Abstract: An object is to provide a cooling unit which can reduce influence of radiation heat from a work piece having high temperature on members surrounding the work piece, prevent leak of coolant and vacuum leak, reduce cost, and prevent turning angle of a work piece conveying mechanism from being limited. The cooling unit is attached to the work piece conveying mechanism in the state that the outer wall part is in close contact with the to-be-cooled surface. The coolant stored in the lower space is evaporated by the heat transmitted from the to-be-cooled surface P via the outer wall part, and the to-be-cooled surface is cooled via the outer wall part by the heat of evaporation lost at the time of the evaporation of the coolant. The vapor in the lower space (coolant container) is discharged to the vacuum chamber by the vapor exhaust unit when the pressure of the vapor in the lower space reaches the fixed value or higher.

Abstract: Automated control of a cooling system cooling at least one electronic component is provided. The control includes monitoring over a period of time variation of an operational variable of the cooling system or of the at least one electronic component, and based, at least in part, on variation of the operational variable over the period of time, automatically determining whether to adjust control of the cooling system to limit variation of the operational variable. In one implementation, depending on the variation of the operational variable, and whether control of the cooling system has been previously adjusted, the method may further include automatically determining a probability of fail or an expected residual life of the cooling system, and responsive to the predicted probability of fail exceeding a first acceptable threshold or the expected residual life being below a second acceptable threshold, automatically scheduling for a cooling system repair or replacement.

Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

Abstract: An apparatus and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Geothermal cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external, possibly geothermal, heat exchange mechanism, then back into the containment vessel.

Abstract: An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).

Abstract: A container data center assembly takes account of ambient temperatures as well as the amount of heat generated by working servers includes a first and second and third circulatory cooling systems and a cooling tower. When the cooling tower can itself be cooled by the ambient temperature to a temperature less than a preset value, the third circulatory cooling system operates only to cool a server rack. When the cooling tower is heated by the ambient temperature or by the high temperature of returning coolant to a temperature equal to or greater than the preset value, the first circulatory cooling system operates to cool the server rack, and the second circulatory cooling system operates to cool a heat dissipating module.

Abstract: A method of constructing a data hall utilizing a plurality of data hall modules, each data hall in the form of a container comprising a top, a bottom, a first pair of opposed sides and second pair of opposed sides, and at least one side of the first pair of opposed sides is open and has a removable panel. For the purpose of transportation, the panel is removably fixed to the open side, and during construction so the plurality of data hall modules are bayed in side-by-side relationship so that their open sides are adjacent to each other and/or in end-to-end relationship so that their open ends are adjacent to each other.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermetically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.

Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

Abstract: An industrial heat load evaporative cooling system. The system includes multiple cooling towers and includes cooling coil heat transfer equipment locally associated with an industrial heat load, with the system subject to command and control equipment.

Abstract: Methods and apparatus are provided for choosing an energy-efficient coolant temperature for electronics by considering the temperature dependence of the electronics' power dissipation. This dependence is explicitly considered in selecting the coolant temperature T0 that is sent to the equipment. To minimize power consumption PTotal for the entire system, where PTotal=P0+PCool is the sum of the electronic equipment's power consumption P0 plus the cooling equipment's power consumption PCool, PTotal is obtained experimentally, by measuring P0 and PCool, as a function of three parameters: coolant temperature T0; weather-related temperature T3 that affects the performance of free-cooling equipment; and computational state C of the electronic equipment, which affects the temperature dependence of its power consumption. This experiment provides, for each possible combination of T3 and C, the value T0* of T0 that minimizes PTotal.

Abstract: A method for actively cooling the battery pack of an electric vehicle after the vehicle has been turned off, thereby limiting the adverse effects of temperature on battery life, is provided. Different battery pack cooling techniques are provided, thus allowing the cooling technique used in a particular instance to be selected not only based on the thermal needs of the battery pack, but also on the thermal capacity and energy requirements of the selected approach.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component of varying heat load. The apparatus includes a refrigerant evaporator coupled in thermal communication with the electronic component, a refrigerant loop coupled in fluid communication with the refrigerant evaporator for facilitating flow of refrigerant through the evaporator, and a thermoelectric array disposed in thermal communication with the evaporator. The thermoelectric array includes one or more thermoelectric elements, and is powered by a voltage and by a current of switchable polarity, which are controlled to maintain heat load on refrigerant flowing through the refrigerant evaporator within a steady state range, notwithstanding varying of the heat load applied to the refrigerant flowing through the refrigerant by the at least one electronic component.

