Abstract: A temperature control system is provided for efficiently controlling the temperature of an optical transmitter such as a laser diode. The temperature control system of the present invention reduces power consumption and achieves a higher efficiency by employing a voltage controller and a high-efficiency DC-DC step-down converter between the TEC controller, which drives the thermoelectric cooler, and the microcontroller, which governs the optical transmitter operation. The voltage controller converts an analog voltage command signal into a current-based command signal, which is then sent to the DC-DC step-down converter. The DC-DC converter produces a stepped-down voltage which it supplies to the TEC controller. The TEC controller receives the stepped-down voltage input from the DC-DC converter and outputs a corresponding current signal to the thermoelectric cooler.

Abstract: The present invention relates to an arrangement for the heat transfer between a tubular body suitable for conducting a fluid and a contact body that is in contact with said tubular body, wherein the contact body comprises a contact side facing the tubular body, with which the contact body is in contact with an outside of the tubular body facing the contact body, wherein in a tensioned state of the arrangement a preload force presses the contact body against the tubular body in a preload direction.

Abstract: A device for cooling a tissue sample on a microtome includes a cooling element (44), a first air channel (32), and a ventilation device (22). The cooling element (44) has a cold region facing the tissue sample and a hot region which faces away from the tissue sample and dissipates the heat generated in the cooling element (44) to the ambient environment. The first air channel (32) is provided for dissipating the heat released by the cooling element (44). The ventilation device (22) generates an air flow through the first air channel (32), said air flow absorbing and removing the heat released via the hot region of the cooling element (44).

Abstract: Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.

Abstract: Disclosed herein are a thermoelectric module including a first substrate and a second substrate that are opposite to each other and spaced from each other; first and second electrodes that are disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric element that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes, wherein at least any one of the first and second substrates has an insulating layer disposed on one surface and a fluid flowing line for moving a fluid transferring heat therein, and a method for manufacturing the same.

Abstract: A device includes a first thermally conductive substrate having a first patterned electrode disposed thereon and a second thermally conductive substrate having a second patterned electrode disposed thereon, wherein the first and second thermally conductive substrates are arranged such that the first and second patterned electrodes are adjacent to one another. The device includes a plurality of nanowires disposed between the first and second patterned electrodes, wherein the plurality of nanowires is formed of a thermoelectric material. The device also includes a joining material disposed between the plurality of nanowires and at least one of the first and second patterned electrodes.

Abstract: An apparatus is provided that includes a thermoelectric generator and an exhaust gas system operatively connected to the thermoelectric generator to heat a portion of the thermoelectric generator with exhaust gas flow through the thermoelectric generator. A coolant system is operatively connected to the thermoelectric generator to cool another portion of the thermoelectric generator with coolant flow through the thermoelectric generator. At least one valve is controllable to cause the coolant flow through the thermoelectric generator in a direction that opposes a direction of the exhaust gas flow under a first set of operating conditions and to cause the coolant flow through the thermoelectric generator in the direction of exhaust gas flow under a second set of operating conditions.

Abstract: A method for managing thermal energy in an internal combustion engine including an exhaust gas recirculation system and an engine cooling system includes recirculating a portion of an exhaust gas through the exhaust gas recirculation system that is in thermal communication with a first side of a thermoelectric device, flowing an engine coolant into thermal communication with a second side of a thermoelectric device, and controlling electric current between an electrical energy storage device and the thermoelectric device to transfer thermal energy between the recirculated exhaust gas and the engine coolant.

Abstract: Apparatus and systems, as well as methods and articles, may operate to actively cool an electronic device using a first heat removing cooling element, and to induce a thermal gradient in a heat pipe by conducting heat from a hot side of the first heat removing cooling element to a cold side of a second heat removing cooling element using the heat pipe. The heat pipe may comprise a variable conductance heat pipe. The apparatus and system may operate in a downhole environment, including logging and drilling operations.

