Abstract: A silicone rubber sponge emulsion composition comprising (A) (a) a liquid diorganopolysiloxane having at least two alkenyl groups per molecule, or a paste-like mixture of (a) a liquid diorganopolysiloxane having at least two alkenyl groups per molecule and (d) a reinforcing filler, (b) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (c) a platinum catalyst, (B) an aqueous solution of a water-soluble polymer, and (C) an emulsifying agent; its production; and production of silicone rubber sponge, wherein silicone rubber sponge is obtained by curing the composition into a molding and heating the molding.

Abstract: Polymers are described that are prepared from di and mono-functional silicone and silane monomers of Formula 1 in which Y represents a direct bond or a oxy group; R1 represents an optionally substituted organo group with at least one double bond which optionally may be an activated unsaturated moiety such as a (meth)acrylate group: for example 1-n-propoxy(acrylate) or ethenyl; and R2 and R3 each separately, and independently within each optional repeat unit, represent an optionally substituted hydrocarbo, hydrocarbo(oxy), hydrosilico and/or hydrosilico(oxy) groups; or example, methyl; or trimethylsiloxy; R4 independently represents an optionally substituted organo group with at least one double bond (such as R1 above) an optionally substituted hydrocarbo, and/or hydrosilico group for example trimethylsilyl or ethenyl; and n is from about 0 to about 2000; preferably from about 1 to about 100, for example n is 1.

Abstract: A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important.

Abstract: A silicone rubber composition, which comprises 100 parts by weight of a vinyl group-introduced methylfluoroalkylvinyl-based silicone rubber obtained by copolymerization of a dimethylsiloxane copolymerization unit as the main component with 5-50% by mole of a methylfluoroalkylsiloxane copolymerization unit, and 0.2-8 parts by weight of an organic peroxide. When silica is used as a filler, it is desirable to use a surfactant for silica, and water at the same time. The present silicone rubber composition can give distinguished low-temperature characteristics and blister resistance, and thus can be used for seal materials directed to high-pressure hydrogen gas storage tanks, for example, to storage under 70 MPa, and particularly as suitable vulcanization-molding materials for O-rings, packings, gaskets, oil seals, valves, etc. High-pressure gases for storage are not limited only to hydrogen gas, but also to oxygen gas, nitrogen gas, helium gas, etc. likewise.

Abstract: Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, —S—R3 (where R3 represents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.

Abstract: A compound having the formula. Each R is methyl or phenyl; R2 comprises one or more of silane, siloxane, and aromatic groups; n is a nonnegative integer; and m is 1 or 2. The dashed bond is a single bond and the double dashed bond is a double bond, or the dashed bond is a double bond and the double dashed bond is a triple bond. A polymer made by a hydrosilation reaction of a polyhedral oligomeric silsesquioxane having pendant siloxane groups with an acetylene- and silicon-containing compound having at least two vinyl or ethynyl groups, and a crosslinked polymer thereof. The reaction occurs between the pendant siloxane groups and the vinyl or ethynyl groups.

Abstract: This invention relates to a silicone pressure-sensitive adhesive composition including: (A) a polydiorganosiloxane composed of a linear polydiorganosiloxane (A1) having two or more alkenyl groups within each molecule and a linear polydiorganosiloxane (A2) having SiOH groups at terminals thereof and no alkenyl groups, which is represented by the formula R22(HO)SiO—(R22SiO)d—SiR22(OH), wherein d represents an integer satisfying 500?d?20,000; (B) a polyorganosiloxane including R33SiO1/2 units, SiO2 units and Si atom-bonded hydroxyl group-containing units; (C) a polyorganohydrogensiloxane having three or more SiH groups within each molecule; (D) a reaction retarder; (E) a platinum group metal-based catalyst; and (F) a metal compound represented by formula MYx, wherein the polyorganosiloxane (B) is condensed with the linear polydiorganosiloxane (A2). The composition exhibits powerful adhesive strength to silicone rubbers and is useful for, by example, producing a pressure-sensitive tape.

