Abstract: In an outdoor unit, an electric component unit includes an inlet part which communicates with an outlet side of an air blower and through which air on the outlet side flows into the electric component unit, and an outlet part which communicates with an inlet side of the air blower and through which air flows out from the electric component unit.

Abstract: A system, configured to be disposed in a information technology equipment rack for providing ice thermal storage, includes a tank configured to hold water, a heat exchanger disposed in water in the tank and configured to convey a two-phase liquid and vapor refrigerant and to transfer heat between the water and the refrigerant, a first valve connected to a liquid and a vapor refrigerant line and configured to selectively connect the liquid refrigerant line to a first port and the vapor refrigerant line to a second port in a first mode and to connect the liquid refrigerant line to the second port and the vapor refrigerant line to the first port in a second mode, a thermostatic expansion valve connected to an inlet of the heat exchanger, and a liquid/vapor pump connected to an outlet of the heat exchanger and to the second port of the first valve.

Abstract: A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space.

Abstract: A cooling system for a server includes at least one radiator and at least one cooling plate that are installed in a server cabinet, a cooling assembly, a storage tank, and a heat exchanger. The cooling assembly is connected to the radiator, and is carried with a first cooling fluid therein. The storage tank is connected to the cooling plate, and is carried with a second cooling fluid therein. The first cooling fluid enters the heat exchanger through the radiator, and the second cooling fluid enters the heat exchanger through the cooling plate. The first cooling fluid and the second cooling fluid perform heat exchange in the heat exchanger, so as to reduce the temperature of the second cooling fluid, thus reducing the required energy enabling the second cooling fluid to return to a set temperature.

Abstract: A cooling system for a room containing electronic data processing equipment includes a raised floor construction dividing the room into a plenum space underneath the raised floor and a usable space above the raised floor, an air conditioning device for feeding cooled air to the plenum space and a cooling module. The cooling module is arranged as a floor element of the raised floor and includes a fan for providing a flow of cooled air from the plenum space to the usable space, the cooling module being configured such that the flow direction of the flow is controllable. The system further includes a control device connected to the cooling module for automatically controlling the flow direction of the flow.

Abstract: A system for providing cooled air to electronic equipment includes a data center having electronic equipment in operation, a plurality of on-floor cooling units, and a cooling water source. The on-floor cooling units cool air warmed by the electronic equipment. The cooling water source is configured to supply cooling water that reduces a temperature of the on-floor cooling units. The power usage effectiveness (“PUE”) of the system is less than 1.3, wherein the PUE is defined by energy used to operate the data center divided by energy used to run the electronic equipment.

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Abstract: A self-contained heat transfer system conveys heat from a first heat reservoir at a relatively low temperature to a second heat reservoir at relatively high temperature, the heat transfer system defining a closed loop that contains a working fluid. The self-contained heat transfer system includes a hermetically-sealed housing that defines an enclosure; a first heat transfer device having an exposed surface configured to be in thermal communication with the first heat reservoir; a second heat transfer device having an exposed surface configured to be in thermal communication with the second heat reservoir; and an electrochemical compressor within the enclosure and between the first and second heat transfer devices, wherein the electrochemical compressor includes one or more electrochemical cells, each electrochemical cell including a gas pervious anode, a gas pervious cathode, and an electrolytic membrane disposed between and in intimate electrical contact with the cathode and the anode.

Abstract: A gelatin capsule drying system that includes a structure divided into first, second and third zones, a first air handler unit positioned to discharge air into the first zone, a second air handler unit positioned to discharge air into the second zone and a third air handler unit positioned to discharge air into the third zone. The system further includes a series of tumble dryers that extend from the first zone, through the second zone and into the third zone, and an HVAC unit that provides air to the first, second and third air handler units.

Abstract: Water for data center uses is generated from the ambient air by a water generator that cools air below its dew point, thereby causing the water in such air to precipitate out. The water generator is powered by renewable energy sources that provide a sufficient amount of energy over an extended period of time, despite temporary interruptions. Heated air from the data center is exhausted so as to absorb moisture from the ambient air, with such heated air being capable of holding a greater amount of moisture, and is then directed through the water generator, thereby enabling the water generator to generate a greater amount of water. The level of water available is monitored and the water generator utilizes on-demand power sources to generate a greater amount of water so as to avoid emptying water storage units.

Abstract: A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.

