Abstract: A heat exchanger includes an air channel configured to receive air from an equipment rack. A fluid circuit is provided having a bi-phase coolant flowing therethrough. The fluid circuit includes a coolant channel coupled to the equipment rack and positioned adjacent to the air channel. The bi-phase coolant is part liquid and part gas as the bi-phase coolant flows through the coolant channel. The bi-phase coolant is configured to condition the air flowing through the air channel.

Abstract: An electric machine system including an alternating current (AC) electric machine. The AC electric machine includes a machine housing having a machine portion and a switch portion. A stator is fixedly mounted in the machine portion of the machine housing, and a rotor rotatably mounted relative to the stator. A switch assembly is arranged within the switch portion of the machine housing and electrically connected to the stator. The switch assembly includes a switch module having a switch member. The switch module is configured and disposed to be detachably mounted in the switch portion of the machine housing. A cooling system that includes an expandable coolant manifold is arranged in the switch portion of the machine housing. The expandable coolant manifold is fluidly connected to the switch module.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.

Abstract: Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.

Abstract: A printed-circuit board (31) having a power element (33) and a refrigerant jacket (20) to which the power element (33) is thermally connected, with refrigerant circulating therein used in refrigeration cycle, are provided in an outdoor unit casing (70). The printed-circuit board (31) is provided in a switch box (40). A face of the outdoor unit casing (70) has a service opening (71). The refrigerant jacket (20) faces the service opening (71), being closer to the front side of the outdoor unit casing (70) than the power element (33) as viewed from the service opening (71).

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract: A cooling element for an electronic apparatus can include an inlet for receiving fluid, an outlet for forwarding fluid from the cooling element, and multiple pipes providing parallel fluid paths for passing the fluid from the inlet to the outlet. To obtain a simple and efficient cooling element, multiple base plates for receiving electronic components can be attached to the pipes for conducting heat generated by the electronic components to the fluid in the pipes.

Abstract: A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.

Abstract: An arrangement for cooling an electrical machine is provided. The electrical machine is connected with a first cooling-system which directly cools the electrical machine. The first cooling-system circulates a first cooling-medium. The first cooling-system is connected with a second cooling-system which delivers heat from the first cooling-system to the second cooling-system. The second cooling-system circulates a second cooling-medium to remove the received heat. The first cooling-system is connected with a third cooling-system, which is a refrigeration-system, to additionally cool down the first cooling-medium of the first cooling-system.

Abstract: A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.

Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.

Abstract: An extruded aluminum electrical circuit component carrier on which at least one electrical circuit component is to be mounted. A first side portion and a second side portion include areas for mounting at least one first electrical circuit component part and at least one second electrical circuit component part. An inlet to which an inlet conduit for a cooling liquid can be connected. An outlet to which an outlet conduit for the cooling liquid can be connected. At least one supply passage for the cooling liquid formed through the first side portion. At least one return passage for the cooling liquid formed through the second side portion. The at least one supply passage is connected to the at least one return passage in series.

Abstract: A chiller bypass system is provided for deployment onboard a vehicle that includes a battery pack through which a first coolant is circulated. In one embodiment, the chiller bypass system comprises a chiller, a chiller bypass duct fluidly coupled to the battery pack and configured to supply the first coolant thereto, and a chiller bypass valve. The chiller bypass valve includes: (i) a valve inlet fluidly coupled to the battery pack and configured to receive the first coolant therefrom, (ii) a first valve outlet fluidly coupled to the chiller and configured to supply the first coolant thereto, and (iii) a second valve outlet fluidly coupled to the chiller bypass duct and configured to supply the first coolant thereto. The chiller bypass valve selectively directs coolant flow between the first valve outlet and the second valve outlet to adjust the volume of the first coolant cooled by the chiller.

Abstract: A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.

Abstract: A cooling module for cooling at least two server modules that are configured to house a plurality of servers, the cooling module including a housing having an interior containing air, an intake into the housing, an outlet from the housing, at least one fan configured to move the air from the intake to the outlet and at least one sprayer configured to spray a mist into the air in the interior for evaporative cooling of the interior. Also a system formed of the cooling module, first and second server modules and a plenum connecting the outlet of the cooling module and intakes of the first and second server modules.

Abstract: A storage apparatus for a measurement probe for use with a coordinate positioning machine. The storage apparatus including a storage unit having at least one receptacle for a measurement probe; and at least one temperature source for controlling the temperature of a measurement probe located in the at least one receptacle.

Abstract: A storage apparatus includes: a front disk unit for receiving a first modular inserted from the front face of a general purpose chassis into a space with a plurality of first cooling devices in an opened state; and a rear disk unit for receiving a second modular inserted from the back face of the general purpose chassis into a space with a plurality of second cooling devices in an opened state. Furthermore, the storage apparatus includes a regulating member for regulating, according to an open-close state of at least one cooling device from among the plurality of openable first cooling devices and the plurality of openable second cooling devices which are provided to face the front face and back face of the general purpose chassis, respectively, an open-close state of the remaining cooling devices.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: An exemplary server cabinet includes an enclosure configured to house multiple servers therein, and a liquid cooling system. A heat conductive plate is positioned in the enclosure to be adjacent to the servers. The liquid cooling system includes a cooler located outside the enclosure, a conduit thermally connecting the cooler with the heat conductive plate, and a working liquid circulating in the conduit and the cooler. Heat generated by the servers is absorbed by the heat conductive plate and transferred to the cooler by the working liquid for dissipation.