Abstract: An object of the invention is to provide an optical element for use in an optical information recording and reproducing device or a like device for recording or reproducing information with respect to an information recording medium using laser light, wherein the optical element is a resin optical element capable of suppressing lowering in transmittance due to deterioration by irradiation of light having a high energy density, and maintaining a high transmittance for a long time. To realize the above object, used is an optical element made of a silicon resin cured material obtained by subjecting a silicon resin composition containing a silsesquioxane compound to a curing treatment.

Abstract: A polyether siloxane of formula (I) R1—Si(CH3)2—O—[—Si(CH3)2—O—]n—[—Si(CH3)R—O—]m—Si(CH3)2—R2??(I) where R, R1 and R2 are the same or different, R in each occurrence is the same or different and represents —(CH2)x—O—(CH2—CR?R?—O)y—R??, R? and R? are the same or different and each represent —H, —CH3, —CH2CH3 or phenyl, R?? represents —H, alkyl or acyl, R1 and/or R2 each represent methyl or R, wherein the alkylene oxide units (CH2—CR?R?—O) within a polyether residue R can be the same or different and the polyether residues R within a polyether siloxane molecule of formula (I) can be the same or different, wherein on average (number average, averaged over all compounds of formula (I)) n+m+2=>10 to 200, m=0 to 40 for R1 and/or R2 representing R or m=1 to 40 for R1 and R2 representing —CH3, x=2 to 10, y=1 to 50, at least 25% of the R?? radicals represent hydrogen and at least 50% of all polyether residues R which have an end group R??=—H have a secondary or tertiary OH end group.

Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.

Abstract: A photocrosslinkable composition has polyorganosiloxane P having a viscosity of at least 10 000 mPa·s at 25° C., wherein the polyorganosiloxane P has an acrylated silicone oil as a crosslinking agent, and a photoinitiator, the chemical structure of which comprises a diaryl ketone group.

Abstract: The present invention relates to a composition for a thermosetting silicone resin, the composition including: (A) an organohydrogenpolysiloxane; (B) an alkenyl group-containing epoxy compound; (C) an alkenyl group-containing cyclic siloxane; and (D) a hydrosilylation catalyst, a thermosetting silicone resin composition obtained by reacting the composition and a production method thereof, a photosemiconductor element-encapsulating material including the thermosetting silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the resin composition or the photosemiconductor element-encapsulating material.

Abstract: A pattern-forming method includes forming a silicon-containing film on a substrate, the silicon-containing film having a mass ratio of silicon atoms to carbon atoms of 2 to 12. A shape transfer target layer is formed on the silicon-containing film. A fine pattern is transferred to the shape transfer target layer using a stamper that has a fine pattern to form a resist pattern. The silicon-containing film and the substrate are dry-etched using the resist pattern as a mask to form a pattern on the substrate in nanoimprint lithography. According to another aspect of the invention, a silicon-containing film includes silicon atoms and carbon atoms. A mass ratio of silicon atoms to carbon atoms is 2 to 12. The silicon-containing film is used for a pattern-forming method employed in nanoimprint lithography.

Abstract: Crosslinkable compositions containing a crosslinkable organosilicon compound; a silica filler; a silicate or halogen analog thereof, a non-silicate resin-forming monomer; and a solid blowing agent containing intercalated liquid or liquid of crystallization, produce uniform foams of good pore structure, with firm adhesion to substrates, with water repellency and water vapor permeability, and with high elongation and low compression set, and are suitable for use in applications where foamed chloroprene rubber has been used, and in other applications as well.

Abstract: A curable organopolysiloxane composition comprising: (A) a solvent-soluble organopolysiloxane obtained by conducting a hydrosilylation reaction between (i) an organopolysiloxane represented by the following average structural formula: RaSiO(4-a)/2 (wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, the content of alkenyl groups in all groups represented by R1 is within the range of 0.

Abstract: The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, a hydroxy group, R3SiCH2— and R3SiO—, wherein R is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, and a hydroxy group, m is an integer of 1 to 100, and n is an integer of 1 to 100, and wherein at least two out of R1's and R's are an alkenyl group.