Abstract: An example of the disclosed refrigerant system includes a compressor having a motor that is cooled by motor cooling fluid provided to the motor from the main refrigerant loop by a motor cooling circuit. The example system further includes a sub-cooling circuit to cool the motor cooling fluid.

Abstract: Various methods related to air moving devices in electronic systems are disclosed. Various electronic systems including controlled air moving devices are also disclosed. Thus, one example electronic system includes an air moving device, a sensor for monitoring an operating parameter of the electronic system and generating a signal representative of the operating parameter, and a controller for controlling the air moving device. The controller is configured to selectively control a rotational speed of the air moving device, to receive the signal representative of the operating parameter, and to delay changing the rotational speed of the air moving device in response to the signal representative of the operating parameter.

Abstract: A cooling device for a charger capable of simplifying the device configuration and reducing the power consumption is provided. Cooling device for cooling the charger for charging a battery with use of power supply received from a power source includes a compressor for circulating a cooling agent, a condenser for condensing the cooling agent, a decompressor for decompressing the cooling agent condensed by condenser, an evaporator for evaporating the cooling agent decompressed by the decompressor, and a cooling portion for cooling the charger with use of the cooling agent flowing from the condenser, and the cooling portion is provided on a path of the cooling agent flowing from the condenser to the evaporator.

Abstract: A data center includes a container, a server system, an air conditioner, and an air guide. The container includes a floor, and a sidewall that defines a through hole adjacent to the floor. The server system includes a rack and a number of servers mounted in the rack. The rack defines an air outlet apart from but facing the sidewall. The air conditioner includes an evaporator and a condenser. The evaporator is positioned on the top of the rack. The condenser defines an outlet and is sandwiched between the bottom of the rack and the floor and extending through the through hole. The air outlet of the condenser faces outside of the container. The air guide is a sheet extending from an edge of the evaporator that is distant from the rack and then bends to extend toward the floor.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space.

Abstract: A heat exchanger includes an air channel configured to receive air from an equipment rack. A fluid circuit is provided having a bi-phase coolant flowing therethrough. The fluid circuit includes a coolant channel coupled to the equipment rack and positioned adjacent to the air channel. The bi-phase coolant is part liquid and part gas as the bi-phase coolant flows through the coolant channel. The bi-phase coolant is configured to condition the air flowing through the air channel.

Abstract: A power control unit that controls a rotary electric machine that drives a vehicle, and that is mounted onto a motor case in which the rotary electric machine is housed, includes a fixed base that is made of resin; a cooler that is arranged on the fixed base and that includes a power module; and a control substrate that is arranged on the cooler. The fixed base inhibits conduction of heat from the motor case to the power control unit.

Abstract: An evaporator includes: a porous medium that has a plurality of tubular projections; a vapor chamber and a liquid chamber that are separated by the porous medium, the liquid chamber also serving as a liquid reservoir; a case that has a first portion that is connected with a vapor line, a second portion that is connected with a liquid line at one side, and a plurality of protrusions that are provided on the first portion; and a high thermal conductivity member that is provided inside the liquid chamber, the high thermal conductivity member extending from the one side that is connected with the liquid line to an opposite side located opposite to the one side, the high thermal conductivity member having a higher thermal conductivity than the second portion.

Abstract: Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

Abstract: A device for cooling a heat source of a motor vehicle is provided that includes a cooling body which has a plurality of feed flow channels and a plurality of return flow channels. At least a multiplicity of the feed flow channels and return flow channels are arranged adjacent to one another in an alternating fashion in the cooling body.

Abstract: Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant.

Abstract: A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount.

