Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second plurality of openings substantially adjacent to the first plurality of openings through the first surface of the substrate, and then forming an n-type TFTEC material within the second plurality of openings.

Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipatve coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.

Abstract: A system and method is disclosed for dissipating heat within the interior of an information handling system. Heat from a heat source is directed to a heat sink and is also directed in parallel to a thermoelectric cooler. The thermoelectric cooler is oriented to direct heat in the direction of a second heat sink. A feedback communications link may be provided between the thermoelectric cooler and the heat source to regulate the operation of the thermoelectric cooler so that the temperature in the vicinity of the heat source is regulated within a temperature range.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A fluid temperature control device, which is particularly suitably applied to the temperature control of a processing liquid in a semiconductor device manufacturing process, capable of performing quickly and precisely the temperature control of a temperature-controlled fluid, and the device can also be made as small as possible. This fluid temperature control device includes a body block having flow passage grooves formed therein; heat transfer plates which are disposed on surfaces of the body block to form flow passages where a temperature-controlled fluid flows; heaters which heat the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates; and thermoelectric modules which heat and cool the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates.

Abstract: The present invention provides a thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, said first conductive pad and said third conductive pad, and an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.

Abstract: In one embodiment of the invention, a system for controlling the temperature of water in a water reservoir includes a water reservoir, an inlet operable to deliver water to the water reservoir, an outlet operable to dispense at least a portion of the water from the water reservoir, and a staged water cooler having a first thermoelectric cooler stage coupled to a second thermoelectric cooler stage, the staged water cooler operable to control the temperature of the water in the water reservoir.

Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.

Abstract: The present invention generally provides multistage thermoelectric coolers and methods for their fabrication. For example, in one aspect, a multistage thermoelectric cooler is disclosed that includes at least two cooling stages, each of which comprises a p-type leg portion and an n-type leg portion coupled to form a p-n junction. The p-n junctions of the two stages are thermally and electrically coupled such that at least a portion of a current flowing, during operation of the device, through one stage is coupled to the other. Further, at least one of the p- or n-type leg portions of one stage forms a unitary structure with a corresponding p- or n-type leg portion of the other stage.

Abstract: The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.

Abstract: A thermoelectric system includes a pair of substrates, a plurality of semiconductor elements, and first, second, and third terminals. The semiconductor elements are positioned between the opposing faces of the substrates, and the semiconductor elements comprise at least two groups of dissimilar semiconductor elements. The semiconductor elements are electrically coupled in series by conductor elements arranged so the two groups of dissimilar semiconductor elements are connected in an alternating pattern. The first, second and third terminals are connected to the conductor elements with the third terminal positioned between the first and second terminals. The electrically coupled semiconductor elements comprise first nodes and second nodes. The first and second nodes emit or absorb heat according to electric current flowing through the semiconductor elements, and impedance of the thermoelectric system is controlled by switching the switch.

Abstract: A refrigerator with thermal-electric semiconductor comprises: a power supply, a thermal-electric semiconductor, a cooling water box, a cyclic water box, and a low temperature heat transfer unit; the cooling water box being a hollow box with cooling water therein; the water inlet tube and water outlet tube of the cooling water box being connected to the cyclic water box; a cold surface of the thermal-electric semiconductor being adhered to one side of the low temperature heat transfer unit; another side of the low temperature heat transfer unit entering into a body of a refrigerator; the low temperature heat transfer unit separating the refrigerator into a freezer and a freezing compartment; the low temperature heat transfer unit being with a temperature sensor and a temperature control circuit for controlling temperature.

Abstract: For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interface is thermally coupled to the component-side thermal interface to transfer the heat from the component-side thermal interface to a heat exchanger. A thermoelectric cooler (TEC) is thermally coupled in series with at least one of the component-side thermal interface and rack-side thermal interface. The TEC is operable to increase an amount of the heat transferred from the electronic device to the heat exchanger in response receiving an electrical input.

Abstract: A storage device (1) adapted to contain a food item such a butter comprises a closeable container (3), a means for maintaining a predetermined temperature with the container irrespective of ambient temperature and an internal power source adapted to power the means for maintaining a predetermined temperature. The closeable container (3) is located on a recharging unit (43) by way of spherical feet (7) which are received in part-spherical cups (47) on the recharging unit (43).