Abstract: The present invention has an object to provide a polysiloxane which is a liquid substance having low viscosity, is excellent in curing workability, and has excellent heat resistance in an obtained cured material, and to a production method of a cured material using the polysiloxane. Specifically disclosed is a polysiloxane which is obtained by hydrolysis and polycondensation of a silicon compound having three hydrolyzable groups, a silicon compound having two hydrolyzable groups and a silicon compound having one hydrolyzable group, and is characterized by containing a hydrosilylatable carbon-carbon unsaturated group, a hydrosilyl group and an alkoxysilyl group, and having a number average molecular weight of 500 to 20,000.

Abstract: Disclosed are low temperature, moisture curable coating compositions, related coated substrates, and methods for coating a substrate. The coating compositions include an ungelled, secondary amine-containing Michael addition reaction product of reactants including a compound comprising more than one site of ethylenic unsaturation, and an aminofunctional silane.

Abstract: Provided is an addition-curable silicone composition including A: a diorganopolysiloxane having a structure represented by a formula (1): (R1)(R2)2SiO((Ar)2SiO)nSi(R2)2(R1) (where R1 represents an aliphatic unsaturated group, R2 represents identical or different, unsubstituted or substituted monovalent hydrocarbon groups, Ar represents identical or different, unsubstituted or substituted aryl groups that may or may not contain a hetero atom, and n represents an integer of 1 or greater), B: an organosilicon compound containing at least two hydrogen atoms bonded to silicon atoms per molecule, and containing no aliphatic unsaturated groups, in an amount that is sufficient to cure the composition in the presence of the hydrosilylation catalyst described below, and C: a platinum group metal-based hydrosilylation catalyst.

Abstract: A core-shell particle is formed by a method that includes forming a crosslinked polyorganosiloxane core, reacting a graftlinking agent with the crosslinked polyorganosiloxane core, and polymerizing a poly(alkenyl aromatic) shell around the graftlinking agent-functionalized polyorganosiloxane core. The method produces a core-shell particle with improved adhesion between shell and core. The core-shell particle is useful as an impact modifier in thermoplastic compositions.

Abstract: Disclosed are a composition including a silane-based organic/inorganic hybrid material having a multiple bond and one or more organic metal compounds and/or one or more organic polymers, an organic insulator including the composition, an organic thin film transistor (OTFT) including the organic insulator and an electronic device including the OTFT. The organic insulator including the composition for preparing an organic insulator has increased charge mobility and an increased on/off current ratio, thus exhibiting improved properties, and the organic thin film transistor manifests uniform properties due to the absence of hysteresis.

Abstract: The present invention relates to polysiloxane nanoparticles have the following properties: an average particle size d50 (measured using REM recordings) in the range of 10-200 nm, a specific surface area Ao of at least 50 m2/g, a pore volume of at least 0.2 cm3/g, an average pore volume d50 of at least 0.8 mn, whereas the particles have groups that contain carbon, which groups are bonded to the silicon at least partially in the form of unsubstituted or substituted alkyl, alkenyl, aryl, arylalkyl, or alkylaryl groups.

Abstract: An optical gel member to be used in a gap between light-emitting diode which is a backlight light source of an optical device and light guide plate, as well as an assembling method for an optical device and an optical device using the same. The optical gel member etc. to be used in an interposed state between light guide plate and light-emitting device consisting of a light-emitting diode (LED) in an optical device, characterized by satisfying the following requirements (i) to (iii). (i) The optical gel member consists of a transparent gel such as silicone type gel or acryl type gel, which has a hardness of 0 to 80 in JIS-A hardness according to JIS K6253, or 20 to 200 in penetration (25° C.) in accordance with JIS K2207; (ii) The optical gel member is in a string-like form, and the peripheral surface thereof is in contact with light guide plate and light-emitting device; (iii) The optical gel member has a repulsive force of 12 MPa or less at a compression rate of 30%.

Abstract: A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with the heat stable cured aryl polysiloxane are further disclosed.

Abstract: Thin films are disclosed that are suitable as thin films in IC's and for other similar applications. In particular, the invention concerns thin films comprising compositions obtainable by hydrolysis of two or more silicon compounds, which yield an at least partially cross-linked siloxane structure. The invention also concerns a method for producing such films by preparing siloxane compositions by hydrolysis of suitable reactants, by applying the hydrolyzed compositions on a substrate in the form of a thin layer and by curing the layer to form a high silicon content film.

