Abstract: The invention relates to silicic acid (hetero) polycondensates consisting of at least one silane that has a group bonded to silicon by a carbon atom and that carries an organically polymerisable C?C double bond, and at least one silane that has a group bonded to silicon by a carbon atom and that carries a sulphonate group or a sulphate group of the formula —(O)d-SO3M wherein d=0 or 1 and M=hydrogen, or a monovalent metal cation, or the corresponding quantity of a polyvalent metal cation, yet not including polycondensates in which the C?C double bonds are formed exclusively by methacrylic esters that are bound, in the form of a methylene acryl ester group, to the groups bonded to silicon by carbon. The invention also relates to composites that consist of such silicic acid (hetero) polycondensates in combination with fillers, and to polymers produced by organically polymerising the C?C double bonds in the polycondensates or composites.

Abstract: The present invention relates to a curable organopolysiloxane composition, which comprises: (A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4; (B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)M.(R4R5SiO2/2)D.(R6SiO3/2)T.

Abstract: A transparent siloxane resin composition for optical applications is provided including: (1) a vinyl-oligosiloxane hybrid prepared by a non-hydrolytic condensation reaction of an organoalkoxysilane having a vinyl group or a mixture of an organoalkoxysilane having a vinyl group and a metal alkoxide with an organosilanediol; (2) an organohydrosilicone compound having two or more silicon-bonded hydrogen atoms; and (3) a metal catalyst. The resulting transparent siloxane resin exhibits excellent light transmittance, light resistance and heat resistance, has refractive index and hardness suitable for optical applications, including optical devices, displays, LEDs or the like, and experiences little contraction during processing.

Abstract: A curable resin composition, comprising 100 parts by mass of a (meth)acrylic polymer (A) having, at a terminal thereof, at least one crosslinkable silyl group; 0.1 to 100 parts by mass of a diamine compound (B) having a monovalent or bivalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched and having at least one primary amino group; and 0.1 to 100 parts by mass of a diamine compound (C) having a monovalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched, and having a crosslinkable silyl group and/or a (meth)acryloyl group.

Abstract: Provided is a silicon-containing curable composition which includes a prepolymer (A) containing two or more Si—H groups in one molecule, which is obtained by subjecting one or more kinds of a cyclic siloxane compound (?) represented the following formula (1) and one or more kinds of a compound (?) represented by the following formula (2), to a hydrosilylation reaction; a cyclic siloxane compound (B) containing, in one molecule, two or more carbon-carbon double bonds that are reactive with Si—H groups; a polysiloxane compound (C) which is different from the prepolymer (A) and the cyclic siloxane compound (B); and a hydrosilylation catalyst (D). In formula (1), R1 to R3 each represent an alkyl group having 1 to 6 carbon atoms, or a phenyl group; a represents a number from 2 to 10; and b represents a number from 0 to 8. In formula (2), n represents the number 1 or 2.

Abstract: An apparatus for forming a silicone article is disclosed. The apparatus includes an pumping system to deliver the silicone formulation to a die, the silicone formulation having a viscosity of less than about 2,000,000 centipoise; the die having a distal end, a proximal end, and a channel there between, wherein the silicone formulation flows through the channel of the die; and a source of radiation energy, wherein the radiation energy substantially cures the silicone formulation as the silicone formulation flows out the channel of the die to form the silicone article. The present disclosure further includes a method of forming the silicone article, a silicone tube, and a silicone extrudate.

Abstract: Methods and systems are provided for a dry silicone gel in a closure or interconnect system. The dry silicone gel may be made by reacting a crosslinker, a chain extender, and a vinyl-terminated polydimethylsiloxane. The reaction may be conducted in the presence of a catalyst. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C.

Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.

Abstract: A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of a terpolymer obtainable via copolymerization of (B1) from 1 to 70% by weight of at least one electron-deficient olefin, (B2) from 0 to 85% by weight of at least one olefin which, at its olefinic double bond, bears only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, and (B3) from 1 to 99% by weight of at least one alkoxyvinylsilane, C) from 0 to 50% by weight of a fibrous or particulate filler or a mixture of these, D) from 0 to 50% by weight of other additives, where the total of the percentages by weight of components A) to D) is 100%.