Abstract: A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

Abstract: A vehicle air conditioner includes a first heat storage device having a first heat storage medium, a battery disposed under a floor of a compartment of a vehicle on a chassis side and a heat insulator covering the first heat storage device for insulating. The first heat storage device is disposed on and thermally connected to the battery.

Abstract: A frying-and-baking oven includes a baking outer pot, a heating cover assembly covering the outer pot, and a frying inner pot disposed between the outer pot and the heat cover assembly. The heating cover assembly includes a cover, an actuator, a hot-air supplying module, and a speed-reducing mechanism. The actuator has a driving shaft. The hot-air supplying module has an air-blowing impeller and a heating element. The driving shaft drives the air-blowing impeller to blow the hot airflow generated by the heating element. The driving shaft also drives a transmission shaft of the speed-reducing mechanism and in turn a stirring member to rotate at a low speed, thereby stirring food materials in the inner pot. With this arrangement, the food materials received in the inner pot can be stirred automatically and cooked sufficiently. Further, the oven can cook the food materials by baking or frying, which increases the functionality and convenience thereof.

Abstract: An electric circuit includes a plurality of electric circuit elements. The circuit is prone to creating voltage spikes on a pair of spaced lines. A jumper line connects the pair of spaced lines. A thermoelectric element is connected on the jumper line such that the voltage spike will pass through a hot node on the thermoelectric element. A cool node of the thermoelectric element is positioned adjacent to components which require cooling.

Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Abstract: A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

Abstract: Described herein is for a system and procedure to apply vaporization for heat transfer processes, particularly condensers in air conditioning and refrigeration systems both for upgrading units using the discontinued R22 refrigerant and for new equipments. The application can be applied to other cooling processes such as computer chip cooling, garments for medical, personal garments for military personnel. The application points to the features of different manifestations of vaporization for cooling in both natural and other equipments. The process can be extended for small and compact implementation on new equipments with maintenance improvement compared to water tower coolers, lower capitalization costs, modularity and ease of maintenance, and indoor installations enabling extension of capability of the cooling system with application of air flow condition.

Abstract: The air conditioning device for electronic components features three channels (6, 7, 8) for two flowing fluids that are in heat exchange with one another. In the first operating mode these two fluids are guided by means of switchable flaps into two selected channels (7, 8) where they are in heat exchange with one another at a partition (12) that is equipped with heat exchange elements (12, 13). In a second operating mode the flaps are switched in such a manner that the two fluids are in heat exchange with one another at a Peltier element (9) that is equipped on both sides with heat exchange elements (9, 11). In a third operating mode the Peltier element is switched as a heating element. In the first operating mode on the other hand the Peltier element is deactivated and consumes no electric energy.

Abstract: A packaged beverage temperature adjustment apparatus includes: a temperature adjustment section configured to hold a packaged beverage, and adjust a temperature of the packaged beverage; and a rotation driving section configured to rotate the temperature adjustment section, the temperature adjustment section including at least one temperature adjustment unit abutting on a side face of the packaged beverage.

Abstract: Systems and methods for controlling a thermoelectric cooler (TEC) in an optical transceiver. A TEC system includes a processor that interacts with a power supply and a TEC controller to prevent inrush current. The power supply is switched by the processor and turned on only at a particular time. The power supply has a relatively large time constant such that it ramps slowly to its full value. In the meantime, the processor and TEC controller cause the temperature to ramp to a target value by repeatedly incrementing or decrementing a target value over time and by controlling when the maximum available voltage can be applied to the TEC.

Abstract: A heat exchange system selectably controls the temperature of a fluid being delivered to a patient's body by a pump device. The heat exchange system includes a thermal element and a heat exchanger that is removably coupled under pressure to the thermal element. The heat exchanger includes a first half made from thermally conductive material that correspondingly mates with the thermal element, a second half made from thermally conductive material opposite the first half, and an internal heat exchange zone existing between the first half and the second half, wherein fluid flows therethrough. The thermal element of the heat exchange system may controllably and safely warm and/or cool the fluid prior to delivery.

