Abstract: Disclosed are new organic semiconducting polymers. The polymers disclosed herein can exhibit high carrier mobility and/or efficient light absorption/emission characteristics, and can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.

Abstract: A proton exchange membrane and method for formation the same is disclosed. When forming the proton exchange membrane, first, a bismaleimide and barbituric acid are copolymerized to form a hyper-branched polymer. Next, the solvent of the sulfonated tetrafluorethylene copolymer (Nafion) aqueous solution is replaced with dimethyl acetamide (DMAc). 10 to 15 parts by weight of the hyper-branched polymer is added to 90 to 85 parts by weight of the Nafion in the DMAc solution, stood and heated to 50° C. for inter-penetration of the hyper-branched polymer and the Nafion. The heated solution is coated on a substrate, baked, and pre-treated to remove residue solvent to complete formation of the proton exchange membrane.

Abstract: The present invention is directed to maleamic acid derivatives of water soluble polymers, to chemically stable water-soluble polymer succinamic acid-active agent conjugates, and to methods for reproducibly preparing, characterizing and using such polymer reagents and their conjugates.

Abstract: Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin, presented in the Chemistry FIG. 1; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost insulated coating layer contacted with the conducting wire, shows the increased adhesivity of the insulated coating layer to the conducting wire without forming an additional bonding layer, as well as the excellent physical properties such as the wear resistance and flexibility, etc.

Abstract: A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. In Formula (I), B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4. The invention also provides a flexible electrical device including the polyimide polymer.

Abstract: A polymer substrate having a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420° C. to about 600° C., a method for forming the polymer substrate, a display device including the polymer substrate, and a method for manufacturing the display device. The method for forming the polymer substrate includes preparing the polymer layer and performing an annealing process to the polymer layer at a temperature greater than about 350° C.

Abstract: The present invention is a thermoplastic resin composition which is obtained by adding a specific modified vinyl copolymer having a specific intrinsic viscosity to a composition comprising a styrene-based resin and a polyamide resin. The thermoplastic resin composition has excellent flowability and has a far better surface appearance than conventional ones while satisfactorily retaining rigidity, heat resistance, chemical resistance, and impact resistance at room and low temperatures.

Abstract: There is described herein an intermediate transfer member including a polyimide polymer having the formula: wherein n is from about 50 to about 2,000.

Abstract: A resin material for a refrigeration circuit comprising a compressor for a refrigerant, a condenser, a depressurizing/expanding means, and an evaporator, the resin material being disposed in the refrigeration circuit at such a position that the resin part comes into direct contact with the refrigerant. The resin material is characterized in that when R1234yf is used as the refrigerant, the resin material has chemical resistance at least to the refrigerant itself or ingredients generated by the decomposition of the refrigerant. This resin material is prevented from undergoing a chemical reaction with the refrigerant R1234yf itself or ingredients generated by the decomposition thereof. Consequently, refrigerant leakage caused by the decomposition of the resin material is prevented. Furthermore, clogging and a decrease in refrigerating performance, which are caused by the circulation of an undesirable compound through the circuit, are prevented.

Abstract: A platelet adhesion-resistant material is provided, which includes polytriuret-urethane consisting essentially of repeating structural units of formulae (I) to (III) in a random order, in which when the total number of the three repeating structural units in the polytriuret-urethane is 100, the number of the repeating structural units (I) is about 5 to about 50: in which each R independently represents a C2-C16 alkylene group, a C6-C30 aromatic group, a C6-C30 alicyclic group; n is an integer of 2 to 16; and R1 represents —(OCmH2m)p, in which m is an integer of 2 to 5, and p is an integer of 3 to 150.

Abstract: Disclosed herein is a composition for forming a substrate, including: a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer.

Abstract: The disclosure relates to biocompatible components useful for forming compositions for use as medical/surgical synthetic adhesives and sealants. Biocompatible components of the present disclosure may include a multifunctional amine or multifunctional polyol core, with isocyanate and/or polyalkylene oxide arms, which may optionally be capped with electrophilic or nucleophilic groups. These biocompatible components may, in embodiments, be combined with optional cross linkers to form adhesive and/or sealant compositions.

Abstract: The invention relates to screw elements for multi-screw extruders with screws co-rotating in pairs and being fully self-wiping in pairs, to the use of the screw elements in multi-screw extruders and to a process for extruding plastic compositions.

Abstract: Disclosed are processes for synthesizing polyimides by a sequential self-repetitive reaction between poly (aryl carbodiimide) (p-CDI) or aryl diisocyanates with dianhydrides.