Abstract: The present invention relates to a photocurable polyethylene glycol silsesquioxane, a polyethylene glycol silsesquioxane network prepared therefrom, an anti-biofouling device including the polyethylene glycol silsesquioxane network, and a method of preparing a nanopattern. The polyethylene glycol silsesquioxane network has a high anti-biofouling property, low viscosity, high optical transparency, good hydrophilicity, high resistance to swelling in organic solvents/aqueous solutions, high stability under biological, chemical, and thermal stress, and high mechanical strength, and can be useful in a wide range of biomedical devices because it enables the manufacture of micro-nanopatterns.

Abstract: The application provides a terpolymer obtainable by copolymerizing (A) 1% to 70% by weight of at least one electron-deficient olefin, an example being an anhydride of a monoethylenically unsaturated C4 to C6 dicarboxylic acid, (B) 1% to 85% by weight of at least one olefin which on its olefinic double bond carries only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, an example being an isobutene homopolymer or copolymer having a number-average molecular weight of 100 to 500 000, and (C) 1% to 70% by weight of at least one alkoxyvinylsilane, and also derivatives of this terpolymer that are obtainable by modification or crosslinking.

Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R22SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.

Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.

Abstract: A silicone acrylate hybrid composition includes the reaction product of a silicon-containing pressure sensitive adhesive composition, an ethylenically unsaturated monomer, and an initiator. The silicon-containing pressure sensitive adhesive composition includes acrylate or methacrylate functionality. A method of making the hybrid composition includes polymerizing the ethylenically unsaturated monomer and the silicon-containing pressure sensitive adhesive composition in the presence of the initiator.

Abstract: The present invention is a method for producing solvent-soluble polysiloxanes which includes a condensation process of subjecting a raw material having siloxane-bond-forming groups to hydrolytic copolycondesation in the presence of a catalyst to synthesize a reactive polysiloxane represented by general formula (1), the raw material containing both an organosilicon compound (S1) having a (meth)acryloyl group and siloxane-bond-forming groups and at least one silicon compound (S2) selected from among tetraalkoxysilanes and tetrahalogenosilanes, wherein in the condensation process, the organosilicon compound (S1) and silicon compound (S2) are used at a (S2)/(S1) molar ratio of 1.

Abstract: An organopolysiloxane having a main chain composed of the following repeating units (I), 2 to 199 side chain units (II) and 1 to 50 crosslinkage units (III) per 100 SiO units in the main chain, provided that the organopolysiloxane has at least 2, on average, crosslinkage units (III):

Abstract: Provided are poly(ferrocenyl)silane based network polymers, methods of preparing the same, and films including the poly(ferrocenyl)silane based network polymers. The network polymers have a steric network structure and are prepared by using a simplified process.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.

Abstract: The invention relates to hydrophilized curable silicone compositions which contain organopolysiloxanes, hydrophilizers and at least one stabilizing phosphorous compound. The compositions are particularly suitable as curable impression materials in dental applications, especially as wash impression materials.

Abstract: Provided are inorganic-organic block copolymers that self assemble without the addition of a precursor. The inorganic block of the polymers includes silicon and the organic block may be any organic polymer. The inorganic-organic block copolymers self assemble to form a material in which the inorganic polymer block may be crosslinked to produce an organosilicate and/or silica matrix, and further thermal curing of the matrix results in the formation of a porous nanostructured film.

Abstract: A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.

Abstract: Methods employing acidic and basic catalysts are disclosed, and generally entail hydrolysis and condensation reactions of silicon based components. The methods are useful for forming siloxane-modified metal-oxide nanoparticles, such as modified ZrO2 nanoparticles. The siloxane-modified metal-oxide nanoparticles, and products including the siloxane-modified metal-oxide nanoparticles, can be used to form various products, such as lenses or encapsulants for making various devices, such as, but not limited to, light emitting diodes (LEDs).

Abstract: A process is disclosed for making an aqueous emulsion of a silicone polyether having a viscosity greater than 10 kPa-s at 25 QC by combining; an SiH terminated silicone polyether copolymer having an HLB of less than 7, an organopolysiloxane having terminal unsaturated groups, a hydrosilylation catalyst, and an emulsifier to form an oil phase, and then admixing water to the oil phase to form an emulsion.