Abstract: Provided is a curable polyorganosiloxane composition which advantageously forms a cured product suitable for LED or optical lens, wherein the cured product has excellent light transmission properties in a short wavelength region, i.e., in the blue to ultraviolet region and is unlikely to suffer yellowing due to exposure to heat.

Abstract: This invention relates to a novel class of Dimer Alkyl Silicone Polymers (DASP) and their use to provide conditioning to skin and hair. By conditioning is meant a elegant smooth skin feel, eliminating dryness and raspiness. It is thought the mechanism of action is related to the fact that the DASP compounds reduce surface tension of personal care products, providing outstanding conditioning and skin feel. The improved conditioning composition based upon a very specific class of dimer alkyl silicone polymers (DASP) that despite their solubility in oil, lower surface tension and improve conditioning of personal care products.

Abstract: The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.

Abstract: Perfluoropolyether compositions are provided comprising: (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units —CaF2aO— in its backbone, and having a molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.

Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.

Abstract: The present invention provides a polyurethane which is non-sticky, exhibits superior handling properties and superior moldability, and has superior adhesive properties with silicones even if a surface activation treatment is not carried out beforehand. The polyurethane of the present invention contains polyol units and organic polyisocyanate units. The polyol units contain an alkenyl group-containing organopolysiloxane structure in an amount ranging from 0.01 to 20% by weight with respect to the weight of the aforementioned polyurethane.

Abstract: Gel compositions containing a silicone elastomer from the reaction of an organohydrogensiloxane having at least two SiH containing cyclosiloxane rings in its molecule, a compound having at least two aliphatic unsaturated hydrocarbon groups in its molecule, and a hydrosilylation catalyst. The silicone elastomer reaction product may itself be a gelled composition, or optionally may be contained in a carrier fluid to form a gel. The gel compositions may further contain a personal or healthcare active. The actives may be incorporated into the gel via either a pre or post load method.

Abstract: The present invention relates to a process for the manufacturing of continuously shaped cured silicone articles, particularly extrusions articles and the use of silicone compositions containing a photoactivatable metal catalyst in said process, wherein the curing is initiated by visible or UV-light.

Abstract: A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.

Abstract: The invention relates to crosslinkable or crosslinked silicone compositions capable of being used to form a water-repellent and release coating for a flexible support made of paper or of polymer, in particular a heat-sensitive flexible support. These compositions are of the type of those comprising crosslinking polyorganosiloxanes carrying SiH units and unsaturated, preferably vinylated, polyorganosiloxanes capable of reacting with the crosslinking agent by polyaddition in the presence of platinum to form the release crosslinked coating on the flexible support. The targeted aim is to make possible the instantaneous crosslinking at low temperature (85-90° C.) of such silicone compositions coated on flexible supports at a very high speed. To achieve this aim, the invention provides for the use of specific crosslinking agents composed of POSs hydrogenated at the chain end and in the chain.

Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:

Abstract: A hardener for silicone rubber materials comprising a silane compound which comprises a 2-hydroxy-propionic acid alkyl ester radical.

Abstract: Disclosed herein is a surface functionalized poly(dimethylsiloxane) (PDMS) and methods for making the same. The surface functionalized PDMS disclosed herein is applicable in the general field of microfluidics, bioMEMS (bio-microelectromechanical systems), soft lithography, and other related biotechnology fields.

Abstract: A thermoset and method of making such by crosslinking a mixture of a polyhedral oligomeric silsesquioxane having pendent siloxane groups or unsaturated carbon bonds and a siloxylcarborane compound having unsaturated carbon bonds.

Abstract: Silicone composites subject to reticulation or reticulated, particularly for creating a coating or water-repellent and anti-adhesive film for flexible substrates such as paper or similar in the form of natural or synthetic polymer films. These compounds contain reticulating polyorganosiloxanes that have SiH units and unsaturated polyorganosiloxanes, preferably vinylated, suitable for reacting with the reticulating agent in an addition reaction and in the presence of platinum to form the reticulated anti-adhesive coating on the flexible substrate, plus at least one additive (D) to promote adhesion to it.

Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperature sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.

Abstract: A hot melt sealant/adhesive composition is provided which comprises the following components—Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c); and either or both of components B. and C. wherein: —B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200° C.; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from 0° C. and 150° C.; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition.

