Abstract: A cooling apparatus includes a generator for receiving a first heat load from first electric components, a evaporator for receiving a second heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a third cooling element arranged outside of the closed compartment for receiving heated fluid from at least one of the generator and evaporator and for transferring heat from the heated fluid to outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, a flow channel of the evaporator is configured to receive a fluid in a liquid state and a fluid in a gas state, where the fluid in the gas state reduces a partial pressure of the fluid in a liquid state and the temperature required for evaporating the fluid in the liquid state, such that the fluid in the liquid state is evaporated.

Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.

Abstract: An air conditioning system provides air to an enclosure associated with a satellite antenna that houses an amplifier or other electronic component. The air conditioning system supplies conditioned air to the bottom of the enclosure and receives return air from the top of the enclosure for improved airflow. Various implementations may also provide redundancy through the use of common supply and return plenums, or other features. In some embodiments, the air conditioning system may be conveniently retrofit onto existing satellite antenna installations to provide improved efficiency and redundancy.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

Abstract: A pumped-loop cooling system for cooling a plurality of heat-generating components that includes a plurality of first heat-generating components and at least one heat exchanger in thermal contact with the first heat-generating components for absorbing heat from the first heat-generating components via refrigerant flowing through the heat exchanger. The system also includes a plurality of second heat-generating components, a chiller for air-cooling the second heat-generating components, and a condenser for receiving and condensing refrigerant received from the heat exchanger and the chiller. A pump circulates refrigerant through the system. The pump receives refrigerant that has been condensed by the condenser and pumps the refrigerant to the heat exchanger and the chiller.

Abstract: A grate access floor panel comprising a support frame and a plurality of vanes supported by the frame, each of the plurality of vanes having an upstream end and a downstream end with respect to a direction of airflow across the plurality of vanes and faces that extend between the upstream and downstream ends, wherein at least some of the vanes have openings that extend through the faces thereof and have angled tips.

Abstract: Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.

Abstract: A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.

Abstract: A data processing system storage unit for storing a plurality of data processing systems is disclosed. In one example of the storage unit, a plurality of storage spaces, each storage space configured for storing a data processing system, is provided. An air inlet duct and an air outlet duct allow air circulation within the storage unit. A plurality of inlet conduits, each inlet conduit configured to connect the inlet air duct to an inlet port of a data processing system, provides air supply to the data processing system. A plurality of outlet conduits, each outlet conduit configured to connect the outlet air duct to an outlet port of a data processing system, provides air exhaust from the data processing system. The example storage unit may also provide a primary air transfer system configured for directing air into the air inlet duct and/or for extracting air from the air outlet duct.

Abstract: A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling stage, a wafer rotating mechanism which holds the wafer in a state separated from the wafer cooling stage by a predetermined gap, and is rotated while holding the wafer, and a driving mechanism which rotates the wafer rotating mechanism at a predetermined rotational speed.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

Abstract: An electric compressor 10 includes a compression mechanism 11, an electric motor 12 driving the compression mechanism 11, and a control portion 13 controlling to drive the electric motor 12, incorporated into a single casing, and further includes a temperature detector 14 detecting a temperature of one or more components constituting one or both of the control portion 13 and the electric motor 12, and a current detector 15 detecting a current flowing through the component. When the temperature detected by the temperature detector 14 is a temperature Td, the current detected by the current detector 15 is a current Id, and a current corresponding to the temperature Td at a temperature characteristic relating to the current specific to the component is a current Ia(Td), the control portion 13 stops driving the electric motor 12 on the basis of a result of comparison between Ia(Td) and Id.

Abstract: An air conditioner includes a printed circuit board to which a power device is attached; and a refrigerant jacket which is connected to the power device, and through which refrigerant used for a refrigeration cycle flows. The printed circuit board is accommodated in a switch box. The refrigerant jacket is fixed to the switch box through a heat transfer plate, and the refrigerant jacket and the printed circuit board are connected together by the switch box.