Abstract: A system for cooling an environment housing a plurality of electronic equipment in one or more cabinets is disclosed, the system comprising a remote cooling unit(s) adapted to provide relatively cool air into the environment, an exhaust associated with each cabinet, the exhaust being provided with variable airflow means; the remote unit being adapted to receive exhausted air, and; sensor means adapted to determine cooling demand and alter the output of the remote cooling unit(s) accordingly. Schemes for using the system are described.

Abstract: An exemplary server system includes a server cabinet defining a space therein; a number of racks arranged in the space, a number of servers mounted in the racks, and a heat dissipation apparatus arranged under the racks. A channel is defined between the racks. Each of the servers includes a drawing fan. The heat dissipation apparatus includes a fan module and two heat exchangers respectively arranged at opposite sides of the fan module. The fan module is aligned with the channel for generating upward a flow of cooling air upward to the channel. During operation of the server system, the cooling air is drawn across the servers by the drawing fans to evacuate heat from the servers and becomes heated air, and the heated air flows down to the heat exchangers where the heat is dissipated from the heated air such that the heated air become the cooling air again.

Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.

Abstract: A storage apparatus includes: a storage drive providing a physical storage area for creating a logical storage area used by an external apparatus; a storage controller including a plurality of central processing units (CPUs) executing data write processing from the external apparatus to the storage drive, and data read processing from the storage drive; a plurality of cooling fans cooling the storage drive; a temperature sensor detecting a temperature of air introduced or discharged by the cooling fans; and a revolving speed sensor detecting a revolving speed of each cooling fan. Any of the CPUs executes operation control processing in which, through a data network path to the storage drive for the data write and read processing, measurement values of the temperature and revolving speed sensors are acquired and a revolving speed setup value of the fans is calculated and is transmitted to the cooling fans.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: A data center cooling system is disclosed. The system includes a plurality of computer racks arranged in a plurality of substantially parallel rows, cooling units associated with the computer racks and arranged in substantially parallel rows to cool air warmed by the cooling racks, and cooling fluid supply and return conduits that are divided by isolation valves into a plurality of cooling sub-loops, wherein adjacent cooling units in a common row are supplied from different sub-loops, and individual sub-loops serve cooling units in multiple rows, so as to provide water-side diversity across the cooling system.

Abstract: A thermal management system and method of use are provided, the system including a heat exchanger, a refrigeration system, a coolant loop thermally coupled to the heat exchanger, and a by-pass valve that regulates the amount of coolant within the coolant loop that either passes through the heat exchanger or is diverted away from the heat exchanger. The coolant loop is thermally coupled to the battery pack of an electric vehicle.

Abstract: Liquid cooling is selectively enabled at a portable information handling system to provide enhanced processing capabilities when needed or desired. A liquid cooling cold plate conducts thermal energy from a processing component heat pipe or heat sink to a liquid pumped from external to the information handling system housing. The pump operates with power provided from an AC/DC adapter of the information handling system or power provided from an interface with the information handling system, such as a USB port and cable. Alternatively, liquid cooling is included in a cradle to automatically engage with the information handling system is coupled to the cradle.

Abstract: A two-stage cooling system configured to cool an interior of an enclosure includes a cabinet, a first vortex tube secured within the cabinet, and a second vortex tube secured within the cabinet. The cabinet defines a venting chamber. The first and second vortex tubes each include a hot pipe within the venting chamber and a cool gas delivery pipe extending outwardly from the cabinet. The first and second cool gas delivery pipes are configured to deliver cold gas to the interior of the enclosure. A separate thermostat may be operatively attached to each vortex tube and extend outwardly from the cabinet to be positioned within the interior of the enclosure. Additionally, first and second dampening sleeves may be secured around at least a portion of the first and second hot pipes, respectively, such that the dampening sleeves dampen noise produced by the vortex tubes.

Abstract: To provide a protective coat on a refrigerated sample collector for a corrosive environment a unitary frame includes a support unit with condenser and evaporator coils mounted to the support unit and an orifice connecting the condenser and evaporator coils. The evaporator coils, condenser coils and restrictor are powder coated after being connected, whereby an effective seal is provided for the restrictor, condenser coils and evaporator coils after they are assembled to the support. The unitary frame can be easily removed or connected as a unit to the sample collector. A peristaltic pump may be used for drawing at least one sample into the refrigerated sample collector and depositing said sample into at least one sample bottle. The peristaltic pump may include contoured tube guides to reduce movement of the peristaltic pump as a roller paddle rotates.