Abstract: Described herein are silicone fluids and silicone materials that posses high glass transition temperatures (Tgs) when compared to conventional silicone materials. In one embodiment, an increased Tg allows the formation of objects and materials by cryogenic lathing. The fluids and materials can be formed by curing silicone fluid with a cross-linker mixture comprising a cross-linker and a monofunctional hydride compound. Upon formation, the silicone materials can be extracted over long periods of time without loss of optical quality. The silicone materials can be sufficiently soft allowing folding and insertion through small incisions in the eye. Additionally, methods of forming optical silicone materials, lenses and silicone materials in general are also disclosed. In one embodiment, the method of forming a silicone based lens using cryogenic lathing techniques is described.

Abstract: A curable silicone gel composition that is of low viscosity, exhibits good fluidity, and generates a silicone gel that exhibits good resistance to external stress and thermal stress. The composition includes (A) a specific organopolysiloxane having at least two alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having a specific branched main chain structure, containing at least three SiH groups within each molecule, and also containing at least one branch-forming unit within each molecule, and (C) a platinum-based catalyst, wherein the cured product has a penetration value of 10 to 200, and loss coefficient values at 25° C. for shear frequency values of 1 Hz and 10 Hz of 0.1 to 1.0 and 0.3 to 1.5 respectively.

Abstract: Gels having viscoelastic qualities, physical stability and adhesive properties, well suited for a wide variety of end applications, are prepared by crosslinking, by hydrosilylation, silicone compositions which contain: a polyorganosiloxanes POS (I) of SiH type; a polyorganosiloxanes POS (II) of SiVi type (Vi=vinyl); a polyorganosiloxanes POS (III) of monofunctional SiVi type; a platinum-based catalyst (D); and optionally, a polyorganosiloxanes POS (IV) of polydimethylsiloxane type.

Abstract: PROBLEM TO BE SOLVED To provide an ophthalmic lens, which can be more safely worn, that is, to provide a material, which is transparent and has high oxygen permeability and a high hydrophilic property, and to provide a novel monomer to be a raw material thereof. SOLUTION A hydrophilic polysiloxane macromonomer contains polyoxyethylene as a hydrophilic side chains in a polysiloxane main chain, wherein transparency, oxygen permeability, and hydrophilic properties of the material are controlled by regulating the length of the polysiloxane main chain, the length of the hydrophilic polyoxyethylene side chains, and the number of the side chains.

Abstract: Hydrophilic silicone copolymers are the addition polymerization product of an unsaturated silicone macromer, and unsaturated polyoxyalkylene polyether, and optionally further unsaturated addition polymerizable monomers.

Abstract: A positive type photosensitive resin composition for forming patterned resin film is provided. The patterned resin film has high transparency, low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and excellent adhesive properties with the substrate, which is obtained by developing with an alkali solution. The positive type photosensitive resin composition contains copolymer of compound of formula (I) and 1,2-quinonediazido compound, or further mixes with other alkali-soluble polymers, in formula (I), R1 is hydrogen or alkyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine; and R2, R3 and R4 are independently hydroxyl group, alkyl group having 1-5 carbon atoms, alkoxyl group having 1-5 carbon atoms or —O(Si(ClH2l+1)2O)mSi(CpH2p+1)3, 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.

Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:

Abstract: A silicon composition with a silicon compound represented by Formula 1 and a silicon compound represented by Formula 2: wherein, R1, R2, R3, R4, R11, R12, R13, R14, R15, R16, R17, R18, and R19 are each independently a C1-C4 alkyl group, R5, R6, R7, R8, R9, and R10 are each independently hydrogen or deuterium, k, m, and n are positive integers, and the ratio of k to the sum of m and n is from about 1:0.001 to about 1:0.2; and an organic light emitting device including the same.

Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.

Abstract: The moisture and gas barrier properties of an organopolysiloxane having at least two substituents which are able to undergo crosslinking reactions per molecule shall be improved. This is achieved by providing an organopolysiloxane wherein at least 10 mol % of all substituents are represented by formula (1) wherein q is an integer from 0 to 5 and R1, R2, R3 each independently are methyl or ethyl groups. Furthermore, the invention is directed to a composition based on the aforementioned organopolysiloxane and to the use of the organopolysiloxane and of the composition.

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract: A dispersion includes dispersed particles. The particles include a reaction product of a first polymer, a second polymer, and a chain terminator. The first and second polymers have at least two Si—H moieties and silicon bonded unsaturated moieties, respectively. The chain terminator has one Si—H moiety or one unsaturated hydrocarbon moiety. The first and second polymers and the chain terminator are reacted in the presence of a metal catalyst. The dispersion is formed by a method that includes the step of combining the first and second polymers, and the chain terminator. This method also reacts the first and second polymers and the chain terminator in the presence of the metal catalyst to form the dispersed particles.