Abstract: A system configured to provide cooling of electronic equipment in a shelter in combination with an air conditioning (A/C) system. The system includes one or more blowers for drawing air into the shelter, a damper arrangement for controlling air exhaust. The system further includes a DC powered controller coupled to the one or more blowers, the damper arrangement, and the A/C system. The controller is configured to receive at least a first analog input signal associated with a shelter-interior temperature, a second analog input signal associated with a shelter-exterior temperature, and a plurality of alarm input signals and to generate the one or more first control signals to control blower rotational speed, the second control signal to open/close the damper arrangement, and a third control signal to inhibit/activate the A/C system based on at least the first analog input signal, or the second analog input signal, or a plurality of alarm input signals, or a combination of these.

Abstract: A cooling system includes a first temperature sensor, a pump, a first controller, and a first filtering device. The first temperature sensor senses a temperature of an external water source and outputs a first temperature value. The pump pumps the water from the external water source. The first controller is connected between the first temperature sensor and the pump to receive the first temperature value, and compare the first temperature value with a first predetermined temperature value. If the first temperature value is less than the first predetermined temperature value, the first controller controls the pump to pump the water from the external water source. The first filtering device is connected to the pump to receive and filter the pumped water and output the filtered water to a cold water pipe of the container data center to cool servers of the container data center.

Abstract: A method for controlling a refrigerant distribution in a vapour compression system, such as a refrigeration system, e.g. an air condition system, comprising at least two evaporators. The refrigerant distribution determines the distribution of the available amount of refrigerant among the evaporators. While monitoring a superheat, SH, at a common outlet for the evaporators, the distribution of refrigerant is modified in such a manner that a mass flow of refrigerant to a first evaporator is altered in a controlled manner. The impact on the monitored SH is then observed, and this is used for deriving information relating to the behaviour of the first evaporator, in the form of a control parameter. This is repeated for each evaporator, and the refrigerant distribution is adjusted on the basis of the control parameters. The impact may be in the form of a significant change in SH.

Abstract: A data center cooling system includes a floor structure defining a below-floor warm-air plenum and an above-floor cool air plenum, a plurality of above-floor computer assemblies arranged to exhaust warmed air into the warm-air plenum, and one or more fan-coil arrangements to draw air from the warm-air plenum, cool the air, and provide the air to the cool air plenum. The volume of the above-floor cool air plenum and the below-floor warm air plenum may both be substantial so as to minimize changes in temperature from the failure of components in the system.

Abstract: The primary purpose of the present invention is to provide a heat equalizer and the fluid transmission duct disposed in a heat carrier existing in solid state in the nature where presents comparatively larger and more stable heat carrying capacity for passing through the fluid. The fluid passes through the solid or gas state semiconductor application installation to regulate temperature equalization of the semiconductor application installation and flows back to the heat equalization installation disposed in the natural heat carrier for the heat equalization installation providing good heat conduction in the natural heat carrier to provide the operation of temperature equalization regulating function on the backflow of the fluid, and through the heat equalizer to transfer thermal energy to the heat storing block constituted by the surrounding natural heat carrier so as to store heat for releasing thermal energy to the specified heat releasing target.

Abstract: A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Abstract: A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device. A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.

Abstract: A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal.

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract: Described is a storage unit for a drive system in a vehicle. The storage unit has at least one sorption store, at least one battery, and at least one cooling circuit. The sorption store is coupled via the cooling circuit to the battery. Further described is a method of operating the storage unit and also a drive system and a vehicle equipped with such a storage unit.

Abstract: A turbo compressor includes an impeller fixed to one end portion of a rotation shaft by a predetermined fastening member, and a regulating portion which is used to regulate rotation of the rotation shaft during fastening of the fastening member and is provided in the other end portion of the rotation shaft. The regulating portion is formed as a recessed portion recessed from an end surface of the other end portion of the rotation shaft.