Abstract: A micromachined device for efficient thermal processing at least one fluid stream includes at least one fluid conducting tube having at least a region with wall thickness of less than 50 ?m. The device optionally includes one or more thermally conductive structures in thermal communication with first and second thermally insulating portions of the fluid conducting tube. The device also may include a thermally conductive region, and at least a portion of the fluid conducting tube is disposed within the region. A plurality of structures may be provided projecting from a wall of the fluid conducting tube into an inner volume of the tube. The structures enhance thermal conduction between a fluid within the tube and a wall of the tube. A method for fabricating, from a substrate, a micromachined device for processing a fluid stream allows the selective removal of portions of the substrate to provide desired structures integrated within the device.

Abstract: According to one embodiment, a thermoelectric conversion module includes a thermoelectric conversion portion, a first external electrode, and a second external electrode. The thermoelectric conversion portion includes a single thermoelectric conversion portion element, or electrically connected thermoelectric conversion portion elements. The thermoelectric conversion portion element includes a high temperature electrode, low temperature electrodes, and an n-type and a p-type thermoelectric conversion semiconductor layer disposed between the high temperature electrode and the low temperature electrodes. The first and the second external electrode are electrically connected to one of the low temperature electrode and another one of the low temperature electrode respectively.

Abstract: An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.

Abstract: A heat exchange system selectably controls the temperature of a fluid being delivered to a patient's body by a pump device. The heat exchange system includes a thermal element and a heat exchanger that is removably coupled under pressure to the thermal element. The heat exchanger includes a first half made from thermally conductive material that correspondingly mates with the thermal element, a second half made from thermally conductive material opposite the first half, and an internal heat exchange zone existing between the first half and the second half, wherein fluid flows therethrough. The thermal element of the heat exchange system may controllably and safely warm and/or cool the fluid prior to delivery.

Abstract: A helmet includes a shell and a cooling module attached to the shell. The cooling module includes a heat pipe, a thermoelectric cooler, and a film type solar cell. The shell has an outer surface and an inner surface. The heat pipe is embedded in the shell and includes an evaporating section and a condensing section. The thermoelectric cooler includes a cold end brought into contact with the condensing section of the heat pipe, a hot end exposed to the exterior of the shell, and an array of N-type semiconductor elements and an P-type semiconductor elements electrically connected in serial sandwiched between the cold end and the hot end. The film type solar cell is provided on the outer surface of the shell and electrically connected with the thermoelectric cooler and used for supplying electric energy to the thermoelectric cooler. A cooling module is also included in the invention.

Abstract: The invention provides an efficient way of cooling of the microelectronic devices and converting the heat back into the electrical power. With addition of the ambient-air heat exchanger the system generates enough power to completely satisfy the demand of the microelectronic device and replace the electric battery with the cryogenic storage vessel.

Abstract: A climate control device comprises a housing, the housing having a first intake port, a first exhaust port, and a second exhaust port, wherein the first exhaust port opens in a different direction than the second exhaust port. A fan is disposed within the housing and is configured to draw air through the first intake port and expel air towards the first exhaust port and the second exhaust port. a separate insert piece configured to be inserted within the housing and adapted to direct substantially all the expelled air through one of the first or second exhaust ports.

Abstract: The present invention provides a system for controlling the climate of a hybrid vehicle. The system includes a thermoelectric module, a heat exchanger, a pump, and a valve. The thermoelectric module includes thermoelectric elements powered by electric energy. The thermoelectric elements emit or absorb heat energy based on the polarity of the electrical energy provided. A tube containing coolant runs proximate the thermoelectric elements. To aid in the transfer of heat energy, a blower is provided to generate an air flow across the thermoelectric elements and the tube. The coolant is provided from the thermoelectric module to a heat exchanger that heats or cools the air flow provided to the cabin of the vehicle. The pump and valve are in fluid communication with the heat exchanger and thermoelectric module. The pump pressurizes the coolant flow through the tube and coolant lines. In a cooling mode, the valve is configured to selectively bypass the engine coolant system of the vehicle.