Abstract: A beverage container which preserves a beverage and dispenses the beverage using a pressurized gas; comprising a beverage storage section having a liquid outlet, an outer wall, which covers an outer periphery of the beverage storage section and is separated from the beverage storage section by a hollow section, and a gas outlet which communicates the hollow section and an outer area; wherein the hollow section is filled with a pressurized gas.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A cooling system cools an electrically rechargeable portable device accommodated in a docking station. The cooling system includes a docking station having a non-forced air active cooling unit and a housing. The cooling unit maintains a first heatsink surface at a temperature below an ambient temperature and a second heatsink surface at a temperature exceeding said first heatsink surface temperature. The housing accommodates an electrically re-chargeable portable device. The housing re-charges said portable device and seats said portable device in a position providing thermal contact between said docking station first heatsink surface and a heat spreader of said portable device while re-charging of said portable device.

Abstract: An assembly that includes one or more thermoelectric devices and a heat sink and that corrects the problem of an uneven heating effect across the area occupied by the devices due to a lateral heat loss at the edges of the devices or other anomalies among the devices is constructed with a heat sink that contains voids in the slab or flat surface that is in thermal contact with the thermoelectric devices. The voids are located at or within the periphery of the area that is directly aligned with the thermoelectric devices and are concentrated in regions relatively close to the periphery, leaving an area in the center of the slab that is either void-free or of a relatively low void density.

Abstract: Apparatus, systems, and methods provide for the cooling of a system on an aircraft or other platform. According to embodiments described herein, a first coolant is routed through a heat-producing system to absorb heat and maintain the system at a desired temperature. The first coolant is routed through a thermoelectric chiller for cooling before returning to absorb further heat from the system. Thermoelectric cooler modules within the chiller transfer heat from cold plates containing the first coolant to hot plates containing a second coolant. The second coolant absorbs the transferred heat and is routed to a radiator, where the heat is discharged into an ambient air stream. The second coolant is routed back to the hot plates to absorb further heat.

Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.

Abstract: An electrostatic atomizing device includes an atomizing electrode which generates charged fine water particles negatively charged in the form of mist, by generating an electric field when a high negative voltage is applied thereto in a state in which water is supplied; a water supply portion which supplies the water to the atomizing electrode; a discharge detection portion which detects whether negative ion discharge, indicating discharge in which only negative ions are generated without generating the charged fine water particles, is occurring at the atomizing electrode or not; and a control portion which reduces the electric field intensity of the electric field generated by the atomizing electrode when the discharge detection portion detects the occurrence of the negative ion discharge.

Abstract: A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.

Abstract: A fluid compression circuit may include a compression mechanism, a volume, a heat exchanger, a fluid conduit, a thermoelectric device, and a heat-transfer device. The compression mechanism includes first and second members cooperating to form a fluid pocket. The volume receives discharge fluid from the fluid pocket. The heat exchanger is in communication with the volume. The fluid conduit is connected to at least one of the volume and the heat exchanger. The thermoelectric device may include a first side in heat-transfer relation with a member at least partially defining the volume and a second side in heat-transfer relation with ambient air and cooperating with the first side to define a temperature gradient generating electrical current in the thermoelectric device. The heat-transfer device may receive electrical current generated by the thermoelectric device and may be in heat-transfer relation with at least one of the heat exchanger and the fluid conduit.

Abstract: A thermoelectric system includes a first thermoelectric element including a first plurality of segments in electrical communication with one another. The thermoelectric system further includes a second thermoelectric element including a second plurality of segments in electrical communication with one another. The thermoelectric system further includes a heat transfer device including at least a first portion and a second portion. The first portion is sandwiched between the first thermoelectric element and the second thermoelectric element. The second portion projects away from the first portion and configured to be in thermal communication with a working medium.

Abstract: The present application is directed to thermoelectric coolers that include multiple temperature zones. The thermoelectric cooler may include a first series of thermoelectric intermediate members interconnecting a second plate with a first section of a first plate, and a second series of thermoelectric intermediate members interconnecting the second plate with a second section of the first plate. The first series may form a first temperature zone and the second series may form a second temperature zone. Each of the first and second series of thermoelectric intermediate members may be configured to electrically connect with a DC power supply to energize the first and second series and independently control temperatures of the first and second sections of the second plate.