Abstract: A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

Abstract: A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrige

Abstract: A container data center includes a container. The container includes a top wall, two sidewalls, a first end wall, and a second end wall. Two elongated water troughs are arranged on the top of the container, near the sidewalls. The outer side plate of each water trough is lower than a top side of the corresponding inner side plate. A water receptacle is arranged near the first end plate. Pipes connect the water receptacle to the water troughs, to transfer the water in the water receptacle to the water troughs. When the water in the water troughs overflows, the water flows down the sidewalls of the container, to separate and thus protect the sidewalls from pollutants and humidity in the surrounding air.

Abstract: An HV_ECU executes a program including: switching, if an operation is in an A/C intake mode and absolute value of temperature difference Thi?Tlo is larger than a predetermined value A and temperature Thi is smaller than a predetermined value B, the operation mode to a compartment intake mode; switching, if the operation is in the compartment intake mode, the compartment intake mode is requested to prevent increase in temperature difference, the absolute value of temperature difference Thi?Tlo is larger than a predetermined value A and temperature Thi is equal to or larger than the predetermined value B, the operation mode to an A/C intake mode; and executing a normal intake mode switching control.

Abstract: A method and system of cooling components of a computer system. At least some of the illustrative embodiments are computer systems comprising an enclosure, a motherboard within the enclosure, a heat generating component coupled to the motherboard and within the enclosure, a canister comprising a compressed fluid (the canister coupled to the enclosure), and a gas cooling device selectively fluidly coupled to the compressed fluid (the gas cooling device produces chilled gas when fluidly coupled to the compressed fluid). The chilled gas is directed upon the heat generating component.

Abstract: In a method for determining a substantially optimized fluid flow distribution in a structure configured to be cooled by a fluid moving device, an indication to activate the fluid moving device according to a reference temperature setpoint of a plurality of sensors is outputted. In addition, conditions detected in multiple areas of the structure with the plurality of sensors are received, a master sensor among the plurality of sensors based upon the detected conditions is identified; and a master reference temperature setpoint for the master sensor that substantially optimizes fluid flow distribution in the structure based upon conditions detected by the plurality of sensors in response to changes in a characteristic of fluid flow supplied to the plurality of sensors is determined.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: A cooling system for computer systems is disclosed. In one aspect, a method includes providing a flow of liquid coolant through conduits positioned within a server system, and spraying the liquid coolant via at least one outlet mechanism of each of the conduits. The outlet mechanisms are adapted to be placed in close proximity to a corresponding target component of one of the servers, to cool the target component.

Abstract: Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser.

Abstract: The present invention provides a refrigeration system for compact equipment, particularly of the type including electronic circuits and internally provided with a heat source to be cooled, said refrigeration system including a heat dissipation device mounted in the equipment and including a heat absorbing portion, which absorbs heat from the heat source, and a heat dissipation portion accessible from the outside of the equipment and which releases the heat to the exterior of the equipment; and an auxiliary refrigeration circuit external to the equipment and having: a heat absorbing means to be selectively coupled to the heat dissipation portion so as to receive therefrom, by conduction, at least part of the heat received from the heat source and dissipated by said heat dissipation portion; and a heat dissipation means which releases the heat to the environment external to the equipment.

Abstract: A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A system and method for thermal management of a memory device is described. In an embodiment, one or more thermal sensors sends a signal to a thermal control module indicating that a pre-determined temperature threshold for a memory device or devices has been reached. The thermal control module may then begin tracking memory thermals or initiate thermal management operations based on the signal and history of memory device temperatures over time.

Abstract: An adsorption-type heat pump includes an adsorber having an adsorbent and capable of switching between an adsorption process of causing an adsorbent to adsorb a refrigerant and a desorption process of desorbing a refrigerant from an adsorbent, a condenser, an evaporator, a first flow hole which causes a refrigerant to flow from the adsorber to the condenser, a second flow hole which causes a refrigerant to flow from the evaporator to the adsorber, and a seat valve body arranged on at least one of the first flow hole and the second flow hole, having a seat material and an opening and closing assisting plate material joined to an end part of the seat material and formed by a temperature-dependent material which deforms in accordance with temperature, and opening and closing at least one of the first flow hole and the second flow hole.

