one or more first fins to form a plurality of second fins.

Abstract: A passivation layer solution composition is provided. A passivation layer solution composition according to an exemplary embodiment of the present invention includes an organic siloxane resin represented by Chemical Formula 1 below. In Chemical Formula 1, R is at least one substituent selected from a saturated hydrocarbon or an unsaturated hydrocarbon having from 1 to about 25 carbon atoms, and x and y may each independently be from 1 to about 200, and wherein each wavy line indicates a bond to an H atom or to an x siloxane unit or a y siloxane unit, or a bond to an x siloxane unit or a y siloxane unit of another siloxane chain comprising x siloxane units or y siloxane units or a combination thereof.

Abstract: This invention relates to compounds having guanidine groups and containing semi-organic silicon groups, their use for the curing of compounds containing alkoxysilyl groups, compositions comprising the curing catalysts of the invention, and use of the compositions as adhesives and sealants and also as coating materials.

Abstract: A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important.

Abstract: The present invention provides a method of forming a multi-layered coating film including the steps of (1) forming an undercoating film using an undercoating composition (I), and (2) forming a top coating film on the undercoating film after the formation of the undercoating film, the top coating film being formed using an active energy ray-curable top coating composition (II) containing a silsesquioxane compound (a) and a photoinitiator (b), the silsesquioxane compound (a) containing one or more organic groups each directly bonded to a silicone atom, and at least one of the organic groups having one or more urethane bonds and one (meth)acryloyloxy group.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.

Abstract: The present relates to novel organopolysiloxane compositions intended to generate an elastomer foam (or silicone foam) with good mechanical properties and low density low density, i.e. less than 0.35 g/cm3 and preferably less than 0.25 g/cm3.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.

Abstract: A package for a light emitting device includes: a resin portion having a sidewall thereof; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being isolated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer.

Abstract: Provided are a curable composition and its use. The curable composition exhibits excellent processability and workability before curing, and excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness after curing. In addition, the curable composition may provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and does not causing whitening and surface stickiness.

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract: Compounds of the formula where R1 each individually is identical or different and is a hydrocarbon radical, R2 each individually is hydrogen or a methyl radical, n is an integer from 6 to 11, and m is 0 or 1, with the proviso that the sum of the number of carbon atoms in the three radicals R1 in the compound of the formula (I) is 6 to 24, can be admixed with curable polymer compositions to form products with hydrophilic surfaces, or can be applied to surfaces to render them hydrophilic.

Abstract: A polymer (A) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (B) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups.

Abstract: A method of preparing an organopolysiloxane is provided. An organopolysiloxane, which has both a linear or cross-linking structure derived from a trifunctional siloxane unit and a linear structure derived from a difunctional siloxane unit among the molecular structures and also has a sufficiently long linear structure, can be effectively prepared. Also, the organopolysiloxane can be synthesized so that it can have a sufficiently high molecular weight, and a target product showing excellent physical properties can be effectively prepared by minimizing a ratio of a functional group such as an alkoxy group or a hydroxyl group in the synthesized organopolysiloxane.

Abstract: An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.

Abstract: Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers.

Abstract: Compositions for use in microelectronic applications: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; and R1, R2, R3 are independently selected from alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; and R4, R5, R6 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; and R7, R8, R9 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and R10, R11, R12, R13 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.

Abstract: A novel polycrystalline stoichiometric fine SiC fiber substantially free of impurities is produced using a novel pre-ceramic polymer. The pre-ceramic polymer is prepared by reacting a mixture of chlorodisilane, boron trichloride, and a vinyl chlorodisilane with an excess of hexamethyldisilazane to form the pre-ceramic polymer resin, which may then be melt-spun, cured, pyrolyzed and heat-treated to obtain the finished SiC fiber. The manufacturing process for the production of the fine SiC ceramic fiber allows for flexibility with respect to cross-linking, in that low-cost thermal treatments may replace more complex methods, while obtaining fibers with improved materials properties as compared to currently available SiC fibers.

Abstract: The present invention provides an amphiphilic polysiloxane prepolymer which comprises hydrophilic monomeric units derived from at least one hydrophilic vinylic monomer, polysiloxane crosslinking units derived from at least one polysiloxane crosslinker having at least two terminal ethylenically-unsaturated groups, dangling polysiloxane chains each of which is terminated with one ethylenically unsaturated group, and chain-transfer units derived from a chain transfer agent other than a RAFT agent. A prepolymer of the invention is suitable for making hydrogel contact lenses. The present invention is also related to hydrogel contact lenses made from an amphiphilic polysiloxane prepolymer of the invention and to processes for preparing an amphiphilic polysiloxane prepolymer of the invention and for making silicone hydrogel contact lenses.