Abstract: Apparatus for cooling electrical elements, comprising a heat sink (1, 101, 201) through which a coolant can flow, a plurality of electrical elements (2, 102, 202) which each have a bottom surface and a side surface, with the bottom surfaces being aligned essentially on one plane, with the heat sink (1, 101, 201) having at least one channel (4, 5, 104, 105, 204, 205) through which a coolant can flow and making thermal contact with the electrical elements (2, 102, 202), characterized in that the heat sink (1, 101, 202) extends essentially parallel to the plane of the bottom surfaces, with the channel (4, 5, 104, 105, 204, 205) in the heat sink having a profile which is matched to edges of the electrical elements (2, 102, 202).

Abstract: An environmental control apparatus includes (A) a condensation air flow loop in which a fan driven when the aircraft is moved on the ground or flies performs a thermal exchange with a condenser of a cooling/heating flow loop; (B) the cooling/heating flow loop, including an evaporator, a compressor configured to have a rotating shaft coupled to the shaft of a ram air turbine, a condenser configured to perform a thermal exchange by the condensation air flow loop, and an expansion valve configured to expand the refrigerant condensed by the condenser, wherein the evaporator, the compressor, the condenser, and the expansion valve are interconnected by a refrigerant circulation line; (C) an air circulation loop for circulating and supplying cooled or heated air to a camera/electronic unit so that the camera/electronic unit maintains a constant temperature; and (D) a controller for controlling the driving of the elements in each of the loops.

Abstract: A computer server enclosure (such as in a server farm) evaporative cooling system. The system includes multiple cooling towers and includes cooling coil heat transfer equipment locally associated with a server enclosure or group of server enclosures, with the system subject to command and control equipment.

Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.

Abstract: A system includes a cooling water intake conduit having a water intake in a submerged area of an open natural body of water, a first water-to-water heat exchanger having a first side in fluid communication with the cooling water intake conduit, and a closed water loop in fluid communication with a second side of the water-to-water heat exchanger and arranged to route water to cooling structures at a computer data center.

Abstract: A cooling system for a spot welding device which cools heating parts of a spot welding device including two electrodes, a gun body, and a transformer, may include an air compressor, an air separator connected with the air compressor and separating compressed air supplied from the air compressor into hot air and cooling air, and a connection line supplying the cooling air separated by the air separator to a heating part of the spot welding device.

Abstract: The invention relates to an instrument cabinet comprising: a wall structure with vertical studs, a fan for cooling electric components to be installed in the instrument cabinet with an airflow produced by the fan, and a cooling element arranged in the airflow and having a flow channel for feeding cooling fluid through the cooling element for cooling the airflow that cools the electric components. To achieve a lower than before instrument cabinet that has fewer risks of leakage, the cooling element is arranged upright and at least partly in the space between the vertical studs.

Abstract: A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.

Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Abstract: The invention relates to an electric cabinet (1) comprising a front part and a rear part and designed to receive electric functional units (2a), said electric cabinet (1) also comprising a separating partition (20) delineating: a first cold thermal area formed by a first space (E1) located at the front part of the cabinet, and a second hot thermal area formed by a second space (E2) located at the rear part of the cabinet. The electric cabinet (1) comprises a cooling and regulating device of the temperature of the first and second spaces E1, E2, said device comprising: a cooling source (100) positioned in contact with the first space (E1) to cool the latter; heat exchange means (40) enabling cold air to flow between the first space (E1) and the second space (E2).

Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.

Abstract: The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.

Abstract: A heat exchange assembly and apparatus and method employing the heat exchange assembly are provided. The heat exchange assembly includes a coolant-to-refrigerant heat exchanger and a heater. The heat exchanger includes a coolant inlet and a coolant outlet for passing a coolant through the heat exchanger, and a refrigerant inlet and a refrigerant outlet for separately passing a refrigerant through the heat exchanger. The heat exchanger cools coolant passing through the heat exchanger by dissipating heat from coolant passing through the heat exchanger to refrigerant passing through the heat exchanger. The heater is integrated with the heat exchanger and applies an auxiliary heat load to refrigerant passing through the heat exchanger to facilitate ensuring that refrigerant passing through the heat exchanger absorbs at least a specified minimum heat load, for example, to ensure that refrigerant egressing from the refrigerant outlet of the heat exchanger is superheated vapor refrigerant.