Abstract: A cooling apparatus for cooling a switchgear is provided. The switchgear has one or more primary contacts supported by a bushing and constructed and arranged to connect to a terminal of a circuit breaker. The cooling apparatus includes at least one evaporator associated with each primary contact, a condenser apparatus located at a higher elevation than the at least one evaporator, fluid conduit structure connecting the at least one evaporator with the condenser apparatus, and electrically insulating working fluid in at least one evaporator so as to be heated to a vapor state, with the fluid conduit structure being constructed and arranged to transfer the vapor to the condenser apparatus and to passively return condensed working fluid back to the at least one evaporator.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.

Abstract: A cooling structure having a sufficient cooling efficiency in cooling an electricity storage device while securing a living space in a vehicle cabin when installed in a compact vehicle having a short distance from a rear seat to the rear end of the vehicle. A battery is contained in an IPU installed in the vehicle. The cooling structure for the battery has an air inlet opened into the vehicle cabin, an air intake duct extending from the air inlet to the IPU and a cover disposed to cover the air inlet and having a hole communicating the air intake duct with the inner side of the vehicle cabin. The air inlet has an opening inclined toward the inner side of the vehicle cabin in one side section of a rear portion of the vehicle cabin near a C-pillar located obliquely posterior to a rear seat.

Abstract: A media device includes at least one piezoelectric fan selectively located to draw or urge air past one or more electrical components, such as an integrated circuit chip. Preferably, the piezoelectric fan is located within a channel milled or otherwise formed in the chip, however the fan may be located proximate the channel yet in fluid communication therewith. The piezoelectric fan operates to convectively cool the electrical component and may also prevent heat that has been generated by the electrical component from moving toward another electrical component within the media device. Thus, the configuration and location of the piezoelectric fan may advantageously cool one component while preventing heat energy from building up around one or more other components mounted nearby.

Abstract: An air conditioning system for a vehicle includes a cabin air conditioning unit, a heat management unit, a temperature detecting unit, a switching unit, and a control unit. The control unit is operable to control operations of the cabin air conditioning unit, the switching unit, and the heat management unit according to temperature detection results from the temperature detecting unit, thereby regulating temperature of at least one of a passenger cabin and a heat generating component, which generates waste heat during operation thereof, of the vehicle.

Abstract: In accordance with embodiments of the present disclosure, a modular fluid-handling system may include an air-handling and mixing unit and a cooling unit. The air-handling and mixing unit may be configured to be in fluid communication with a primary structure, and may include an air mover configured to move air. The cooling unit may be configured to be in fluid communication with the primary structure and the air-handling and mixing unit, the cooling unit further configured to receive, one at a time, a plurality of different types of heat-rejection media.

Abstract: In this method, a refrigerant (52) is compressed (32) in a refrigerating circuit, then condensed by cooling in a condenser (44), then expanded in a throttle valve (62) and delivered in the expanded state, in the form of wet vapor (52), to an evaporator (60) that is in thermally conductive contact with a substrate (12) to be cooled. The cooling process thus operates similarly to a liquid cooling process, but with a higher mean logarithmic heat transfer temperature difference, which allows lower temperatures of the substrate (12) to be achieved and makes possible a better heat transition coefficient, since the refrigerant is present as wet vapor. A corresponding arrangement is likewise described.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: Embodiments of the invention provide high-efficiency cooling in a data center in response to a cooling and/or humidity demand using a system having multiple cooling loops to allow for a higher chilled liquid temperature of a first chilled liquid loop, while maintaining data center room temperature and humidity control. Specifically, the system includes a plurality of integrated cooling systems each comprising one or more specifically sized chillers and a liquid loop to address the cooling demand. A free cooling heat exchanger is coupled to the first liquid loop for use when a wet-bulb temperature surrounding the data center is at or below a free cooling set point of the first chilled liquid loop. The system isolates humidity control components to a second chilled liquid loop, and enables greater control of the first chilled liquid loop of the data center to meet specific IT loads.

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.