Abstract: The switch cupboard for receiving electrical and electronical components and switching elements which is subject to a rotation and which has at least one cooling device (30) with a cold emitting device part (31) placed in its inner space (23) and with a heat emitting device part (32) which is situated outside the switch cupboard (20) and which is placed for example in the tower head (11) of a wind power station is configured in such a manner that a condensate ring (41) is placed as a shell-shaped collecting trough (40) in the area of the cold side (31a) of the cooling device (30) which is placed in a wall (22) of the switch cupboard (20), cold side which is situated in the inner space (23) of the switch cupboard (20), whereby the inner space (42) is connected with a hose (50) guided out of the inner space (23) of the switch cupboard (20) which is configured as a spiral hose (50a) in the area of the warm side (32a) of the cooling device (30) situated outside the switch cupboard (20), whereby the spirally confi

Abstract: An air-conditioning apparatus includes upper and lower chambers, and first and second heat exchange units respectively disposed in the upper and lower chambers and respectively having first and second working fluids. The first heat exchange unit has a condenser and a first fan adapted to draw air into the upper chamber for exchange of heat with the condenser. The second heat exchange unit has an evaporator and a second fan adapted to draw air into the lower chamber for exchange of heat with the evaporator. First and second tubing units are respectively connected to the condenser and the evaporator and each has a heat exchange tube section. The heat exchange tube sections of the first and tubing units are associated with each other such that the second working fluid transfers heat to the first working fluid.

Abstract: Disclosed is a thermoelectric fan for use with radiant heaters, particularly catalytic heaters. The thermoelectric fan of the present invention comprises a housing sub-assembly coupled to a thermal plate sub-assembly, the housing sub-assembly comprising a shrouded circulating air moving member, such as a fan blade, powered solely by the conversion of heat from a separate heater into electricity via an integrated thermoelectric module. Also disclosed is a self-powered fan that can safely perform in hazardous atmospheres while converting radiant heat to circulate air. The thermoelectric fan of the present invention ensures that the air within the space to be heated is more effectively distributed and temperature gradients are minimized. Also disclosed are methods for assembling, installing and safe operation of the thermoelectric fan.

Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Abstract: A heat exchanger and an indoor thermoelectric air conditioner containing the heat exchanger, the heat exchanger includes a heat transfer plate provided with an elevation area for the plate to be erected on bottom in outer casing of the air conditioner; multiple heat sink fins parallel with one another are fixed on one side of the plate at where abutted to the elevation area; free ends of those fins are inclined downward in a direction facing the elevation area; a fan blows the air from both sides of each fin to create airway between any two abutted fins; water of vapors in the air condensed on surface of each fin fall off downward due to central gravity thus to separate waterway from airway to warrant well-facilitate air vane of the air conditioner; and outer surface of each fin being applied with a hydrophilic film to frustrate condensation to further insurance of the well-facilitated air vane.

Abstract: A thermoelectric air conditioning unit and a thermoelectric air conditioner containing the unit; the unit includes thermoelectric component and heat exchanger; the heat exchanger is provided with heat transfer plate; multiple heat sink fins are disposed on one side of the heat transfer plate and the other side of the heat transfer plate is adhered to the thermoelectric component; another side of the component is attached with a water tank; the component is secured at where between the exchanger and the tank; the exchanger and the tank are respectively coated on one side an insulation heat transfer layer; the air conditioner is provided with an outer casing containing multiple thermoelectric air conditioning units; a fan is fixed at the outer casing; heat loss is reduced for 1˜2 ? due to that the coated layer that substitutes a heat transfer plate so to upgrade energy efficiency ratio of the thermoelectric air conditioning unit and that of the thermoelectric air conditioner containing the unit.

Abstract: Systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In various embodiments, a vapor compression system may include an evaporator, a compressor, a condenser, and an expansion valve. In some embodiments a separate heat pipe may be placed between the computer component and the evaporator. In various embodiments, a thermo conductive plate may be used to thermally couple the heat pipe to various components including the computer component, evaporator, condenser, and/or heat sink. In some embodiments, a thermo electric module (TEM) may be coupled to various parts of the system.