Abstract: A passively cooled instrument protective housing has an internal heat exchanger, an external heat exchanger, and a storage tank for a cooling medium and disposed in a housing interior. A cooling unit having a cooling unit evaporator is disposed in the storage tank and in which a cooling unit coolant is evaporated with the use of heat from the storage tank cooling medium. A condenser or a liquefier is disposed outside the housing and in which the vaporous or gaseous cooling unit coolant emanating from the cooling unit evaporator is liquefied. A switching and/or shut-off device is provided, by which the cooling unit can be switched off and/or can be uncoupled from the passive cooling system formed by the internal and external heat exchangers and by the storage tank. In addition, a control and/or regulating device is provided, which same is operatively connected to the cooling unit.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system.

Abstract: A system for regulating gas flow for a computer room containing computer components includes vents configured to direct gas from a gas supply toward the computer components, sensors disposed and configured to provide information regarding at least a first property associated with the computer components, and a controller coupled to the sensors and the vents and configured to effect a change in gas flow through a second one of the vents in accordance with a first value of the first property associated with a first of the computer components.

Abstract: A system for cooling air in a data center includes a data center having electronic equipment in operation, a cooling water source, and a plurality of on-floor cooling units. The cooling water source is configured to retain at maximum capacity a total amount of water. Each on-floor cooling unit is configured to cool air heated by a portion of the electronic equipment in the data center using water from the cooling water source. The total amount of water is insufficient to maintain a leaving air temperature of each on-floor cooling unit below an inside setpoint when a temperature outside of the data center is above a predetermined external temperature.

Abstract: A cooling unit operating in a magnetic field is provided. The cooling unit includes an encasement body having a non-electrically conductive composition and defining a first and second opposing planar surface. The cooling unit also includes a metal conduit disposed in the encasement body substantially parallel to the first surface. Additionally, the cooling unit also includes a series of metal fins disposed in the encasement body and extending from the conduit. In some configurations the fins can be substantially parallel to the first surface. Further, in some configurations, non-electrically conductive inserts having a thermal conductivity greater than a thermal conductivity of the encasement body can be disposed in a portion of the encasement body between one of the first and second surfaces and one or more of the metals fins.

Abstract: A system and method for thermal management of a memory device is described. In an embodiment, one or more thermal sensors sends a signal to a thermal control module indicating that a pre-determined temperature threshold for a memory device or devices has been reached. The thermal control module may then begin tracking memory thermals or initiate thermal management operations based on the signal and history of memory device temperatures over time.

Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack, and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.

Abstract: A cooling device for a charger capable of simplifying the device configuration and reducing the power consumption is provided. Cooling device for cooling the charger for charging a battery with use of power supply received from a power source includes a compressor for circulating a cooling agent, a condenser for condensing the cooling agent, a decompressor for decompressing the cooling agent condensed by condenser, an evaporator for evaporating the cooling agent decompressed by the decompressor, and a cooling portion for cooling the charger with use of the cooling agent flowing from the condenser, and the cooling portion is provided on a path of the cooling agent flowing from the condenser to the evaporator.

Abstract: A current lead apparatus includes a pipe surrounding a current lead connected between a low temperature side terminal and an ambient side terminal. The refrigerant gas discharged at the ambient temperature side is circulated via a plurality of stages of freezers to a low temperature side of the pipe.

Abstract: A refrigeration system (10) includes: a refrigerant circuit (11) performing a vapor compression refrigeration cycle by including a compressor (30), a utilization side heat exchanger (24) configured to allow refrigerant to perform heat exchange with air, and a heat-source side heat exchanger (25) configured to allow refrigerant to perform heat exchange with water; and a casing (14) housing the utilization side heat exchanger (24). The casing (14) contains a power supply (31) including a power semiconductor device and configured to supply electric power to the compressor (30), and also contains a cooler (19) configured to cool the power supply (31) by supplying air to the power supply (31).

Abstract: Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.

Abstract: Cooling systems for providing cooled air to electronic equipment are described. The systems can include large storage tanks or waste treatment systems to improve the efficiency of the plant and reduce impact on the environment.

Abstract: A cooling system is provided for cooling an electrical component. The cooling system includes a supply of liquid natural gas (LNG) and a heat sink configured to be positioned in thermal communication with the electrical component. The cooling system also includes an LNG conduit configured to be interconnected between the heat sink and the supply of LNG such that the LNG conduit is configured to carry LNG from the supply to the heat sink. A pump is configured to be operatively connected in fluid communication with the supply of LNG. The pump is configured to move LNG within the LNG conduit from the supply to the heat sink.

Abstract: An exhaust air removal system and method for use with a rack or enclosure containing equipment is provided. The system and method are configured for removal of exhaust air vented from equipment during operation to thereby remove heat from the equipment. In one aspect, the system includes a fan unit preferably configured to serve as a back door of an equipment rack or enclosure and configured to provide access to an interior of the rack or enclosure. The fan unit provides multiple fans coupled to internal exhaust ducts that are arranged to draw and to remove exhaust air vented from rack-mounted equipment. The fan unit is further configured to vent exhaust air to an area external to a rack or enclosure, such as an external exhaust duct or plenum. Removal of hot and warm exhaust air vented from rack-mounted equipment enables the equipment to operate effectively, drawing sufficient amounts of cooling air to meet its cooling requirements.