Abstract: A portable cooled merchandising unit including a product container assembly, a door assembly, a cooling assembly, a customer enticement device, and a power unit. The product container assembly defines an interior region for containing products. The cooling assembly is connected to the product container assembly and includes a powered cooling device to cool the interior region. The enticement device is adapted to encourage customer interest in the merchandising unit and includes a powered component. The power unit includes a power supply electrically connectable to an external power source, with each of the powered cooling device and the power component of the enticement device being electrically coupled to the power supply. With this configuration, the common power supply serves to power both the cooling assembly as well as the customer enticement device. In some embodiments, the cooling assembly includes a thermoelectric device.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A heating and cooling system to maintain an area at a desired temperature including a thermoelectric device (102), a vapor compression system (106), and a control system (104) operably connected to the thermoelectric device (102) and the vapor compression system (106).

Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.

Abstract: According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger.

Abstract: The invention relates to systems and methods including a combination of thermal generating device technologies to achieve more efficiency and accuracy in PCR temperature cycling of nucleic samples undergoing amplification.

Abstract: A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC.

Abstract: The refrigeration device for electronic components features a plate that is equipped on both sides with heat exchanger elements (22), along whose surface two separate air stream paths are disposed, of which one guides external air and one internal air. The refrigeration device features two intakes (15, 16), which lie in one plane, that are in a flow connection with two separated chambers (19, 20). Furthermore the two chambers are in an air stream connection by means of guiding plates (25, 26) with channels (23, 24) on the upper- and lower side of the plate.

Abstract: In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member.

Abstract: A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control.

Abstract: A heat exchanger may include a housing including an intake port through which air is introduced into the housing from outside, a seat inlet supplying air to a vehicle seat, and an exhaust port through which a portion of the air introduced from outside is exhausted from the housing to outside, a blower unit mounted inside the housing and operated by a first motor to supply the air introduced into the housing through the intake port, out of the housing through the seat inlet, and a thermoelectric element disposed between the intake port and the seat inlet and heat-controlling the air introduced into the housing through the intake port.

Abstract: According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, in which the length of the minor width is less than the major width. The cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.

Abstract: Disclosed are anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Also disclosed are systems for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Further disclosed are methods for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers.

Abstract: A cooling system for a modular light emitting diode (LED) lighting fitting includes a heat sink, at least one cooling fan located at an upper portion of the heat sink and inducing heat radiating from the heat sink to an outside to cool the heat sink, at least one thermoelectric element provided at a lower portion of the heat sink and having a heat absorbing part in contact with the LED lighting fitting at a lower portion thereof and a heat radiating part in contact with the heat sink at an upper portion thereof, and at least one temperature sensor mounted at the lower portion of the heat sink. The cooling fan is controllably driven to cool the LED lighting fitting according to whether or not a temperature measured by the temperature sensor reaches a preset temperature.

Abstract: A system for condensing water from air includes a column having a substantially non-reflective surface effective for absorbing heat energy from the sun and transferring the heat to air in the interior of the column. A condenser is secured within the column, and includes a condensing surface with a thermoelectric or natural gas cooler positioned thereon for cooling the condensing surface. A collector is positioned within the column for collecting water that condenses on and falls from the at least one condensing surface of the condenser, and an accumulator is coupled in fluid communication with the collector for accumulating the water.

Abstract: A thermal transfer device applies a uniform heat to a plurality of samples. The thermal transfer device takes advantage of the natural thermal gradient pattern of a heat exchanging device and arranges the samples along isothermal lines of the heat exchanger. By arranging the samples in this manner, at least two problems are specifically addressed. First, the temperature applied within each sample is uniform. Second, the symmetrical arrangement of the samples guarantees that each sample is exposed to exactly the same conditions as the neighboring samples.