Abstract: A cooling system for an eco-friendly vehicle, may include an unified radiator that cools working fluid flowing therethrough to cool an electric power component and an air-cooling type AC condenser, respectively, a pump that is disposed in a series with the unified radiator to pump up the working fluid in the unified radiator to the electric power component or the water-cooling type AC condenser, a first branch pipe and a second branch pipe that connect the electric power components with the water-cooling type AC condenser in parallel for the unified radiator and the pump, and a valve connected to the first and second branch pipes and disposed to selectively supply the working fluid from the pump to the first branch pipe and the second branch pipe.

Abstract: A cooling system for an eco-friendly vehicle, may include an unified radiator that cools working fluid flowing therethrough to cool an electric power component and an air-cooling type AC condenser, respectively, a pump that is disposed in a series with the unified radiator to pump up the working fluid in the unified radiator to the electric power component or the water-cooling type AC condenser, a first branch pipe and a second branch pipe that connect the electric power components with the water-cooling type AC condenser in parallel for the unified radiator and the pump, and a valve connected to the first and second branch pipes and disposed to selectively supply the working fluid from the pump to the first branch pipe and the second branch pipe.

Abstract: A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.

Abstract: This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are connected to the avionic rack on the one hand electrically (C3-C4) and on the other hand fluidically (36?-37, 45?-44) to a system of pipes (30a, 30b) on at least one cold source for a cooling fluid (30). A heat-dissipating electronic board (35) is equipped with a dissipated-heat collector plate (61-65), in which fluid circulation channels are implemented, connected via quick-disconnect fluidic couplings (42, 39) to quick-disconnect fluidic couplings of the system of pipes. These devices allow the equipment to be removed from or inserted into the rack (32-EE) or the electronic board (35) to be removed from or inserted into the electrical equipment (33-35).

Abstract: To reduce power consumption and more efficiently cool computing devices in a data center, an air supply unit supplies air from outside the data center to an air handling unit, which cools servers within the data center using the supplied air. Using air from outside the data center, rather than recirculating and cooling air from within the data center, reduces the power consumption of the data center. In an embodiment, a chiller and/or an evaporative cooling system are coupled to the air supply unit to allow further cooling of the outside air before it is circulated. Heat generated by the servers within the data center is collected, for example using thermal pathways coupled to server components, and used by the chiller in an absorption or adsorption process to further reduce power consumption of the data center and allow the air handling unit to further cool the outside air.

Abstract: Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

Abstract: A connector for use in a negative pressure coolant system is disclosed. The connector connects coolant system circulating to an electrical component thereby allowing the coolant to circulate through the electrical component. The connector is made up of two components, a component side connector and a pump side connector, and can be in three positions: disengaged, semi-engaged and fully-engaged. An electrical component can be drained of its coolant while the connector is shifted from the fully-engaged position, to the semi-engaged position and to the disengaged position. This can be accomplished without shutting down the negative pressure coolant system, thus allowing a particular electrical component to be disconnected without affecting the cooling efficiency of other electrical components connected to the system. Because the coolant is drained, it will not spill on the electrical component and cause damage.

Abstract: A computer cabinet includes at least one rackable server cooled by a cooling circuit; a cooling circuit supply device including: two cooling modules, each cooling module including: a primary hydraulic circuit; a secondary hydraulic circuit; a heat exchanger; a pump; a controller to control the pump; a central control unit connected to the controller of each of the cooling modules; the central control unit being capable of activating one of the cooling modules while the other cooling module is inactive.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

Abstract: A system for cooling gas heated by passing the gas over heat-producing equipment to cool the equipment comprises a heat exchanger including a first heat transfer mechanism configured to transfer heat from the heated gas to a first coolant, and a first condensing module connected for fluid communication with the heat exchanger and including second and third heat transfer mechanisms, the first condensing module being configured to transfer heat through the second and third heat transfer mechanisms from the first coolant to second and third coolants in the second and third heat transfer mechanisms, respectively.