Abstract: According to an aspect of the invention, medical devices are provided which include (a) a substrate and (b) a coating that includes an antifouling copolymer, an adhesive copolymer, or both. Antifouling copolymers for use in conjunction with the present invention contain (i) at least one antifouling polymer block having multiple pendant alkoxy functional groups along the polymer backbone and (ii) at least one additional polymer block. Adhesive copolymers for use in conjunction with the present invention contain (i) at least one adhesive polymer block having multiple pendant ring-hydroxyl-substituted aromatic groups along the polymer backbone and (ii) at least one additional polymer block.

Abstract: The present invention refers to medical devices comprising a modified polyamide or to modified polyamides or modified polyamide elastomers with the polyamides having high flexibility and high stress resistance, especially tensile strength or tear resistance, in addition to the good physical characteristics of the known polyamide elastomers.

Abstract: Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formula, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.

Abstract: Positive-working imageable elements having improved sensitivity, high resolution, and solvent resistance are prepared using a water-insoluble polymeric binder comprising vinyl acetal recurring units that have pendant hydroxyaryl groups, and recurring units comprising carboxylic acid aryl ester groups that are substituted with a cyclic imide group. These imageable elements can be imaged and developed to provide various types of elements including lithographic printing plates.

Abstract: An organic layer composition and a liquid crystal display including the same are provided. An organic layer composition according to an exemplary embodiment includes a binder formed by copolymerizing compounds included in a first group and a second group, wherein the first group includes an acryl-based compound and the second group includes a compound without a —COO— group.

Abstract: Disclosed are a method for forming an organic layer pattern which is characterized by forming a thin layer by coating a coating solution including a polyimide-based polymer having a heteroaromatic pendant group including a heteroatom in its polyimide major chain, a photoinitiator and a crosslinking agent on a substrate and drying the substrate, and exposing and developing the thin layer, an organic layer pattern prepared by the method, and an organic memory device comprising the pattern. According to example embodiments, a high-resolution micropattern may be formed without undergoing any expensive process, e.g., photoresist, leading to simplification of the preparation process and cost reduction.

Abstract: The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Abstract: The invention relates to a macromolecule comprising a polymer central core having at least two atoms to which at least two monomers are attached forming a dendrimeric structure comprising at least three polymer bonds, at least two linear polymers (b) being bond to said polymer bonds, wherein said polymers (b) at least have terminal functional groups for cytotoxic agents and at least on extended polymer (a) having a size of at least 1 carbon atoms longer than said polymers (b) and at least a terminal functional group for a targeting agent. The invention also relates to a macromolecule conjugate as well as a macromolecule biotin conjugate comprising said macromolecule, methods to produce said macromolecules as well as kits or system comprising said macromolecules and method of treating a mammal by said macromolecules.

Abstract: Disclosed are conjugates which bind VLA-4. Certain of these conjugates also inhibit leukocyte adhesion and, in particular, leukocyte adhesion mediated by VLA-4. Such conjugates are useful in the treatment of inflammatory diseases in a mammalian patient, e.g., human, such as asthma, Alzheimer's disease, atherosclerosis, AIDS dementia, diabetes, inflammatory bowel disease, rheumatoid arthritis, tissue transplantation, tumor metastasis and myocardial ischemia. The conjugates can also be administered for the treatment of inflammatory brain diseases such as multiple sclerosis.

Abstract: Disclosed is an electrode binder for a secondary battery, an electrode including the electrode binder, and the secondary battery. The disclosed electrode binder for the secondary battery includes a polymer whose cohesion force with a metal (loid) electrode active material is equal to or more than 100 gf/cm, and adhesion force with an electrode current collector ranges from 0.1 gf/mm to 70 gf/mm, the metal (loid) electrode active material being capable of reversibly storing and discharging lithium, wherein the polymer includes at least one kind selected from the group including polyamide imide, polyamide, polyacrylonitrile, polyacrylic acid and polyvinyl alcohol.

Abstract: Polyimide matrix microparticles or microcapsules having a thermally stable polyimide wall or matrix and functional polymer additives as core materials. The polyimide matrix microparticles or microcapsules can be processed into high-melting polymers by melt compounding.

Abstract: In one embodiment the present invention provides for high thermal conductivity materials 30 that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix 32 that the high thermal conductivity materials 30 are added to.

Abstract: A polyoxadiazole polymer is synthesized by heating polyphosphoric acid to a temperature of at least about 160° C. and making a solution by mixing hydrazine sulfate salt with one or more dicarboxylic acids or their derivatives in the heated polyphosphoric acid. The solution is heated under an inert gas atmosphere and the polymer is precipitated in a basic solution. The polyoxadiazole polymer can be produced as a homopolymer or copolymer, and may be used to produce a membrane or fibers.