Abstract: Carbosilane-containing polymers (including oligomers) having the following structural features: greater than one repeat unit; at least four Si-arylene bonds; at least one (meth)acrylate moiety, Si—H moiety, or both; no Si—O bonds; preferably at least four silicon atoms; wherein two silicon atoms are separated by one arylene group in each repeat unit.

Abstract: The present invention provides a silicone resin lens obtained by molding and curing a silicon resin composition into a lens, wherein the lens has a refractive index at 400 nm of 1.5 or more, a ratio of a refractive index at 400 nm to a refractive index at 596 nm of 1.01 or more, an Abbe's number of 45 or more, and an absolute value of a differential of refractive indexes against temperatures, dn/dT, of 250×10?6/degrees C. or less. Further, the present invention provides a method for preparing the silicone resin lens according to any one of claims 1 to 4, wherein the silicone resin lens is prepared in conditions where a ratio of a molding shrinkage ratio found after subjecting the silicone resin composition to post-cure to a molding shrinkage ratio found after subjecting the silicone resin composition to molding is 0.8 to 1.2.

Abstract: A synthetic process for polyhedral oligomeric silsesquioxanes (POSS) and polyhedral oligomeric silicates (POS) produces silanol and siloxide molecules containing both olefinic groups and alkyl or aromatic groups. Olefin-bearing POSS silanol/siloxides are derivatized into a variety of chemical species while retaining the ability to further derivatize the silanol/siloxide.

Abstract: A compound having the formula below. Each R is methyl or phenyl; R2 comprises one or more of silane, siloxane, and aromatic groups; n is a nonnegative integer; and m is 1 or 2. The dashed bond is a single bond and the double dashed bond is a double bond, or the dashed bond is a double bond and the double dashed bond is a triple bond. A polymer made by a hydrosilation reaction of a polyhedral oligomeric silsesquioxane having pendant siloxane groups with an acetylene- and silicon-containing compound having at least two vinyl or ethynyl groups, and a crosslinked polymer thereof. The reaction occurs between the pendant siloxane groups and the vinyl or ethynyl groups.

Abstract: An addition-curable silicone composition is provided. The composition includes (A) a resin structure organopolysiloxane and (B) a platinum group metal-based catalyst. The component (A) has silicon-bonded alkenyl groups and hydrosilyl groups, and includes a structure in which R22SiO units, wherein R2 is a methyl group, etc., are connected together in a continuous repeating sequence, and the number of units in the continuous repeating sequence is within a range from 5 to 300. The composition can be prepared in a solid or semisolid form, and hence is suitable conventional molding apparatus such as a transfer molding apparatus, and upon curing, forms a hard resin cured product that exhibits excellent flexibility and minimal surface tack.

Abstract: Multicomponent silicone compositions which can be crosslinked via the click reaction and which, after mixing of the individual components, harden to give an elastomeric material contain: at least one compound (A) or (B), at least one compound (B) or (C), and at least one Cu catalyst (D), where (A) is an organic compound or an organosilicon compound which possesses at least two moieties having terminal aliphatic carbon-carbon triple bonds having terminally bonded hydrogen; (B) is an organic compound or an organosilicon compound which possesses at least two moieties having terminal aliphatic carbon-carbon triple bonds having terminally bonded hydrogen and simultaneously at least two moieties having carbon-bonded azide groups; (C) is an organic compound or an organosilicon compound which possesses at least two moieties having carbon-bonded azide groups.

Abstract: A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.

Abstract: The present invention relates to the production of amphiphilic copolymer networks or co-networks that are both hydrophobic and hydrophilic, the copolymer networks comprise polyalkylene glycol segments and disubstituted polysiloxane segments. Furthermore, the present invention relates to products and/or films made from the amphiphilic copolymer networks or co-networks produced in accordance with the synthesis methods of the present invention. In one embodiment, amphiphilic networks or co-networks are synthesized using functional multiblock co-polymers according to the formula (AY)x(BY)y, where A represents an alkylene glycol polymer having n repeating alkylene glycol units, B represents a disubstituted siloxane polymer having m repeating siloxane units, and Y represents a molecule (e.g., a silane) that functions both as a chain extender and a crosslinker.