Abstract: The invention relates to a composition for taking dental impressions, the composition comprising a siloxane component (A) comprising terminal vinyl groups, a siloxane component (B) comprising Si—H groups, a catalyst (C) being able to catalyze a curing reaction between components (A) and (B) and a silicone oil (D), wherein the silicone oil has a viscosity at 23 DEG C of at least about 600,000 mPa*s and is present in an amount from about 1 to about 20 wt.% with respect to the weight of the whole composition. The invention also relates to a method of producing such a composition and a method for adjusting the Shore hardness A of a composition.

Abstract: A polymer and a method of forming a polymer are provided. The polymer has the general structure (I): wherein M is a main group element, a transition metal element, or an organic moiety; X is a main group element selected from S, P, As, Se, Te, and Sb; R1 is a direct bond between M and the ethylene group depicted between M and X or a hydrocarbyl linking moiety having between 1 and about 9 carbon atoms; R2 is a hydrocarbyl moiety; R3 is an organic linking group; Y has a value of 0, 1, 2, 3, or 4; Z has a value of 0, 1, 2, 3, or 4; YY has a value of 0, 1 or 2; and Y, YY, and Z are such that the total number of moieties bonded to M is 3, 4, 5, or 6.

Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.

Abstract: The present invention relates to a process for the manufacturing of continuously shaped cured silicone articles, particularly extrusions articles and the use of silicone compositions containing a photoactivatable metal catalyst in said process, wherein the curing is initiated by visible or UV-light.

Abstract: The present invention relates to a method for preparation of an ultraviolet (UV)-curable inorganic-organic hybrid resin containing about or less than 4% volatiles and less than 30% organic residues. The UV-curable inorganic-organic hybrid resin obtained according to this method can be UV-cured within a markedly very short time and enables, upon curing, the formation of a transparent shrink-and crack-free glass-like product having high optical quality, high thermal stability and good bonding properties. In view of these properties, this hybrid resin can be used in various applications such as electro-optic, microelectronic, stereolithography and biophotonic applications.

Abstract: Disclosed herein is a composition having a thermoset polymer and a plurality of hollow microsphere homogenously dispersed in the composition. The polymer is a cyanate ester thermoset, a phthalonitrile thermoset, a crosslinked acetylene thermoset, or a hydrosilation thermoset. Also disclosed herein is a method of: providing a thermosetting compound; adding microspheres to the thermosetting compound; and mixing the thermosetting compound while initiating crosslinking of the thermosetting compound.

Abstract: An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: (A) a linear organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule; (B) an organopolysiloxane having 2 or more aliphatic unsaturated groups bonded to a silicon atom and 1 or more CF3—(CF2)y—(CH2)z— groups bonded to a silicon atom in one molecule and having a branch structure of a siloxane unit represented by an SiO4/2 and/or an RSiO3/2; (C) an organosilicon compound represented by the following general formula (1); and (D) a platinum group metal-based catalyst.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: Disclosed herein is a composition having a thermoset polymer and a plurality of hollow microsphere homogenously dispersed in the composition. The polymer is a cyanate ester thermoset, a phthalonitrile thermoset, a crosslinked acetylene thermoset, or a hydrosilation thermoset. Also disclosed herein is a method of: providing a thermosetting compound; adding microspheres to the thermosetting compound; and mixing the thermosetting compound while initiating crosslinking of the thermosetting compound.

Abstract: Branched polysiloxanes of formula (I) Ma1MHa2MVia3Db1DHb2DVib3Tc1THc2TVic3Qd??(I) wherein M=[R2R12SiO1/2], MH=[R12HSiO1/2], MVi=[R3R12SiO1/2], D=[R12SiO2/2], DH=[R1HSiO2/2], DVi=[R1R3SiO2/2], T=[R4SiO3/2], TH=[HSiO3/2], TVi=[R3SiO3/2], Q=[SiO4/2], R1 is mutually independently identical or different, linear or branched, saturated or unsaturated hydrocarbon moieties, R2 is mutually independently the same as R1, an alkoxy moiety or a hydroxy group, R3 is mutually independently identical or different, linear or branched, olefinically unsaturated hydrocarbon moieties, R4 is mutually independently R1 or identical or different linear, branched and/or cyclic, saturated or unsaturated hydrocarbon moieties comprising heteroatoms, a1=from 0 to 50, a2=from 1 to 50, a3=from 1 to 50, b1=from 10 to 5000, b2=from 0 to 30, b3=from 0 to 30, c1=from 0 to 50, c2=from 0 to 50 c3=from 0 to 50, d=from 0 to 50, with the proviso that the sum c1+c2+c3+d is greater than or equal to 1, are provided.

Abstract: Silicone fibers suitable for use as optical fibers are prepared by crosslinking an extruded mixture of a silicone resin and an organopolysiloxane, both containing aliphatically unsaturated groups, an organopolysiloxane bearing Si—H groups, and a light activatable trimethyl(methylcyclopentadienyl) platinum catalyst.