Abstract: There is provided a simple production method of polyhydroxyimide and a positive photosensitive resin composition containing the polyhydroxyimide. A production method of a polyhydroxyimide comprising: adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor of Formula (1): (where X is a tetravalent aliphatic or aromatic group, Y is an organic group containing an aromatic group substituted with at least one OH group, and n is an integer of 1 or more); and heating the resultant mixture to a temperature of 50 to 100° C. to prepare a polyimide of Formula (2): (where X, Y and n are the same as those defined above) having a weight average molecular weight of 3,000 to 100,000.

Abstract: Organic coating compositions, particularly antireflective coating compositions, are provided that can be developed with an aqueous alkaline developer, including in a single step during development of an overcoated photoresist layer. Preferred coating compositions comprise a tetrapolymer that comprises at least four distinct functional groups.

Abstract: Disclosed are new semiconductor materials prepared from perylene-imide copolymers. Such polymers can exhibit high n-type carrier mobility and/or good current modulation characteristics. In addition, the compounds of the present teachings can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.

Abstract: Disclosed is an aromatic polyimide film having specific elastic modulus and thermal expansion coefficient. Also disclosed is a method for producing such an aromatic polyimide film. Specifically disclosed is an aromatic polyimide film which is composed of an aromatic polyimide containing not less than 70 mol % of repeating units represented by the following formula (I): (I) while satisfying the following relations (1) and (2): CTEMD??11×MiMD+70??(1) CTETD??11×MiTD+70??(2) wherein CTEMD represents the in-plane thermal expansion coefficient (ppm·K?1) in the machine direction; CTETD represents the in-plane thermal expansion coefficient (ppm·K?1) in the transverse direction; MiMD represents the elastic modulus (GPa) in the machine direction; and MiTD represents the elastic modulus (GPa) in the transverse direction. Also specifically disclosed is a method for producing such an aromatic polyimide film.

Abstract: Disclosed is a polyimide film having superior thermal stability, in which the degree of change depending on variation in temperature is minimized.

Abstract: A polyimide-type material that exhibits an excellent heat resistance and moldability such as easiness of molding into a film configuration and low process load, and a film made from this polyimide-type material are provided. The polyimide-type material contains a polyamic acid and/or polyimide obtained by reacting (A) at least one acyl compound selected from the group consisting of 1-cis-2-cis-3-trans-4-trans-cyclopentanetetracarboxylic acid, 1-cis-2-cis-3-trans-4-trans-cyclopentanetetracarboxylic acid dianhydride, and reactive derivatives thereof, with (B) an imino-forming compound.

Abstract: This invention relates to hydroxy alkyl isocyanurates, coating compositions comprising hydroxy alkyl isocyanurates and methods for producing hydroxy alkyl isocyanurates. Dried and cured coating compositions containing the hydroxy alkyl isocyanurates provide excellent durability, gloss and distinctness of image.

Abstract: Polymers of naphthalene tetracarboxylic diimide dimmers are provided. The polymers are of the Formula I wherein the A units are selected from and Formula IX The polymers are suitable for use in the active layer of an imaging member and exhibit properties of both a binder and an electron-transporting material.

Abstract: A method for producing an amino group-containing conjugated diene polymer includes polymerizing a conjugated diene compound in the presence of a reaction product of 1,3-bis(diphenylethenyl)benzene or a derivative thereof and an organolithium compound to obtain a conjugated diene polymer, and reacting the conjugated diene polymer with a modifier.

Abstract: A multibranched polyoxyalkylene compound represented by the following formula (1): CH2-L1-(OA1)n-L2-X CH(OA2)mOR1 CH(OA2)mOR1 CH(OA2)mOR1 CH2(OA2)mOR1 ??(1) wherein R1 is the same or different and is a hydrocarbon group having 1 to 24 carbon atoms, OA1 and OA2 are the same or different and are an oxyalkylene group having 2 to 4 carbon atoms, n and m are the same or different and are an average number of moles of the oxyalkylene group added, n represents 0 to 1000, m is the same or different and represents 10 to 1000, X represents a functional group capable of reacting with an amino group, a mercapto group, an aldehyde group, a carboxyl group, a triple bond, or an azide group to form a chemical bond, and L1 and L2 are the same or different and are a single bond, an alkylene group, or an alkylene group in which at least one bond selected from an ester bond, a urethane bond, an amide bond, an ether bond, and an amino is interposed.