Abstract: A device includes a liquid metal and a ferrofluid contained in a closed tube. Many electrode groups are connected to the closed tube. A feedback device is connected to the electrode groups. The feedback device switches power to each electrode group in series to circulate the liquid metal and move the ferrofluid in the closed tube.

Abstract: A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.

Abstract: Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated by the die. The cold plate may include one or more piercing elements that are coupled with the flow path. The manifold plate may hold a volume of a liquid coolant, and one or more breakable seals on the manifold plate contain the liquid coolant within the manifold plate (and perhaps other components of a fluid cooling system). The piercing element (or elements) on the cold plate may be inserted into the breakable seal (or seals) on the manifold plate to open the breakable seals and establish fluid communication between the cold and manifold plates. The use of a manifold plate including the breakable seals may enable the shipment and storage of a fluid cooling system precharged with a working fluid. Other embodiments are described and claimed.

Abstract: A personal portable environmental control system, which includes a thermoelectric device, two heat sinks, an exhaust fan for blowing ambient air across one heat sink and a blower for blowing ambient air across the other heat sink such that the blown air is conditioned (either heated or cooled). The thermoelectric device is disposed between the two heat sinks.

Abstract: A heating, ventilating and air conditioning (HVAC) system for a hybrid vehicle is disclosed, the HVAC system including at least one thermoelectric device for providing supplemental heating and cooling for air supplied to a passenger compartment of the vehicle to maximize an efficiency of operation of the hybrid vehicle during operation of the HVAC system.

Abstract: The invention is a solid-state thermoelectric cooling device for attachment to a personal or laptop computer. The device consists of a plurality of thermoelectric coolers that are mounted on a heat exchanger, each powered by less than about 12 volts DC, which provides a cold face on a thermoelectric cooling panel which is mounted on the top or a side of the computer. The internal temperature of the computer is controlled to avoid moisture condensation.

Abstract: An exposure apparatus includes an optical system for guiding light to an object, a holding member for holding the object, a first refrigerator located near a holding side of the holding member without contacting the holding side, and a second refrigerator located near a backside of the holding member without contacting the backside.

Abstract: A thermoelectric air conditioner includes semiconductor, cold and hot ducts, fins, temperature controller and fan installed in a casing; cold air or hot air generated through the process by the thermoelectric cooling chip before being delivered through superconductor ducts free of barrier to be stored by fins; and push buttons provided on the user interface of the temperature controller allowing the air temperature to be controlled at constant, cooler or hotter before delivering the air stored in fins through the fan for the room to arrive at the temperature desired in short time.

Abstract: A cooling system (200) for a computer system (100) includes a housing (220) and a thermoelectric module (240) in the housing. The housing is hermetically connected to a computer case (120). The thermoelectric module comprises a cold side (242) and a hot side (244) when subject to an electric voltage. A first fan (300) is for blowing hot air generated by a CPU (50) in the computer case to the cold side of the thermoelectric module. A second fan (400) is for blowing cold air from the cold side of the thermoelectric module to the CPU. A first heat sink (250) is mounted to the cold side of the thermoelectric module. A second heat sink (260) is mounted to the hot side of the thermoelectric module.

Abstract: An electric clipper cooling device includes a body that has a cavity, spaced inner and outer layers, an external power source, a combination fan and vent, and a thermoelectric cooler disposed therein. A heat absorbing material is disposed between said inner and outer layers and lies adjacent the cavity for assisting to draw heated air outwardly therefrom. A plurality of elongated tubes are connected to the cooler and the cavity respectively for allowing the exchange of air therebetween. Air that has a first temperature is drawn to the cooler via one of the tubes and air that has a second temperature is introduced to the cavity via another of the tubes so that an electric device disposed within the body can be cooled during non-operating conditions.

Abstract: A method for transferring heat from a first location to a second location includes thermoelelectrically transferring heat from the first location to a third location; and transferring heat from the third location to the second location through a magneto-hydrodynamic (MHD) flow. A cooling system includes a thermoelectric cooling (TEC) component; and a magnetohydrodynamic (MHD) component, wherein the MHD component and the TEC component are in thermal contact.