Abstract: An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Abstract: A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body. A vapor compression cycle system is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.

Abstract: A cooling system constructed to cool down an accumulator mounted on a motor vehicle is herein presented. The cooling system sequentially controls an air blower to restrict the air blow to the accumulator, controls the air blow mode switchover module to switch over the active air blow mode after restriction of the air blow to the accumulator, and controls the air blower to release the restriction of the air blow to the accumulator after the switchover of the active air blow mode by the air blow mode switchover module.

Abstract: A system for cooling a computer data center includes a computer data center building; a plurality of computer racks arranged in a plurality of linear rows inside the computer data center building, with particular ones of the racks housing a plurality of computer systems; a plurality of cooling fluid conduits; and a plurality of cooling plants arranged outside the computer data center building along an exterior wall of the computer data center building. At least one of the cooling plants corresponds to one or more particular ones of the cooling fluid conduits and provides cooling for the corresponding conduit.

Abstract: Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.

Abstract: A server cabinet includes a rack, at least one assembling frame, a radiator and at least one fan. The rack has a first frame and a second frame opposite to each other. The assembling frame and the radiator are mounted on the first frame in sequence. The radiator transfers a coolant to flow inside a plurality of heatsink fins thereof in a circulating manner. The fan is mounted in the assembling frame, and the fan guides an airflow to flow into the first frame from the radiator, and blows the airflow in the rack to the second frame, thus lowering the temperature inside the rack.

Abstract: A controller for a thermoelectric cooling system comprises a sensor input that receives input from a sensor that measures a performance parameter of a thermoelectric cooling system. The thermoelectric cooling system comprises a plurality of thermoelectric devices electrically coupled in a combination of in series and in parallel with one another and electrically driven by a common driver. The controller also comprises a voltage control signal output, a processor, and a non-transitory memory having stored thereon a program executable by the processor to perform a method of controlling the thermoelectric cooling system. The method comprises receiving sensor data from the sensor input, determining a parameter of the voltage control signal based on the input sensor data, and transmitting a voltage control signal having the parameter to the driver to control heat transfer by the plurality of thermoelectric devices.

Abstract: A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger.

Abstract: A system is disclosed for cooling superconducting devices. The system includes a cryogen cooling system configured to be coupled to the superconducting device and to supply cryogen to the device. The system also includes a cryogen storage system configured to supply cryogen to the device. The system further includes flow control valving configured to selectively isolate the cryogen cooling system from the device, thereby directing a flow of cryogen to the device from the cryogen storage system.

Abstract: An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.

Abstract: The invention relates to a system for cooling a computing system, the computing system being cooled using at least two cooling circuits.

Abstract: A battery cooling system operates by pumping liquid through a cooling fluid circulation path. Because the battery cooling system pumps liquid, the compression system that generates the cooling power does not require the use of a condenser. The compression system utilizes a compression wave. An evaporator of the cooling system operates in the critical flow regime in which the pressure in an evaporator tube will remain almost constant and then ‘jump’ or ‘shock up’ to an increased pressure.

Abstract: A data center includes a server, a trestle-floor, and a battery box. The server is positioned on the trestle-floor. The battery box is located under the trestle-floor and below the server. The trestle-floor includes a number of tiles. The battery box receives a number of battery units. When the battery units need to be replaced or repaired, one or more tiles of the trestle-floor are operable to be removed to expose the battery units.

Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.

Abstract: The air conditioning device for electronic components features three channels (6, 7, 8) for two flowing fluids that are in heat exchange with one another. In the first operating mode these two fluids are guided by means of switchable flaps into two selected channels (7, 8) where they are in heat exchange with one another at a partition (12) that is equipped with heat exchange elements (12, 13). In a second operating mode the flaps are switched in such a manner that the two fluids are in heat exchange with one another at a Peltier element (9) that is equipped on both sides with heat exchange elements (9, 11). In a third operating mode the Peltier element is switched as a heating element. In the first operating mode on the other hand the Peltier element is deactivated and consumes no electric energy.

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to the cooling air intake side of electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: A cooling member for a variable speed drive is disclosed. The cooling member includes including at least two channels, each channel including at least one inlet and at least one outlet, a first passageway configured to provide fluid to the at least two channels through the at least one inlet of each channel, a second passageway configured to receive fluid from the at least one outlet of each channel the at least two channels, and a connector to connect the cooling member to a second cooling member.

Abstract: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3?) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.