Abstract: Disclosed are semiconducting compounds having one or more phthalimide units and/or one or more head-to-head (H-H) substituted biheteroaryl units. Such compounds can be monomeric, oligomeric, or polymeric, and can exhibit desirable electronic properties and possess processing advantages including solution-processability and/or good stability at ambient conditions.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: A non-fibrous, apertured membrane comprises at least one thermoplastic polymeric material and has a discrete porous structure. The membrane is soluble in the thermoset matrix polymer of a composite material.

Abstract: Disclosed is a water-repellent/oil-repellent agent which is composed of a fluorine-containing polymer containing a repeating unit (A) derived from a fluorine-containing monomer having a fluoroalkyl group or a fluoroalkenyl group, and a repeating unit (B) derived from a monomer having an imide group at a weight ratio of from 10/90 to 95/5 (repeating unit (A)/repeating unit (B)). Also disclosed is a thermoplastic resin composition which is obtained by adding such a water-repellent/oil-repellent agent into a thermoplastic resin. Since the fluorine-containing polymer is improved in heat resistance, the water-repellent/oil-repellent agent is capable of imparting a wide range of thermoplastic resins with excellent water repellency and oil repellency.

Abstract: Photosensitive polyimide compositions include a photosensitive additive and a polymer comprising a repeating unit represented by the following formula (I): wherein R1 comprises an aliphatic group, an alicyclic group, an aromatic group, a heterocyclic group, or combinations thereof, R2 comprises an aliphatic group, an alicyclic group, an aromatic group, a heterocyclic group, or combinations thereof, R3 represents hydrogen or an organic group comprising a hydrophilic group, an acid-cleavable group, a base-cleavable group, a cross-linkable group, or combinations thereof, and h represents an integer of 1 or more. The photosensitive compositions may be formed by combining a precursor polymer with a processing solvent, followed by a relatively low-temperature cyclization process in which the precursor polymer is converted to the final polymer. The resulting polyimide may be separated from the solution and purified. It may then be combined with a casting solvent and a photosensitive additive.

Abstract: The invention relates to a thermosensitive (poly(ethylene oxide) poly(propylene oxide))-acetal derivative, which can be used to functionalize chitosan, and to the process for the preparation thereof. The invention therefore also relates to a process for functionalizing chitosan by grafting this thermosensitive copolymer and optionally another thermosensitive polymer, poly(ethylene oxide). A subject of the invention is also a chitosan-(poly(ethylene oxide) poly(propylene oxide))-poly(ethylene oxide) derivative which has the advantage of being water-soluble at physiological pH. The invention therefore also relates to the aqueous compositions comprising this derivative and to the use of this composition for the manufacture of gel by heating.

Abstract: An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D wherein D is a di-phenylethynyl endcap; and A is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.

Abstract: The present invention relates to thermoset resin fibre components, composite materials comprising thermoset resin fibre components, composite articles manufactured using such composite materials and methodologies for manufacturing same. The thermoset resin fibre components may comprise a single fibre of thermoset resin or a plurality of fibres commingled together. There properties and characteristics of the thermoset resin used are chosen according to the material to be produced therefrom. The thermoset fibre components may be woven into reinforcement fibres to form prepregs. Thermoplastic fibres may be commingled and co-woven with the thermoset fibre components.

Abstract: The present invention relates generally to mercaptofunctional high ?? EO chromophores and EO polymers, and particularly to mercaptofunctional high ?? EO chromophores and EO polymers useful for making electro-optical devices and systems. Mercaptofunctional high ?? EO chromophores are covalently bonded to poly(imido sulfide) polymers producing high Tg, low optical loss, covalently bonded, high ?? EO chromophore containing polymers. Methods of synthesizing these EO materials using mild polymerization conditions are also described.

Abstract: A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.

Abstract: Disclosed in embodiments herein is a method of synthesizing device forming monomers using N-(Vinyloxycarbonyloxy)succinimide.

Abstract: A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.

Abstract: Disclosed is a linear polyimide precursor having an intrinsic viscosity of not less than 0.5 dL/g and composed of a repeating unit represented by at least one formula selected from the group consisting of the general formula (1) below and the general formula (2) below. In the general formulae (1) and (2), X represents a divalent aromatic group other than a residue of 1,4-bis(4-aminophenoxy)benzene and a residue of bis(4-amino-3-methylphenyl)methane or an aliphatic group. Since this linear polyimide precursor has high glass transition temperature and high toughness, while exhibiting excellent solubility and thermoplasticity, it is suitably used as a raw material for an asymmetric polyimide which is useful as an adhesive resin for flexible printed circuits (FPC) or the like.