Abstract: Redundant cooling systems and methods are disclosed. In an exemplary embodiment, a method for redundant cooling system of computer systems and other electronics may comprise thermally connecting a cooling fluid to one or more heat-generating components to absorb heat from the heat-generating components during operation. The method may also comprise thermally connecting the cooling fluid to a primary coolant and a secondary coolant. The method may also comprise exchanging heat between the cooling fluid and the primary coolant or the secondary coolant to remove heat from the cooling fluid even if one of the cooling sources is unavailable.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: An enclosure containing heat-producing equipment includes an air inlet for admitting air from an environment containing the enclosure. The equipment is situated relative to the air inlet such that the air absorbs heat from the equipment, increasing the temperature of the air. An air-to-liquid heat exchanger is mounted on an outside surface of the enclosure adjacent to an air outlet. The heat exchanger is connectable to an external cooling source such that heat from the heated air exiting the enclosure absorbed by the heat exchanger is expelled outside the environment containing the enclosure.

Abstract: An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

Abstract: A method of controlling air conditioning to cool servers, the method includes selecting, when the number of operating servers is a certain threshold number or more, a first mode, in which the pressure of a cold aisle is set higher than the pressure of a hot aisle; selecting, when the number of operating servers is less than the certain threshold number, a second mode, in which the pressure of the cold aisle is set equal to the pressure of the hot aisle; and informing the operating servers of whether a current mode is the first mode or the second mode, and when the current mode is the first mode, driving fans of the servers at a minimum rotational speed in a specification, and when the current mode is the second mode, driving the fans of the servers at a rotational speed higher than the minimum rotational speed in the specification.

Abstract: A cooling system for PV cells includes an evaporator configured to thermally contact the PV cells and transfer heat generated thereby to coolant in the evaporator, a condenser for receiving vaporized coolant from the evaporator and condensing the coolant to a liquid state, tubing connecting the evaporator, and the condenser in a circuit, a compressor arranged in the circuit for pumping coolant therethrough in a coolant flow direction, an active charge control apparatus arranged in the circuit between, in the coolant flow direction, the evaporator and the condenser, and a liquid flow control apparatus arranged in the circuit between, in the coolant flow direction, the condenser and the evaporator. The active charge control apparatus and the liquid flow apparatus cooperate to maintain the evaporator completely wetted by coolant and prevent coolant in the liquid state from leaving the evaporator.

Abstract: A power module is attached to a refrigerant cooler in contact with the refrigerant cooler, and cooling is performed by dissipating heat to the refrigerant flowing in the refrigerant cooler. A controller outputs a driving signal to a drive circuit to reduce the number of switching operations of switching elements.

Abstract: The present invention provides a wind direction adjuster for controlling cooling air in a data center. The adjuster includes: an access floor-flat plate; a first support, a second support, a third support, and a fourth support that form frames supporting the access floor-flat plate from below; and a wind direction-adjusting plate for concentrating a wind direction of cooling air supplied from an air conditioner by blocking an open space between at least any two supports of the first to fourth supports in accordance with a structure of a building, an installation environment of a computing equipment, and a reach distance of the cooling air.

Abstract: A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger cools the refrigerants by gasifying liquefied gas. The pump circulates the refrigerants. The third heat exchanger heats the liquefied gas with sea water before the liquefied gas enters the second heat exchanger.

Abstract: A hot water storage type hot water supply system includes a storage battery unit, a heat pump cycle, a water storage tank, a water circulation path, first and second paths, first and second temperature sensors, and a controller. The heat pump cycle circulates a first refrigerant. The first and second paths circulate a second refrigerant. The first and second sensors sense temperatures of the storage battery unit and water stored in the tank, respectively. The controller controls the second refrigerant to flow in the first or the second path when the temperature of the storage battery unit sensed by the first sensor is higher or lower than a first or a second predetermined temperature, respectively. The controller controls to close the first and second paths when the temperature of the storage battery unit sensed by the first sensor is not lower than the second predetermined temperature and not higher than the first predetermined temperature.

Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.

Abstract: When cooling a superconducting magnet for use in a magnetic resonance imaging (MRI) device, a two-stage cryocooler (42) employs a first stage cooler (52) to cool a working gas (e.g., Helium, Hydrogen, etc.) to approximately 25 K. The working gas moves through a tubing system by convection until the magnet (20) is at approximately 25K. Once the magnet (20) reaches 25 K, gas flow stops, and a second stage cooler (54) cools the magnet (20) further, to about 4 K.

Abstract: The cooling apparatus (10) for electronic-device exhaustion includes an evaporator unit (201), a fluid piping (306) and a vapor piping (305). A plurality of evaporator units (201) is disposed in a rack (100) in the height direction, and have a dimension in height of any of 2 U, 3 U, and 4 U with 1 U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (100), and cools the exhaust air. The fluid piping (306) is a supply route of the coolant fluid to the evaporator units (201), the vapor piping (305) is a discharging route of the coolant vapor from the evaporator units (201), and both are commonly connected to the plurality of evaporator units (201).

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.