Abstract: The present invention is a method for manufacturing a reactive polysiloxane solution, the method comprising: a condensation process for hydrolyzing and copolycondensing a starting compound containing an organosilicon compound having a reactive functional group selected from a (meth)acryloyl group and an oxetanyl group, and also having a siloxane bond-forming group to synthetize a reactive polysiloxane represented by general formula (1); a dissolution process for dissolving the obtained reactive polysiloxane in an organic solvent for water washing; and a washing process for bringing the obtained organic solution and water in contact with each other to remove the water layer from the mixed liquid. The organic solvent for water washing that is used is a compound (e.g., propylene glycol mono butyl ether, 1-pentanol) including a hydroxyl group, having a boiling point at 1 atm of 110° C.-200° C., and a solubility of 10 g or less in 100 g of water at 20° C.

Abstract: Compositions and methods of removing particulate matter from a surface. An example comprises contacting a kneadable dust removal composition with the surface so that the particulate matter adheres or becomes embedded within the composition, and is removed from the surface with the dust removal composition. Preferably the dust removal composition comprises a polymerized siloxane, more preferably a substituted polymerized siloxane, even more preferably, a non-cross-linked, linear polymerized siloxane. In other embodiments the invention comprises a kneadable dust removal composition, preferably comprising a polymerized siloxane. The dust removal composition may be packaged to be attachable to a broom, sweeper, or mop so that it make used to pick up residue from sweeping, brushing or mopping. In other embodiments the dust removal composition may be packaged in a “twist-up” or other similar package permitting the composition to be extruded or advanced to expose a fresh surface.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: Disclosed herein are self-crosslinking compositions containing a hydrosilation catalyst and the reaction product of a mixture comprising (i) a resinous copolymer having both silicon-bonded hydrogen and silanol groups, and (ii) one or more vinyl-functional polyorganosiloxanes. These compositions have stable post-cure adhesive properties and are suitable for use in electronic applications.

Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A phosphosiloxane resin comprises a plurality of covalently bonded monomer units selected from phosphosiloxane units SiR23—O—P(?O)(R1)—(OR3)q(O1/2—)p and organosiloxane units R2m(OR3)nSiO(4-m-n)/2. R1 and each R2 are independently selected from the group consisting of hydrogen, C1 to C10 hydrocarbyl, and C1 to C10 hydrocarbylene; each R3 is independently selected from the group consisting of hydrogen and C1 to C10 hydrocarbyl; p is 0 or 1; q=1?p; m is 0, 1, 2, 3, or 4; n is 0, 1, or 2; and m+n is 0, 1, 2, 3, or 4. Curable silicone compositions comprise a phosphosiloxane resin having greater than one silicon-bonded alkenyl group, an organosilicon compound having at least two silicon-bonded hydrogen atoms, and a hydrosilylation catalyst. Fiber-reinforced free-standing films may comprise fibers dispersed in a cured product of the silicone composition. Laminated substrates comprise at least one fiber-reinforced free-standing film.

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract: The HBP Free-POSS compounds of Formula I are superior to prior HB polymers and linear polymers in space and electronic applications because they have better resistance to electrons, protons and atomic oxygen, have superior out-gassing performance, and are transparent. They are used as coatings, films, adhesives, sealants and elastomers.

Abstract: Compounds of the formula where R1 each individually is identical or different and is a hydrocarbon radical, R2 each individually is hydrogen or a methyl radical, n is an integer from 6 to 11, and m is 0 or 1, with the proviso that the sum of the number of carbon atoms in the three radicals R1 in the compound of the formula (I) is 6 to 24, can be admixed with curable polymer compositions to form products with hydrophilic surfaces, or can be applied to surfaces to render them hydrophilic.

Abstract: A curable silicone composition for sealing an optical semiconductor element, comprising: (A) an organopolysiloxane that has at least two silicon-bonded vinyl groups in one molecule, that has C1-10 alkyl for the other silicon-bonded organic groups therein, and that lacks a siloxane unit represented by the following formula: SiO4/2; (B) an organopolysiloxane represented by an average unit formula; (C) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule, that has C1-10 alkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass % of silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst, wherein a viscosity at 25° C. and a viscosity at 100° C. of this composition lacking component (D) reside in a specific relationship, can efficiently perform resin sealing by transfer molding or compression molding while exhibiting an excellent moldability and can provide a cured product that has a low surface tack.

Abstract: Silicone elastomers exhibiting high breakdown voltage and improved static decay characteristics are prepared from a crosslinkable silicone composition containing an ethylenically unsaturated polyoxyalkylene polyether which becomes chemically bonded into the elastomer during cure.

Abstract: Self-adhesive crosslinkable silicone compositions may be transparent and prepared without conventional adhesion promoters, and contain (1) an organopolysiloxane having a minimum of two aliphatically unsaturated carbon-carbon bond-containing groups, (2) a pendant Si—H functional organopolysiloxane having at least 3 Si—H groups and a minimum of 0.7 weight percent of Si-bonded hydrogen, and (3) a linear organopolysiloxane bearing terminal Si—H groups, wherein the mol ratio of silicon-bonded hydrogen in (2) to that in [(2) and (3)] is from 0.05 to 1.