Abstract: Provided is a process for making a saturated star hydrocarbon polymer. The process has the following steps: (A) hydrosilylating tetraethylene silicon with methyldichlorosilane in the presence of a hydrosilylating catalyst to form a chlorosilane dendrimer; (B) reacting the chlorosilane dendrimer with vinylmagnesium bromide in the presence of a lithium and/or organolithium initiator stepwise to build a higher generation chlorosilane dendrimer; (C) anionically polymerizing polybutadiene in the presence of a lithium and/or organolithium initiator to form living poly(butadienyl)lithium; (D) attaching the living poly(butadienyl)lithium to the higher generation dendrimer to form a star polybutadiene; and (E) hydrogenating the star polybutadiene to form the saturated star hydrocarbon polymer. There is also provided a saturated star hydrocarbon polymer made according to the above process and a polymer composition of a matrix ethylene polymer and the saturated star hydrocarbon polymer.

Abstract: A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.

Abstract: Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.

Abstract: The present curable composition comprises an organosilicon compound produced by hydrolysis copolycondensation of (A) a silicon compound R0Si(R1)nX13-n [wherein R0 represents a (meth)acryloyl group; and X1 represents a hydrolyzable group] and (B) a silicon compound SiY14 [wherein Y1 represents a siloxane-bond forming group] under an alkaline condition at a ratio of compound (A) to compound (B) of 1:(0.3 to 1.8) by mol. The present process for producing an organosilicon compound comprises a reaction process of conducting alcohol exchange reaction of a silicon compound SiY24 [wherein Y2 represents a siloxane-bond forming group] in 1-propanol to produce a composition; and a condensation process of adding a silicon compound R0Si(R1)nX23-n [wherein R0 represents a (meth)acryloyl group; and X2 represents a hydrolyzable group] to the composition to perform the hydrolysis copolycondensation of the silicon compounds under alkaline conditions.

Abstract: Low molecular weight siloxane materials having one functional group are provided which have reduced tendency to form phase separated domains after polymerization. Two classes of siloxane materials are included: (1) symmetric siloxane macromonomers containing at least two monomer termini and one polymerizable functional group which is equidistant from the termini, and (2) assymetric siloxane macromonomers having at least one polymerizable functional group terminus and at least one oxygen-containing polar hydrophilic terminus selected from the group consisting of hydroxyl, ether, and polyether. Symmetric siloxane macromonomers having hydroxyl termini are useful for forming biocompatible materials, such as for contact lenses, tissue regeneration scaffold polymers, and coatings to reduce non-specific binding of proteins.

Abstract: A borosiloxane composition comprising a borosiloxane having an average of at least two alkenyl groups per molecule, an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, and a hydrosilylation catalyst; a borosiloxane adhesive comprising a cured product of at least one borosiloxane; and a coated substrate and a laminated substrate, each comprising the borosiloxane adhesive.

Abstract: A curable composition contains (A) a polyorganosiloxane base polymer having an average per molecule of at least two aliphatically unsaturated organic groups, optionally (B) a crosslinker having an average per molecule of at least two silicon bonded hydrogen atoms, (C) a catalyst, (D) a thermally conductive filler, and (E) an organic plasticizer. The composition can cure to form a thermally conductive silicone gel or rubber. The thermally conductive silicone rubber is useful as a thermal interface material, in both TIM1 and TIM2 applications. The curable composition may be wet dispensed and then cured in situ in an (opto)electronic device, or the curable composition may be cured to form a pad with or without a support before installation in an (opto)electronic device.

Abstract: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.

Abstract: A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.

Abstract: The general field of the invention is that of airbags. The invention relates to a process for improving the tear strength and the combing strength of coated fabrics intended for uses in the field of inflatable bags using a silicone composition comprising an additive containing a polyorganosiloxane resin (V) and a calcium carbonate. After coating the composition onto the fabric supports and curing, the coated supports not only have optimum adhesion and crease resistance properties, but also have good properties in terms of combing strength and tear strength.

Abstract: Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same.

Abstract: A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two silanol groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without having an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation retarder.