Abstract: Apparatus is provided including an assembly (22) and a control unit (36). The assembly (22) includes a housing (34) configured to be applied to a nerve (20) of a subject, and at least one cathode (30) and at least one Peltier cooler (32), which are fixed to the housing (34). The control unit (36) is configured to drive the cathode (30) to apply an activating current to the nerve (20) that generates action potentials traveling in first and second directions (38 and 40) in the nerve (20), and the Peltier cooler (32) to cool the nerve (20) sufficiently to block propagation of at least a portion of the cathode-generated action potentials traveling in the second direction (40). Other embodiments are also described.

Abstract: A temperature regulator provides thermoelectric temperature control in a X-ray detector. The temperature regulator maintains the temperature within the X-ray detector by controlling current through a thermoelectric device. The temperature regulator can both heat and cool the X-ray detector.

Abstract: A refrigeration system for multi-temperature and single-temperature applications combines a refrigeration circuit and a single-phase fluid heat-transfer circuit in heat-conducting contact through a thermoelectric device. A vapor compression cycle provides a first stage of cooling and the thermoelectric device in conjunction with the heat-transfer circuit provides the second stage of cooling. Polarity of the thermoelectric device can be reversed to provide a defrost function for the refrigeration system.

Abstract: A cooling assembly includes a plate having a center portion for engaging and transferring heat from the electronic device and a peripheral portion surrounding the center portion. A heat sink overlies the plate and receives heat from the plate. A thermoelectric module is disposed between the peripheral portion of the plate and the heat sink for pumping heat laterally from the center portion of the plate to the peripheral portion of the plate and then to the heat sink.

Abstract: A cooling device with a thermoelectric conversion element having a heat absorbing surface and a heat releasing surface includes: a heat-absorbing-side heat conductive member connected with the heat absorbing surface in a heat-conductive manner; a heat-releasing-side heat conductive member connected with the heat releasing surface in a heat-conductive manner; a plurality of heat-absorbing-side fin members that is disposed to the heat-absorbing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat absorbing surface and extends in a predetermined direction; and a plurality of heat-releasing-side fin members that is disposed to the heat-releasing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat releasing surface and extends in a predetermined direction intersecting with the plurality of heat-absorbing-side fin members in plan view.

Abstract: A method and system that uses the flow of drilling fluid to cool electrical components in a downhole environment. A substantially cylindrical housing comprises a wall which houses at least one electrical component directly coupled to a thermoelectric cooling device. An opposing surface of the thermoelectric cooling device contacts a flow of drilling fluid through a hollow passageway in the wall. The flow of drilling fluid acts as a heat sink to transfer heat from the cooling device to a remote location. In this manner, heat is efficiently and directly transferred from the electrical component to the cooling device to the drilling fluid, while the location of the present system within a wall of the housing enables reliable protection of sensitive electrical components from hostile effects downhole.

Abstract: The fruit refrigerator has a cold plate which is cooled by a thermal electric unit secured underneath. Power is supplied to the thermal electric unit and to a cooling fan which blows air over the thermal electric unit. The cold plate has a depressed center, and liquid drains down through a wick. The cold plate has a transparent cover. A circulating fan on the cold plate prevents stratification within the domed cover and helps equalize cooling of fruit on the tray.

Abstract: Apparatus and methods for improving the control of the temperature of a supported member, such as a substrate, in high vacuum processing systems, such as ion beam etch (IBE) systems. The apparatus includes thermoelectric devices that transfer heat from a support member supporting the supported member to a liquid-cooled heat exchange member to regulate the temperature of the support member. The method includes cooling the support member with thermoelectric devices that transfer the heat to the liquid-cooled heat exchange member.

Abstract: A system and method for controlling the temperature of a heat-generating component such as a laser. A microelectromechanical system for controlling the temperature of the heat-generating component includes a magnetic heat sink device, a temperature sensor, and control circuitry. The temperature sensor detects the temperature of the heat-generating component through the heat sink and feeds the sensed temperature to the control circuitry. The detected temperature is compared to a predetermined temperature set point. When the detected temperature is higher than the temperature set point, a command is sent to the magnetic heat sink to take more heat out of the heat-generating component. When the detected temperature is lower than the temperature set point, a command is sent to the magnetic heat sink to take less heat out of the heat-generating component.